CN211848201U - Copper electroplating equipment for controlling copper ion concentration - Google Patents
Copper electroplating equipment for controlling copper ion concentration Download PDFInfo
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- CN211848201U CN211848201U CN202020227458.1U CN202020227458U CN211848201U CN 211848201 U CN211848201 U CN 211848201U CN 202020227458 U CN202020227458 U CN 202020227458U CN 211848201 U CN211848201 U CN 211848201U
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Abstract
The utility model discloses an electro-coppering equipment of management and control copper ion concentration, including the dissolving tank, management groove, the plating bath that loop through the steel pipe connection, the dissolving tank adds the device with the cupric oxide and is connected, the management groove with the cupric oxide adds and is equipped with concentration analysis device and addition controlling means between the device, the concentration analysis device carries out data transfer to the volume of adding controlling means after analyzing the cupric oxide that has dissolved, the cupric oxide adds the device and carries out the powder according to the data that add the volume controlling means and add. The utility model discloses an electro-coppering equipment of management and control copper ion concentration, simple structure, convenient to use connect the management and the control that reach real-time copper ion concentration with concentration analysis device and addition controlling means, have reduced the management scope of copper ion to manage and control copper ion concentration through periodic analysis, can accurately control the addition of copper oxide powder, have very high practical value.
Description
Technical Field
The utility model relates to a liquid concentration electroplating engineering technical field especially relates to a copper electroplating equipment of management and control copper ion concentration.
Background
The PCB engineering must form plated lines by copper sulfate plating. The plating method is classified into a soluble Cu anode and an insoluble (Ti/Ir) anode according to the material of the anode. The soluble Cu anode causes the plating thickness of the object to be plated (cathode) to spread due to the uneven dissolution, the change in the area of the anode, the adhesion of copper oxide to the plating layer, and the like as the process proceeds, and causes the plating line defect due to the adhesion of foreign matter during etching after the plating. Thus requiring periodic replacement of the anodes and periodic cleaning and management. To address such shortcomings, the copper sulfate electroplating project now prefers to use insoluble (Ti/Ir) anodes. When the concentration of copper ions is reduced, the copper plating thickness on the surface of an electroplated object, the copper plating thickness in the through hole and the ViaFilling property are changed, so that the ideal copper plating effect cannot be achieved. When the insoluble anode is used, consumed copper ions need to be replenished, and a dissolving tank for providing the copper ions, a management tank and a circulating device of an electroplating tank need to be additionally arranged. The copper ion consumption was calculated from the amount of work and converted into the amount of copper oxide to be added to the dissolution tank. The concentration of copper ions is increased by supplying the copper ions to the plating tank through the management tank after dissolution, but the concentration of copper ions cannot be precisely controlled by the above method, and an error is easily generated by a manual calculation, and thus, the prior art needs to be improved.
SUMMERY OF THE UTILITY MODEL
In view of the above-described drawbacks of the prior art, there is now provided an electrolytic copper plating apparatus that manages the concentration of copper ions, calculates the amount of copper ion consumption from the amount of work, and adds the amount of copper ion consumption to a dissolution tank in terms of the amount of copper oxide added.
In order to realize above-mentioned purpose and other relevant purposes, the utility model provides a management and control copper ion concentration's electro-coppering equipment, including dissolving tank, management groove, the plating bath that loops through the pipe connection, the dissolving tank adds the device with the cupric oxide and is connected, the management groove with the cupric oxide adds and is equipped with concentration analysis device and addition controlling means between the device, concentration analysis device carries out data transfer to adding volume controlling means after analyzing the cupric oxide that has dissolved, the cupric oxide adds the device and carries out the powder according to the data that add volume controlling means and add.
In the above copper electroplating apparatus for controlling the concentration of copper ions, the concentration analyzing device includes a constant delivery pump, and the plating solution moved to the plating tank by the management tank is pumped by the constant delivery pump.
The concentration analysis device of the copper electroplating equipment for managing and controlling the concentration of copper ions further comprises a sensor and a concentration analyzer, data of the quantitative pump is received and analyzed by the concentration analyzer, and the analysis data is calculated by the sensor and then transmitted to the additive amount control device.
The utility model discloses owing to use above technical scheme, make its beneficial effect who has be:
1. the structure is reasonable and the use is simple;
2. the convenience of controlling the concentration of the copper oxide is improved;
3. the problem of use solubility Cu anode engineering among the prior art to lead to electroplating the circuit bad is solved.
Drawings
FIG. 1 is a connection structure diagram of each part of the electrolytic copper plating apparatus of the present invention;
FIG. 2 is a schematic view showing the structure of the copper oxide adding apparatus of the electrolytic copper plating apparatus of the present invention.
The reference numerals in the specification are as follows:
a dissolving tank 1, a management tank 2, a plating tank 3, a copper oxide adding device 4, an adding amount control device 5, a dosing pump 6, a concentration analyzer 7, a sensor 8, a storage tank 41, a transmission tank 42, and a screw rod 43.
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
The structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention does not have the substantial significance in the technology, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy which can be produced by the present invention and the purpose which can be achieved by the present invention. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.
The utility model provides an electrolytic copper plating equipment of management and control copper ion concentration, as shown in figure 1, including the dissolving tank 1, the administrative groove 2, the plating bath 3 that loop through the pipe connection, dissolving tank 1 is connected with copper oxide adds device 4, be equipped with concentration analysis device and addition controlling means 5 between administrative groove 2 and the copper oxide adds device 4, addition controlling means 5 is the PLC controller, concentration analysis device carries out the analysis to dissolved copper oxide after to data transfer to addition controlling means 5, copper oxide adds device 4 and carries out the powder according to the data of addition controlling means 5, as shown in figure 2, copper oxide adds device 4 and includes storage tank 41, the transmission case 42 that locates storage tank 41 bottom and communicate with storage tank 41, storage tank 41 is hopper-shaped, be equipped with hob 43 in the transmission case 42, this hob 43 passes through motor drive, and the motor passes through PLC controller control, wherein, concentration analysis device includes constant delivery pump 6, constant delivery pump 6 is connected in management groove 2, the plating solution that management groove 2 removed to plating bath 3 is extracted through constant delivery pump 6, concentration analysis device still includes inductor 8 and concentration analyzer 7, it is from taking the display screen, concentration analyzer 7 receives the data of constant delivery pump 6 and carries out the analysis and obtains the analysis data and show on the display screen, concentration analyzer 7 puts back the liquid that has analyzed in management groove 2, this analysis data conveys to adding volume controlling means 5 after 8 calculations through the inductor.
In a concrete use, the above-mentioned equipments are sequentially installed, the consumption of copper ions is calculated according to the working amount, the copper ions are converted into the addition amount of copper oxide and added into the copper oxide adding device 4, the PLC controller controls the motor to drive the screw rod 43 to rotate, so that the powder of copper oxide is fed into the dissolving tank 1, the powder of copper oxide is supplied into the plating tank 3 through the management tank 2 after being dissolved, the concentration of copper ions is increased, the thickness of copper plating is determined by the amount of current passing between the object to be plated and the anode, so that the concentration of copper ions is reduced according to a corresponding proportion, the plating solution transferred from the management tank 2 to the plating tank 3 is extracted through the constant delivery pump 6 and is transferred to the concentration analyzer 7 for copper ion concentration analysis, the analysis result is transferred to the sensor 8, the sensor 8 calculates the amount of copper oxide powder to be added through conversion and transmits a signal to the addition amount control device 5, the copper oxide adding device 4 is controlled to automatically add the copper oxide powder.
The method of replenishing the copper oxide powder is estimated from the cumulative current amount, and the dispersion of the copper ion concentration occurs by the natural evaporation and the minute surface area change of the product as described above. Usually, the concentration of copper ions is controlled to be an upper limit, the concentration of copper ions continuously decreases along with the electroplating, the concentration decreases to a lower limit, the concentration of copper ions is increased by adding copper oxide powder, and the concentration curve fluctuates greatly. In order to solve the problem, a concentration interval respective control unit is arranged, and the concentration of copper ions is respectively controlled according to STEPs, so that the time for controlling the concentration is shortened, the concentration of the copper ions is always kept at a target value, and Cpk is increased;
step1 (lower limit interval of concentration management), converting the cumulative current amount into 2 times of copper oxide supply amount to reach the target concentration of more than 2%;
step2 (exceeding the upper limit critical concentration interval): when the upper limit critical concentration is exceeded, stopping the copper oxide adding device 4, and naturally reducing the concentration of copper ions to the target concentration through engineering;
step3 (control concentration range): when the copper ion concentration reaches the target concentration within the control range, the copper oxide is added in an amount converted from the integrated current.
Specifically, when the copper concentration reaches the lower limit (lower than 245g/L), the system is operated according to Step1, and the copper oxide adding device 4 is started to observe the copper ion concentration in real time through the concentration analyzer 8; when the critical concentration is reached (255g/L), stopping the copper oxide adding device 4 according to Step2, and naturally consuming the copper ion concentration; when the target concentration (250g/L) is reached, adding copper oxide powder according to a calculation value of an accumulated electric current according to Step 3; when the copper ion concentration exceeds the upper limit of management in the engineering operation, the concentration reaches the target concentration according to the mode of converting Step2 into Step 3. The control range is set to the critical value of copper ion, the system is controlled according to step to ensure Cpk and shorten the concentration control time, so as to reduce the overfeeding and control the operation of the concentration equipment.
The utility model discloses an electro-coppering equipment of management and control copper ion concentration, simple structure, convenient to use connect the management and the control that reach real-time copper ion concentration with concentration analysis device and addition controlling means 5, have reduced the management scope of copper ion to manage and control copper ion concentration through periodic analysis, can accurately control the addition of copper oxide powder, have very high practical value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (3)
1. The utility model provides an electro-coppering equipment of management and control copper ion concentration which characterized in that: the device comprises a dissolving tank, a management tank and an electroplating tank which are sequentially connected through a pipeline, wherein the dissolving tank is connected with a copper oxide adding device, a concentration analysis device and an addition amount control device are arranged between the management tank and the copper oxide adding device, the concentration analysis device analyzes dissolved copper oxide and then transmits data to an addition amount control device, and the copper oxide adding device performs powder addition according to the data of the addition amount control device.
2. The electrolytic copper plating apparatus for regulating a concentration of copper ions according to claim 1, wherein: the concentration analysis device comprises a fixed displacement pump, and the electroplating solution moved to the electroplating tank by the management tank is pumped by the fixed displacement pump.
3. The electrolytic copper plating apparatus for regulating a concentration of copper ions according to claim 2, wherein: the concentration analysis device also comprises a sensor and a concentration analyzer, the data of the quantitative pump is received and analyzed by the concentration analyzer, and the analysis data is calculated by the sensor and then transmitted to the additive amount control device.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020227458.1U CN211848201U (en) | 2020-02-28 | 2020-02-28 | Copper electroplating equipment for controlling copper ion concentration |
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| CN202020227458.1U CN211848201U (en) | 2020-02-28 | 2020-02-28 | Copper electroplating equipment for controlling copper ion concentration |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113832529A (en) * | 2021-09-02 | 2021-12-24 | 苏州公汇兴电子科技有限公司 | Automatic control method and system for copper ion concentration in copper plating bath |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113832529A (en) * | 2021-09-02 | 2021-12-24 | 苏州公汇兴电子科技有限公司 | Automatic control method and system for copper ion concentration in copper plating bath |
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