CN211903505U - High-precision vacuum oven for medical treatment and semiconductor - Google Patents
High-precision vacuum oven for medical treatment and semiconductor Download PDFInfo
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- CN211903505U CN211903505U CN202020446160.XU CN202020446160U CN211903505U CN 211903505 U CN211903505 U CN 211903505U CN 202020446160 U CN202020446160 U CN 202020446160U CN 211903505 U CN211903505 U CN 211903505U
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Abstract
The utility model provides a medical treatment and high accuracy vacuum oven for semiconductor, including the box, be provided with the mounting panel that parallel placed about the multilayer in the box, the mounting panel is connected with a plurality of heating rods in the side of box, the wiring mouth of box sets up at the box outsidely the side of box is provided with vacuum pump interface, inflation inlet and thermocouple interface, and every layer of mounting panel all corresponds a thermocouple interface. The high-precision vacuum oven for medical treatment and semiconductors can customize the size of the vacuum oven according to the heating quantity of articles, the layering quantity and the layering height in the customized oven, and the temperature control precision is high.
Description
Technical Field
The utility model relates to an oven device especially relates to a medical treatment and high accuracy vacuum oven for semiconductor.
Background
At present, part of medical instruments and high-precision semiconductor chips need to be sealed, packaged or welded in an anhydrous and oxygen-free environment, moisture attached to the medical instruments and the high-precision semiconductor chips needs to be baked, evaporated and pumped away in a high-temperature heating mode in a vacuum environment, the baking temperature requirement is extremely high, and the temperature uniformity requirement is generally +/-1 ℃; for example: 100 +/-1 ℃. If the temperature uniformity does not reach the required overtemperature, the articles are burnt out, and the defects are caused when the temperature uniformity does not reach the required temperature. Medical instruments and semiconductor chips need to be baked for a long time with high precision under vacuum, so that the moisture in the chips can be completely removed.
SUMMERY OF THE UTILITY MODEL
The utility model provides a medical treatment and high accuracy vacuum oven for semiconductor has solved vacuum oven's temperature control's precision problem, and its technical scheme is as follows:
the utility model provides a medical treatment and high accuracy vacuum oven for semiconductor, includes the box, is provided with the mounting panel that parallel placed about the multilayer in the box, the mounting panel is connected with a plurality of heating rods in the side of box, the wiring mouth of box sets up outside the box, the side of box is provided with vacuum pump interface, inflation inlet and thermocouple interface, and every layer of mounting panel all corresponds a thermocouple interface.
And the thermocouple interface is arranged on the side surface of the box body and is positioned in the middle of the side surface of the corresponding mounting plate.
The thermocouple interface is used for inserting a thermocouple of a temperature controller.
The vacuum pump interface is arranged in the middle of the side face of the box body in height.
The height of the inflation inlet is the same as that of the vacuum pump interface.
The top of box is provided with the sensor interface, the sensor interface is used for installing pressure sensor, vacuum gauge.
The mounting panel is provided with the multilayer, and the inboard top of box is pressed close to the mounting panel of superiors, and the inboard bottom of box 1 is pressed close to the mounting panel of lower floor, and the space height between the mounting panel is the same.
The heating rods are uniformly arranged along the side face of the mounting plate.
Five heating rods are connected to each mounting plate.
The mounting plate and the heating rod are made of aluminum
The high-precision vacuum oven for medical treatment and semiconductors can customize the size of the vacuum oven according to the heating quantity of articles, the layering quantity and the layering height in the customized oven, and the temperature control precision is high.
Drawings
FIG. 1 is a schematic structural view of the high-precision vacuum oven for medical treatment and semiconductor;
FIG. 2 is a schematic side view of the high-precision vacuum oven for medical and semiconductor applications;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
the reference numbers in the figures:
1-a box body; 2-mounting a plate; 3-heating a rod; 4-vacuum pump interface; 5-an inflation inlet; 6-thermocouple interface; 7-sensor interface.
Detailed Description
As shown in fig. 1 to 3, the high-precision vacuum oven for medical treatment and semiconductor comprises a box body 1, wherein a plurality of layers of mounting plates 2 which are arranged in parallel up and down are arranged in the box body 1, the mounting plates 2 are fixedly connected with a plurality of heating rods 3 on the right side of the box body 1, and the heating rods 3 are uniformly arranged along the side surfaces of the mounting plates 2.
Specifically, the mounting plate 2 is provided with 5 layers, the mounting plate 2 of the uppermost layer is close to the top of the inner side of the box body 1, the mounting plate 2 of the lowermost layer is close to the bottom of the inner side of the box body 1, and the mounting plate 2 is provided with upper and lower through holes, so that each layer of space is communicated. Each mounting plate 2 has 5 heating rods 3 attached to it. Therefore, the multilayer heating structure is adopted, and the temperature uniformity in the oven is good. And the heating rod 3 is easy to replace and maintain.
The mounting plate 2 and the heating rod 3 are made of aluminum or aluminum alloy, so that the heat transfer performance is good, and the temperature control precision is high.
The right side of box 1 is provided with thermocouple interface 6 that corresponds mounting panel 2, and every mounting panel 2 all corresponds a thermocouple interface 6, thermocouple interface 6 is used for the fixed mounting thermocouple, feeds back the temperature of every layer of mounting panel 2 through the thermocouple, realizes that every layer adopts solitary temperature controller to control the temperature.
The right side of the box body 1 is further provided with a vacuum pump interface 4 and an inflation inlet 5, the vacuum pump interface 4 is used for being connected with a vacuum pump, and the box body 1 is vacuumized through the vacuum pump. The inflation inlet 5 is used for being connected with an inflation device and filling inert gas into the box body 1.
The heating rod, the thermocouple interface, the vacuum pump interface 4 and the inflation inlet 5 are arranged on the same side of the box body 1, so that interface management of the box body 1 is facilitated, and the wiring mode is arranged outside the box body. Further, can set up mounting panel 2 and be detachable construction, conveniently take out and clear up.
The top of the box body 1 is provided with a sensor interface 7, and a pressure sensor, a vacuum gauge and the like are installed through the sensor interface 7. The air supplement function in the oven is controlled by adopting a pressure sensor, and the vacuum degree in the oven is accurately controlled by adopting a vacuum gauge.
When the baking oven is used, medical instruments and semiconductor chips are placed, the vacuum pump is used for exhausting air and dehumidifying, (heating-nitrogen filling-vacuumizing) is repeatedly circulated in a set program, so that the oven body is in a high vacuum state, the boiling point of water is reduced, and the baking speed is accelerated.
The utility model discloses can be according to article heating quantity, the customization vacuum oven size, generally set for every layer of space highly be 5 ~ 20cm, customization oven inside layering quantity and layer height, the accuse temperature precision is high, and the wiring position is outside at the box, therefore the oven is inside can not produce under the argon gas environment and discharge.
Claims (10)
1. The utility model provides a medical treatment and high accuracy vacuum oven for semiconductor which characterized in that: including the box, be provided with the mounting panel that parallel placement about the multilayer in the box, the mounting panel is connected with a plurality of heating rods in the side of box, the wiring mouth of box sets up at the box outside, the side of box is provided with vacuum pump interface, inflation inlet and thermocouple interface, and every layer of mounting panel all corresponds a thermocouple interface.
2. The medical and semiconductor high-precision vacuum oven according to claim 1, characterized in that: and the thermocouple interface is arranged on the side surface of the box body and is positioned in the middle of the side surface of the corresponding mounting plate.
3. The medical and semiconductor high-precision vacuum oven according to claim 2, characterized in that: the thermocouple interface is used for inserting a thermocouple of a temperature controller.
4. The medical and semiconductor high-precision vacuum oven according to claim 1, characterized in that: the vacuum pump interface is arranged in the middle of the side face of the box body in height.
5. The medical and semiconductor high-precision vacuum oven according to claim 1, characterized in that: the height of the inflation inlet is the same as that of the vacuum pump interface.
6. The medical and semiconductor high-precision vacuum oven according to claim 1, characterized in that: the top of box is provided with the sensor interface, the sensor interface is used for installing pressure sensor, vacuum gauge.
7. The medical and semiconductor high-precision vacuum oven according to claim 1, characterized in that: the mounting panel is provided with the multilayer, and the inboard top of box is pressed close to the mounting panel of superiors, and the inboard bottom of box is pressed close to the mounting panel of lower floor, and the space height between the mounting panel is the same.
8. The medical and semiconductor high-precision vacuum oven according to claim 1, characterized in that: the heating rods are uniformly arranged along the side face of the mounting plate.
9. The medical and semiconductor high-precision vacuum oven according to claim 1, characterized in that: five heating rods are connected to each mounting plate.
10. The medical and semiconductor high-precision vacuum oven according to claim 1, characterized in that: the mounting plate and the heating rod are made of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020446160.XU CN211903505U (en) | 2020-03-31 | 2020-03-31 | High-precision vacuum oven for medical treatment and semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020446160.XU CN211903505U (en) | 2020-03-31 | 2020-03-31 | High-precision vacuum oven for medical treatment and semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211903505U true CN211903505U (en) | 2020-11-10 |
Family
ID=73274880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020446160.XU Active CN211903505U (en) | 2020-03-31 | 2020-03-31 | High-precision vacuum oven for medical treatment and semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211903505U (en) |
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2020
- 2020-03-31 CN CN202020446160.XU patent/CN211903505U/en active Active
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