CN219248167U

CN219248167U - PCB structure for optimizing welding yield of ground network pins of DIP device

Info

Publication number: CN219248167U
Application number: CN202223294709.6U
Authority: CN
Inventors: 林冬飞; 王灿钟
Original assignee: Edadoc Co ltd
Current assignee: Edadoc Co ltd
Priority date: 2022-12-08
Filing date: 2022-12-08
Publication date: 2023-06-23
Anticipated expiration: 2032-12-08

Abstract

The utility model discloses a PCB structure for optimizing the welding yield of ground network pins of a DIP device, which comprises conducting layers and insulating layers arranged between the conducting layers, wherein the conducting layers are not less than 6 layers, a plurality of ground network connection holes are formed in the conducting layers and the insulating layers, ground network welding pins are arranged in the ground network connection holes, connecting wires for electrically connecting the ground network welding pins and the conducting layers are arranged between the ground network welding pins and the conducting layers, and the number of layers for connecting the ground network welding pins and the conducting layers is not more than 4. According to the utility model, the number of layers connected by the ground network soldering leg is limited, and meanwhile, the ground network soldering leg and the conductive layer are connected by the connecting wire, so that the connection mode is made into a flower connection, and other conductive layers are in a disconnected state, so that heat transfer during welding is reduced, heat dissipation is reduced, and the welding yield is improved.

Description

PCB structure for optimizing welding yield of ground network pins of DIP device

Technical Field

The utility model relates to the technical field of PCBs, in particular to a PCB structure for optimizing the welding yield of pins of a ground network of a DIP device.

Background

Printed circuit boards (Printed Circuit Board, PCB boards), also known as printed circuit boards, printed wiring boards, are an important component of the physical support and signal transmission of electronic products. In a multi-layer (more than 6 layers) PCB, as the layers increase, the more layers of the local network plane are, resulting in the increase of the layers of the dip device connected with the ground network soldering pins. In the welding process, soldering tin heat can be transferred to the copper foil surface through the connecting part, and heat dissipation can be too fast due to the fact that the connecting layers are too many, and poor welding of the welding legs can possibly be caused.

The above disadvantages are to be improved.

Disclosure of Invention

In order to solve the problem that poor welding of the welding leg is possibly caused because the heat of soldering tin can be transferred to the copper foil surface through the connecting part in the welding process and the heat dissipation is too fast due to the fact that the connecting layers are too many, the utility model provides the PCB structure for optimizing the welding yield of the ground network pins of the DIP device.

The technical scheme of the utility model is as follows:

the utility model provides an optimize PCB plate structure of DIP device earth screen pin welding yield, includes the conducting layer, sets up insulating layer between the conducting layer, the conducting layer is no less than 6 layers, the conducting layer with be provided with a plurality of earth screen connecting holes on the insulating layer, be provided with earth screen leg in the earth screen connecting hole, earth screen leg with be provided with the connecting wire that is used for two electric connection between the conducting layer, earth screen leg with the number of piles of conducting layer connection is no more than 4.

According to the PCB structure for optimizing the welding yield of the ground network pins of the DIP device, the connecting wires are arranged in a plurality, one ends of the connecting wires intersect the ground network pins, and the other ends of the connecting wires are connected with the conducting layers.

Further, the connecting wires are arranged in two, and the two connecting wires are collinear.

Further, the connecting lines are three, the included angle between every two connecting lines is 120 degrees, or the three connecting lines are T-shaped.

Further, four connecting lines are arranged, and the four connecting lines are in an X shape or a cross shape.

Further, five connecting lines are arranged, and the five connecting lines are in an onium type.

Further, six connecting lines are provided, and six connecting lines are in a form of a x.

According to the PCB structure for optimizing the welding yield of the ground network pins of the DIP device, the line width of the connecting line is 15mil-20mil.

According to the PCB structure for optimizing the welding yield of the ground network pins of the DIP device, the distance between the ground network pins and the conductive layer is not less than 8mil.

According to the PCB structure for optimizing the welding yield of the ground network pins of the DIP device, the distance between the ground network pins and the intermittent conductive layer is not less than 8mil.

According to the scheme, the number of layers connected by the ground network soldering leg is limited, and meanwhile, the ground network soldering leg and the conductive layer are connected by the connecting wire, so that the connection mode is made into a flower connection mode, and other conductive layers are set to be in a disconnected state, so that heat transfer during welding is reduced, heat dissipation is reduced, and welding yield is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic cross-sectional view of a first embodiment of the present utility model;

FIG. 2 is a schematic top view of a conductive layer connected to a ground trace of an embodiment of the present utility model;

FIG. 3 is a schematic top view of the conductive layer disconnected from the ground network fillets in accordance with the present utility model;

fig. 4 is a schematic top view of a conductive layer and a ground network pad according to a second embodiment of the present utility model;

fig. 5 is a schematic top view of a connection between a second conductive layer and a ground network solder tail according to a second embodiment of the present utility model;

FIG. 6 is a schematic top view of a conductive layer and ground network pad connection according to an embodiment of the present utility model;

fig. 7 is a schematic top view of a connection between a second conductive layer and a ground network pad according to an embodiment of the present utility model;

fig. 8 is a schematic top view of a connection between a fourth conductive layer and a ground network pad according to an embodiment of the present utility model;

fig. 9 is a schematic top view of a fifth conductive layer and ground network pad connection according to an embodiment of the present utility model.

Wherein, each reference sign in the figure: 1. a conductive layer; 2. an insulating layer; 3. ground network leg; 4. and (5) connecting wires.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

It will be understood that when an element is referred to as being "mounted" or "disposed" or "connected" to another element, it can be directly or indirectly on the other element. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are directions or positions based on the drawings, and are merely for convenience of description and are not to be construed as limiting the present technical solution. The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "multiple" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one, unless specifically defined otherwise.

Example one

As shown in fig. 1 to 3, the PCB structure for optimizing DIP device ground network pin welding yield according to the present utility model includes a conductive layer 1, an insulating layer 2 disposed between the conductive layers 1, the conductive layer 1 is 6 layers, a plurality of ground network connection holes are disposed on the conductive layer 1 and the insulating layer 2, a ground network soldering leg 3 is disposed in the ground network connection holes, a connecting line 4 for electrically connecting the ground network soldering leg 3 and the conductive layer 1 is disposed between the ground network soldering leg 3 and the conductive layer 1, two connecting lines 4 are disposed, the two connecting lines 4 are collinear, and the number of layers of connection between the ground network soldering leg 3 and the conductive layer 1 is 4 layers.

In this example, the number of layers connected by the ground network soldering leg 3 is limited, and meanwhile, the ground network soldering leg 3 and the conductive layer 1 are connected by the connecting wire 4, so that the connection mode is made into a flower connection, and other conductive layers 1 are in a disconnected state, so that heat transfer during welding is reduced, heat dissipation is reduced, and welding yield is improved.

As shown in fig. 2, in a preferred embodiment, the line width W of the connection line 4 is 15mil-20mil, so that the connection line 4 is ensured to have a sufficient line width W, so that the connection line has a sufficient current carrying capacity and a certain structural strength, and in addition, the ground network solder tail 3 and the conductive layer 1 are not completely connected, so that the heat conducting effect is reduced, and the welding yield is ensured.

As shown in fig. 2 and 3, in a preferred embodiment, the distance D1 between the ground network pad 3 and the conductive layer 1 connected thereto is not less than 8mil, and the distance D2 between the ground network pad 3 and the intermittent conductive layer 1 is not less than 8mil, so that a sufficient distance between the ground network pad 3 and the conductive layer 1 is ensured, and heat dissipation is reduced.

Example two

As shown in fig. 4, the difference from the first embodiment is that three connecting wires 4 are provided, and the included angle between every two connecting wires 4 is 120 °. The connecting wires 4 are increased to improve the connecting strength, when the line width W is unchanged, the current carrying capacity is improved, the line width W is reduced, the thermal barrier effect can be ensured, the welding yield is ensured, and the connecting wires 4 are uniformly distributed and stressed uniformly.

As shown in fig. 5, in a preferred embodiment, three of the connection lines 4 are T-shaped.

Example three

As shown in fig. 6, the difference from the first embodiment is that four connection lines 4 are provided, and four connection lines 4 are in an X shape. The connecting wires 4 are further increased, so that the connecting strength is improved, the current carrying capacity is improved when the line width W is unchanged, the line width W is reduced, the thermal barrier effect can be ensured, and the welding yield is ensured.

As shown in fig. 7, in a preferred embodiment, four connection lines 4 are cross-shaped, each connection line 4 is uniformly distributed and stressed, and this embodiment is a preferred embodiment, and has good heat blocking effect and good structural strength.

Example four

As shown in fig. 8, the difference from the first embodiment is that five connection lines 4 are provided, and five connection lines 4 are in a square shape. The connecting wires 4 are further increased to improve the connecting strength, when the line width W is unchanged, the current carrying capacity is improved, the line width W is reduced, the thermal barrier effect can be ensured, the welding yield is ensured, and the connecting wires 4 are uniformly distributed and stressed uniformly.

Example five

As shown in fig. 9, the difference from the first embodiment is that six connection lines 4 are provided, and six connection lines 4 are of a type. The connecting wires 4 are further increased to improve the connecting strength, when the line width W is unchanged, the current carrying capacity is improved, the line width W is reduced, the thermal barrier effect can be ensured, the welding yield is ensured, and the connecting wires 4 are uniformly distributed and stressed uniformly.

In the practical application process, the utility model is generally applied to the PCB board with at least 6 layers of the conductive layer 1, the number of layers of the ground network welding legs 3 connected with the conductive layer 1 is not more than 4, the specific connection layer is selected according to the practical situation, a plurality of connecting wires 4 can be arranged, one ends of the connecting wires 4 intersect the ground network welding legs 3, the other ends of the connecting wires 4 are connected with the conductive layer 1, and when the connecting wires 4 are more, the line width W can be properly reduced, so that the thermal insulation effect is ensured.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. The utility model provides an optimize PCB plate structure of DIP device earth screen pin welding yield, its characterized in that, is in including the conducting layer, set up insulating layer between the conducting layer, the conducting layer is not less than 6 layers, the conducting layer with be provided with a plurality of earth screen connecting holes on the insulating layer, be provided with earth screen leg in the earth screen connecting hole, earth screen leg with be provided with the connecting wire that is used for two electric connection between the conducting layer, earth screen leg with the number of piles of conducting layer connection is not more than 4.

2. The PCB structure of claim 1, wherein a plurality of connecting wires are provided, one ends of the plurality of connecting wires intersect the ground network pins, and the other ends of the plurality of connecting wires are connected with the conductive layer.

3. The PCB structure of claim 2, wherein two of the connecting wires are collinear.

4. The PCB structure for optimizing DIP device ground network pin soldering yield of claim 2, wherein three of said connecting lines are provided, each of said connecting lines having an included angle of 120 ° therebetween, or three of said connecting lines are T-shaped.

5. The PCB structure for optimizing DIP device ground network pin solder yield of claim 2, wherein four of said connection lines are provided, and four of said connection lines are X-shaped or cross-shaped.

6. The PCB structure of claim 2, wherein five of said connection lines are provided, and five of said connection lines are in the form of a bump.

7. The PCB structure of claim 2, wherein six connecting wires are provided, and six connecting wires are in a form of x.

8. A PCB structure for optimizing DIP device ground network pin solder yield as set forth in any one of claims 1-7 wherein the bond wire has a linewidth of 15mil to 20mil.

9. The PCB structure of claim 1, wherein a pitch between the ground network pad and the conductive layer is not less than 8 mils.

10. The PCB structure of claim 1, wherein a spacing between the ground network pins and the intermittent conductive layer is not less than 8 mils.