CN211925699U - 一种用于led环氧树脂胶基板的冷却管 - Google Patents
一种用于led环氧树脂胶基板的冷却管 Download PDFInfo
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- CN211925699U CN211925699U CN202020946679.4U CN202020946679U CN211925699U CN 211925699 U CN211925699 U CN 211925699U CN 202020946679 U CN202020946679 U CN 202020946679U CN 211925699 U CN211925699 U CN 211925699U
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- cooling
- heat absorption
- absorption section
- section
- cooling tube
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- 238000001816 cooling Methods 0.000 title claims abstract description 75
- 239000000758 substrate Substances 0.000 title claims description 14
- 239000003822 epoxy resin Substances 0.000 title claims description 13
- 229920000647 polyepoxide Polymers 0.000 title claims description 13
- 239000000853 adhesive Substances 0.000 title claims description 9
- 230000001070 adhesive effect Effects 0.000 title claims description 9
- 238000010521 absorption reaction Methods 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 229920006335 epoxy glue Polymers 0.000 claims abstract description 5
- 239000002826 coolant Substances 0.000 claims abstract description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 9
- 239000000110 cooling liquid Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 239000000047 product Substances 0.000 abstract description 3
- 239000007795 chemical reaction product Substances 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
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CN202020946679.4U CN211925699U (zh) | 2020-05-29 | 2020-05-29 | 一种用于led环氧树脂胶基板的冷却管 |
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CN202020946679.4U CN211925699U (zh) | 2020-05-29 | 2020-05-29 | 一种用于led环氧树脂胶基板的冷却管 |
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CN211925699U true CN211925699U (zh) | 2020-11-13 |
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CN202020946679.4U Active CN211925699U (zh) | 2020-05-29 | 2020-05-29 | 一种用于led环氧树脂胶基板的冷却管 |
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CN (1) | CN211925699U (zh) |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Cooling pipe for LED epoxy resin adhesive substrate Effective date of registration: 20220412 Granted publication date: 20201113 Pledgee: Bank of China Limited by Share Ltd. Jingmen branch Pledgor: HUBEI XIEJIN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2022420000100 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20201113 Pledgee: Bank of China Limited by Share Ltd. Jingmen branch Pledgor: HUBEI XIEJIN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Registration number: Y2022420000100 |