CN107038474B - Smart card manufacturing process - Google Patents
Smart card manufacturing process Download PDFInfo
- Publication number
- CN107038474B CN107038474B CN201710209626.7A CN201710209626A CN107038474B CN 107038474 B CN107038474 B CN 107038474B CN 201710209626 A CN201710209626 A CN 201710209626A CN 107038474 B CN107038474 B CN 107038474B
- Authority
- CN
- China
- Prior art keywords
- middle frame
- upper substrate
- lower substrate
- smart card
- manufacturing process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 147
- 239000003292 glue Substances 0.000 claims abstract description 28
- 238000007731 hot pressing Methods 0.000 claims abstract description 18
- 238000010030 laminating Methods 0.000 claims abstract description 4
- 230000001680 brushing effect Effects 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 238000003475 lamination Methods 0.000 abstract description 6
- 238000003825 pressing Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 238000012797 qualification Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2425/00—Cards, e.g. identity cards, credit cards
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention provides a manufacturing process of an intelligent card, which comprises the following steps: fixing a middle frame on one side of the upper substrate, pouring glue into a hollow cavity of the middle frame, and fixing a lower substrate on one side of the middle frame far away from the upper substrate; rigid plates are respectively arranged on one side of the upper substrate far away from the middle frame and one side of the lower substrate far away from the middle frame; and putting the assembled upper substrate, middle frame, lower substrate and rigid plate into a laminating machine for hot pressing until the glue solution is completely cured. The manufacturing process of the smart card adopts a hot pressing process, utilizes the rigid plate to assist lamination, and has no limitation on the materials of the upper substrate and the lower substrate, so that the smart card has good surface flatness, good pasting effect, strong antistatic property, short production time and high production efficiency.
Description
Technical Field
The invention belongs to the field of smart cards, and particularly relates to a smart card manufacturing process.
Background
The intelligent card has large capacity, the working principle of the intelligent card is similar to that of a microcomputer, and the intelligent card can realize multiple functions and is widely applied to the fields of data statistics storage, access security control, mobile payment, entry and exit control and the like. Generally, smart cards, which include user information and a small amount of security control information, are composed of a multi-layered structure in which internal components such as a circuit board are wrapped, and provide rigidity and protection required for the internal components through the multi-layered structure. The prior smart card manufacturing process has the following problems:
1) the existing card pressing process uses a cold pressing process, the surface flatness of the formed smart card is poor, the sticking effect of an upper substrate and a lower substrate is poor, the antistatic effect is poor, the time required by the card pressing process is long, and the production efficiency is low;
2) the existing cold pressing process has limitation on the materials of the upper substrate and the lower substrate, and some materials cannot be subjected to the cold pressing process (for example, PVC materials cannot be subjected to the cold pressing process).
Disclosure of Invention
The invention aims to provide a smart card manufacturing process, which aims to solve the technical problems that the smart card manufacturing process in the prior art is low in production efficiency, the manufactured smart card is poor in surface smoothness, the upper substrate and the lower substrate are poor in pasting effect, the antistatic effect is poor, the time required by a card pressing process is long, and the production efficiency is low.
In order to achieve the purpose, the invention adopts the technical scheme that: a manufacturing process of a smart card is provided, which comprises the following steps:
fixing a middle frame on one side of an upper substrate, pouring glue into a hollow cavity of the middle frame, and fixing a lower substrate on one side of the middle frame far away from the upper substrate;
respectively placing rigid plates on one side of the upper substrate far away from the middle frame and one side of the lower substrate far away from the middle frame;
and putting the assembled upper substrate, the middle frame, the lower substrate and the rigid plate into a laminating machine for hot pressing until the glue solution is completely cured.
Further, the temperature of the hot pressing is 60-80 ℃.
Further, the pressure of the hot pressing is 0-1 MPa.
Further, the rigid plate is a steel plate.
Further, before the middle frame is fixed on one side of the upper substrate, the circuit board is fixed on the upper substrate, the middle frame is fixed on one side of the upper substrate, on which the circuit board is fixed, and the circuit board is located in the hollow cavity of the middle frame.
Furthermore, a first indication position is arranged on the middle frame, and a second indication position matched with the first indication position to realize the positioning of the middle frame and the upper substrate is arranged on the upper substrate.
Further, the step of fixing the middle frame at one side of the upper substrate includes: and brushing glue on one side of the upper substrate, which is provided with the second indicating position, aligning the first indicating position with the second indicating position, and bonding the middle frame to the upper substrate.
Furthermore, a third indicating position is arranged on the middle frame, and a fourth indicating position which is matched with the third indicating position to realize the positioning of the middle frame and the lower substrate is arranged on the lower substrate; the step of fixing the lower substrate on the side of the middle frame far away from the upper substrate comprises the following steps: and brushing glue on one side of the lower substrate, which is provided with the fourth indication position, aligning the fourth indication position with the third indication position, and bonding the lower substrate on the middle frame.
Furthermore, a fourth indicating position which is matched with the first indicating position to realize the positioning of the middle frame and the lower substrate is arranged on the lower substrate; first instruction position is for locating through-hole on the center, second instruction position for print in the upper substrate is close to the wire frame of center one side, fourth instruction position for print in the infrabasal plate is close to the wire frame of center one side.
Further, the step of fixing the middle frame at one side of the upper substrate includes: brushing glue on one side of the upper substrate, which is provided with the second indicating position, aligning the first indicating position with the second indicating position, and bonding the middle frame to the upper substrate;
the step of fixing the lower substrate on the side of the middle frame far away from the upper substrate comprises the following steps: and brushing glue on one side of the lower substrate, which is provided with the fourth indicating position, aligning the fourth indicating position with the first indicating position, and bonding the lower substrate on the middle frame.
The manufacturing process of the smart card provided by the invention has the beneficial effects that: compared with the prior art, the manufacturing process of the smart card adopts a hot pressing process, utilizes the rigid plate to assist lamination, and has no limitation on the materials of the upper substrate and the lower substrate, so that the smart card has good surface flatness, good pasting effect, strong antistatic property, short production time and high production efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
FIG. 1 is a flow chart of a smart card manufacturing process provided by an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an upper substrate, a middle frame, a lower substrate and a rigid plate that are assembled before hot pressing in the smart card manufacturing process according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
1-an upper substrate; 2-middle frame; 3-lower substrate; 4-potting adhesive layer; 5-a circuit board; 6-rigid plate.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element.
It is to be understood that the terms "upper," "middle," "lower," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting.
Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", "third", "fourth" may explicitly or implicitly include one or more of the features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 and fig. 2, a manufacturing process of the smart card according to the present invention will now be described. The manufacturing process of the smart card comprises the following steps:
s1, fixing the middle frame 2 on one side of the upper substrate 1, filling glue solution into the hollow cavity of the middle frame 2, and fixing the lower substrate 3 on one side of the middle frame 2 far away from the upper substrate 1;
s2, respectively placing rigid plates 6 on the side of the upper substrate 1 away from the middle frame 2 and the side of the lower substrate 3 away from the middle frame 2;
s3, putting the assembled upper substrate 1, the middle frame 2, the lower substrate 3 and the rigid plate 6 into a laminating machine for hot pressing until the glue solution is completely cured; for convenience of description later, the assembled upper substrate 1, the middle frame 2 and the lower substrate 3 are referred to as card-making components for short, and after glue solution filled in the card-making components is cured, the smart card can be obtained;
s4, removing the rigid plate and blanking the smart card, which is an optional step. After the hot pressing is finished, the two rigid plates 6 are taken away, the intelligent card obtained through the hot pressing process can be taken out, if the appearance of the intelligent card needs to be adjusted, the hot-pressed intelligent card can be punched to obtain the intelligent card meeting the appearance requirements of customers.
Compared with the prior art, the manufacturing process of the smart card adopts a hot pressing process and utilizes the two rigid plates 6 to assist in lamination, on one hand, the materials of the upper substrate 1 and the lower substrate 3 are not limited, on the other hand, the card manufacturing assembly is uniformly extruded during lamination, the surface smoothness of the smart card is improved, the bonding effect of the pouring sealant layer 4 formed by curing glue solution on the upper substrate 1, the middle frame 2 and the lower substrate 3 is improved, the antistatic property is strong, on the other hand, the production time is shortened, and the production efficiency is improved.
Further, as a specific implementation manner of the manufacturing process of the smart card provided by the invention, the hot-pressing temperature in the step S3 is 60-80 ℃, so that the glue solution is cured more quickly, the efficiency of hot-pressing card manufacturing is improved, air can be exhausted, the problem that the structural stability of the smart card is affected by steam bubbles wrapped inside the glue solution is avoided, the adhesive force of the pouring sealant layer 4 formed by curing the glue solution on the upper substrate 1, the middle frame 2 and the lower substrate 3 is increased, the surface smoothness of the smart card is improved, and the antistatic capability of the smart card is improved. The hot pressing temperature in the present embodiment is preferably 70 ℃, and the smart card with the best overall performance can be obtained while considering the production efficiency.
Further, as a specific implementation manner of the manufacturing process of the smart card provided by the invention, the pressure of the hot pressing in the step S3 is 0-1MPa, which is beneficial to exhausting air and avoiding the influence of bubbles wrapped inside the glue solution on the structural stability of the smart card.
Further, as a specific implementation manner of the manufacturing process of the smart card provided by the invention, the rigid plate 6 can be made of steel plates, the steel plates have long service life, do not deform after long-term use, and do not deform when heated, so that the card-making components (namely the assembled upper substrate 1, the middle frame 2 and the lower substrate 3) positioned between the two steel plates can be ensured to be uniformly stressed during hot pressing, the surface flatness of the smart card is improved, and the rigid plate 6 can also be made of other materials which are not easily deformed when heated and pressed.
Further, as a specific embodiment of the manufacturing process of the smart card provided by the present invention, the circuit board 5 may be fixed on the upper substrate 1 before the lower substrate 3 is fixed on the side of the middle frame 2 away from the upper substrate 1, or the circuit board may be placed in the middle frame. Preferably, before the middle frame 2 is fixed on one side of the upper substrate 1, the circuit board 5 is fixed on the upper substrate 1, then the middle frame 2 is fixed on one side of the upper substrate 1, where the circuit board 5 is fixed, so that the circuit board 5 is located in the hollow cavity of the middle frame 2, and then glue is poured into the hollow cavity, so that the circuit board 5 is prevented from being out of position, and the structural stability of the smart card is improved.
Further, as a specific implementation manner of the smart card manufacturing process provided by the present invention, the flexible circuit board 5 may be selected as the circuit board 5, and the flexible circuit board 5 has certain flexibility, so that on one hand, the flexible circuit board is easier to fix, on the other hand, the flexible circuit board can withstand a certain degree of bending pressure, and the obtained smart card has a more stable and reliable structure.
Further, as a specific implementation manner of the smart card manufacturing process provided by the present invention, a first indication position is disposed on the middle frame 2, and a second indication position that cooperates with the first indication position to realize the positioning of the middle frame 2 and the upper substrate 1 is disposed on the upper substrate 1. Simple operation, it is just right through first instruction position and second instruction position, can carry out accurate location to upper substrate 1 and center 2 for the system card subassembly is easily assembled more, and production efficiency is higher. Preferably, the number of the first indicating bits and the number of the second indicating bits are at least two, and each first indicating bit is right opposite to the corresponding second indicating bit; therefore, at least two positions can be formed between the upper substrate 1 and the middle frame 2, so that the upper substrate 1 and the middle frame 2 can be positioned more quickly and accurately. Specifically, in both the first indication position and the second indication position, one of the first indication position and the second indication position may be a protrusion and the other one may be a concave hole, both the first indication position and the second indication position may be a through hole, both the first indication position and the second indication position may be a printed wire frame, and both the first indication position and the second indication position may be a through hole and the other one may be a printed wire frame.
Further, as a specific embodiment of the manufacturing process of the smart card provided by the present invention, the step of fixing the middle frame 2 on one side of the upper substrate 1 includes: and brushing glue on one side of the upper substrate 1 provided with the second indicating position, aligning the first indicating position with the second indicating position, and bonding the middle frame 2 to the upper substrate 1. One side of upper substrate 1 that is equipped with the second indication position has brushed gluey, place middle frame 2 on upper substrate 1 when second indication position and first indication position are aligned, can realize middle frame 2 and upper substrate 1 quick, accurate location, take place the off-position between upper substrate 1 and the middle frame 2 when tentatively bonding can also avoid the lamination, the location operation is more simple and convenient, do benefit to the qualification rate that improves the smart card, do benefit to and improve production efficiency, make card-making subassembly easily assemble more, production efficiency is higher.
Further, as a specific implementation manner of the smart card manufacturing process provided by the invention, a third indication position is arranged on the middle frame 2, and a fourth indication position which is matched with the third indication position to realize the positioning of the middle frame 2 and the lower substrate 3 is arranged on the lower substrate 3; simple operation, it is just right through fourth instruction position and third instruction position, can carry out accurate location to center 2 and infrabasal plate 3 for the system card subassembly is easily assembled more, and production efficiency is higher. Preferably, the number of the third indicating bits and the number of the fourth indicating bits are at least two, and each fourth indicating bit is respectively right opposite to the corresponding third indicating bit; thus, at least two positions can be formed between the lower substrate 3 and the middle frame 2, so that the lower substrate 3 and the middle frame 2 can be positioned more quickly and accurately. Specifically, in both the third indication position and the fourth indication position, one of the third indication position and the fourth indication position may be a protrusion and the other may be a concave hole, or both may be a through hole, or both may be a printed wire frame, or both may be a through hole and the other may be a printed wire frame, which can both realize the quick positioning of the third indication position and the fourth indication position.
Further, as a specific embodiment of the manufacturing process of the smart card provided by the present invention, the step of fixing the lower substrate 3 on the side of the middle frame 2 away from the upper substrate 1 includes: and brushing glue on one side of the lower substrate 3, which is provided with a fourth indicating position, aligning the fourth indicating position with the third indicating position, and bonding the lower substrate 3 on the middle frame 2. One side of base plate 3 that is equipped with the fourth instruction position has brushed glue down, place the center 2 with infrabasal plate 3 when fourth instruction position and third instruction position are aligned on, can realize the speed of infrabasal plate 3 and center 2, accurate location, take place the off-position between base plate 3 and the center 2 under preliminary bonding can also avoiding the lamination, the location operation is more simple and convenient, do benefit to the qualification rate that improves the smart card, do benefit to and improve production efficiency, make the card-making subassembly easily assemble more, production efficiency is higher.
Further, as a specific embodiment of the manufacturing process of the smart card provided by the present invention, if the first indication bit and the second indication bit are already set, the third indication bit may also be omitted (it can be understood that the first indication bit also plays a role of the third indication bit), and only the lower substrate 3 is provided with the fourth indication bit which cooperates with the first indication bit to realize the positioning of the middle frame 2 and the lower substrate 3; therefore, the first indication position and the third indication position are combined together, so that the working procedures are reduced, and the production efficiency is improved. Preferably, the first indicating position is a through hole formed in the middle frame 2, the second indicating position is a wire frame printed on the upper substrate 1 near the middle frame 2, and the fourth indicating position is a wire frame printed on the lower substrate 3 near the middle frame 2; so, through the through-hole (being first instruction position) that corresponds second instruction position and fourth instruction position simultaneously, can realize the location of upper substrate 1, center 2 and infrabasal plate 3, simple structure avoids offering too much through-hole and influencing the stability of center 2 on center 2.
Further, as a specific embodiment of the manufacturing process of the smart card provided by the present invention, the step of fixing the middle frame 2 on one side of the upper substrate 1 includes: brushing glue on one side of the upper substrate 1 provided with the second indicating position, aligning the first indicating position with the second indicating position, and bonding the middle frame 2 to the upper substrate 1; the step of fixing the lower substrate 3 on the side of the middle frame 2 away from the upper substrate 1 includes: and brushing glue on one side of the lower substrate 3, which is provided with a fourth indicating position, aligning the fourth indicating position with the first indicating position, and bonding the lower substrate 3 on the middle frame 2. One side of being equipped with the second indication position of last base plate 1 has brushed gluey, place middle frame 2 on upper substrate 1 with first indication position and second indication position alignment, can realize middle frame 2 with the upper substrate fast, accurate location, one side that base plate 3 was equipped with the fourth indication position has brushed gluey down, place middle frame 2 with infrabasal plate 3 when fourth indication position and third indication position alignment on, can realize infrabasal plate 3 and middle frame 2 fast, accurate location, positioning operation is more simple and convenient, do benefit to the qualification rate that improves the smart card, do benefit to and improve production efficiency, make system card subassembly easily assemble more, production efficiency is higher.
Further, as a specific embodiment of the manufacturing process of the smart card provided by the present invention, the first indication bits, the second indication bits and the fourth indication bits are all set to be four and distributed on four corners of the corresponding upper substrate 1, the middle frame 2 and the lower substrate 3, so that the upper substrate 1, the middle frame 2 and the lower substrate 3 are more easily and accurately positioned, and the production efficiency is high. The first indication bit, the second indication bit and the fourth indication bit are corresponding in outline shape, and specifically can be in a circular shape, a square shape, a triangular shape or other shapes, if the fourth indication bit is set in a printed wire frame mode, a portion, corresponding to the fourth indication bit, on the lower substrate 3 is transparent, so that the positioning conditions of the fourth indication bit and the first indication bit can be seen from one side, far away from the upper substrate 1, of the lower substrate 3 during assembly.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. The manufacturing process of the smart card is characterized by comprising the following steps:
fixing a middle frame on one side of an upper substrate, pouring glue into a hollow cavity of the middle frame, and fixing a lower substrate on one side of the middle frame far away from the upper substrate;
respectively placing rigid plates on one side of the upper substrate far away from the middle frame and one side of the lower substrate far away from the middle frame;
putting the assembled upper substrate, the middle frame, the lower substrate and the rigid plate into a laminating machine for hot pressing until glue solution is completely cured, wherein the hot pressing temperature is 60-80 ℃;
before the middle frame is fixed on one side of the upper substrate, a flexible circuit board is fixed on the upper substrate, the middle frame is fixed on one side of the upper substrate, on which the flexible circuit board is fixed, and the flexible circuit board is located in the hollow cavity of the middle frame.
2. The smart card manufacturing process of claim 1, wherein the pressure of the hot press is 0-1 MPa.
3. The smart card manufacturing process of claim 1, wherein the rigid plate is a steel plate.
4. The manufacturing process of the smart card according to claim 1, wherein a first indication position is provided on the middle frame, and a second indication position which cooperates with the first indication position to realize the positioning of the middle frame and the upper substrate is provided on the upper substrate.
5. The smart card manufacturing process of claim 4, wherein the step of fixing the middle frame at one side of the upper substrate comprises: and brushing glue on one side of the upper substrate, which is provided with the second indicating position, aligning the first indicating position with the second indicating position, and bonding the middle frame to the upper substrate.
6. The manufacturing process of the smart card according to claim 1, wherein a third indication position is provided on the middle frame, and a fourth indication position which cooperates with the third indication position to realize the positioning of the middle frame and the lower substrate is provided on the lower substrate; the step of fixing the lower substrate on the side of the middle frame far away from the upper substrate comprises the following steps: and brushing glue on one side of the lower substrate, which is provided with the fourth indication position, aligning the fourth indication position with the third indication position, and bonding the lower substrate on the middle frame.
7. The manufacturing process of the smart card according to claim 4, wherein a fourth indication bit is provided on the lower substrate for positioning the middle frame and the lower substrate in cooperation with the first indication bit; first instruction position is for locating through-hole on the center, second instruction position for print in the upper substrate is close to the wire frame of center one side, fourth instruction position for print in the infrabasal plate is close to the wire frame of center one side.
8. The smart card manufacturing process of claim 7, wherein the step of fixing the middle frame at one side of the upper substrate comprises: brushing glue on one side of the upper substrate, which is provided with the second indicating position, aligning the first indicating position with the second indicating position, and bonding the middle frame to the upper substrate;
the step of fixing the lower substrate on the side of the middle frame far away from the upper substrate comprises the following steps: and brushing glue on one side of the lower substrate, which is provided with the fourth indicating position, aligning the fourth indicating position with the first indicating position, and bonding the lower substrate on the middle frame.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710209626.7A CN107038474B (en) | 2017-03-31 | 2017-03-31 | Smart card manufacturing process |
| PCT/CN2018/078138 WO2018177087A1 (en) | 2017-03-31 | 2018-03-06 | Smart card manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710209626.7A CN107038474B (en) | 2017-03-31 | 2017-03-31 | Smart card manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107038474A CN107038474A (en) | 2017-08-11 |
| CN107038474B true CN107038474B (en) | 2019-12-20 |
Family
ID=59534707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710209626.7A Active CN107038474B (en) | 2017-03-31 | 2017-03-31 | Smart card manufacturing process |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107038474B (en) |
| WO (1) | WO2018177087A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107038474B (en) * | 2017-03-31 | 2019-12-20 | 深圳市文鼎创数据科技有限公司 | Smart card manufacturing process |
| CN111340169A (en) * | 2019-05-16 | 2020-06-26 | 深圳市文鼎创数据科技有限公司 | Smart card and smart card manufacturing process |
| CN111954377A (en) * | 2020-07-14 | 2020-11-17 | 深圳安博电子有限公司 | Chip card, packaging method and packaging equipment thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1222116A (en) * | 1996-06-17 | 1999-07-07 | 三菱电机株式会社 | Method for producing thin IC cards and construction thereof |
| CN1556499A (en) * | 2003-12-30 | 2004-12-22 | 上海东方磁卡工程有限公司 | Manufacturing method of non contact type intelligent low frequency card |
| CN102063631A (en) * | 2010-12-22 | 2011-05-18 | 上海浦江智能卡系统有限公司 | Method for manufacturing intelligent card with double-interface chip |
| CN103093271A (en) * | 2013-01-08 | 2013-05-08 | 上海浦江智能卡系统有限公司 | Double-interface intelligent card manufacture process and double-interface intelligent card |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1134551A (en) * | 1997-07-17 | 1999-02-09 | Seiko Epson Corp | Production of card type electronic device, heat welding device used therefor, and method for heat welding of adherend |
| US20080195817A1 (en) * | 2004-07-08 | 2008-08-14 | Super Talent Electronics, Inc. | SD Flash Memory Card Manufacturing Using Rigid-Flex PCB |
| CN105150613B (en) * | 2015-09-08 | 2020-12-15 | 苏州海博智能系统有限公司 | Lamination process method of electronic card |
| CN107038474B (en) * | 2017-03-31 | 2019-12-20 | 深圳市文鼎创数据科技有限公司 | Smart card manufacturing process |
-
2017
- 2017-03-31 CN CN201710209626.7A patent/CN107038474B/en active Active
-
2018
- 2018-03-06 WO PCT/CN2018/078138 patent/WO2018177087A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1222116A (en) * | 1996-06-17 | 1999-07-07 | 三菱电机株式会社 | Method for producing thin IC cards and construction thereof |
| CN1556499A (en) * | 2003-12-30 | 2004-12-22 | 上海东方磁卡工程有限公司 | Manufacturing method of non contact type intelligent low frequency card |
| CN102063631A (en) * | 2010-12-22 | 2011-05-18 | 上海浦江智能卡系统有限公司 | Method for manufacturing intelligent card with double-interface chip |
| CN103093271A (en) * | 2013-01-08 | 2013-05-08 | 上海浦江智能卡系统有限公司 | Double-interface intelligent card manufacture process and double-interface intelligent card |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018177087A1 (en) | 2018-10-04 |
| CN107038474A (en) | 2017-08-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107038474B (en) | Smart card manufacturing process | |
| US8181880B2 (en) | Combi-card and method for making the same | |
| JP5209602B2 (en) | Electronic embedded modules for electronic cards and electronic tags | |
| CN106980891B (en) | Smart card manufacturing assembly and smart card manufacturing process | |
| JP2009541993A (en) | Embedded electronic device and method for manufacturing an embedded electronic device | |
| CN106211564A (en) | A kind of flexible circuit panel element and ground connection steel disc attachment means and method | |
| WO2022047771A1 (en) | Flexible panel support structure, display device, and method for assembling flexible module | |
| EP3738078A1 (en) | Method for manufacturing a sim card and sim card | |
| CN206627988U (en) | Smart card fabrication component | |
| CN206480017U (en) | A kind of general radio frequency with tinfoil paper layer pays component | |
| JPS63185688A (en) | Manufacture of ic card | |
| CN219695774U (en) | Intelligent card | |
| CN210808045U (en) | Hot-pressing type flexible phase change soaking zone/plate based on polymer film | |
| JP4904647B2 (en) | Non-contact type IC recording medium manufacturing method | |
| JP5369496B2 (en) | Non-contact IC card manufacturing method | |
| CN210042449U (en) | FPC three-dimensional attaching mold | |
| CN210519090U (en) | High-precision adhesive tape sticking device | |
| CN217467680U (en) | Smart card | |
| CN213026290U (en) | Battery and electronic device | |
| CN206480018U (en) | A kind of general radio frequency pays component | |
| JPH0324383Y2 (en) | ||
| CN207528111U (en) | A kind of heat dissipation board fixing structure | |
| CN217902444U (en) | Anti metal electronic tags who conveniently bonds | |
| CN214395908U (en) | A heat-conducting glue printing jig for 5G communication product | |
| CN103050777B (en) | FPC (flexible printed circuit) antenna and assembly method for FPC antenna and mobile terminal casing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |