CN211831314U - Circuit board with composite structure - Google Patents
Circuit board with composite structure Download PDFInfo
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- CN211831314U CN211831314U CN202020016133.9U CN202020016133U CN211831314U CN 211831314 U CN211831314 U CN 211831314U CN 202020016133 U CN202020016133 U CN 202020016133U CN 211831314 U CN211831314 U CN 211831314U
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- insulating plate
- hole
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- electrode
- circuit board
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Abstract
The utility model discloses a circuit board of composite construction, including the first insulation board, second insulation board, third insulation board, fourth insulation board and the fifth insulation board that connect gradually, and seted up the through-hole on every insulation board, the through-hole on the adjacent insulation board is at least partly dislocation distribution, has the electrode in the through-hole, the electrode passes the through-hole and meets with the conductor, wherein, arranges the conductor on first insulation board upper surface, and its part exposes outside, still includes the top cap, has the wire in the top cap inside, has the contact with the exposed conductor matched with above the first insulation board in the bottom surface of top cap; the bottom of fifth insulating board is connected with the welding piece, the welding piece meets the part of two adjacent conductors at least, through above technical scheme, can promote the reliability of connecting.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a composite construction's flexible circuit board, and it has higher connection reliability.
Background
In the connection process of the multilayer circuit board in the prior art, through holes are usually formed, a plurality of circuit boards are connected in series through the same electrode, and the electrodes in the circuit boards are uniformly arranged in a straight line.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a composite construction's circuit board, it can realize connecting the reliability.
The technical scheme of the utility model as follows:
a circuit board with a composite structure comprises a first insulating plate, a second insulating plate, a third insulating plate, a fourth insulating plate and a fifth insulating plate which are sequentially connected, wherein each insulating plate is provided with a through hole, at least parts of the through holes on the adjacent insulating plates are distributed in a staggered manner, electrodes are arranged in the through holes and penetrate through the through holes to be connected with conductors, the conductors arranged on the upper surface of the first insulating plate are partially exposed outside, the circuit board also comprises a top cover, a lead is arranged in the top cover, and contacts matched with the conductors exposed above the first insulating plate are arranged on the bottom surface of the top cover; and the bottom of the fifth insulating plate is connected with a welding block, and the welding block at least connects parts of two adjacent conductors.
Furthermore, a through hole is formed in the first insulating plate, the through hole communicates the top surface of the first insulating plate with the bottom surface of the first insulating plate, a conductor is embedded in the first insulating plate, the conductor covers the top of the through hole, two ends of the conductor are fixed to the first insulating plate, an electrode is connected in the through hole, and the top end of the electrode is connected with the conductor.
Furthermore, a through hole is also formed in the second insulating plate, wherein at least part of the through hole in the second insulating plate and the through hole in the first insulating plate are staggered, the top surface of the second insulating plate is communicated with the bottom surface of the second insulating plate through the through hole, a conductor is embedded in the second insulating plate and covers the top of the through hole, two ends of the conductor are fixed to the second insulating plate, an electrode is connected in the through hole, the top end of the electrode on the second insulating plate is connected with the lower surface of the conductor in the second insulating plate, and the bottom end of the electrode on the first insulating plate is connected with the upper surface of the conductor in the second insulating plate.
Furthermore, a through hole is also formed in the third insulating plate, wherein the through hole is also formed in the third insulating plate, and at least part of the through hole in the third insulating plate and the through hole in the second insulating plate are staggered; at least part of the through holes on the third insulating plate and the through holes on the second insulating plate are staggered, the through holes communicate the top surface of the third insulating plate with the bottom surface of the third insulating plate, conductors are embedded in the third insulating plate, the conductors cover the top and the bottom of the through hole, two ends of each conductor are fixed on the third insulating plate, and an electrode is connected in the through hole, the top end of the electrode on the third insulating plate is connected with the lower surface of the conductor at the top of the through hole in the third insulating plate, the bottom end of the electrode on the second insulating plate is connected with the upper surface of the conductor in the third insulating plate, and the bottom end of the electrode on the third insulating plate is connected with the upper surface of the conductor at the bottom of the through hole in the third insulating plate.
Furthermore, a through hole is also formed in the fourth insulating plate, wherein at least part of the through hole in the fourth insulating plate and the through hole in the third insulating plate are staggered, the top surface of the fourth insulating plate is communicated with the bottom surface of the fourth insulating plate through the through hole, a conductor is embedded in the fourth insulating plate and covers the bottom of the through hole, two ends of the conductor are fixed to the fourth insulating plate, an electrode is connected in the through hole, the top end of the electrode on the fourth insulating plate is connected with the lower surface of the conductor in the third insulating plate, and the bottom end of the electrode on the fourth insulating plate is connected with the upper surface of the conductor in the fourth insulating plate.
Further, a through hole is also formed in the fifth insulating plate, wherein the through hole is located in the third insulating plate and located in at least part of the through hole in the second insulating plate, the through hole enables the top surface of the fifth insulating plate to be communicated with the bottom surface of the fifth insulating plate, a conductor is embedded in the fifth insulating plate, covers the bottom of the through hole, two ends of the conductor are fixed in the fifth insulating plate, an electrode is connected in the through hole, the top end of the electrode on the fifth insulating plate is connected with the lower surface of the conductor in the fourth insulating plate, and the bottom end of the electrode on the fifth insulating plate is connected with the upper surface of the conductor in the fifth insulating plate.
Further, the surface of the conductor has a bump.
Preferably, the salient points are in a conical structure.
Has the advantages that: the utility model discloses a conductor staggered arrangement can disperse the pressure of insulation board on a certain vertical direction to it is too sufficient to prevent that local rigidity from, and it is unbalanced to lead to the local atress to appear in the use, improves the reliability of connecting.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional structure diagram of a circuit board with a composite structure according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional structure diagram of a connection component with a circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a conductor according to an embodiment of the present invention
The corresponding part names indicated by the numbers and letters in the drawings:
1. a first insulating plate; 2. a second insulating plate; 3. a third insulating plate; 4. a fourth insulating plate; 5. a fifth insulating plate; 6. a conductor; 7. an electrode; 8. an insulating block; 9. welding the blocks; 10. a top cover; 11. a contact; 12. and (4) bumps.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Examples
Fig. 1 shows a schematic cross-sectional structure of a circuit board of a composite structure, which discloses a first insulating plate 1, a second insulating plate 2, a third insulating plate 3, a fourth insulating plate 4, and a fifth insulating plate 5, wherein the first insulating plate 1 is located at the uppermost, the top surface of the second insulating plate 2 is connected to the bottom surface of the first insulating plate 1, the top surface of the third insulating plate 3 is connected to the bottom surface of the second insulating plate 2, the top surface of the fourth insulating plate 4 is connected to the bottom surface of the third insulating plate 3, and the top surface of the fifth insulating plate 5 is connected to the bottom surface of the fourth insulating plate 4.
The through hole has been seted up on first insulating plate 1, the through hole will the top surface of first insulating plate 1 with the bottom surface of first insulating plate 1 communicates with each other first insulating plate 1 goes up to embed and has conductor 6, conductor 6 cover in the through hole top, just the both ends of conductor 6 are fixed in first insulating plate 1 the through hole in-connection has electrode 7, electrode 7's top with conductor 6 connects.
An insulating block 8 is further arranged on the upper surface of the first insulating plate 1, and the insulating block 8 at least connects parts of two adjacent conductors 6, so that the part where the electrode 7 is connected with the conductor 6, namely the part of the conductor 6 which is positioned right above the through hole, is exposed outside.
The second insulating plate 2 is also provided with through holes, wherein at least part of the through holes on the second insulating plate 2 and the through holes on the first insulating plate 1 are staggered, so that the insulating plates are uniformly stressed on a certain longitudinal line and are not easy to warp or deform.
The top surface of the second insulating plate 2 is communicated with the bottom surface of the second insulating plate 2 through the through hole, a conductor 6 is embedded in the second insulating plate 2, the conductor 6 covers the top of the through hole, two ends of the conductor 6 are fixed to the second insulating plate 2, an electrode 7 is connected in the through hole, the top end of the electrode 7 positioned on the second insulating plate 2 is connected with the lower surface of the conductor 6 positioned in the second insulating plate 2, and the bottom end of the electrode 7 positioned on the first insulating plate 1 is connected with the upper surface of the conductor 6 in the second insulating plate 2.
The third insulating plate 3 is also provided with through holes, wherein at least part of the through holes on the third insulating plate 3 and the through holes on the second insulating plate 2 are staggered, so that the insulating plates are uniformly stressed on a certain longitudinal line and are not easy to warp or deform.
The top surface of the third insulating plate 3 is communicated with the bottom surface of the third insulating plate 3 through the through hole, a conductor 6 is embedded in the third insulating plate 3, the conductor 6 covers the top and the bottom of the through hole, two ends of the conductor 6 are fixed to the third insulating plate 3, an electrode 7 is connected in the through hole, the top end of the electrode 7 positioned on the third insulating plate 3 is connected with the lower surface of the conductor 6 positioned at the top of the through hole in the third insulating plate 3, the bottom end of the electrode 7 positioned on the second insulating plate 2 is connected with the upper surface of the conductor 6 in the third insulating plate 3, and the bottom end of the electrode 7 positioned on the third insulating plate 3 is connected with the upper surface of the conductor 6 positioned at the bottom of the through hole in the third insulating plate 3.
The fourth insulating plate 4 is also provided with through holes, wherein at least part of the through holes on the fourth insulating plate 4 and the through holes on the third insulating plate 3 are staggered, so that the insulating plates are uniformly stressed on a certain longitudinal line and are not easy to warp or deform.
The top surface of the fourth insulating plate 4 is communicated with the bottom surface of the fourth insulating plate 4 through the through hole, a conductor 6 is embedded in the fourth insulating plate 4, the conductor 6 covers the bottom of the through hole, two ends of the conductor 6 are fixed to the fourth insulating plate 4, an electrode 7 is connected in the through hole, the top end of the electrode 7 positioned on the fourth insulating plate 4 is connected with the lower surface of the conductor 6 positioned in the third insulating plate 3, and the bottom end of the electrode 7 positioned on the fourth insulating plate 4 is connected with the upper surface of the conductor 6 positioned in the fourth insulating plate 4.
The fifth insulating plate 5 is also provided with a through hole, wherein the through hole on the third insulating plate 3 and the through hole on the second insulating plate 2 are at least partially staggered, so that the insulating plates are uniformly stressed on a certain longitudinal line and are not easy to warp or deform.
The through-hole will the top surface of fifth insulating board 5 with the bottom surface of fifth insulating board 5 communicates with each other fifth insulating board 5 goes up embedded conductor 6 that has, conductor 6 cover in the through-hole bottom, just the both ends of conductor 6 are fixed in fifth insulating board 5 the through-hole in-connection has electrode 7, is located on fifth insulating board 5 the top of electrode 7 with be located in fourth insulating board 4 6 lower surfaces of conductor meet, are located on fifth insulating board 5 the bottom of electrode 7 with in the fifth insulating board 5 the upper surface of conductor 6 meets.
The lower surface of the fifth insulating plate 5 is further provided with a welding block 9, and the welding block 9 at least connects parts of two adjacent conductors 6, so that the part where the electrode 7 is connected with the conductor 6, namely at least the part of the conductor 6 in the fifth insulating plate 5, which is positioned right below the through hole, is exposed outside.
Fig. 2 is a schematic cross-sectional view of a connection part with a circuit board, which includes a top cover 10, a conductive wire is provided inside the top cover 10, a contact 11 is provided on the bottom surface of the top cover 10 to be engaged with the conductor 6 exposed above the first insulating plate 1, the top cover is fixed above the first insulating plate 1, and the contact 11 can be contacted with the conductor 6.
The bottom of the fifth insulating plate 5 can be soldered to a semiconductor 6, such as a processor or a memory, so that an electrical connection can be made.
Through the technical scheme, the utility model provides a conductor staggered arrangement can disperse the insulation board at the ascending pressure of a certain vertical direction to prevent that local rigidity is too sufficient, lead to the local atress unbalance to appear in the use, influence the reliability of connecting.
In order to further ensure the reliability of the connection, fig. 3 shows a schematic structural diagram of a conductor, wherein the surface of the conductor is provided with a bump 12, and the bump 12 has a tapered structure, so that the conductor can be more stably connected with a corresponding insulating plate.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, it is possible to make several modifications and improvements, such as adding or reducing the insulating plate in the present embodiment, without departing from the inventive concept of the present invention, and these all fall into the protection scope of the present invention.
Claims (8)
1. A circuit board with a composite structure is characterized by comprising a first insulating plate, a second insulating plate, a third insulating plate, a fourth insulating plate and a fifth insulating plate which are sequentially connected, wherein each insulating plate is provided with a through hole, at least part of the through holes on the adjacent insulating plates are distributed in a staggered manner, electrodes are arranged in the through holes and penetrate through the through holes to be connected with conductors, the conductors arranged on the upper surface of the first insulating plate are partially exposed outside, the circuit board also comprises a top cover, a lead is arranged in the top cover, and contacts matched with the conductors exposed above the first insulating plate are arranged on the bottom surface of the top cover; and the bottom of the fifth insulating plate is connected with a welding block, and the welding block at least connects parts of two adjacent conductors.
2. The printed circuit board of claim 1, wherein the first insulating plate has a through hole, the through hole connects the top surface of the first insulating plate to the bottom surface of the first insulating plate, a conductor is embedded in the first insulating plate, the conductor covers the top of the through hole, two ends of the conductor are fixed to the first insulating plate, an electrode is connected to the through hole, and the top end of the electrode is connected to the conductor.
3. The circuit board of claim 2, wherein the second insulating plate is further provided with a through hole, wherein the through hole on the second insulating plate is at least partially offset from the through hole on the first insulating plate, the through hole connects the top surface of the second insulating plate to the bottom surface of the second insulating plate, the second insulating plate is embedded with a conductor, the conductor covers the top of the through hole, two ends of the conductor are fixed to the second insulating plate, an electrode is connected to the through hole, the top end of the electrode on the second insulating plate is connected to the lower surface of the conductor in the second insulating plate, and the bottom end of the electrode on the first insulating plate is connected to the upper surface of the conductor in the second insulating plate.
4. The circuit board of claim 3, wherein the third insulating plate has a through hole, and wherein the through hole of the third insulating plate is at least partially offset from the through hole of the second insulating plate; the top surface of the third insulating plate is communicated with the bottom surface of the third insulating plate through the through hole, a conductor is embedded in the third insulating plate, the conductor covers the top and the bottom of the through hole, two ends of the conductor are fixed on the third insulating plate, an electrode is connected in the through hole, the top end of the electrode on the third insulating plate is connected with the lower surface of the conductor at the top of the through hole in the third insulating plate, the bottom end of the electrode on the second insulating plate is connected with the upper surface of the conductor in the third insulating plate, and the bottom end of the electrode on the third insulating plate is connected with the upper surface of the conductor at the bottom of the through hole in the third insulating plate.
5. The circuit board of claim 4, wherein the fourth insulating plate has a through hole, wherein the through hole on the fourth insulating plate is at least partially offset from the through hole on the third insulating plate, the through hole connects the top surface of the fourth insulating plate to the bottom surface of the fourth insulating plate, the fourth insulating plate has a conductor embedded therein, the conductor covers the bottom of the through hole, and both ends of the conductor are fixed to the fourth insulating plate, an electrode is connected to the through hole, the top end of the electrode on the fourth insulating plate is connected to the lower surface of the conductor in the third insulating plate, and the bottom end of the electrode on the fourth insulating plate is connected to the upper surface of the conductor in the fourth insulating plate.
6. The circuit board of claim 5, wherein the fifth insulating plate is further provided with a through hole, the through hole connects the top surface of the fifth insulating plate with the bottom surface of the fifth insulating plate, a conductor is embedded in the fifth insulating plate, two ends of the conductor are fixed to the fifth insulating plate, the top end of the electrode on the fifth insulating plate is connected to the lower surface of the conductor in the fourth insulating plate, and the bottom end of the electrode on the fifth insulating plate is connected to the upper surface of the conductor in the fifth insulating plate.
7. A composite structural circuit board as claimed in claim 1, wherein the surface of said conductor has bumps.
8. A composite structural circuit board according to claim 7, wherein said bumps are tapered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020016133.9U CN211831314U (en) | 2020-01-06 | 2020-01-06 | Circuit board with composite structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020016133.9U CN211831314U (en) | 2020-01-06 | 2020-01-06 | Circuit board with composite structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211831314U true CN211831314U (en) | 2020-10-30 |
Family
ID=73041448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020016133.9U Active CN211831314U (en) | 2020-01-06 | 2020-01-06 | Circuit board with composite structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211831314U (en) |
-
2020
- 2020-01-06 CN CN202020016133.9U patent/CN211831314U/en active Active
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