CN211868388U - Stress sheet assembly filling clamp - Google Patents
Stress sheet assembly filling clamp Download PDFInfo
- Publication number
- CN211868388U CN211868388U CN201922356389.4U CN201922356389U CN211868388U CN 211868388 U CN211868388 U CN 211868388U CN 201922356389 U CN201922356389 U CN 201922356389U CN 211868388 U CN211868388 U CN 211868388U
- Authority
- CN
- China
- Prior art keywords
- stress
- groove
- die holder
- circuit board
- negative pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000565 sealant Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000001802 infusion Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 abstract description 20
- 238000009434 installation Methods 0.000 abstract description 16
- 239000003292 glue Substances 0.000 abstract description 10
- 239000010410 layer Substances 0.000 description 29
- 238000007493 shaping process Methods 0.000 description 13
- 238000004891 communication Methods 0.000 description 4
- 230000010412 perfusion Effects 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Images
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
The utility model provides a stress piece subassembly fills anchor clamps, provide the device including die holder and negative pressure, seted up fixed slot and air vent on the die holder, the blow vent has been seted up to the tank bottom in fixed slot, and the air vent passes through blow vent and fixed slot intercommunication, and the fixed slot is interior to upwards having set gradually the substrate layer installation position from the tank bottom, flexible circuit board installation position, sealed glue filling groove and rigid connection board installation position, and sealed glue filling groove is enclosed by the lateral wall in flexible circuit board installation position, rigid connection board installation position and fixed slot. The negative pressure providing device provides negative pressure airflow to the fixed groove through the vent hole. The stress sheet assembly pouring clamp can prevent the stress sheet assembly from deforming.
Description
Technical Field
The utility model belongs to the technical field of stress piece production facility and specifically relates to a stress piece subassembly fills anchor clamps is related to.
Background
The existing stress sheet assembly comprises a base material layer, a flexible circuit board, a flexible sealing glue layer and a rigid connecting plate which are sequentially stacked. In stress piece subassembly production process, fill sealed gluey back between to flexible circuit board and the rigid connection board, because substrate layer and flexible circuit board all have the flexibility, sealed gluey can shrink in the curing process to can make substrate layer and flexible circuit board take place to warp, influence the accuracy that stress piece subassembly detected.
Disclosure of Invention
The utility model aims at providing a prevent that stress piece subassembly from taking place the stress filling fixture of deformation.
In order to realize the above object, the utility model provides a stress piece subassembly fills anchor clamps, provide the device including die holder and negative pressure, seted up fixed slot and air vent on the die holder, the blow vent has been seted up to the tank bottom in fixed slot, and the air vent passes through blow vent and fixed slot intercommunication, and the fixed slot is interior to upwards having set gradually substrate layer installation position, flexible circuit board installation position, sealed glue filling groove and rigid connection board installation position from the tank bottom, and sealed glue filling groove is enclosed by the lateral wall in flexible circuit board installation position, rigid connection board installation position and fixed slot. The negative pressure providing device provides negative pressure airflow to the fixed groove through the vent hole.
According to the scheme, in the step of glue pouring of the stress sheet assembly, the substrate layer is placed on the substrate layer mounting position, the flexible circuit board is placed on the flexible circuit board mounting position, then the negative pressure supply device supplies negative pressure air flow to the fixed-size groove through the vent hole, the substrate layer and the flexible circuit board are flatly sucked by the negative pressure, and then the rigid connecting plate is placed on the rigid connecting plate mounting position after glue is poured into the sealant filling groove. Until the sealant is solidified to form a flexible sealant layer. Through providing the negative pressure air current to the design inslot for the substrate layer keeps the horizontality always, like this, when sealed solidification shrink, can not influence the roughness of substrate layer and flexible circuit board, thereby makes stress piece subassembly have better detection precision.
Preferably, the number of the shaping grooves is multiple, and the multiple shaping grooves are arranged in a matrix.
Therefore, the vent holes are conveniently distributed on the die holder.
The further scheme is that the air vent includes main hole section and a plurality of branch hole section that communicate each other, and the main hole section extends along the length direction of die holder, and every branch hole section all extends to corresponding air vent from main hole section.
According to a preferable scheme, a plurality of air vents are formed in the bottom of one fixed groove and are communicated with the air vents.
Preferably, the plurality of air vents are uniformly arranged along the length direction of the shaped groove.
Therefore, the vent holes are used for venting to the positioning groove simultaneously, so that the suction force of the base material layer and the flexible circuit board is balanced, and the flatness of the base material layer and the flexible circuit board in the shaping groove is guaranteed.
The die holder is characterized in that supporting plates are arranged on two sides of the die holder in the width direction and are higher than the die holder, and clamping grooves penetrating through the supporting plates in the width direction are formed in the supporting plates.
Therefore, the card slot is used for clamping the communication data line.
Preferably, the stress sheet assembly pouring clamp further comprises a positive pressure supply device, and the positive pressure supply device supplies positive pressure air flow to the shaping groove.
It can be seen that the positive pressure supply device is used for supplying positive pressure air flow into the shaping groove after the sealant is cured so as to discharge the strain gauge component.
The further proposal is that the positive pressure supply device and the negative pressure supply device are both air pumps.
Drawings
Fig. 1 is an exploded view of a stress beam assembly.
Fig. 2 is a structural diagram of the stress sheet assembly perfusion fixture according to the embodiment of the present invention after being matched with the stress sheet assembly.
Fig. 3 is an exploded view of an embodiment of the perfusion fixture for stress plate assemblies according to the present invention.
Fig. 4 is a cross-sectional view of an embodiment of the perfusion jig for stress plate assemblies according to the present invention after being combined with the stress plate assemblies.
Fig. 5 is a partially enlarged view of a portion a in fig. 4.
The present invention will be further explained with reference to the drawings and examples.
Detailed Description
Referring to fig. 1, the stress sheet assembly 1 includes a flat substrate layer 11, a flexible circuit board 12 is disposed above the substrate layer 11, a stress sensor 121 and an electrical contact 122 are formed by etching on the flexible circuit board 12, and the electrical contact 122 is connected to the communication data line 10. The substrate layer 11 may be flexible or rigid, and in this embodiment, the substrate layer 11 is made of modified phenol or polyimide. A flexible sealant layer 13 is disposed above the flexible circuit board 12, and a rigid connection plate 14 is disposed above the flexible sealant layer 13, a clip 141 is disposed at one end of the rigid connection plate 14, and an end portion of the communication data line 10 may be clamped in the clip 141.
Referring to fig. 2 to 5, the stress sheet assembly perfusion jig includes a die holder 2 and an air pump (not shown) serving as both a negative pressure supply device and a positive pressure supply device.
A base material layer mounting position 211, a flexible circuit board mounting position 212, a sealant filling groove 213 and a rigid connecting plate mounting position 214 are sequentially arranged in the fixed groove 21 from the bottom to the top, and the sealant filling groove 213 is surrounded by the flexible circuit board mounting position 212, the rigid connecting plate mounting position 214 and the side wall of the fixed groove 21.
Substrate layer installation position 211 is used for placing substrate layer 11, and flexible circuit board installation position 212 is used for placing flexible circuit board 12, and sealed gluey filling groove 213 is used for filling sealed glue, forms flexible sealing glue layer 13 after the sealing glue solidification, and rigid connection board installation position 214 is used for placing rigid connection board 14.
The die holder 2 is provided with twenty shaping grooves 21 and vent holes 22, the number of the shaping grooves 21 is twenty, the twenty shaping grooves 21 are arranged in two rows and ten rows in a matrix manner, and the two rows of the shaping grooves 21 are arranged in a mirror image manner by taking the central line of the die holder 2 in the width direction as the central axis. Two air vents 210 are formed in the bottom of each fixed groove 21, and the two air vents 210 are arranged along the length direction of the fixed groove 21. The vent hole 22 is communicated with the shaping groove 21 through the vent hole 210, and the air pump provides negative pressure air flow or positive pressure air flow into the shaping groove 21 through the vent hole 22.
Referring to fig. 4, the vent hole 22 includes a main hole section 221 and twenty branch hole sections 222 that are communicated with each other, the main hole section 221 extends along the length direction of the die holder 2, the branch hole sections 222 are all connected with the main hole section 221, each branch hole section 222 extends from the main hole section 221 to a corresponding vent 210, each branch hole section 222 includes a horizontal extension section 2221 and two vertical extension sections 2222 that are connected, the top end of the vertical extension section 2222 is connected with the vent 210, and the bottom end of the vertical extension section 2222 is connected with the horizontal extension section 2221.
The two sides of the width direction of the die holder 2 are both provided with a support plate 23, the support plate 23 is higher than the die holder 2, and the support plate 23 is provided with a clamping groove 231 which penetrates through the support plate 23 in the width direction. The card slot 231 is used for clamping the communication data line 10.
In the step of encapsulating stress sheet assembly 1, firstly, the substrate layer 11 is placed on the substrate layer installation position 211, the flexible circuit board 12 is placed on the flexible circuit board installation position 212, then, the air pump sucks air, negative pressure air flow is provided for the shaping groove 21 through the vent hole 22, the substrate layer 11 and the flexible circuit board 12 are flatly sucked by the negative pressure, then, after encapsulating is performed for the sealant filling groove 213, the rigid connecting plate 14 is placed on the rigid connecting plate installation position 214, until the sealant is solidified to form the flexible sealing adhesive layer 13, finally, after the sealant is solidified, the air pump blows air, positive pressure air flow is provided for the shaping groove 21 through the vent hole 22, and therefore the strain sheet assembly is discharged.
Through providing the negative pressure air current to the design inslot for the substrate layer keeps the leveling state always, like this, when sealed solidification shrink, can not influence the roughness of substrate layer, thereby makes stress piece subassembly have better detection precision.
In addition, the positive pressure supply device and the negative pressure supply device may be two air pumps. The negative pressure providing means may also be a vacuum generator. The number of the air vents can be one or more than three, and the air vents are uniformly arranged along the length direction of the fixed groove. The number and the arrangement mode of the fixed grooves can be changed according to actual needs. The above changes also enable the object of the present invention to be achieved.
Finally, it should be emphasized that the above-described preferred embodiments of the present invention are merely examples of implementations, and are not intended to limit the scope of the present invention, as those skilled in the art will appreciate that various changes and modifications may be made without departing from the spirit and scope of the invention, and it is intended to cover all such modifications, equivalents, and improvements as fall within the true spirit and scope of the invention.
Claims (8)
1. Stress piece subassembly fills anchor clamps, its characterized in that includes:
the flexible circuit board sealing device comprises a die holder, wherein a fixed groove and an air vent are formed in the die holder, an air vent is formed in the bottom of the fixed groove, the air vent is communicated with the fixed groove through the air vent, a base material layer mounting position, a flexible circuit board mounting position, a sealant filling groove and a rigid connecting plate mounting position are sequentially arranged in the fixed groove from the bottom of the groove upwards, and the sealant filling groove is defined by the flexible circuit board mounting position, the rigid connecting plate mounting position and the side wall of the fixed groove;
and the negative pressure providing device provides negative pressure airflow to the fixed groove through the vent hole.
2. The stress blade assembly infusion fixture of claim 1, wherein:
the number of the fixed grooves is multiple, and the fixed grooves are arranged in a matrix mode.
3. The stress blade assembly infusion fixture of claim 2, wherein:
the air vent includes main hole section and a plurality of branch hole section that communicate each other, the main hole section is along the length direction of die holder extends, every branch hole section is all certainly main hole section extends to corresponding the air vent.
4. The stress patch assembly infusion jig of any one of claims 1 to 3, wherein:
and a plurality of air vents are formed in the bottom of the fixed groove and communicated with the air vents.
5. The stress patch assembly infusion jig of any one of claims 1 to 3, wherein:
the plurality of air vents are uniformly arranged along the length direction of the shaped groove.
6. The stress patch assembly infusion jig of any one of claims 1 to 3, wherein:
the die holder is characterized in that supporting plates are arranged on two sides of the die holder in the width direction and are higher than the die holder, and clamping grooves penetrating through the supporting plates in the width direction are formed in the supporting plates.
7. The stress patch assembly infusion jig of any one of claims 1 to 3, wherein:
the stress piece assembly pouring clamp further comprises a positive pressure providing device, and the positive pressure providing device provides positive pressure air flow into the fixed groove.
8. The stress blade assembly infusion fixture of claim 7, wherein:
the positive pressure providing device and the negative pressure providing device are both air pumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922356389.4U CN211868388U (en) | 2019-12-23 | 2019-12-23 | Stress sheet assembly filling clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922356389.4U CN211868388U (en) | 2019-12-23 | 2019-12-23 | Stress sheet assembly filling clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211868388U true CN211868388U (en) | 2020-11-06 |
Family
ID=73263512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922356389.4U Expired - Fee Related CN211868388U (en) | 2019-12-23 | 2019-12-23 | Stress sheet assembly filling clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211868388U (en) |
-
2019
- 2019-12-23 CN CN201922356389.4U patent/CN211868388U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210609 Address after: 511458 room 2010-3, software building north, Nansha Information Technology Park, 2 Huanshi Avenue South, Nansha District, Guangzhou City, Guangdong Province (office use only) Patentee after: GUANGZHOU DOARON INFORMATION TECHNOLOGY Co.,Ltd. Address before: 519031 room 105-6043, No.6 Baohua Road, Hengqin New District, Zhuhai City, Guangdong Province (centralized office area) Patentee before: Guangdong Lianda Technology Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201106 |