CN211853674U

CN211853674U - LED UV remote curing lamp and LED UV curing equipment

Info

Publication number: CN211853674U
Application number: CN202020669477.XU
Authority: CN
Inventors: 龙波
Original assignee: Shenzhen Changyao Optoelectronic Technology Co ltd
Current assignee: Shenzhen Changyao Optoelectronic Technology Co ltd
Priority date: 2020-04-27
Filing date: 2020-04-27
Publication date: 2020-11-03
Anticipated expiration: 2030-04-27

Abstract

The utility model relates to a remote curing lamp of LED UV and LED UV curing equipment adopts the luminous module of LED UV as the solidification light source, utilizes the high printing opacity lens that quartz glass made, can make the light source possess directive property to high luminousness can make the loss of light source in the air of the within range in 20CM-100CM little, and the solidification ability is strong, efficient.

Description

LED UV remote curing lamp and LED UV curing equipment

Technical Field

The utility model relates to a UV paint solidification technology field especially relates to a remote curing lamp of LED UV and LEDUV curing apparatus.

Background

Along with the higher living standard and the higher customization degree of furniture, the original standard production curing equipment can not meet the production requirement. Traditional paint adopts from dry mode, and is consuming time long, and work efficiency is low, and is with high costs, has appeared UV paint along with the development of technique, adopts UV solidification to solidify the mode that ultraviolet lamp solidifies promptly. However, since furniture generally has a large volume, the existing UV curing technology generally adopts mercury lamps, and since the mercury lamps also have infrared rays and low-band ultraviolet rays and have no directivity, remote open curing equipment cannot be made, and generally only a curing distance of less than 20CM can be achieved, and the curing capacity and the curing efficiency cannot meet the requirements.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide an LED UV remote curing lamp and an LED UV curing apparatus with strong curing capability.

In order to solve the technical problem, the utility model discloses a technical scheme be: an LED UV remote curing lamp comprises a heat dissipation cover plate, a heat dissipation substrate, an LED UV light emitting module, a front cover plate and a high-transmittance lens which are sequentially attached, wherein the heat dissipation cover plate is in threaded connection with the front cover plate; the high-transmittance lens is made of quartz glass materials and covers the light-emitting part of the LED UV light-emitting module.

Further, the light-emitting angle of the high-light-transmission lens is less than or equal to thirty degrees.

Furthermore, the radiating base plate faces one side of the LED UV light-emitting module and is provided with a groove for accommodating the LED UV light-emitting module, and the radiating cover plate and the groove are internally provided with wire holes for the LED UV light-emitting module to be electrically connected.

Furthermore, a stepped hole is formed in the front cover plate, and the high-transmittance lens is embedded in the stepped hole.

Further, the heat-radiating cover plate and the heat-radiating substrate are made of aluminum or aluminum alloy.

Further, the LED UV light-emitting module comprises a heat dissipation wiring substrate, an LED UV chip, a step layer substrate, a lens fixing substrate and a small-angle condensing lens, wherein the LED UV chip is fixed on the heat dissipation wiring substrate and is electrically connected with the heat dissipation wiring substrate, the step layer substrate is attached to the heat dissipation wiring substrate and is provided with a through hole for exposing the LED UV chip, the lens fixing substrate is provided with a communicating through hole for supplying the through hole for installing the small-angle condensing lens, and the lens fixing substrate is attached to one surface of the step layer substrate, which faces away from the heat dissipation wiring substrate.

Further, the light source of the LED UV light-emitting module is formed by a COB LED packaging light source, or the light source of the LED UV light-emitting module is formed by welding an SMD light source on a PCB in an SMT mode.

The utility model also provides a LED UV curing equipment, including foretell LED UV remote curing lamp, it is a plurality of the cooperation of the remote curing lamp of LED UV forms a 360 degrees confined solidification spaces.

The beneficial effects of the utility model reside in that: the LED UV light-emitting module is used as a curing light source, the light source can have directivity by utilizing the high-light-transmission lens made of quartz glass, the high-light-transmission lens can enable the light source to have small loss in the air within the range of 20-100 CM, the curing capability is strong, and the efficiency is high.

Drawings

Fig. 1 is a schematic structural diagram of an LED UV remote curing lamp according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an LED UV light emitting module of an LED UV remote curing lamp according to an embodiment of the present invention.

Description of reference numerals:

100. a heat dissipation cover plate; 200. a heat-dissipating substrate; 210. a groove; 220. a wire hole;

300. an LED UV light emitting module; 310. a heat dissipation wiring substrate; 320. an LED UV chip;

330. a step layer substrate; 340. a lens fixing substrate; 350. a small-angle condenser lens;

400. a front cover plate; 410. a stepped hole; 500. a high light transmission lens.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the following description, with reference to the accompanying drawings and embodiments, will explain the present invention in further detail with respect to a remote LED UV curing lamp and a remote LED UV curing apparatus. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Referring to fig. 1-2, an LED UV remote curing lamp includes a heat-dissipating cover plate 100, a heat-dissipating substrate 200, an LED UV light-emitting module 300, a front cover plate 400, and a high-transmittance lens 500, which are sequentially attached, wherein the heat-dissipating cover plate 100 is screwed with the front cover plate 400; the high light-transmitting lens 500 is made of quartz glass material, and covers the light-emitting portion of the LED UV light-emitting module 300.

The LED UV light-emitting module 300 is used as a curing light source, and the high-transmittance lens 500 made of quartz glass enables the light source to have directivity, and the high transmittance enables the light source to have low loss in the air within the range of 20-100 CM, strong curing capability and high efficiency.

In particular, the light exit angle of the high-transmittance lens 500 is less than or equal to thirty degrees. The lens with the light-emitting angle smaller than or thirty degrees can enable the light source to have stronger directivity and the loss of the light source in the air in the range of 20CM-100CM is smaller. The loss of light in 1M in the air is only 15-30%, and higher radiation intensity and radiation energy can be obtained.

Referring to fig. 1, a groove 210 for accommodating the LED UV light emitting module 300 is disposed on a surface of the heat dissipating substrate 200 facing the LED UV light emitting module 300, and wire holes 220 for electrically connecting the LED UV light emitting module 300 are disposed on the heat dissipating cover plate 100 and in the groove 210. The setting of recess 210 can be better laminating LED UV sends out optical module 300, and convenient heat dissipation can make LED UV send out optical module 300 fixed more stable, can reduce holistic thickness. Particularly, the four corners of the groove 210 are provided with small arc grooves, so that the four corners of the LED UV light-emitting module 300 are prevented from colliding, and the LED UV light-emitting module 300 is convenient to install and take out.

Referring to fig. 1, a stepped hole 410 is formed on the front cover 400, and the high-transmittance lens 500 is embedded in the stepped hole 410. The arrangement of the stepped hole 410 can keep a proper distance between the high-transmittance lens 500 and the light source, thereby facilitating heat dissipation and ensuring the directivity of the light source.

Preferably, the heat radiating cover plate 100 and the heat radiating base plate 200 are made of aluminum or an aluminum alloy. The aluminum or aluminum alloy has strong heat dissipation capability, low cost and convenient processing.

Referring to fig. 2, the LED UV light emitting module 300 includes a heat dissipation wiring substrate 310, an LED UV chip 320, a step layer substrate 330, a lens fixing substrate 340 and a small-angle condensing lens 350, wherein the LED UV chip 320 is fixed on the heat dissipation wiring substrate 310 and electrically connected to the heat dissipation wiring substrate 310, the step layer substrate 330 is attached to the heat dissipation wiring substrate 310 and has a through hole for exposing the LED UV chip 320, the lens fixing substrate 340 has a mounting hole for mounting the small-angle condensing lens 350, and the lens fixing substrate 340 is attached to a surface of the step layer substrate 330 opposite to the heat dissipation wiring substrate 310. The heat dissipation wiring substrate 310 is generally a copper plate.

Generally, the light source of the LED UV light emitting module 300 is formed by a COB LED package light source, or the light source of the LED UV light emitting module 300 is formed by an SMD light source soldered on a PCB board in an SMT manner. The SMD is called Surface mounted devices, which is one of Surface mount technology components; COB is called Chip On Board, which is a Chip-On-Board package and is one of bare Chip mounting technologies; two kinds of techniques respectively have the advantage, can select as required, the utility model discloses preferably be COB.

The utility model also provides a LED UV curing equipment, including foretell LED UV remote curing lamp, the cooperation of a plurality of LED UV remote curing lamps forms a 360 degrees confined solidification spaces. The curing is carried out in 360 degrees without dead angles, and the curing speed and the curing effect can be improved.

To sum up, the utility model provides a pair of remote curing lamp of LED UV and LED UV curing equipment adopts the luminous module of LED UV as the solidification light source, utilizes the high printing opacity lens that quartz glass made, can make the light source possess directive property to can make the loss of light source in the range in 20CM-100CM in the air little, the solidification ability is strong, efficient.

The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description in any form, and although the present invention has been disclosed with reference to the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make modifications or changes equivalent to the equivalent embodiment of the above embodiments without departing from the scope of the present invention.

Claims

1. An LED UV remote curing lamp is characterized by comprising a heat dissipation cover plate, a heat dissipation substrate, an LEDUV light emitting module, a front cover plate and a high-transmittance lens which are sequentially attached, wherein the heat dissipation cover plate is in threaded connection with the front cover plate; the high-transmittance lens is made of quartz glass materials and covers the light-emitting part of the LED UV light-emitting module.

2. The LED UV remote curing lamp of claim 1, wherein the exit angle of the high transmission lens is less than or equal to thirty degrees.

3. The LED UV remote curing lamp as claimed in claim 1, wherein a surface of the heat dissipation substrate facing the LED UV light emitting module is provided with a groove for accommodating the LED UV light emitting module, and the heat dissipation cover plate and the groove are provided with wire holes for the LED UV light emitting module to be electrically connected.

4. The LED UV remote curing lamp as claimed in claim 1, wherein the front cover plate is provided with a stepped hole, and the high-transmittance lens is embedded in the stepped hole.

5. The LED UV remote curing light as claimed in claim 1, wherein the heat dissipating cover plate and the heat dissipating substrate are made of aluminum or aluminum alloy.

6. The LED UV remote curing lamp according to claim 1, wherein the LED UV light-emitting module comprises a heat dissipation wiring substrate, an LED UV chip, a step layer substrate, a lens fixing substrate and a small-angle condensing lens, the LED UV chip is fixed on the heat dissipation wiring substrate and is electrically connected with the heat dissipation wiring substrate, the step layer substrate is attached to the heat dissipation wiring substrate and is provided with a through hole for exposing the LED UV chip, the lens fixing substrate is provided with a mounting hole for connecting the through hole and mounting the small-angle condensing lens, and the lens fixing substrate is attached to a surface of the step layer substrate, which faces away from the heat dissipation wiring substrate.

7. The LED UV remote curing lamp as claimed in claim 1, wherein the light source of the LED UV light emitting module is formed by COB LED package light source, or the light source of the LED UV light emitting module is formed by SMT welding of SMD light source on PCB board.

8. An LED UV curing apparatus comprising the LED UV remote curing lamp according to any one of claims 1 to 7, wherein a plurality of the LED UV remote curing lamps cooperate to form a 360 degree enclosed curing space.