CN211791728U

CN211791728U - Imaging device and electronic apparatus

Info

Publication number: CN211791728U
Application number: CN202020738658.3U
Authority: CN
Inventors: 石峣
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-05-07
Filing date: 2020-05-07
Publication date: 2020-10-27
Anticipated expiration: 2030-05-07

Abstract

The application discloses an imaging device and an electronic apparatus. The imaging device comprises a frame assembly, an imaging module and a module circuit board assembly. The imaging module is accommodated in the frame assembly and can move relative to the frame assembly. The imaging module comprises a lens component and a photosensitive component. Light reaches the photosensitive assembly through the lens assembly, and the photosensitive assembly is used for converting optical signals into electric signals to form images. The module circuit board assembly comprises a module circuit board and a cable, one end of the module circuit board is connected with the photosensitive assembly, and the other end of the module circuit board is connected with the cable. In the imaging device and the electronic equipment of this application embodiment, module circuit board assembly includes module circuit board and cable, and the section and the sensitization subassembly of module circuit board are connected, and the other end is connected with the cable. So, reduce the antitorque force effect of module circuit board to the formation of image module motion through using the cable, avoid the damage of module circuit board.

Description

Imaging device and electronic apparatus

Technical Field

The present disclosure relates to the field of imaging technologies, and more particularly, to an imaging device and an electronic apparatus.

Background

The imaging module of the electronic equipment and the mainboard of the electronic equipment can be connected through a circuit board so as to realize signal transmission between the imaging module and the mainboard. However, when the imaging module moves, the circuit board is also driven, and at this time, the circuit board is twisted and generates a corresponding torque. Thus, the circuit board is easily damaged.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an imaging device and an electronic device.

The imaging device of the embodiment of the application comprises a frame assembly, an imaging module and a module circuit board assembly. The imaging module is accommodated in the frame assembly and can move relative to the frame assembly. The imaging module comprises a lens component and a photosensitive component. Light passes through the lens subassembly and reaches the sensitization subassembly, the sensitization subassembly is used for converting light signal into the electrical signal with formation of image. The module circuit board assembly comprises a module circuit board and a cable, one end of the module circuit board is connected with the photosensitive assembly, and the other end of the module circuit board is connected with the cable.

In some embodiments, the modular circuit board assembly further includes a connector to which an end of the cable remote from the modular circuit board is connected.

In some embodiments, the number of cables includes a plurality of cables, and each of the cables has one end connected to the module circuit board and the other end connected to the connector.

In some embodiments, the imaging device further comprises a cable binder for binding a plurality of the cables.

In some embodiments, the frame assembly includes a first frame and a second frame. The second frame is accommodated in a first accommodating space formed in the first frame, and the imaging module is accommodated in a second accommodating space formed in the second frame. The image forming apparatus further includes a cover. The cover body is fixedly connected with the imaging module. The cover body is movably connected with the first frame and the second frame, and the driving force applied to the second frame can drive the imaging module to move relative to the first frame through the cover body so as to compensate the shaking amount of the imaging module.

In some embodiments, the cover and the first frame are movably connected to form two first joints, and a line connecting the two first joints defines a first axis. The cover body is movably connected with the second frame to form two second connecting positions, and a connecting line of the two second connecting positions is defined as a second axis. The driving force can drive the imaging module to rotate around the first axis and/or the second axis relative to the first frame through the cover body so as to compensate the shaking amount of the imaging module.

In some embodiments, the cover comprises a cover body and two first hinge arms, each of the first hinge arms has one end connected to the cover body and the other end hinged to the first frame. The extending directions of the two first hinge arms are coincident with the first axis.

In some embodiments, the first frame includes a first inner sidewall and a first outer sidewall opposite to each other, the first inner sidewall is closer to the second frame than the first outer sidewall, and the first inner sidewall is recessed toward the first outer sidewall to form two first receiving cavities. The imaging device further comprises two first hinge pieces corresponding to the two first accommodating cavities, each first hinge piece is arranged on the first frame and accommodated in the corresponding first accommodating cavity, and one end, far away from the cover body, of each first hinge arm is connected with the corresponding first hinge piece.

In some embodiments, the cover further comprises two second hinge arms, each of which has one end connected to the cover body and the other end hinged to the second frame. The extending directions of the two second hinge arms are coincident with the second axis.

In some embodiments, the second frame includes a second inner sidewall and a second outer sidewall opposite to each other, the second inner sidewall is closer to the imaging module than the second outer sidewall, and the second inner sidewall is recessed toward the second outer sidewall to form two second receiving cavities. The imaging device further comprises two second hinged pieces corresponding to the two second accommodating cavities, each second hinged piece is arranged on the second frame and accommodated in the corresponding second accommodating cavity, and one end, far away from the cover body, of each second hinged arm is connected with the second hinged piece.

The electronic device according to the embodiment of the present application includes a housing and the imaging apparatus according to any one of the above embodiments. The imaging device is coupled to the housing.

In the imaging device and the electronic equipment of this application embodiment, module circuit board assembly includes module circuit board and cable, and the section and the sensitization subassembly of module circuit board are connected, and the other end is connected with the cable. So, reduce the antitorque force effect of module circuit board to the formation of image module motion through using the cable, avoid the damage of module circuit board.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic perspective assembly view of an imaging device according to certain embodiments of the present application;

FIG. 2 is an exploded perspective view of the imaging device of FIG. 1;

FIG. 3 is a schematic plan view of the imaging device of FIG. 1;

FIG. 4 is a schematic partial cross-sectional view of the imaging device of FIG. 1 taken along line IV-IV;

FIG. 5 is a schematic view of a cover and hinge assembly of the imaging device of FIG. 1;

FIG. 6 is a schematic view of the cover and hinge of the imaging device of FIG. 1 from another perspective;

FIG. 7 is a partially exploded perspective view of the imaging device of FIG. 1;

FIG. 8 is a schematic plan view of an imaging device according to certain embodiments of the present application;

FIG. 9 is a schematic view of the position relationship between the first driving member and the magnetic induction device in the imaging apparatus according to some embodiments of the present application;

FIG. 10 is a schematic view of the position relationship of the first driving member and the magnetic induction device in the imaging apparatus according to some embodiments of the present application;

FIG. 11 is a schematic plan view of an electronic device according to some embodiments of the present application.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, 2 and 4, an imaging device 100 is provided. The imaging device 100 includes a frame assembly, an imaging module 30, and a module circuit board assembly 90. The imaging module 30 is housed within the frame assembly and is capable of movement relative to the frame assembly. The imaging module 30 includes a lens assembly 31 and a photosensitive assembly 32. The light passes through the lens assembly 31 to the photosensitive assembly 32. The photosensitive element 32 is used to convert the optical signal into an electrical signal for imaging. The modular circuit board assembly 90 includes a modular circuit board 91 and a cable 92. One end of the module circuit board 91 is connected to the photosensitive element 32, and the other end is connected to the cable 92.

In the imaging device 100 according to the embodiment of the present application, the module circuit board assembly 90 connected to the imaging module 30 includes a module circuit board 91 and a cable 92. So, reduce the torsional force effect of module circuit board subassembly 90 to the motion of imaging module 30 through using cable 92, can ensure on the one hand that imaging module 30 can carry out accurate shake compensation, on the other hand can reduce the motion of imaging module 30 and to module circuit board subassembly 90's influence, avoid module circuit board subassembly 90's damage.

Referring to fig. 2, 4, 5, 6 and 7, an imaging apparatus 100 according to an embodiment of the present disclosure includes a frame assembly, an imaging module 30, a cover 40, a first hinge 51, a second hinge 52, a driving circuit board 60, a driving assembly 70, a magnetic induction device 80 and a module circuit board assembly 90. The frame assembly includes a first frame 10 and a second frame 10.

Referring to fig. 2, the first frame 10 includes a first sub-frame 13 and a second sub-frame 14 connected to each other. The first subframe 13 defines a first receiving space 12 for receiving the second frame 20, the first subframe 13 includes a first inner sidewall 101 and a first outer sidewall 102, which are opposite to each other, and the first inner sidewall 101 is closer to the second frame 20 than the first outer sidewall 102. The first inner sidewall 101 is recessed toward the first outer sidewall 102 to form two first receiving cavities 11. The second sub-frame 14 extends from the first outer sidewall 10 in a direction away from the first receiving space 12, and the second sub-frame 14 defines a receiving cavity 141 for receiving a portion of the modular circuit board assembly 90.

With reference to fig. 2, the second frame 20 is accommodated in the first frame 10, and specifically, the second frame 20 is accommodated in the first accommodating space 12 of the first subframe 13. The second frame 20 includes a second inner sidewall 201 and a second outer sidewall 202, the second inner sidewall 201 and the second outer sidewall 202 are opposite, and the second inner sidewall 201 is closer to the imaging module 30 than the second outer sidewall 202. The second inner sidewall 201 of the second frame 20 encloses a second receiving space 22. The second inner sidewall 201 is recessed toward the second outer sidewall 202 to form two second receiving cavities 21. The second outer sidewall 202 is recessed toward the second inner sidewall 201 to form a mounting groove 23 (shown in fig. 7).

Referring to fig. 2 and 4, the imaging module 30 is accommodated in the second frame 20, and specifically, the imaging module 30 is accommodated in the second accommodating space 22 of the second frame 20. The imaging module 30 includes a lens assembly 31, a photosensitive assembly 32, and a module holder 33. The module holder 33 is formed with a third housing space 331, and the lens assembly 31 is housed in the third housing space 331. The light passes through the lens assembly 31 to the photosensitive assembly 32, and the photosensitive assembly 32 is used for converting the optical signal into an electrical signal to form an image.

Referring to fig. 2, the cover 40 is fixedly connected to the imaging module 30 and movably connected to both the first frame 10 and the second frame 20. The driving force applied to the second frame 20 can drive the imaging module 30 to move relative to the first frame 10 through the cover 40 to compensate for the shaking amount of the imaging module 30. Referring to fig. 3, the cover 40 is movably connected to the first frame 10 to form two first joints 901, a connection line of the two first joints 901 is defined as a first axis D1, the cover 40 is movably connected to the second frame 20 to form two second joints 902, and a connection line of the two second joints 902 is defined as a second axis D2. In one example, the first axis D1 may be perpendicular to the second axis D2. Of course, the included angle between the first axis D1 and the second axis D2 may be other angles, and is not limited herein. In the case where the cover 40, the first frame 10 and the second frame 20 shown in fig. 3 are all of a square structure, the extending direction of the first axis D1 and the extending direction of the second axis D2 may be two diagonal directions of the square structure. Of course, in other embodiments, the cover 40, the first frame 10 and the second frame 20 may be all circular structures, and in this case, the extending direction of the first axis D1 and the extending direction of the second axis D2 may be two radial directions of the circular structures, respectively, and are not limited herein. The driving force can drive the imaging module 30 to rotate around the first axis D1 relative to the first frame 10 through the cover 40 to compensate for the shaking amount of the imaging module 30; alternatively, the driving force can drive the imaging module 30 to rotate around the second axis D2 relative to the first frame 10 and the second frame 20 through the cover 40 to compensate for the shaking amount of the imaging module 30; or the driving force can drive the imaging module 30 to rotate around the first axis D1 relative to the first frame 10 through the cover 40, and can drive the imaging module 30 to rotate around the first axis D1 and around the second axis D2 relative to the first frame 10 and the second frame 20 through the cover 40 (the rotation around the first axis D1 and the rotation around the second axis D2 can be performed in a time-sharing manner) to compensate the shaking amount of the imaging module 30.

Referring to fig. 1, 2, 4 and 5, the cover 40 is disposed on the top of the imaging module 30, and the cover 40 includes a first surface 401, a second surface 402, a cover body 41, a first hinge arm 42 and a second hinge arm 43. The first surface 401 is opposite the second surface 402. The second surface 402 is closer to the imaging module 30 than the first surface 401. The cover body 41 is provided with a light hole 411, and one end of the lens assembly 31 far away from the photosensitive assembly 32 extends out of the light hole 411.

Referring to fig. 3 and 5, the number of the first hinge arms 42 is two, and the extending direction of the two first hinge arms 42 is coincident with the first axis D1. Each of the first hinge arms 42 has one end connected to the cover body 41 and the other end hinged to the first frame 10. At an end of each first hinge arm 42 away from the cover body 41, the first surface 401 is recessed toward the second surface 402 to form a first receiving groove 421.

Referring to fig. 3 and 6, the number of the second hinge arms 43 is two, and the extending directions of the two second hinge arms 43 are both coincident with the second axis D2. One end of each second hinge arm 43 is connected to the cover body 41, and the other end is hinged to the second frame 20. At an end of each second hinge arm 43 away from the cover body 41, a second receiving groove 431 is formed by the first surface 401 being recessed toward the second surface 402.

Referring to fig. 2, 3 and 5, the number of the first hinge members 51 is two. The two first hinge members 51 correspond to the two first receiving cavities 11. Each of the first hinge members 51 is disposed on the first frame 10 and received in the corresponding first receiving cavity 11. An end of the first hinge arm 42 remote from the cover body 41 is connected to the first hinge 51. Each first hinge 51 includes a first hinge body 511 and a first ball 512. The first hinge body 511 has a first through hole 5111. The first ball 512 is partially received in the first through hole 5111. A portion of the first ball 512 not received in the first through hole 5111 is at least partially received in the first receiving groove 421. In this way, the cover 40 can rotate the imaging module 30 relative to the first frame 10 about the first axis D1 to compensate for the shake of the imaging module 30 by the movable connection between the first hinge 51 and the first hinge arm 42.

Referring to fig. 2, 3 and 6, the number of the second hinge parts 52 is two. The two second hinge members 52 correspond to the two second receiving cavities 21. Each of the second hinge members 52 is disposed on the second frame 20 and is received in the corresponding second receiving cavity 21. An end of the second hinge arm 43 remote from the cover body 41 is connected to the second hinge 52. Each second hinge 52 includes a second hinge body 521 and a second ball 522. The second hinge body 521 has a second through hole 5211. The second ball 522 is partially received in the second through hole 5211. A portion of the second ball 522 not received in the second through hole 5211 is at least partially received in the second receiving groove 431. In this way, the cover 40 can drive the imaging module 30 to rotate around the second axis D2 relative to the first frame 10 and the second frame 20 through the movable connection between the second hinge 52 and the second hinge arm 43 to compensate for the shake amount of the imaging module 30.

Referring to fig. 2, 4 and 7, the driving circuit board 60 is mounted on the first inner sidewall 101 of the first frame 10 and penetrates the first frame 10 such that the connector end extends toward a side away from the first receiving space 12. The driving circuit board 60 includes a first side 601 and a second side 602, and the first side 601 is opposite to the second side 602. The first side 601 is closer to the second frame 20 than the second side 602.

The drive assembly 70 comprises a first drive member 71 and a second drive member 72. The first driving member 71 is mounted on a side of the driving circuit board 60 close to the second frame 20, that is, the first driving member 71 is mounted on the first side 601 of the driving circuit board 60. The second driving member 72 is installed at a side of the second frame 20 close to the first frame 10, that is, the second driving member 72 is installed at the second outer sidewall 202 of the second frame 20. The first drive member 71 interacts with the second drive member 72 to generate a driving force. Illustratively, as shown in fig. 4, the first driving member 71 is a coil, the second driving member 72 is a magnet, and the driving circuit board 60 supplies current to the coil, so that the coil and the magnet interact to generate driving force. Illustratively, as shown in fig. 7, the second driving member 72 is mounted in the mounting groove 23 of the second frame 20, thus facilitating reduction in the lateral dimension of the image forming apparatus 100.

The number of drive assemblies 70 may be one, two, three, four, etc., and is not limited herein. As shown in fig. 2 and 7, the number of the driving assemblies 70 is two, and two driving assemblies 70 are respectively located at adjacent both sides of the second frame 20. Of course, in other embodiments, two driving assemblies 70 may be located on two opposite sides of the second frame 20, and are not limited herein. Providing two driving assemblies 70 to apply driving force to the second frame 20 can reduce the number of components required for the imaging apparatus 100 and the weight of the imaging apparatus 100 while ensuring that sufficient driving force can be applied to achieve the anti-shake effect. As shown in fig. 2 and 8, the number of the driving assemblies 70 is four, and four driving assemblies 70 are respectively located on four second outer sidewalls 202 of the second frame 20. The provision of the four driving assemblies 70 can ensure that a sufficient driving force can be applied to the second frame 20, so that the cover 40 can better drive the imaging module 30 to move for anti-shake.

Referring to fig. 4, the driving assembly 70 may further include a third driving member 73. The third driving member 73 is mounted on a side wall of the lens assembly 31. The third driving member 73 interacts with the second driving member 72 to generate a driving force, which can drive the lens assembly 31 to move along the optical axis of the lens assembly 31, so as to realize zooming or focusing of the imaging module 30. In one example, the second driving member 72 is a magnet, and the third driving member 73 is a coil.

In the embodiment shown in fig. 4, the first driving member 71 can interact with the second driving member 72 to provide a driving force for the shake compensation movement of the imaging module 30, and the second driving member 72 can interact with the third driving member 73 to provide a driving force for the focusing movement of the lens assembly 31, which can reduce the number of components required for the imaging device 100 and is beneficial to reducing the lateral size and weight of the imaging module 30.

Referring to fig. 7, 9 and 10, the magnetic induction device 80 is disposed on a side (i.e., a first side 601) of the driving circuit board 60 close to the second frame 20. As shown in fig. 9, when the magnetic induction device 80 is disposed on the side of the driving circuit board 60 close to the second frame 20, it can also be disposed in the space surrounded by the first driving member 71 (i.e., the coil); alternatively, as shown in fig. 10, when the magnetic induction device 80 is disposed on the side of the driving circuit board 60 close to the second frame 20, it may be disposed outside the space surrounded by the first driving member 71 (i.e., the coil). The magnetic induction device 80 can detect the movement position of the imaging module 30, and the detected movement position can be used to determine whether the imaging module 30 moves to the target position, and further correct the movement position of the imaging module 30 when the imaging module 30 does not move to the target position. In this way, the data detected during the magnetic induction 80 forms feedback information, and the motion position of the imaging module 30 is further adjusted based on the feedback information, so that the shake compensation of the imaging module 30 is more accurate.

Referring to fig. 2 and 4, the module circuit board assembly 90 can be used to supply power to the photosensitive elements 32 in the imaging module 30, and also can supply current to the third driving member 73, of course, the third driving member 73 can also be electrically connected to the driving circuit board 60, and at this time, the current of the third driving member 73 can be supplied by the driving circuit board 60. The module circuit board assembly 90 is partially received in the first frame 10, and specifically, the module circuit board assembly 90 is partially received in the receiving cavity 141 of the second subframe 14. The module circuit board assembly 90 includes a module circuit board 91, a cable 92 and a connector 93 connected in sequence. The module circuit board 91 is accommodated in the first accommodating space 12 of the first sub-frame 13, and the photosensitive element 32 is disposed on the module circuit board 91 and electrically connected to the module circuit board 91. One end of the module circuit board 91 far away from the photosensitive assembly 32 is connected to a cable 92. Cable 92 is at least partially received in receiving cavity 141, and second subframe 14 may function to protect cable 92. Of course, in other embodiments, the first frame 10 may not be provided with the second subframe 14 for protecting the cable 92, and is not limited herein. The cable 92 is, for example, a cable wire. The number of cables 92 may be one or more. When the number of the cables 92 is one, one end of the one cable 92 is connected to the module circuit board 91; when the number of the cables 92 is plural, one end of each cable is connected to the module circuit board 91. An end of the cable 92 remote from the module circuit board 91 is connected to the connector 93. When the number of the cables 92 is one, an end of the one cable 92 remote from the connector 93 is connected to the connector 93. When the number of the cables 92 is plural, one end of each cable 92 away from the module circuit board 91 is connected to the connector 93. The connector 93 is used for connection with other circuit boards outside, such as a motherboard. It can be understood that, since the module circuit board assembly 90 supplies power to the imaging module 30, and for anti-shake, the driving force can drive the imaging module 30 to move integrally relative to the first frame 10 through the cover 40, in the process of the overall movement of the imaging module 30, the module circuit board assembly 90 can also be driven, and at this time, the existence of the module circuit board assembly 90 can generate a torsional force effect on the movement of the imaging module 30, which affects shake compensation of the imaging module 30. Moreover, the movement of the imaging module 30 may cause damage to the module circuit board assembly 90. Therefore, through set up module circuit board 91, cable 92 and connector 93 in module circuit board subassembly 90, cable 92 can reduce the torsional force effect of module circuit board subassembly 90 to the imaging module 30 motion, and the guarantee imaging module 30 can carry out accurate shake compensation, and simultaneously, also can reduce the influence of the motion of imaging module 30 to module circuit board subassembly 90, avoids module circuit board subassembly 90's damage.

In summary, in the imaging apparatus 100 according to the embodiment of the present disclosure, the imaging module 30 is fixedly connected to the cover 40, and the cover 40 is movably connected to the first frame 10 and the second frame 20, so that the cover 40 can drive the imaging module 30 to move relative to the first frame 10 to compensate for the shaking amount of the imaging module 30. Thus, in the whole anti-shake process, the imaging module 30 moves integrally, the lens assembly 31 does not move horizontally relative to the photosensitive assembly 32, and the imaging module 30 can obtain an image with better quality.

Further, the driving assembly 70 comprises a first driving member 71, a second driving member 72 and a third driving member 73, wherein the first driving member 71 and the second driving member 72 can interact to provide a driving force for the shake compensation movement of the imaging module 30; the second drive member 72 and the third drive member 73 can interact to provide a driving force for focusing or zooming the lens assembly 31. This drive sharing approach may reduce the number of components required for the imaging device 100 and may facilitate reducing the lateral size and weight of the imaging module 30.

In addition, module circuit board assembly 90 includes module circuit board 91, cable 92 and connector 93, and cable 92 can reduce the torsional force effect of module circuit board assembly 90 to the imaging module 30 motion, and the guarantee imaging module 30 can carry out accurate shake compensation, and simultaneously, also can reduce the influence of imaging module 30 motion to module circuit board assembly 90, avoids module circuit board assembly 90's damage.

In some embodiments, the imaging device 100 shown in fig. 2 may further include a beamline (not shown). The cable tie may tie the plurality of cables 92 such that the plurality of cables 92 may be neatly placed together.

Referring to fig. 2 and fig. 11, an electronic device 300 is also provided. The electronic device 300 includes the housing 200 and the imaging apparatus 100 according to any of the above embodiments. The image forming apparatus 100 is combined with the housing 200, for example, the image forming apparatus 100 is mounted in the housing 200. The electronic device 300 may be a mobile phone, a notebook computer, a tablet computer, an intelligent wearable device (such as an intelligent watch, an intelligent bracelet, an intelligent helmet, an intelligent glasses, etc.), a virtual reality device, etc., without limitation.

In the electronic device 300 of the embodiment of the present application, the module circuit board assembly 90 includes the module circuit board 91, the cable 92 and the connector 93, the cable 92 can reduce the torsional force effect of the module circuit board assembly 90 on the movement of the imaging module 30, the imaging module 30 can be ensured to perform accurate shake compensation, and meanwhile, the influence of the movement of the imaging module 30 on the module circuit board assembly 90 can be reduced, and the damage of the module circuit board assembly 90 is avoided.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. An image forming apparatus, comprising:

a frame assembly;

the imaging module is accommodated in the frame assembly and can move relative to the frame assembly, the imaging module comprises a lens assembly and a photosensitive assembly, light passes through the lens assembly and reaches the photosensitive assembly, and the photosensitive assembly is used for converting optical signals into electric signals to form images; and

the module circuit board assembly comprises a module circuit board and a cable, one end of the module circuit board is connected with the photosensitive assembly, and the other end of the module circuit board is connected with the cable.

2. The imaging apparatus of claim 1, wherein the modular circuit board assembly further comprises a connector, an end of the cable distal from the modular circuit board being connected to the connector.

3. The image forming apparatus as claimed in claim 2, wherein the number of cables includes a plurality of cables, each of which has one end connected to the module circuit board and the other end connected to the connector.

4. The imaging apparatus of claim 3, further comprising a harness for tethering a plurality of the cables.

5. The imaging device according to claim 1, wherein the frame assembly comprises a first frame and a second frame, the second frame is received in a first receiving space defined in the first frame, and the imaging module is received in a second receiving space defined in the second frame;

the imaging device further comprises a cover body, the cover body is fixedly connected with the imaging module, the cover body is movably connected with the first frame and the second frame, and the driving force applied to the second frame can drive the imaging module to move relative to the first frame through the cover body so as to compensate the shaking amount of the imaging module.

6. The imaging apparatus according to claim 5, wherein the cover is movably connected to the first frame to form two first joints, a connection line between the two first joints defines a first axis, the cover is movably connected to the second frame to form two second joints, and a connection line between the two second joints defines a second axis, and the driving force is capable of driving the imaging module to rotate around the first axis and/or the second axis relative to the first frame via the cover to compensate for a shake amount of the imaging module.

7. The imaging apparatus as claimed in claim 6, wherein the cover includes a cover body and two first hinge arms, each of the first hinge arms has one end connected to the cover body and the other end hinged to the first frame, and the extending directions of the two first hinge arms coincide with the first axis.

8. The imaging device according to claim 6, wherein the first frame includes a first inner sidewall and a first outer sidewall opposite to each other, the first inner sidewall is closer to the second frame than the first outer sidewall, and the first inner sidewall is recessed toward the first outer sidewall to form two first receiving cavities;

the imaging device further comprises two first hinge pieces corresponding to the two first accommodating cavities, each first hinge piece is arranged on the first frame and accommodated in the corresponding first accommodating cavity, and one end, far away from the cover body, of each first hinge arm is connected with the corresponding first hinge piece.

9. The imaging apparatus as claimed in claim 6, wherein the cover further comprises two second hinge arms, each of which has one end connected to the cover body and the other end hinged to the second frame, and the extending directions of the two second hinge arms coincide with the second axis.

10. The imaging apparatus as claimed in claim 9, wherein the second frame includes a second inner sidewall and a second outer sidewall opposite to each other, the second inner sidewall is closer to the imaging module than the second outer sidewall, and the second inner sidewall is recessed toward the second outer sidewall to form two second receiving cavities;

the imaging device further comprises two second hinged pieces corresponding to the two second accommodating cavities, each second hinged piece is arranged on the second frame and accommodated in the corresponding second accommodating cavity, and one end, far away from the cover body, of each second hinged arm is connected with the second hinged piece.

11. An electronic device, comprising:

a housing; and

the imaging device of any one of claims 1-10, in combination with the housing.