CN211858679U

CN211858679U - LED packaging structure and LED lamp

Info

Publication number: CN211858679U
Application number: CN202020830681.5U
Authority: CN
Inventors: 陈瑶新; 罗迪恬
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-05-18
Filing date: 2020-05-18
Publication date: 2020-11-03
Anticipated expiration: 2030-05-18

Abstract

An LED packaging structure and an LED lamp are provided, wherein the LED packaging structure comprises a packaging piece for packaging an LED chip; the packaging piece comprises an outer fixing piece, an inner fixing piece and a cover plate; the outer fixing piece is sleeved on the periphery of the cover plate and forms a cavity for containing the LED chip with the cover plate, and one end of the outer fixing piece is provided with a blocking part for preventing the cover plate from falling off; the other end of the outer fixing piece is a fixing part for fixing on the substrate; the inner fixing piece is positioned in the cavity and used for supporting the cover plate, and the outer fixing piece is matched with the inner fixing piece to limit the cover plate between the inner fixing piece and the blocking part; the LED chip is arranged on the substrate. Through setting up outer mounting to prevent through the portion of blockking on the outer mounting that the apron from droing, the cooperation of the portion of blockking and interior mounting plays mechanical fastening effect to the apron, makes the reliability of encapsulation higher, and has reduced the encapsulation cost.

Description

LED packaging structure and LED lamp

Technical Field

The invention relates to the technical field of packaging, in particular to an LED packaging structure and an LED lamp.

Background

An LED (semiconductor light emitting diode) package refers to a package of a light emitting chip, and the package of the LED is to provide sufficient protection to an internal chip, preventing the chip from failing due to long-term exposure or mechanical damage in the air, and improving the stability of the chip. The conventional LED package usually uses a cover made of transparent organic materials (such as epoxy and silicone), glass, especially quartz glass, to form a fixed connection with the substrate of the LED, so as to achieve the effect of packaging the LED chip.

The glass cover plate is usually fixed by bonding or welding. The glass cover plate and the substrate are directly bonded, the colloid is easy to age and lose efficacy due to ultraviolet irradiation, the glass cover plate falls off, and the reliability is poor. When the glass cover plate is fixed on the substrate or the frame fixedly connected with the substrate in a welding mode, a metal layer or other transition layers are required to be formed on the glass cover plate, the process difficulty is high, the yield is low, and the welding reliability is not guaranteed.

Therefore, the existing LED package is still to be improved.

Disclosure of Invention

The invention mainly solves the technical problem of providing an LED packaging structure and an LED lamp so as to ensure the packaging reliability.

According to a first aspect, an LED package structure includes a package for packaging an LED chip; the packaging piece comprises an outer fixing piece, an inner fixing piece and a cover plate; the outer fixing piece is sleeved on the periphery of the cover plate and forms a cavity for accommodating the LED chip with the cover plate, and one end of the outer fixing piece is provided with a blocking part for preventing the cover plate from falling off; the other end of the outer fixing piece is a fixing part for fixing on the substrate; the inner fixing piece is positioned in the cavity and used for supporting the cover plate, and the outer fixing piece is matched with the inner fixing piece to limit the cover plate between the inner fixing piece and the blocking part; the LED chip is arranged on the substrate.

In the LED packaging structure, the side wall of the outer fixing piece is used for surrounding the LED chip, and the blocking part is arranged at the top of the side wall and extends towards the cover plate direction to prevent the cover plate from falling off; the bottom of the side wall is a fixing part.

In the LED packaging structure, the blocking part is of a groove structure, and the cover plate is clamped in the groove.

In the LED package structure, the package further includes: the inner fixing piece is located in the cavity and used for supporting the cover plate, and the cover plate is limited between the inner fixing piece and the blocking portion.

In the LED packaging structure, the inner fixing piece is an annular table or a plurality of columns which are arranged by wrapping the LED chip.

In the LED packaging structure, the height of the inner fixing piece is equal to or larger than that of the LED chip.

In the LED packaging structure, the cavity is sealed; and a sealing layer is arranged between the outer edge of the cover plate and the outer fixing piece or between the outer edge of the cover plate and the inner fixing piece and used for ensuring the air tightness in the cavity.

In the LED packaging structure, the sealing layer is a glue layer or a welding layer.

The LED packaging structure further comprises the substrate and the LED chip; the LED chip is bonded or welded on the substrate; the substrate is further provided with: the first limiting groove is used for limiting the fixing part of the outer fixing piece, and the second limiting groove is used for limiting the inner fixing piece; the substrate is a ceramic substrate, a PCB substrate or a metal substrate; the outer fixing piece is a ceramic outer fixing piece, a plastic outer fixing piece, a metal outer fixing piece or an alloy outer fixing piece; the inner fixing piece is a ceramic inner fixing piece, a plastic inner fixing piece, a metal inner fixing piece or an alloy inner fixing piece; the cover plate is light-transmitting and is a light-transmitting glass cover plate, a light-transmitting plastic cover plate or a light-transmitting metal cover plate.

According to a second aspect, an embodiment provides an LED package structure comprising a package for packaging an LED chip; the packaging piece comprises an outer fixing piece and a cover plate; the outer fixing piece is sleeved on the periphery of the cover plate and forms a cavity for accommodating the LED chip with the cover plate; one end of the outer fixing piece is a blocking part for preventing the cover plate from falling off, and the other end of the outer fixing piece is a fixing part for fixing on the substrate; the LED chip is arranged on the substrate.

According to a third aspect, an embodiment provides an LED luminaire comprising the LED package structure as described above.

According to the LED packaging structure and the LED lamp, the cover plate is fixed through the outer fixing piece, the outer fixing piece prevents the cover plate from falling off through the blocking portion, the blocking portion is used for mechanically fixing the cover plate, the cover plate can be stably fixed on the outer fixing piece, and packaging reliability is guaranteed.

Drawings

Fig. 1 is a schematic view of a package structure according to an embodiment of the present invention;

fig. 2 is a schematic view of a package structure according to another embodiment of the present invention;

fig. 3 is a schematic view of a package structure according to another embodiment of the present invention;

fig. 4 is a top view of an external fixing member according to an embodiment of the present invention;

fig. 5 is a top view of an external fixing member according to an embodiment of the present invention;

fig. 6 is a top view of an inner fixing member according to an embodiment of the present invention;

fig. 7 is a top view of an inner fixing member according to another embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the following detailed description and accompanying drawings. Wherein like elements in different embodiments are numbered with like associated elements. In the following description, numerous details are set forth in order to provide a better understanding of the present application. However, those skilled in the art will readily recognize that some of the features may be omitted or replaced with other elements, materials, methods in different instances. In some instances, certain operations related to the present application have not been shown or described in detail in order to avoid obscuring the core of the present application from excessive description, and it is not necessary for those skilled in the art to describe these operations in detail, so that they may be fully understood from the description in the specification and the general knowledge in the art.

Furthermore, the features, operations, or characteristics described in the specification may be combined in any suitable manner to form various embodiments. Also, the various steps or actions in the method descriptions may be transposed or transposed in order, as will be apparent to one of ordinary skill in the art. Thus, the various sequences in the specification and drawings are for the purpose of describing certain embodiments only and are not intended to imply a required sequence unless otherwise indicated where such sequence must be followed.

The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings).

The chip in the utility model refers to the LED chip, semiconductor emitting diode promptly.

In the existing LED packaging, the cover plate is easy to age and fall off due to bonding, so that the packaging reliability is low; and the apron has made the metallization layer after, and again with the metal frame welding, this kind of mode is with high costs not only, moreover because the LED chip is small, the metal frame is corresponding also less, leads to the welding degree of difficulty big, and it is not high to think that welding quality is not high to lead to the apron to fix insecure, the encapsulation reliability just also is low.

In the embodiment of the invention, the cover plate is fixed by adopting a mechanical fixing mode, and a gluing or welding method is avoided, so that the reliability of fixing the cover plate is improved, and the packaging cost is reduced.

Referring to fig. 1, the package structure provided in this embodiment includes: substrate 10, chip 20 and package 30.

The package 30 is used to package the LED chip.

The substrate 10 is used for carrying the chip 20, that is, a substrate for adhering or soldering the chip 20, and the substrate 10 may be a ceramic substrate, a PCB substrate, or a metal substrate. The substrate 10 may be provided with a metal layer for ensuring electrical connection between one or more chips.

One or more chips 20 are mounted on the substrate 10, and the chips 20 in this embodiment are LED chips that can emit visible light, ultraviolet light, or near-infrared light.

The package 30 includes an external fixing member 31 (e.g. a housing) and a cover plate 32, the external fixing member 31 is disposed on an outer edge side of the cover plate 32, the external fixing member 31 and the cover plate 32 form a cavity 40 for accommodating the chip, in other words, the package 30 is disposed on the chip 20 to protect the chip.

One end of the outer fixing member 31 is a blocking portion for preventing the cover plate 32 from falling off, the other end of the outer fixing member 31 is a fixing portion for fixing with the substrate 10, and due to the matching of the blocking portion and the cover plate 32, the cavity 40 formed by the outer fixing member 31 and the cover plate 32 covers the outer side of the chip 20, so that the purpose of packaging is achieved, methods such as gluing or welding are avoided, the packaging cost is reduced, and the packaging stability is improved.

Since it is necessary to ensure light transmittance when the LED semiconductor light emitting diode is packaged, the material having a good light transmittance is glass or quartz glass, and thus the cover plate may be a light-transmissive glass cover plate, a light-transmissive plastic cover plate, or the like. The glass may specifically be quartz glass. Of course, the cover plate may also be a light-transmitting metal cover plate, for example, a light-transmitting hole is provided on the metal cover plate to realize light transmission. In the prior art, when a cover plate made of a glass cover plate or a metal cover plate is directly sealed on a substrate, the cover plate needs to be made into a special shape, such as a shape with a concave cavity, and the process cost is high. And the utility model discloses owing to be provided with outer mounting 31, apron 21 can be planar, low in production cost. Of course, the cover plate 21 may be a curved or multi-faceted lens in other embodiments.

The material of the cover plate 32 in this embodiment is quartz glass.

In some embodiments, the material of the cover plate 32 may also be metal, if desired.

Referring to fig. 4 and fig. 5 in combination, fig. 4 is a top view of the outer fixing member 31 provided in this embodiment, the outer fixing member 31 is a ring structure capable of surrounding the chip 20, wherein a cross section of an inner wall of the outer fixing member 31 may be circular, square, or other shapes capable of surrounding the chip 20.

One end (shown as a top end) of the outer fixing member 31 is a stopper 311a, and the other end (shown as a bottom end) thereof is a fixing portion 311b for fixedly connecting to the substrate 10. Specifically, in the embodiment shown in fig. 1, the side wall of the external fixing member 31 is used to surround the chip 20, and the blocking portion 311a is disposed on the top of the side wall of the external fixing member 31 and extends toward the cover plate 32 to prevent the cover plate 32 from falling off; the bottom of the sidewall of the outer fixing member 31 is a fixing portion 311 b. In other words, the stop portion 311a is substantially perpendicular to the sidewall of the outer fixing member 31, and is located above the outer edge of the cover plate 32 to prevent the cover plate 32 from falling off. In fig. 1, the cross section of the side wall of the external fixing member 31 and the blocking portion 311a is inverted L-shaped, the cover plate 32 is disposed at the inner corner formed by the side wall of the external fixing member 31 and the blocking portion 311a, so that the cover plate 32 can be well blocked from falling off, the cavity 40 formed by the cover plate 32 and the external fixing member 31 can accommodate the chip 20, in this embodiment, the bottom of the cover plate 32 is supported by the chip 20, so that the cover plate 32 is firm and will not loosen.

Referring to fig. 2, the embodiment shown in fig. 2 is different from that shown in fig. 1 in that the structure of the blocking portion 313a is different, in the embodiment shown in fig. 2, the blocking portion 313a is a groove structure, the cover plate 32 is clamped in the groove, so that the cover plate 32 is fixed on the external fixing member 31, and forms a cavity 40 in cooperation with the external fixing member 31, and the cavity 40 covers the chip 20, thereby achieving the purpose of packaging. The height of the groove structure may be higher than the height of the chip 20, so as to avoid the cover plate 32 from contacting the chip 20, which is beneficial for protecting the chip 20.

Referring to fig. 3, the embodiment shown in fig. 3 is added with an inner fixing member 33 (e.g., an inner frame) on the basis of the embodiment of fig. 1, i.e., the package member includes the outer fixing member 31, the cover plate 32 and the inner fixing member 33 as described above. The inner fixing member 33, the outer fixing member 31 and the cover plate 32 are adapted in size. The inner fixing member 33 is located in a cavity 40 formed by the outer fixing member 31 and the cover plate 32. The top of the inner fixing member 33 is pressed against the outer edge of the bottom of the cover plate 32, and the inner fixing member 33 is engaged with the outer fixing member 31 to fix the cover plate 32. In other words, the inner fixing member 33 and the stopping portion 313a clamp the outer edge of the cover plate 32 to limit the displacement of the cover plate 32 in the vertical direction, and the side wall of the outer fixing member 31 limits the displacement of the cover plate 32 in the horizontal direction, which is equivalent to clamping the cover plate 32, so that the structure is simple, the fixing is firm, and the installation is convenient. Therefore, the fixing mode provided by the embodiment can be well suitable for LED packaging, particularly packaging of UV light LED chips.

Specifically, referring to fig. 6 and 7 in combination, the inner fixing member 33 is an annular table disposed around the chip, and the section of the inner wall of the inner fixing member 33 may be circular, square, or other shapes capable of surrounding the chip 20.

In other embodiments, the inner fixing member 33 may be a plurality of pillars disposed around the chip, as long as the pillars can support the cover plate 32 and limit the cover plate 32 between the inner fixing member 33 and the blocking portion 312 a.

It should be noted that the height of the inner fixing member 33 is not less than the height of the chip 20, so as to avoid the chip 20 contacting the cover plate 32, which is beneficial for protecting the chip 20.

In some embodiments, the outer fixing member 31 may be integrally formed, and the inner fixing member 33 may also be integrally formed.

The external fixing member 31 may be a ceramic external fixing member, a plastic external fixing member, a metal external fixing member (e.g., a copper external fixing member, an iron external fixing member, a nickel external fixing member, etc.), or an alloy external fixing member (e.g., a kovar alloy external fixing member, an iron-nickel alloy external fixing member, etc.). Similarly, the inner fixing member 33 can be a ceramic outer fixing member, a plastic outer fixing member, a metal outer fixing member (e.g., a copper outer fixing member, an iron outer fixing member, a nickel outer fixing member, etc.), or an alloy outer fixing member (e.g., a kovar outer fixing member, an iron-nickel outer fixing member, etc.).

It should be noted that the fixing portion of the outer fixing member 31 may be fixed on the substrate 10 by glue bonding or soldering, laser welding or resistance welding, or may be sleeved around the substrate 10 by mechanical fixing, specifically, the fixing portion of the outer fixing member 31 may be provided with a groove, a protrusion of the substrate is provided at a corresponding position, the outer fixing member 31 is clamped on the substrate 10 by the matching of the groove and the protrusion, and glue and the like may be added to increase stability, so as to achieve the fixing effect.

Of course, a first limiting groove (not shown) and a second limiting groove (not shown) may be disposed on the substrate 10, the first limiting groove is used for limiting the fixing portion of the external fixing member 31, for example, the first limiting groove is used for clamping the fixing portion, and glue may be disposed in the first limiting groove (the fixing portion is less irradiated by light, and there is no need to worry about aging), so that the fixing portion and the fixing portion are more firmly fixed. The positioning and installation of the outer fixing member 31 are facilitated by the limiting of the first limiting groove. The second limiting groove is used for limiting the inner fixing piece; for example, the second limit groove is clamped with the bottom of the inner fixing piece, and glue can be arranged in the second limit groove (the bottom of the inner fixing piece is less irradiated by light, so that the aging problem is not needed), so that the inner fixing piece and the outer fixing piece are fixed more firmly. The inner fixing piece is convenient to position and mount through the limiting of the second limiting groove.

The cavity is sealed, and in some embodiments, a sealing layer may be further disposed between the outer edge of the cover plate 32 and the outer fixing member 31, and/or between the outer edge of the cover plate 32 and the inner fixing member 33, so as to ensure airtightness inside the cavity 40 and prevent moisture or other harmful gases from entering the cavity 40 and affecting the lifetime of the chip; the sealing layer is a glue layer or a welding layer. For example, glue may be disposed between the outer edge of the cover plate 32 and the outer fixing member 31, glue may be disposed between the outer edge of the cover plate 32 and the inner fixing member 33, and glue may be disposed between the outer edge of the cover plate 32 and the outer fixing member 31 and between the outer edge of the cover plate 32 and the inner fixing member 33 to ensure the air tightness of the cavity. Besides glue, it is also possible to secure the airtightness inside the cavity 40 by providing solder, i.e., by welding between the outer edge of the cover plate 32 and the outer fixture 31 and/or between the outer edge of the cover plate 32 and the inner fixture 33, to secure the airtightness inside the cavity 40.

The utility model also provides a LED lamp, and this LED lamp includes above-mentioned arbitrary packaging structure, lamps and lanterns casing and is used for the power supply circuit for the LED chip power supply, because above-mentioned packaging structure has used mechanical fixation's method, so, this kind of LED lamp can not take place to come unstuck because of the ultraviolet ray shines for a long time and ageing such as become flexible, and then makes the life of this LED lamp improve.

The present invention has been described in terms of specific examples, which are provided to aid understanding of the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.

Claims

1. An LED packaging structure is characterized by comprising a packaging piece used for packaging an LED chip; the packaging piece comprises an outer fixing piece, an inner fixing piece and a cover plate; the outer fixing piece is sleeved on the periphery of the cover plate and forms a cavity for accommodating the LED chip with the cover plate, and one end of the outer fixing piece is provided with a blocking part for preventing the cover plate from falling off; the other end of the outer fixing piece is a fixing part for fixing on the substrate; the inner fixing piece is positioned in the cavity and used for supporting the cover plate, and the outer fixing piece is matched with the inner fixing piece to limit the cover plate between the inner fixing piece and the blocking part; the LED chip is arranged on the substrate.

2. The LED package structure of claim 1, wherein the side wall of the outer fixing member is configured to surround the LED chip, and the blocking portion is disposed on the top of the side wall and extends toward the cover plate to prevent the cover plate from falling off; the bottom of the side wall is a fixing part.

3. The LED package structure of claim 1, wherein the blocking portion is a groove structure, and the cover plate is clamped in the groove.

4. The LED package structure of claim 1, wherein said inner mount is an annular ledge or a plurality of posts disposed around said LED chip.

5. The LED package structure of claim 1, wherein the height of the inner mount is equal to or greater than the height of the LED chip.

6. The LED package structure of claim 1, wherein said cavity is sealed; and a sealing layer is arranged between the outer edge of the cover plate and the outer fixing piece or between the outer edge of the cover plate and the inner fixing piece and used for ensuring the air tightness in the cavity.

7. The LED package structure of claim 6, wherein the sealing layer is a glue layer or a solder layer.

8. The LED package structure of claim 1, further comprising said substrate and said LED chip; the LED chip is bonded or welded on the substrate; the substrate is further provided with: the first limiting groove is used for limiting the fixing part of the outer fixing piece, and the second limiting groove is used for limiting the inner fixing piece; the substrate is a ceramic substrate, a PCB substrate or a metal substrate; the outer fixing piece is a ceramic outer fixing piece, a plastic outer fixing piece, a metal outer fixing piece or an alloy outer fixing piece; the inner fixing piece is a ceramic inner fixing piece, a plastic inner fixing piece, a metal inner fixing piece or an alloy inner fixing piece; the cover plate is light-transmitting and is a light-transmitting glass cover plate, a light-transmitting plastic cover plate or a light-transmitting metal cover plate.

9. An LED packaging structure is characterized by comprising a packaging piece used for packaging an LED chip; the packaging piece comprises an outer fixing piece and a cover plate; the outer fixing piece is sleeved on the periphery of the cover plate and forms a cavity for containing the LED chip with the cover plate, one end of the outer fixing piece is provided with a blocking part for preventing the cover plate from falling off, and the other end of the outer fixing piece is provided with a fixing part for fixing on the substrate; the LED chip is arranged on the substrate.

10. An LED lamp comprising the LED package structure of any one of claims 1-8.