CN211807093U - Silicon chip buddha's warrior attendant wire-electrode cutting foam mechanism with ultrasonic wave remove device - Google Patents
Silicon chip buddha's warrior attendant wire-electrode cutting foam mechanism with ultrasonic wave remove device Download PDFInfo
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- CN211807093U CN211807093U CN201922012344.5U CN201922012344U CN211807093U CN 211807093 U CN211807093 U CN 211807093U CN 201922012344 U CN201922012344 U CN 201922012344U CN 211807093 U CN211807093 U CN 211807093U
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Abstract
The utility model aims at providing a silicon chip buddha's warrior attendant wire-electrode cutting foam mechanism with ultrasonic wave remove device, its characterized in that: the cutting fluid defoaming device comprises a cutting base table, a fluid storage tank, a diamond wire cutting machine, a cutting fluid storage cabin, a fluid collection container, a stirring driving machine, a stirring device, a defoaming sensor, a circulating pump and a control device, wherein a screen is arranged in the fluid collection container, a fluid storage tank filter screen is arranged at the upper part of the fluid storage tank, and the circulating pump is provided with a cutting fluid extraction pipe and a cutting fluid conveying pipe; whole mechanism simple structure, convenient operation, utilize ultrasonic wave remove device can be in time effectively to the produced cutting foam of buddha's warrior attendant wire-electrode cutting district along with the liquid stream advances the liquid storage district, form a large amount of bubbles in the liquid storage district, the bubble piles up, form foam and partial foam are abolished, the drawback and the problem of a series of influences cutting operations such as the solid of dispersion in the cutting fluid holds up, the dirty gauze of gluing have been solved, avoid the potential safety hazard that the chemical composition in the liquid storage district used and brought, defoaming efficiency has been improved.
Description
Technical Field
The utility model relates to a cutting fluid recovery processing field especially relates to a silicon chip buddha's warrior attendant line cutting foam mechanism with ultrasonic wave remove device.
Background
At present, the diamond wire cutting technology is more and more mature, a large amount of friction heat is released when a silicon rod is ground and cut, heat is transferred to cutting fluid, superfine (generally called submicron grade) silicon powder and diamond powder generated by cutting are dispersed in the cutting fluid to generate an oxidation-reduction reaction, hydrogen and carbon monoxide gas are released and are gathered in foam, a wire mesh running at a high speed and cutting fluid sprayed at a large flow are in cross impact, the wire mesh is a main energy source generated by the foam, if a large amount of bubbles generated in a cutting area are stacked to form the foam, part of the foam enters a liquid storage area along with the cutting fluid flow, part of the foam is accumulated in the cutting area, and solids dispersed in the cutting fluid are lifted to stick to the wire mesh, so that cutting is influenced; bubbles and foams entering the liquid storage area liquid bin are continuously accumulated on the liquid level, and after reaching the top of the liquid storage area liquid bin, the foams overflow to seriously influence the operation site; cutting fluid in a fluid storage tank of a fluid storage area circulates rapidly in the cutting process, the fluid storage tank of the fluid storage area stores 200-300L of fluid, the circulation flow rate is 140-200L/min, namely, the fluid is circulated once in 1.0-1.5 minutes, bubbles mixed in the cutting fluid are dispersed by a centrifugal pump impeller and are sprayed to a wire mesh cutting area, the sprayed cutting fluid is high in proportion and floats upwards after being sampled and stood by a beaker, the fine liquid bubbles are sprayed to the wire mesh, the protection performance of the liquid on steel wire wrapping and cooling is reduced, the abrasion of a steel wire is accelerated, the cutting capacity of the wire is reduced, hydrogen and carbon monoxide generated by the reaction of superfine silicon powder and diamond powder with water form tiny bubbles and enter a foam wrapping formed by a surfactant, so that harmful gas is difficult to be discharged from the cutting fluid in time, the potential safety hazard is caused, and therefore the cutting fluid foam needs to be eliminated in the operation process of the diamond wire cutting equipment, in the past, defoaming agents are added to eliminate cutting fluid foams, and when the cutting is carried out on-line recycling and circulating, the defoaming agents are accumulated in a system to cause the problems of filter bag blockage, low flow, alarm and the like to influence cutting.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an utilize ultrasonic wave remove device can be in time effectively to the produced cutting foam of buddha's warrior attendant wire-electrode cutting district advances the liquid storage district along with the liquid stream, and form a large amount of bubbles in the liquid storage district, the bubble piles up, form foam and partial foam and break away, the solid matter that has solved and disperse in the cutting fluid holds up, glue a series of drawbacks and the problem that influence cutting operation such as dirty gauze, make hydrogen and carbon monoxide that produce in the cutting process discharge from the cutting fluid after the sieve is strained fast, avoid the hidden danger that the chemical composition in the liquid storage district used and brought, silicon chip buddha's warrior attendant wire-electrode cutting foam mechanism of the dispersion ability of cutting fluid self has been improved.
The technical scheme of the utility model is that: the utility model provides a silicon chip buddha's warrior attendant line cutting foam mechanism with ultrasonic wave remove device which characterized in that: the cutting fluid defoaming device comprises a cutting base station, a fluid storage tank, a diamond wire cutting machine, a cutting fluid storage cabin, a fluid collecting container, a stirring driving machine, a stirring device, a defoaming sensor, a circulating pump and a control device, wherein the fluid storage tank is positioned at the upper part of the cutting base station, the fluid storage tank is fixedly connected with the cutting base station, the diamond wire cutting machine is positioned at the upper part of the fluid storage tank, the diamond wire cutting machine is fixedly connected with the fluid storage tank, the cutting fluid storage cabin is positioned at the upper part of the diamond wire cutting machine, the cutting fluid storage tank is fixedly connected with the diamond wire cutting machine, the fluid collecting container is positioned between the fluid storage tank and the diamond wire cutting machine, the fluid collecting container is fixedly connected with the fluid storage tank, the stirring driving machine is positioned at the bottom of the fluid storage tank, the stirring driving machine is fixedly connected with the fluid storage tank, the stirring device is positioned inside the fluid storage tank, and one end of, the defoaming device is positioned on one side of the liquid storage tank, the defoaming device is movably connected with the liquid storage tank, the defoaming sensor is positioned inside the liquid storage tank, the defoaming sensor is movably connected with the liquid storage tank and is connected with the defoaming device by a circuit, the circulating pump is positioned at the edge position of one side of the upper part of the liquid storage tank, the circulating pump is fixedly connected with the liquid storage tank, the circulating pump is also provided with a cutting fluid extraction pipe and a cutting fluid conveying pipe, the cutting fluid extraction pipe is positioned on one side of the circulating pump, one end of the cutting fluid extraction pipe is fixedly connected with the circulating pump, the other end of the cutting fluid extraction pipe is inserted into the liquid storage tank, the cutting fluid conveying pipe is positioned on the other side of the circulating pump, one end of the cutting fluid conveying pipe is fixedly connected with the circulating pump, and the other end of the cutting fluid conveying pipe is fixedly connected with the cutting fluid storage tank, the control device is positioned on one side of the cutting base station and is fixedly connected with the cutting base station.
Further, the liquid storage tank is a transparent toughened glass tank.
Further, the cutting fluid storage cabin is a container with liquid level scales.
Further, the liquid collecting container is of a funnel-shaped structure.
Further, still be equipped with the screen cloth on the collection liquid container, the screen cloth is located collection liquid container's inside, screen cloth and collection liquid container are fixed connection, the screen cloth is the fibre net.
Further, still be equipped with the liquid reserve tank filter screen on the liquid reserve tank, the liquid reserve tank filter screen is located the inboard upper portion position department of liquid reserve tank, the liquid reserve tank filter screen is fixed connection with the liquid reserve tank, the liquid reserve tank filter screen is the cotton-wadded net.
Further, the stirring device is a stirring paddle.
Further, the defoaming device is an ultrasonic defoamer.
Further, the defoaming inductor is an ultrasonic wave energy conversion rod.
The beneficial effects of the utility model reside in that: the equipment is a silicon wafer diamond wire cutting foam mechanism which can effectively and timely eliminate cutting foam generated by a diamond wire cutting area along with liquid flowing into a liquid storage area, and forms a large amount of bubbles, bubble stacking, foam forming and partial foam in the liquid storage area to be broken, so that the defect and the problem that a series of solid matters dispersed in cutting liquid are lifted, dirt sticking net and the like influence cutting operation are solved, hydrogen and carbon monoxide generated in the cutting process are quickly discharged from the filtered cutting liquid, the hidden danger caused by the use of chemical components in the liquid storage area is avoided, and the self dispersion performance of the cutting liquid is improved; the defoaming sensor is arranged in the liquid storage tank, the defoaming sensor adopts an ultrasonic energy conversion rod and is connected with a defoaming device adopting the ultrasonic defoamer by utilizing a circuit, under the action of the defoaming device, the defoaming sensor can generate ultrasonic waves, bubbles are extruded and stretched by the vibration effect of high-frequency sound waves generated by the ultrasonic waves, and the purpose of breaking the bubbles is achieved, because the ultrasonic waves break the bubbles by utilizing the vibration effect of wave transmission, the physical process is realized, the hidden danger caused by the use of chemical components can be avoided, the ultrasonic waves can play the roles of anti-deposition, homogenization and dispersion, the self-dispersion performance of the cutting liquid can be improved, in addition, the hydrogen and carbon monoxide generated in the cutting process can be quickly discharged from the cutting liquid by timely breaking of the bubbles, and the current situation of unorganized discharge of harmful gases can be well solved by matching with an explosion-proof exhaust system, in addition, the fluidity of the cutting fluid can be increased by matching with a stirring device in the liquid storage tank, so that the ultrasonic defoaming is quicker; the whole mechanism is simple in structure, convenient to operate and obvious in defoaming effect, defoaming time is saved, and recycling efficiency is improved.
Drawings
Fig. 1 is a front view of the present invention.
Fig. 2 is a sectional view of the cutting fluid collecting container of the present invention.
Fig. 3 is the schematic diagram of the internal structure of the liquid storage tank of the present invention.
Wherein: 1. cutting base 2, liquid reserve tank 3, buddha's warrior attendant wire cut electrical discharge machining
4. Cutting fluid storage cabin 5, liquid collecting container 6 and screen mesh
7. Liquid storage tank filter screen 8, stirring driving machine 9 and stirring device
10. Defoaming device 11, defoaming inductor 12 and circulating pump
13. Cutting fluid extraction pipe 14, cutting fluid delivery pipe 15, controlling means
Detailed Description
The following provides a brief description of the embodiments of the present invention with reference to the accompanying drawings.
As shown in fig. 1, 2 and 3, the silicon wafer diamond wire cutting foam mechanism with the ultrasonic wave elimination device is characterized in that: the cutting fluid cutting machine is characterized by comprising a cutting base platform 1, a fluid storage tank 2, a diamond wire cutting machine 3, a cutting fluid storage cabin 4, a fluid collection container 5, a stirring driving machine 8, a stirring device 9, a defoaming device 10, a defoaming sensor 11, a circulating pump 12 and a control device 15, wherein the fluid storage tank 2 is positioned on the upper portion of the cutting base platform 1, the fluid storage tank 2 is fixedly connected with the cutting base platform 1, the diamond wire cutting machine 3 is positioned on the upper portion of the fluid storage tank 2, the diamond wire cutting machine 3 is fixedly connected with the fluid storage tank 2, the cutting fluid storage cabin 4 is positioned on the upper portion of the diamond wire cutting machine 3, the cutting fluid storage cabin 4 is fixedly connected with the diamond wire cutting machine 3, the fluid collection container 5 is positioned between the fluid storage tank 2 and the diamond wire cutting machine 3, the fluid collection container 5 is fixedly connected with the fluid storage tank 2, a screen 6 is further arranged on the fluid collection container 5, and the screen, the screen 6 is fixedly connected with the liquid collecting container 5, the liquid storage tank 2 is also provided with a liquid storage tank filter screen 7, the liquid storage tank filter screen 7 is positioned at the upper position of the inner side of the liquid storage tank 2, the liquid storage tank filter screen 7 is fixedly connected with the liquid storage tank 2, the stirring driving machine 8 is positioned at the bottom of the liquid storage tank 2, the stirring driving machine 8 is fixedly connected with the liquid storage tank 2, the stirring device 9 is positioned inside the liquid storage tank 2, one end of the stirring device 9 penetrates through the liquid storage tank 2 and is fixedly connected with the stirring driving machine 8, the defoaming device 10 is positioned at one side of the liquid storage tank 2, the defoaming device 10 is movably connected with the liquid storage tank 2, the defoaming sensor 11 is positioned inside the liquid storage tank 2, the defoaming sensor 11 is movably connected with the liquid storage tank 2 and is connected with the defoaming device 10 by a circuit, the circulating pump 12 is positioned at the edge position of one side of the upper portion of the liquid storage tank 2, circulating pump 12 is fixed connection with liquid reserve tank 2, still be equipped with cutting fluid extraction tube 13 and cutting fluid conveyer pipe 14 on the circulating pump 12, cutting fluid extraction tube 13 is located one side of circulating pump 12, the one end of cutting fluid extraction tube 13 is fixed connection with circulating pump 12, the inside of liquid reserve tank 2 is inserted to the other end of cutting fluid extraction tube 13, cutting fluid conveyer pipe 14 is located circulating pump 12's opposite side, cutting fluid conveyer pipe 14's one end is fixed connection with circulating pump 12, cutting fluid conveyer pipe 14's the other end is fixed connection with cutting fluid storage cabin 4, controlling means 15 is located one side of cutting base station 1, controlling means 15 is fixed connection with cutting base station 1. The liquid storage tank 2 is a transparent toughened glass tank. The cutting fluid storage cabin 4 is a container with liquid level scales. The liquid collecting container 5 is of a funnel-shaped structure. The screen 6 is a fiber mesh. The filter screen 7 of the liquid storage tank is a cotton net. The stirring device 9 is a stirring paddle. The defoaming device 10 is an ultrasonic defoamer. The defoaming sensor 11 is an ultrasonic transduction rod.
The working mode is as follows: the equipment is a silicon wafer diamond wire cutting foam mechanism which can effectively and timely eliminate cutting foam generated by a diamond wire cutting area along with liquid flowing into a liquid storage area, and forms a large amount of bubbles, bubble stacking, foam forming and partial foam in the liquid storage area to be broken, so that the defect and the problem that a series of solid matters dispersed in cutting liquid are lifted, dirt sticking net and the like influence cutting operation are solved, hydrogen and carbon monoxide generated in the cutting process are quickly discharged from the filtered cutting liquid, the hidden danger caused by the use of chemical components in the liquid storage area is avoided, and the self dispersion performance of the cutting liquid is improved; the cutting machine mainly comprises a cutting base platform 1, a liquid storage tank 2, a diamond wire cutting machine 3, a cutting liquid storage cabin 4, a liquid collecting container 5, a stirring driving machine 8, a stirring device 9, a defoaming device 10, a defoaming sensor 11, a circulating pump 12 and a control device 15, wherein the whole set of equipment is supported by the cutting base platform 1, and all parts are installed on the cutting base platform 1, so that the whole cutting machine is convenient to carry, move and fix integrally, when in use, firstly, the diamond wire cutting machine 3 utilizes the cutting liquid in the cutting liquid storage cabin 4 arranged at the top of the diamond wire cutting machine to carry out cutting work, the cutting liquid generated in work enters the liquid collecting container 5, the cutting liquid storage cabin 4 adopts a container with liquid level scales, an operator can observe the height of the cutting liquid inside the diamond wire cutting machine to store the cutting liquid inwards at any time, and the liquid collecting container 5 adopts a funnel-shaped structure, so that the cutting liquid can be conveniently leaked in, avoid forming hydrops in the liquid collecting container 5 and handling very difficultly, a screen 6 is arranged in the liquid collecting container 5, the screen 6 adopts a fiber mesh which can preliminarily filter large granular impurities and cutting scraps in the used cutting fluid, the cutting fluid after primary filtering enters the liquid storage tank 2 at the lower part of the diamond wire cutting machine 3, a liquid storage tank filter screen 7 is also arranged at the upper part of the inner side of the liquid storage tank 2, the liquid storage tank filter screen 7 adopts a cotton mesh, the density of the cotton mesh is smaller, fine particles in the cutting fluid can be intercepted, the cutting fluid after double filtering can be gathered in the liquid storage tank 2, because the diamond wire cutting machine 3 can lead superfine silicon powder and diamond powder to generate a large amount of bubble stacking and foam, further the cutting operation is influenced, a defoaming sensor 11 is arranged in the liquid storage tank 2, the defoaming sensor 11 adopts an ultrasonic transduction rod, and the defoaming device 10 using the ultrasonic wave defoamer is connected by using a circuit, under the action of the defoaming device 10, the defoaming sensor 11 can generate ultrasonic waves, bubbles are extruded and stretched by the vibration effect of high-frequency sound waves generated by the ultrasonic waves, and the purpose of breaking foams is achieved, because the bubbles are broken by the vibration effect of wave transmission by the ultrasonic waves, which is a physical process, the hidden danger caused by the use of chemical components can be avoided, and the ultrasonic waves can play the roles of deposition resistance, homogenization and dispersion, so that the self-dispersing performance of the cutting fluid can be improved, moreover, through the timely breaking of the foams, hydrogen and carbon monoxide generated in the cutting process can be rapidly discharged from the cutting fluid, the current situation of unorganized discharge of harmful gases can be well solved by matching with an explosion-proof exhaust system, in addition, by matching with the stirring device 9 in the liquid storage tank 2, under the drive of the stirring driver 8, the stirring device 9 starts to operate, the stirring device 9 adopts a stirring paddle, so that the fluidity of cutting fluid can be increased, the ultrasonic defoaming is quicker, finally, the circulating pump 12 is utilized to extract the cutting fluid with the defoaming completed in the liquid storage tank 2 through the cutting fluid extraction pipe 13 and convey the cutting fluid into the cutting fluid storage cabin 4 along the cutting fluid conveying pipe 14, the defoaming circulation is further completed, the driving and the electric control of the whole equipment are implemented through the control device 15, and the whole mobility and the handling control performance are enhanced; the whole mechanism is simple in structure, convenient to operate and obvious in defoaming effect, defoaming time is saved, and recycling efficiency is improved.
In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "inner", "outer", "top", "bottom", "end", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention, and should not be considered as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (9)
1. The utility model provides a silicon chip buddha's warrior attendant line cutting foam mechanism with ultrasonic wave remove device which characterized in that: the cutting fluid defoaming device comprises a cutting base station, a fluid storage tank, a diamond wire cutting machine, a cutting fluid storage cabin, a fluid collecting container, a stirring driving machine, a stirring device, a defoaming sensor, a circulating pump and a control device, wherein the fluid storage tank is positioned at the upper part of the cutting base station, the fluid storage tank is fixedly connected with the cutting base station, the diamond wire cutting machine is positioned at the upper part of the fluid storage tank, the diamond wire cutting machine is fixedly connected with the fluid storage tank, the cutting fluid storage cabin is positioned at the upper part of the diamond wire cutting machine, the cutting fluid storage tank is fixedly connected with the diamond wire cutting machine, the fluid collecting container is positioned between the fluid storage tank and the diamond wire cutting machine, the fluid collecting container is fixedly connected with the fluid storage tank, the stirring driving machine is positioned at the bottom of the fluid storage tank, the stirring driving machine is fixedly connected with the fluid storage tank, the stirring device is positioned inside the fluid storage tank, and one end of, the defoaming device is positioned on one side of the liquid storage tank, the defoaming device is movably connected with the liquid storage tank, the defoaming sensor is positioned inside the liquid storage tank, the defoaming sensor is movably connected with the liquid storage tank and is connected with the defoaming device by a circuit, the circulating pump is positioned at the edge position of one side of the upper part of the liquid storage tank, the circulating pump is fixedly connected with the liquid storage tank, the circulating pump is also provided with a cutting fluid extraction pipe and a cutting fluid conveying pipe, the cutting fluid extraction pipe is positioned on one side of the circulating pump, one end of the cutting fluid extraction pipe is fixedly connected with the circulating pump, the other end of the cutting fluid extraction pipe is inserted into the liquid storage tank, the cutting fluid conveying pipe is positioned on the other side of the circulating pump, one end of the cutting fluid conveying pipe is fixedly connected with the circulating pump, and the other end of the cutting fluid conveying pipe is fixedly connected with the cutting fluid storage tank, the control device is positioned on one side of the cutting base station and is fixedly connected with the cutting base station.
2. The silicon wafer diamond wire cutting foam mechanism with the ultrasonic elimination device according to claim 1, is characterized in that: the liquid storage tank is a transparent toughened glass tank.
3. The silicon wafer diamond wire cutting foam mechanism with the ultrasonic elimination device according to claim 1, is characterized in that: the cutting fluid storage cabin is a container with liquid level scales.
4. The silicon wafer diamond wire cutting foam mechanism with the ultrasonic elimination device according to claim 1, is characterized in that: the liquid collecting container is of a funnel-shaped structure.
5. The silicon wafer diamond wire cutting foam mechanism with the ultrasonic elimination device according to claim 1, is characterized in that: the liquid collecting container is characterized in that a screen is further arranged on the liquid collecting container, the screen is located inside the liquid collecting container, the screen is fixedly connected with the liquid collecting container, and the screen is a fiber net.
6. The silicon wafer diamond wire cutting foam mechanism with the ultrasonic elimination device according to claim 1, is characterized in that: still be equipped with the liquid reserve tank filter screen on the liquid reserve tank, the liquid reserve tank filter screen is located the inboard upper portion position department of liquid reserve tank, the liquid reserve tank filter screen is fixed connection with the liquid reserve tank, the liquid reserve tank filter screen is the cotton-wadded net.
7. The silicon wafer diamond wire cutting foam mechanism with the ultrasonic elimination device according to claim 1, is characterized in that: the stirring device is a stirring paddle.
8. The silicon wafer diamond wire cutting foam mechanism with the ultrasonic elimination device according to claim 1, is characterized in that: the defoaming device is an ultrasonic defoamer.
9. The silicon wafer diamond wire cutting foam mechanism with the ultrasonic elimination device according to claim 1, is characterized in that: the defoaming inductor is an ultrasonic wave energy conversion rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922012344.5U CN211807093U (en) | 2019-11-20 | 2019-11-20 | Silicon chip buddha's warrior attendant wire-electrode cutting foam mechanism with ultrasonic wave remove device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922012344.5U CN211807093U (en) | 2019-11-20 | 2019-11-20 | Silicon chip buddha's warrior attendant wire-electrode cutting foam mechanism with ultrasonic wave remove device |
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| Publication Number | Publication Date |
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| CN211807093U true CN211807093U (en) | 2020-10-30 |
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| CN201922012344.5U Active CN211807093U (en) | 2019-11-20 | 2019-11-20 | Silicon chip buddha's warrior attendant wire-electrode cutting foam mechanism with ultrasonic wave remove device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112549335A (en) * | 2020-11-23 | 2021-03-26 | 龚旭敏 | Semiconductor production device with waste recovery structure |
| CN113858463A (en) * | 2021-11-03 | 2021-12-31 | 燕飞 | Diamond wire cutting machine for solar-grade silicon wafer |
-
2019
- 2019-11-20 CN CN201922012344.5U patent/CN211807093U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112549335A (en) * | 2020-11-23 | 2021-03-26 | 龚旭敏 | Semiconductor production device with waste recovery structure |
| CN113858463A (en) * | 2021-11-03 | 2021-12-31 | 燕飞 | Diamond wire cutting machine for solar-grade silicon wafer |
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