CN114267765A - LED packaging device - Google Patents
LED packaging device Download PDFInfo
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- CN114267765A CN114267765A CN202111479836.0A CN202111479836A CN114267765A CN 114267765 A CN114267765 A CN 114267765A CN 202111479836 A CN202111479836 A CN 202111479836A CN 114267765 A CN114267765 A CN 114267765A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims description 26
- 239000000428 dust Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 241000255925 Diptera Species 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims 1
- 230000001846 repelling effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 13
- 230000003139 buffering effect Effects 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 description 5
- 239000000077 insect repellent Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
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Abstract
The invention relates to the technical field of LED packaging, and particularly discloses an LED packaging device which comprises a packaging shell, a substrate and a packaging piece, wherein a plurality of substrates are arranged in the packaging shell, LED chips are arranged on the substrates, the packaging piece wraps the outer sides of the LED chips, a plurality of first grooves are symmetrically formed in the left side and the right side of the interior of the packaging shell, the left side and the right side of each substrate are inserted into the corresponding first groove, and a rubber pad is tightly attached to the inner wall of each first groove; according to the LED packaging structure, the LED chip is placed on the substrate, the packaging piece is wrapped on the LED chip, and the substrate is inserted into the first groove provided with the rubber pad in the transportation process, so that the LED chip moves along with the movement of the packaging shell, the rubber pad has certain buffering capacity, the shaking generated in the movement process of the LED chip can be reduced, the corner damage and the direct cracking of the LED chip are avoided, the LED chip is well stored, and the LED chip can normally work.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to an LED packaging device.
Background
The rapid development of LED technology not only makes the luminous efficiency of LED chips exceed that of incandescent lamps, and the light intensity reaches candle level, but also makes the light source color of LED chips cover the whole visible spectrum range from red to blue, and this technological revolution from indicator lamp level to exceeding light source level makes LED light sources get large-scale application in the lighting market. The LED package is a package of a light emitting chip, and is significantly different from an integrated circuit package. The encapsulation of the LED is required not only to protect the wick but also to be transparent, so that the encapsulation of the LED has special requirements for the encapsulation material. Generally, the function of the package is to provide sufficient protection for the chip, and to prevent the chip from being damaged by long-term exposure or mechanical damage in the air, so as to improve the stability of the chip.
An LED packaging device developed in the prior art, such as a packaging device of CN708493316A, is characterized in that a mounting groove for placing an LED chip is arranged on the side wall of one side of a substrate, a first air inlet hole is arranged between two adjacent mounting grooves, the lower end of the mounting groove is provided with a heat conducting piece for the LED chip and a heat conducting rod, the heat conducting rod is placed in the substrate with a hollow structure, the side wall of the heat conducting rod is provided with a second air inlet hole, and the bottom end of the heat conducting rod is provided with an air outlet hole, when the LED chip works, the heat generated by the LED chip is transferred to the heat conducting piece, the heat conducting piece drives airflow to flow to the air outlet hole through the second air inlet hole of the heat conducting rod, so that the heat generated by the LED chip is timely dissipated out, but the LED packaging device has the following defects in the use process, because the LED chip is thin, the corner is easy to be damaged or directly cracked, and the LED chip can not be normally used due to mechanical damage, the stability of the LED chip is poor.
Disclosure of Invention
The present invention is directed to an LED package device to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a LED packaging device, includes packaging shell, base plate and packaging part, packaging shell is formed by the concatenation of polylith transparent glass board, packaging shell's inside is provided with the polylith base plate, the intermediate position of base plate upper surface is provided with solid brilliant district, and hugs closely at the intermediate position in solid brilliant district and be provided with the LED chip, the outside parcel of LED chip has the packaging part, a plurality of first recesses have been seted up to the inside left and right sides symmetry of packaging shell, the left and right sides of base plate all inserts in the first recess, hug closely on the inner wall of first recess and be provided with the rubber pad, the below of base plate is provided with heat abstractor.
As a further scheme of the invention, each surface of the packaging shell is provided with a plurality of supporting blocks, the outer sides of the supporting blocks are provided with elastic pieces in a clinging manner, and gaps of the packaging shell are provided with sealing glue.
As a further scheme of the present invention, a second groove is formed at the edge of the periphery of the substrate, a plurality of protrusions are arranged on the upper surface of the substrate, the edge of the bottom of the package is inserted into the second groove, and the bottom of the package is clamped with the protrusions.
As a further aspect of the present invention, the heat dissipation device comprises a heat conduction sheet, a plurality of heat transfer rods and a plurality of heat dissipation fins, wherein the top of the heat conduction sheet is tightly attached to the lower surface of the substrate, the heat dissipation fins are located below the heat conduction sheet, the plurality of heat transfer rods are located between the heat conduction sheet and the heat dissipation fins, and the upper and lower ends of the heat transfer rods are respectively and fixedly connected to the heat conduction sheet and the heat dissipation fins.
As a further solution of the present invention, the upper surface of the package housing is provided with a plurality of air inlets, the lower surface of the package housing is provided with air outlets at positions corresponding to the air inlets, the substrate, the package member and the heat dissipation device are provided with through holes at positions corresponding to the air inlets, and the air inlets are provided with fans.
As a further scheme of the invention, the air inlet and the air outlet are also provided with dust screens, the inner walls of the air inlet and the air outlet are provided with mosquito repellent strips in a close contact manner, the outer sides of the air inlet and the air outlet are provided with annular grooves, and the dust screens are inserted into the annular grooves.
As a further scheme of the present invention, a positive electrode region and a negative electrode region are disposed on the left side of the die attach region, the positive electrode of the LED chip is electrically connected to the positive electrode region, and the negative electrode of the LED chip is connected to the negative electrode region.
As a further scheme of the present invention, a storage battery is disposed in the middle of the bottom of the package housing, a microprocessor is disposed on the right side of the storage battery, a temperature sensor is disposed on the front side of the LED chip, and an indicator lamp is disposed on the right side of the temperature sensor.
In a still further aspect of the present invention, a waterproof layer is disposed at a connection portion between the substrate and the package, and an electrostatic shielding layer is disposed to be in close contact with an outer side of the waterproof layer.
As a further scheme of the present invention, a cover plate is disposed on a front surface of the package housing, a latch is disposed at a middle position above the cover plate, and a sealing pad is disposed at an edge of an inside of the cover plate in a close-fitting manner.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the LED chip is placed on the die bonding area, the packaging part is wrapped on the LED chip, and the substrate is inserted into the first groove provided with the rubber pad in the transportation process, so that the LED chip moves along with the movement of the packaging shell, the rubber pad has certain buffering capacity, the shaking generated in the movement process of the LED chip can be reduced, the corner damage and the direct cracking of the LED chip are avoided, the LED chip is well stored, the normal work of the LED chip is ensured, and the LED chip has strong stability.
2. According to the LED chip packaging structure, the supporting block is arranged on the packaging shell, the elastic piece is arranged on the outer side of the supporting block, the supporting block can avoid violent collision between two adjacent packaging shells in the transportation process of the LED chip, the elastic piece can weaken the buffer force of collision of the two adjacent packaging shells to cause the packaging shells to break, the packaging pieces and the LED chip cannot be protected continuously, the possibility of mechanical damage of the LED chip is increased, and the service life of the LED chip is prolonged.
Drawings
FIG. 1 is a schematic diagram of an LED package device;
FIG. 2 is a schematic cross-sectional view of an LED package device;
FIG. 3 is an enlarged view of a portion of the structure at A in FIG. 2;
FIG. 4 is a schematic view of the internal structure of the air inlet;
FIG. 5 is a schematic view of a top surface plan view of a substrate;
FIG. 6 is a schematic view of the internal structure of the heat dissipation device;
fig. 7 is a schematic perspective view of the cover plate.
In the figure: 1. a package housing; 101. a first groove; 102. a rubber pad; 2. a substrate; 201. a die bonding area; 202. an LED chip; 203. a second groove; 204. a protrusion; 3. a package; 4. a heat sink; 401. a heat conductive sheet; 402. a heat transfer rod; 403. a heat sink; 5. a support block; 501. an elastic member; 6. sealing glue; 7. an air inlet; 701. a fan; 8. an air outlet; 9. a through hole; 10. a dust screen; 11. mosquito repellent strips; 12. an annular groove; 13. a positive electrode region; 14. a negative electrode region; 15. a storage battery; 16. a microprocessor; 17. a temperature sensor; 18. an indicator light; 19. a waterproof layer; 20. an electrostatic shielding layer; 21. a cover plate; 22. locking; 23. and a gasket.
Detailed Description
Referring to fig. 1 to 7, in the embodiment of the present invention, an LED package device includes a package housing 1, a substrate 2, and a package 3, where the package housing 1 is formed by splicing a plurality of transparent glass plates, on one hand, a worker can observe a working state of an indicator 18 through the transparent glass plates to determine a working state of an LED chip 202, and on the other hand, can ensure that the package 3 has good light extraction efficiency, so that the packaged LED chip 202 has good light emitting efficiency, the package housing 1 is internally provided with the plurality of substrates 2, a die bonding region 201 is disposed at a middle position of an upper surface of the substrate 2, the LED chip 202 is closely attached to the middle position of the die bonding region 201, the package 3 is wrapped outside the LED chip 202, the package housing 1 is symmetrically provided with a plurality of first grooves 101 at left and right sides, the substrate 2 is inserted into the first grooves 101, the inner wall of the first groove 101 is provided with the rubber pad 102 in a clinging mode, in the transportation process, the substrate 2 is inserted into the first groove 101 provided with the rubber pad 102, the LED chip 202 moves along with the movement of the packaging shell 1, the rubber pad 102 has certain buffering capacity, the shaking generated in the moving process of the LED chip 202 can be reduced, the corner damage and direct fragmentation of the LED chip 202 are avoided, the LED chip 202 is well stored, the LED chip 202 can normally work, the LED chip 202 has high stability, and the heat dissipation device 4 is arranged below the substrate 2.
In fig. 1, each surface of the package housing 1 is provided with a plurality of supporting blocks 5, and an elastic member 501 is tightly attached to the outer side of each supporting block 5, a gap of the package housing 1 is provided with a sealant 6, the transparent glass plates of the package housing 1 can be firmly adhered together by the sealant 6, so that the transparent glass plates are prevented from scattering, in the transportation process of the LED chip, the supporting blocks 5 can avoid violent collision between two adjacent package housings 1, the elastic member 501 can weaken the buffer force of collision between two adjacent package housings 1, and the package housing 1 is broken, so that the package housing 3 and the LED chip 202 cannot be continuously protected, the possibility of mechanical damage of the LED chip 202 is increased, and the service life of the LED chip 202 is prolonged.
In fig. 2, fig. 3 and fig. 5, a second groove 203 is formed in the periphery of the substrate 2, a plurality of protrusions 204 are arranged on the upper surface of the substrate 2, the edge of the bottom of the package 3 is inserted into the second groove 203, the bottom of the package 3 is connected with the protrusions 204 in a clamping manner, so that the adhesion of the package 3 is increased, a gap is formed between the package 3 and the substrate 2 due to vibration in the transportation or transmission process of the package 3, and the package 3 is seriously detached, so that the good packaging of the LED chip 202 is ensured, and the service life of the LED chip 202 is further prolonged.
In fig. 2 and 6, the heat dissipation device 4 is composed of a heat conduction plate 401, a plurality of heat transfer rods 402 and a plurality of heat dissipation fins 403, the top of the heat conduction plate 401 is closely attached to the lower surface of the substrate 2, the plurality of heat dissipation fins 403 are located below the heat conduction plate 401, the plurality of heat transfer rods 402 are located between the heat conduction plate 401 and the plurality of heat dissipation fins 403, the upper end and the lower end of each heat transfer rod 402 are respectively and fixedly connected to the heat conduction plate 401 and the plurality of heat dissipation fins 403, the heat conduction plate 401 can quickly conduct heat generated by the LED chips 202 to the upper end, and the heat generated by the LED chips 202 is transferred to the heat dissipation fins 403 through the heat transfer rods 402, so that the heat generated by the LED chips 202 is dissipated in time.
In fig. 1, 2, 4 and 5, a plurality of air inlets 7 are formed in the upper surface of the package housing 1, air outlets 8 are formed in the lower surface of the package housing 1 and are opposite to the air inlets 7, through holes 9 are formed in the positions, opposite to the air inlets 7, of the substrate 2, the package 3 and the heat dissipation device 4, a fan 701 is arranged on the air inlets 7, the fan 701 is controlled to work, cold air is sucked from the air inlets 7 and exhausted from the air outlets 8, the flowing of air inside the package housing 1 is achieved, and therefore heat generated by the LED chips 202 is timely dissipated, the temperature junction of the LED chips 202 is reduced, the service life of the LED chips 202 is prolonged, and the use cost of the LED package device is reduced.
In fig. 1, 2 and 4, the air inlet 7 and the air outlet 8 are further provided with dust screens 10, the inner walls of the air inlet 7 and the air outlet 8 are provided with mosquito repellent strips 11 in a close contact manner, the dust screen 10 and the mosquito repellent strip 11 can effectively prevent dust and mosquitoes outside the packaging shell 1 from entering the packaging shell 1 in the air flowing process, the components inside the package housing 1 are damaged to an unacceptable extent, thereby affecting the normal operation of the LED chip 202, annular grooves 12 are formed in the outer sides of the air inlet 7 and the air outlet 8, the dust screen 10 is inserted into the annular grooves 12, in the long-time working process of the dust screen 10, the surface of the dust screen 10 may be adsorbed with a large amount of dirt, which may affect the air flow efficiency of the air inlet 7 and the air outlet 8, thereby affecting the heat dissipation efficiency of the whole device.
In fig. 5, a positive electrode region 13 and a negative electrode region 14 are disposed on the left side of the die bonding region 201, the positive electrode of the LED chip 202 is electrically connected to the positive electrode region 13, the negative electrode of the LED chip 202 is connected to the negative electrode region 14, and the LED chip 202 is electrically connected to form a closed loop through the positive electrode region 13 and the negative electrode region 14, so that the LED chip 202 can normally operate.
In fig. 2 and 5, a storage battery 15 is disposed at the middle position of the bottom of the package housing 1, a microprocessor 16 is disposed at the right side of the storage battery 15, a temperature sensor 17 is disposed at the front side of the LED chip 202, an indicator light 18 is disposed at the right side of the temperature sensor 17, the temperature sensor 17 and the indicator light 18 are electrically connected to the microprocessor 16, the temperature sensor 17 includes an optical system, a thermal surface resistor and a conversion circuit, infrared light is emitted through the optical system, the infrared light is refracted and reflected in the air and finally irradiates on the thermistor, the temperature of the thermistor changes with the refractive index of the emitted light and is converted into a thermistor resistance value, the thermistor resistance value changes to reflect the temperature change of the LED chip 202, and the conversion circuit converts the resistance value into an electrical signal to be transmitted to the microprocessor 16, the microprocessor 16 analyzes and processes the electrical signal, and transmits the processed electrical signal to the indicator light 18 and the fan 701, when the temperature of the LED chip 202 is normal, it indicates that the LED chip 202 is in a normal working state, the temperature of the LED chip 202 is stable, at this time, the indicator light 18 is displayed as a green light, the fan 701 keeps a normal rotation speed, and the whole device maintains a normal heat dissipation efficiency, when the temperature of the LED chip is too high, it indicates that the LED chip 202 is in an abnormal working state, at this time, the indicator light 18 is bright red, the normal rotation speed of the fan 701 cannot meet the heat dissipation requirement of the whole device, the rotation speed of the fan 701 needs to be increased, the air flowing speed inside the package housing 1 is increased, thereby the heat dissipation efficiency inside the package housing 1 is increased, the temperature of the LED chip 202 is rapidly reduced, and the over-high temperature of the LED chip 202 is avoided, the LED chip 202 is burned out, and the operation of the LED chip 202 can be suspended under necessary conditions, so as to avoid the continuous heat generation of the LED chip 202, thereby further prolonging the service life of the LED chip 202.
In fig. 3 and 5, a waterproof layer 19 is disposed at a connection position between the substrate 2 and the package member 3, and an electrostatic shielding layer 20 is disposed on an outer side of the waterproof layer 19 in a close contact manner, the waterproof layer 19 can effectively prevent water vapor in air from entering the LED chip 202, so that a circuit on the LED chip 202 is prevented from being damaged due to moisture, the service life of the LED chip is further prolonged, the electrostatic shielding layer 20 can effectively ensure that the LED chip 202 does not interfere with an external electromagnetic field, the LED chip 202 can further work normally, and meanwhile, an electromagnetic field generated in a working process of the LED chip 202 cannot affect normal work of other electronic products outside the package member 3.
In fig. 1 and 7, a cover plate 21 is disposed on a front surface of the package housing 1, a latch 22 is disposed at a middle position above the cover plate 21, a gasket 23 is disposed at an edge inside the cover plate 21 in a close contact manner, when the LED chip needs to be inspected and maintained, the latch 22 is unscrewed, the cover plate 21 is opened, and the substrate 2 is pulled out from the first groove 101, in a normal state. The cover plate 21 covers the packaging shell 1 tightly, the sealing gasket 23 can ensure that the packaging shell 1 and the cover plate 21 have good sealing performance, dust and water vapor in the outside air can not enter the LED chip through a gap between the packaging shell 1 and the cover plate 21, and the circuit on the LED chip 202 is prevented from being corroded to be damaged, so that the normal work of the LED chip 202 is prevented from being influenced.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention are equivalent to or changed within the technical scope of the present invention.
Claims (10)
1. An LED packaging device comprises a packaging shell (1), a substrate (2) and a packaging piece (3), it is characterized in that the packaging shell (1) is formed by splicing a plurality of transparent glass plates, a plurality of substrates (2) are arranged in the packaging shell (1), a solid crystal area (201) is arranged in the middle position of the upper surface of each substrate (2), and an LED chip (202) is closely arranged at the middle position of the die bonding area (201), the outer side of the LED chip (202) is wrapped with a packaging piece (3), the left side and the right side of the interior of the packaging shell (1) are symmetrically provided with a plurality of first grooves (101), the left and right sides of the base plate (2) are inserted into the first groove (101), a rubber pad (102) is arranged on the inner wall of the first groove (101) in a clinging mode, and a heat dissipation device (4) is arranged below the base plate (2).
2. The LED packaging device as claimed in claim 1, wherein a plurality of support blocks (5) are disposed on each surface of the packaging casing (1), an elastic member (501) is disposed on the outer side of each support block (5), and a sealant (6) is disposed in the gap of the packaging casing (1).
3. The LED packaging device according to claim 1, wherein a second groove (203) is formed at the periphery of the substrate (2), a plurality of protrusions (204) are arranged on the upper surface of the substrate (2), the edge of the bottom of the package (3) is inserted into the second groove (203), and the bottom of the package (3) is clamped with the protrusions (204).
4. The LED packaging device of claim 1, wherein the heat dissipation device (4) comprises a heat conducting plate (401), a plurality of heat conducting rods (402) and a plurality of heat dissipation fins (403), the top of the heat conducting plate (401) is closely attached to the lower surface of the substrate (2), the heat dissipation fins (403) are located below the heat conducting plate (401), the plurality of heat conducting rods (402) are located between the heat conducting plate (401) and the heat dissipation fins (403), and the upper end and the lower end of each heat conducting rod (402) are fixedly connected to the heat conducting plate (401) and the heat dissipation fins (403), respectively.
5. The LED packaging device according to claim 1, wherein the packaging housing (1) has a plurality of air inlets (7) formed on an upper surface thereof, and an air outlet (8) is formed on a lower surface of the packaging housing (1) at a position corresponding to the air inlets (7), the substrate (2), the packaging member (3) and the heat dissipation device (4) have through holes (9) formed thereon at a position corresponding to the air inlets (7), and the air inlets (7) have fans (701) formed thereon.
6. The LED packaging device according to claim 5, wherein a dust screen (10) is further arranged on the air inlet (7) and the air outlet (8), a mosquito repelling strip (11) is arranged on the inner walls of the air inlet (7) and the air outlet (8) in a clinging manner, an annular groove (12) is arranged on the outer sides of the air inlet (7) and the air outlet (8), and the dust screen (10) is inserted into the annular groove (12).
7. The LED packaging device according to claim 1, wherein a positive electrode region (13) and a negative electrode region (14) are arranged on the left side of the die bonding region (201), the positive electrode of the LED chip (202) is electrically connected to the positive electrode region (13), and the negative electrode of the LED chip (202) is connected to the negative electrode region (14).
8. An LED package device as claimed in claim 1, characterized in that a storage battery (15) is arranged at a middle position of the bottom of the package housing (1), a microprocessor (16) is arranged at the right side of the storage battery (15), a temperature sensor (17) is arranged at the front side of the LED chip (202), and an indicator light (18) is arranged at the right side of the temperature sensor (17).
9. The LED packaging device according to claim 1, wherein a waterproof layer (19) is disposed at the joint between the substrate (2) and the package member (3), and an electrostatic shielding layer (20) is disposed on the outer side of the waterproof layer (19).
10. The LED packaging device according to claim 1, wherein a cover plate (21) is opened on the front surface of the package housing (1), a latch (22) is disposed at a middle position above the cover plate (21), and a sealing gasket (23) is tightly attached to an edge inside the cover plate (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111479836.0A CN114267765A (en) | 2021-12-06 | 2021-12-06 | LED packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111479836.0A CN114267765A (en) | 2021-12-06 | 2021-12-06 | LED packaging device |
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| Publication Number | Publication Date |
|---|---|
| CN114267765A true CN114267765A (en) | 2022-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111479836.0A Pending CN114267765A (en) | 2021-12-06 | 2021-12-06 | LED packaging device |
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