CN112822377A

CN112822377A - Light-sensitive imaging component of camera

Info

Publication number: CN112822377A
Application number: CN202110135960.9A
Authority: CN
Inventors: 隋真真; 关宏杰; 徐忠文
Original assignee: Hangzhou Hikvision Digital Technology Co Ltd
Current assignee: Hangzhou Hikvision Digital Technology Co Ltd
Priority date: 2021-02-01
Filing date: 2021-02-01
Publication date: 2021-05-18
Anticipated expiration: 2041-02-01
Also published as: CN112822377B

Abstract

The invention discloses a light sensing imaging component of a camera. Based on the invention, the imaging module can be directly and fixedly connected with the lens module and can be indirectly arranged on the fixed frame through the mounting housing assembled with the lens module, thereby reducing the assembly stress born by the circuit board of the imaging module, reducing the influence of the image sensor of the imaging module on the imaging quality of the imaging module due to the deformation or vibration of the circuit board in response to the assembly stress and being beneficial to reducing the influence of the assembly stress on the circuit board.

Description

Light-sensitive imaging component of camera

Technical Field

The invention relates to an assembly technology of a camera, in particular to a light sensation imaging component of the camera.

Background

The light sensation imaging component of the camera comprises an imaging module and a lens module, and the imaging module and the lens module are arranged in the camera together through a fixed frame.

The imaging module generally includes a Sensor board, that is, a circuit board having an image Sensor. When assembling, the imaging module is arranged between the lens module and the fixed frame, and the imaging module and the lens module and the fixed frame are both rigidly connected, for example, the circuit board of the imaging module is adhesively connected with the lens component and fixedly connected with the fixed frame through screws.

Therefore, assembly stress during assembly is concentrated on the circuit board of the imaging module, which results in poor imaging quality (e.g., virtual image) of the image sensor disposed on the circuit board, especially when the lens assembly uses a full-color fixed-focus lens with high pixel precision and large lens size.

Therefore, how to reduce the influence of the assembly stress on the imaging quality of the imaging module becomes a technical problem to be solved in the prior art.

Disclosure of Invention

In one embodiment, a light-sensing imaging assembly of a camera is provided, which helps to reduce the influence of assembly stress on the imaging quality of an imaging module.

The light-sensing imaging component of the camera in the embodiment can comprise:

an imaging module having a circuit board and an image sensor disposed on the circuit board;

the lens module is provided with a lens base and a lens arranged on the lens base, wherein the lens base is stacked on one side of the circuit board, which is provided with the image sensor, and the image sensor is accommodated in the lens base and is positioned in the visual field range of the lens;

the mounting cover is provided with an end plate and a side plate bent at the side edge of the end plate, wherein the end plate is stacked on one side of the mirror base, which is back to the circuit board, the lens penetrates through a lens hole of the end plate, and the side plate extends outwards from the side edge of the circuit board to one side of the circuit board, which is back to the mirror base;

the fixed frame is arranged on one side, back to the lens base, of the circuit board and fixedly connected with the side plate of the mounting housing.

Optionally, further comprising: the heat dissipation module is arranged on the fixed frame and is positioned between the circuit board and the fixed frame.

Optionally, the fixing frame is provided with an avoiding window for releasing the contact stress between the heat dissipation module and the imaging module.

Optionally, the lens base is fixedly connected with the circuit board through a screw; the circuit board is provided with a force leakage groove, wherein the force leakage groove is arranged adjacent to the position where the screw is fixedly connected.

Optionally, the end plate has a receiving groove communicating with the lens hole, and a snap arranged at an edge of the receiving groove; the edge of the mirror base is provided with a clamping wing; when the end plate is stacked and arranged on the lens base, the lens base is accommodated in the accommodating groove, and the lens base is clamped in the accommodating groove through the clamping of the clamping buckle and the clamping wing.

Optionally, the end of the buckle has a guide slope; the mirror base is further provided with an inclined rib which supports the clamping wing on one side facing the buckle; when the end plate is stacked and arranged on the mirror seat, the buckle and the clamping wing are guided by the inclined surface and the inclined rib in an inclined manner to avoid butt joint interference.

Optionally, the end plate further has a positioning insertion groove disposed at an edge of the receiving groove; the lens base is further provided with a lateral boss which is convex outwards in the lateral direction at the edge; when the end plate is stacked and arranged on the mirror base, the mirror base enters the accommodating groove through the sliding guide between the lateral boss and the positioning slot.

Optionally, the end plate further has a positioning notch formed at an edge of the lens hole; the lens base is further provided with a positioning column which is convex along the axis of the lens on the surface facing the end plate; when the lens base enters the accommodating groove through the sliding guide between the lateral lug bosses and the positioning slots, the lens base is positioned in the accommodating groove by the insertion fit of the positioning columns and the positioning notches.

Optionally, the imaging module further has a wiring socket disposed on the circuit board, wherein the wiring socket is located on a surface of the circuit board facing away from the mirror base; the side plate is provided with a threading slot hole which is aligned with the wiring jack.

Optionally, the end plate has a reinforcing rib on a side near the threading slot hole.

Based on above-mentioned embodiment, the imaging module can only with the direct fixed connection of camera lens module to, can install in fixed frame indirectly through the installation housing with the assembly of camera lens module, can reduce the assembly stress that the circuit board of imaging module bore from this, with the influence that reduces imaging module's image sensor receives because the circuit board responds to the deformation or the vibrations of assembly stress, thereby, help reducing the influence of assembly stress to imaging module's imaging quality.

Drawings

The following drawings are only schematic illustrations and explanations of the present invention, and do not limit the scope of the present invention:

FIG. 1 is a schematic diagram of an assembly of a light-sensing imaging assembly of a camera in one embodiment;

FIG. 2 is an exploded view of the photoimageable assembly of FIG. 1;

FIG. 3 is a schematic structural diagram of the lens module of the optical imaging assembly shown in FIG. 1 after a first assembly process;

FIG. 4 is an axial cross-sectional view of the lens module shown in FIG. 3 after the first assembling process;

FIG. 5 is a schematic view of a second assembly process between the lens module and the imaging module of the optical imaging assembly shown in FIG. 1;

fig. 6 is a sectional view showing an assembled structure of the lens module and the imaging module after the second assembling process shown in fig. 5;

FIG. 7 is a rear view of the assembled structure of the lens module and the imaging module after the second assembling process shown in FIG. 5;

FIG. 8 is a schematic view of a third assembly process between the lens module and the mounting housing of the optical imaging assembly shown in FIG. 1;

FIG. 9 is an expanded representation of the assembled relationship of the third assembly process shown in FIG. 8;

fig. 10 is a perspective view of an assembly structure of the lens module and the imaging module and the mounting housing after the third assembly process shown in fig. 8;

fig. 11 is a front view of an assembly structure of the lens module and the imaging module with the mounting housing after the third assembly process shown in fig. 8;

fig. 12 is a sectional view showing an assembly structure of the lens module and the imaging module with the mounting housing after the third assembly process shown in fig. 8;

FIG. 13 is a schematic diagram illustrating an assembly relationship of a fourth assembly process between the heat dissipation module and the fixing frame of the optical imaging assembly shown in FIG. 1;

fig. 14 is a perspective view of an assembly structure of the heat dissipation module and the fixing frame after the fourth assembly process shown in fig. 13;

FIG. 15 is a schematic diagram illustrating a fifth assembly process of the photoimaging package shown in FIG. 1;

FIG. 16 is a perspective view of the photo imaging assembly of FIG. 1 after a fifth assembly step of FIG. 15.

Description of the reference numerals

10 imaging module

11 circuit board

110 force-releasing groove

12 image sensor

13 wiring socket

15 mounting hole

20 lens module

21 microscope base

210 internal thread cylinder

211 clamping wing

212 diagonal rib

213 side boss

214 positioning column

214a first positioning post (thin positioning post)

214b second locating post (Thick locating post)

215 threaded hole

22 lens

30 mounting cover

31 end plate

311 fastener

312 guide inclined plane

313 positioning slot

314 locating notch

314a first location gap (Small gap)

314b second location gap (big gap)

315 reinforcing rib

316 relief groove

32 side plate

320 threading slot

321 first side plate

322 second side plate

33 lens hole

341 first rib edge

342 second reinforcing rib edge

343 third bead

344 fourth bead

345 fifth strengthening the tendons

346 sixth bead

347 seventh bead

35 screw hole

361 first assembling location column

362 second assembly positioning column

40 fixed frame

400 avoiding window

41 fixed frame plate

42 longitudinal hanging arm

50 heat radiation module

51 Heat conductor

52 mounting boom

61 first screw

62 second screw

63 third screw

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and examples.

Fig. 1 is a schematic view of an assembly structure of a light-sensing imaging component of a video camera in one embodiment. FIG. 2 is an exploded view of the photoimageable assembly of FIG. 1. Referring to fig. 1 in conjunction with fig. 2, in this embodiment, the light sensing imaging component of the camera may include:

an imaging module 10, the imaging module 10 may have a circuit board 11 and an image sensor 12 disposed on the circuit board 11 (e.g., the image sensor 12 may be located on a front side surface of the circuit board 11 when vertically placed);

a lens module 20, wherein the lens module 20 may have a lens holder 21 and a lens 22 mounted on the lens holder 21, wherein the lens holder 21 may be stacked on a side of the circuit board 11 having the image sensor 12 (e.g., a front side of the circuit board 11 when vertically placed), and the image sensor 12 may be accommodated in the lens holder 21 and located in a visual field of the lens 22;

a mounting cover 30, wherein the mounting cover 30 may have an end plate 31 and a side plate 32 bent at a side of the end plate 31, wherein the end plate 31 may be stacked on a side of the mirror base 21 facing away from the circuit board 11 (e.g., a front side of the mirror base 21), the lens 22 may be inserted into the lens hole 33 of the end plate 31, and the side plate 32 may extend outward from the side of the circuit board 11 to a side of the circuit board 11 facing away from the mirror base 21 (e.g., a rear side of the circuit board 11 when vertically placed);

a fixing frame 40, wherein the fixing frame 40 can be fixedly connected with the side plate 32 of the mounting cover 30 at a side of the circuit board 11 facing away from the mirror base 21 (for example, a rear side of the circuit board 11 when vertically placed).

Based on the above embodiment, the imaging module 10 may be directly and fixedly connected with the lens module 20, and may be indirectly installed in the fixing frame 40 through the installation housing 30 assembled with the lens module 20, thereby reducing the assembly stress borne by the circuit board 11 of the imaging module 10, so as to reduce the influence on the image sensor 12 of the imaging module 10 due to the deformation or vibration of the circuit board 11 in response to the assembly stress, thereby contributing to reducing the influence on the imaging quality of the imaging module 10 from the assembly stress, and particularly, the imaging module including the image sensor 12 sensitive to the stress, and the improvement effect of the imaging quality is more obvious, and may be more suitable for application scenes with higher requirements on images.

Moreover, the above embodiment only needs to add the mounting cover 30 for indirectly mounting the imaging module 10 to the fixing frame 40 through the lens module 20, and the mounting cover 30 can be processed to adapt to any lens structure, so that the technical solution of the above embodiment has certain compatibility with lenses of different specifications.

In order to better understand the technical solution of the above embodiments, the following describes each component in detail in conjunction with the assembling process of the photo imaging assembly.

Fig. 3 is a schematic structural diagram of the lens module in the optical imaging assembly shown in fig. 1 after a first assembly process. Fig. 4 is an axial cross-sectional view of the lens module shown in fig. 3 after the first assembling process. Referring to fig. 2 and focusing on fig. 3 and 4, the lens holder 21 may have an internal thread barrel 210, and the lens (e.g., a full-color fixed focus lens) 22 may also have an external thread, so that the lens 22 and the lens holder 21 can be assembled and connected in a spot-gluing manner based on thread pre-fixing.

Specifically, the lens 22 may be screwed with the internally threaded barrel 210 to achieve pre-fixing between the lens 22 and the lens holder 21 based on the screw connection. After the relative position between the lens 22 and the lens holder 21 is determined by fixing, the lens 22 and the lens holder 21 may be fixed by dispensing at the adjacent position.

Further, the length L0 of the threaded connection of the lens 22 and the internally threaded barrel 210 can be set as long as possible, so that the lens 22 after the pre-fixing is completed is prevented from being deflected due to the cantilever force, thereby preventing image blur due to deflection of the lens 22 after the assembly is completed.

FIG. 5 is a schematic view of a second assembly process between the lens module and the imaging module of the optical imaging assembly shown in FIG. 1. Fig. 6 is a sectional view showing an assembly structure of the lens module and the imaging module after the second assembly process shown in fig. 5. Fig. 7 is a rear view of an assembly structure of the lens module and the imaging module after the second assembly process shown in fig. 5. Referring to fig. 2 and focusing on fig. 5 to 7, the mirror base 21 and the circuit board 11 of the imaging module 10 can be fixedly connected by screws (e.g., the first screws 61 shown in fig. 5 to 7).

Specifically, the circuit board 11 of the imaging module 10 may be opened with the mounting hole 15 at a position avoiding the image sensor 12, for example, the opened position of the mounting hole 15 may be located outside a region where the circuit board 11 overlaps with the main body of the mirror base 21, and the mounting holes 15 may be arranged in pairs on opposite sides of the image sensor 12 in the first direction (e.g., the longitudinal direction) on the circuit board 11.

Accordingly, the mirror base 21 may have a threaded hole 215 arranged in alignment with the mounting hole 15. For example, if the opening position of the mounting hole 15 can be located outside the region where the circuit board 11 overlaps with the main body of the mirror base 21, the mirror base 21 can have a lateral boss 213 protruding outward in the lateral direction, and the screw hole 215 can be opened in the lateral boss 213; if the mounting holes 15 are arranged in pairs on opposite sides of the image sensor 12 in the first direction (e.g., the longitudinal direction) on the circuit board 11, the lateral bosses 213 provided with the threaded holes 215 may also be arranged in pairs on opposite side edges of the mirror base 21 in the first direction (e.g., the longitudinal direction).

The first screw 61 can be passed through the mounting hole 15 from the side of the circuit board 11 facing away from the mirror base 21 and screwed into the threaded hole 215 of the mirror base 21.

Compared with the connection mode that the mirror base 21 is bonded with the circuit board 11 of the imaging module 10 through the adhesive medium, the problem that the mirror base 21 is separated from the circuit board 11 due to the failure of the adhesive medium can be avoided through the mode that the screws (such as the first screws 61) are fixedly connected.

In the case of the screw fixing connection, there may be concentrated stress generated by the fastening of the first screws 61 on the circuit board 11 of the imaging module 10. If such concentrated stress exists, the circuit board 11 may be locally deformed, thereby affecting the imaging effect of the image sensor 12, for example, causing the visual field of the lens 22 to be virtual-focused on the image sensor 12. In order to avoid the concentrated stress that may exist as described above, the circuit board 11 in this embodiment may have a relief groove 110, wherein, as is clear from fig. 5 and 7, the relief groove 110 may be disposed adjacent to the position (mounting hole 15) where the screw is fixedly connected. Preferably, the relief groove 110 may be disposed outside the area of the circuit board 11 where the image sensor 12 is disposed.

In this embodiment, taking as an example that the mounting holes 15 are arranged in pairs on opposite sides of the image sensor 12 in the first direction (e.g., the longitudinal direction) on the circuit board 11, at this time, a pair of relief grooves 110 extending in the second direction may be respectively arranged on opposite sides of each mounting hole 15 in the second direction (e.g., the lateral direction).

Fig. 8 is a schematic view illustrating an assembly relationship of a third assembly process between the lens module and the mounting housing in the optical imaging assembly shown in fig. 1. Fig. 9 is an expanded representation of the assembly relationship of the third assembly process shown in fig. 8. Fig. 10 is a perspective view of an assembly structure of the lens module and the imaging module and the mounting housing after the third assembly process shown in fig. 8. Fig. 11 is a sectional view showing an assembly structure of the lens module and the imaging module with the mounting housing after the third assembly process shown in fig. 8. Fig. 12 is a front view of an assembly structure of the lens module and the imaging module with the mounting housing after the third assembly process shown in fig. 8.

Referring to fig. 8 and 9 with further attention paid to fig. 2, the mounting cover 30 is used as a force bearing member for mounting between the lens module 20 and the fixing frame 40, and the strength thereof is relatively high. For this purpose, the mounting housing 30 may have a plurality of reinforcing ribs, for example:

one side edge (e.g., an upper edge) of the end plate 31 of the mounting cover 30 in the first direction (e.g., the longitudinal direction) may have a first bead 341;

the other side edge (e.g., lower edge) of the end plate 31 of the mounting cover 30 in the first direction (e.g., longitudinal direction) may have a second bead 342;

one side plate 32 (which may be referred to as a first side plate 321) of the mounting housing 30 in the second direction (e.g., the lateral direction), one side edge (e.g., an upper edge) thereof in the first direction (e.g., the longitudinal direction) may have a third bead edge 343;

one side plate 32 (first side plate 321) of the mounting housing 30 in the second direction (e.g., the lateral direction) may have a fourth bead 344 on the other side (e.g., the lower portion) in the first direction (e.g., the longitudinal direction);

the joint of the other side plate 32 (which may be referred to as a second side plate 322) of the mounting housing 30 in the second direction (e.g., the lateral direction) and the end plate 31 may have a fifth reinforcing bead 345 protruding in a direction opposite to the side plate 32 (the second side plate 322);

the joint of the side plate 32 (second side plate 322) of the other side of the mounting housing 30 in the second direction (e.g., transverse direction) and the end plate 31 may have a sixth bead 346 on the same side as the side plate 32 (second side plate 322);

the other side plate 32 (second side plate 322) of the mounting case 30 in the second direction (e.g., lateral direction) may have a seventh reinforcing rib 347 at one side edge (e.g., upper side edge) in the first direction (e.g., longitudinal direction).

The above described stiffener deployment scheme is merely a preferred scheme in this embodiment, and the actual design of the mounting case 30 may not be limited thereto. Preferably, the height of the rib may be greater than or equal to 2mm, or the height of the rib may be greater than or equal to the plate thickness (e.g., 2mm) of the end plate 31 or the side plate 32.

In order to facilitate the manufacture of the mounting cover 30 with the reinforcing ribs, a plastic film forming process may be selected to obtain the mounting cover 30 with the specified reinforcing rib deployment scheme.

If the housing 30 is made of an insulating material, the circuit board 11 of the imaging module 10 may be grounded by using a metal fixing frame 40 (e.g., a sheet metal member). For example, the ground signal terminal of the side of the circuit board 11 facing the fixed frame 40 may be connected to the fixed frame 40 (e.g., a sheet metal part) through a conductive medium such as a spring or a conductive foam.

Referring to fig. 2 with further attention to fig. 8 to 11, and particularly to fig. 11, the end plate 31 may have a receiving groove 310 communicating with the lens hole 33, and a snap 311 disposed at an edge of the receiving groove 311, and the lens holder 21 may have a snap wing 211 at an edge thereof.

Thus, when the end plate 31 is stacked and mounted on the mirror base 21, the mirror base 21 can be accommodated in the accommodating groove 310, and the mirror base 21 can be locked in the accommodating groove 311 by the engagement of the latch 311 and the latch wing 211.

The engagement between the latch 311 and the tab 211 may be a clearance fit (e.g., a clearance of about 0.5mm to 2 mm). The clamping based on clearance fit can weaken and even eliminate the influence of the tolerance of the manufacturing process on assembly, and can also make the assembly operation easier to realize.

In design, the cantilever of the catch 311 may be designed to have a length sufficient to allow the catch 311 to elastically swing. Specifically, the cantilever length of the latch 311 may be determined according to a preset engagement amount, and the size of the engagement amount is related to the stability after assembly. If high stability is required, the engagement amount of the latch 311 and the wing 211 in the second direction (e.g., the transverse direction) at least satisfies 0.8mm, the cantilever length of the latch 311 is about 3mm to 5mm, and the thickness in the second direction (e.g., the transverse direction) is about 0.5mm to 1mm, which can satisfy the production process requirements and make the latch 311 easily deform. If the design space is not enough to design the cantilever of the latch 311 long enough, or it is desired to further increase the engaging amount without increasing the length of the cantilever of the latch 311, the release grooves 316 may be provided on both sides (both sides in the first direction) of the cantilever of the latch 311 to improve the elastic deformation capability of the latch 311.

Preferably, the end of the catch 311 may have a guide slope 312, and the mirror base 21 may further have a diagonal rib 212 supporting the catch 211 at a side facing the catch 311.

Thus, when the end plate 31 is stacked and mounted on the mirror base 21, the catch 311 and the catch wing 211 can avoid abutting interference by the inclined guide between the guide inclined surface 312 and the inclined rib 212.

Here, the inclined guide angle α formed by the inclined rib 212 and the inclined guide angle β formed by the guide slope 312 may be set to be the same as each other, and for example, both the inclined guide angles α and β may be set to 30 ° to 45 °.

With further attention to fig. 8-10 and 12, and with particular attention to fig. 12, with reference to fig. 2, the fitting between the lens holder 21 and the mounting housing 30 can be achieved by coarse positioning and/or fine positioning.

If coarse positioning is adopted, the end plate 31 may further have a positioning insertion groove 313 arranged at the edge of the receiving groove (310), and, as mentioned above, the lens base 21 may have a lateral boss 213 protruding laterally outward at the edge, wherein, when the end plate 31 is stacked and mounted on the lens base 21, the lens base 21 enters the receiving groove 310 through the sliding guide between the lateral boss 213 and the positioning insertion groove 313.

If fine positioning is further provided on the basis of coarse positioning, the end plate 31 may further have a positioning notch 314 formed at an edge of the lens hole 33, and the lens holder 21 may further have a positioning post 214 protruding along an axis of the lens 22 on a surface facing the end plate 31, wherein when the lens holder 21 enters the receiving groove 310 through sliding guidance between the lateral boss 213 and the positioning insertion groove 313, the lens holder 21 may be positioned in the receiving groove 310 by the insertion and engagement of the positioning post 214 and the positioning notch 314.

As a preferable solution, the positioning pillars 214 may be arranged in pairs, and a first positioning pillar 214a of the positioning pillars 214 arranged in pairs may have a smaller outer diameter than a second positioning pillar 214b, i.e., the first positioning pillar 214a may be referred to as a thin positioning pillar, and the second positioning pillar 214b may be referred to as a thick positioning pillar; correspondingly, the positioning notches 314 can be arranged in pairs with the positioning posts 214, and a first positioning notch 314a of the positioning notches 314 arranged in pairs can have a smaller inner diameter than a second positioning notch 314b, i.e., the first positioning notch 314a can be referred to as a small notch and the second positioning notch 314b can be referred to as a large notch. The reverse installation of the mounting cover 30 relative to the lens module 20 can be avoided by the thickness difference of the positioning posts 214 arranged in pairs and the size difference of the positioning notches 314 arranged in pairs (commonly called fool-proof design).

Referring to fig. 9 to 11, the imaging module 10 may further have a wiring socket 13 disposed on the circuit board 11, wherein the wiring socket 13 may be located on a surface of the circuit board 11 facing away from the lens holder 21, and the side plate 32 (the first side plate 321) on the same side as the first socket 13 may be provided with a threading slot 320 aligned with the wiring socket 13.

Since repeated connector insertion and extraction operations of the wiring insertion opening 13 may occur during use, which may more easily cause deformation of the circuit board 11, the end plate 31 may have a reinforcing rib 315 on a side near the threading slot hole 320 (near the first side plate 321) for bearing pressure on the circuit board 11 when the insertion and extraction operations of the wiring insertion opening 13 are performed, and preventing or reducing deformation of the circuit board 11 due to the insertion and extraction operations.

In addition, the side plates 32 (the first side plate 321 and the second side plate 322) may be respectively opened with a screw hole 35 for the second screw 62 to pass through and connect with the fixing frame 40, and the first side plate 321 may have a first assembling location column 361 for positioning and matching with the fixing frame 40, and the second side plate 322 may have a second assembling location column 362 for positioning and matching with the fixing frame 40.

First assembly locator post 361 and second assembly locator post 362 may have different outer diameter dimensions, similar to locator post 314.

Moreover, annular bosses (the height of which can be about 0.5mm to 1 mm) can be arranged on the peripheries of the screw holes 35 so as to reduce the requirement on the flatness of the assembly surface; the outer peripheries of first and second assembly locator posts 361 and 362 may be provided with annular grooves to better control dimensional tolerances and improve assembly tolerances by releasing the freedom of axial offset of first and second assembly locator posts 361 and 362.

Fig. 13 is a schematic view illustrating an assembly relationship of a fourth assembly process between the heat dissipation module and the fixing frame in the optical imaging assembly shown in fig. 1. Fig. 14 is a perspective view of an assembly structure of the heat dissipation module and the fixing frame after the fourth assembly process shown in fig. 13. Referring to fig. 2 and further focusing on fig. 13 and 14, the photo imaging device in the embodiment may further include a heat dissipation module 50, the heat dissipation module 50 may be mounted on the fixing frame 40, and the heat dissipation module 50 may be located between the circuit board 11 and the fixing frame 40. Preferably, the fixing frame 40 may have an escape window 400 for releasing contact stress between the heat dissipation module 50 and the imaging module 10, and the heat dissipation module 50 may be disposed at the escape window 400.

Specifically, the heat dissipation module 50 may be mounted to the fixing frame 40 using third screws 63. For example, the heat dissipation module may include a heat conductor 51 and a mounting suspension arm 52 extending from the heat conductor 51 in a first direction (e.g., a longitudinal direction), and the third screw 63 may be fixed to the fixed frame plate 41 of the fixed frame 40 through a through hole opened in the mounting suspension arm 52 (the fixed frame plate 41 may have the aforementioned escape window 400), and at this time, the heat conductor 51 may contact the imaging module 10 (the area of the circuit board 11 where the image sensor 12 is disposed) within the escape window 400.

Therefore, the heat sink module 50 is also installed without generating assembly stress on the circuit board 11 of the imaging module 10, which further helps to reduce the influence of the assembly stress on the imaging quality of the imaging module 10, especially the imaging module including the image sensor 12 sensitive to stress.

FIG. 15 is a schematic diagram illustrating a fifth assembly process of the photo-imaging module shown in FIG. 1. FIG. 16 is a perspective view of the photo imaging assembly of FIG. 1 after a fifth assembly step of FIG. 15. Referring to fig. 15 with attention paid to fig. 16, after the imaging module 10, the lens module 20 and the mounting frame 30 are stacked and assembled by the second assembling process and the third assembling process, and the heat dissipation module 50 is mounted on the fixing frame 40 by the fourth assembling process, the side plates 32 of the mounting frame 30 can be fixed on the fixing frame 40 by the first assembling positioning posts 361 and the second assembling positioning posts 362 and by the second screws 62.

Thus, the photo-imaging member can be mounted at a designated mounting position by the pair of longitudinal hanging arms 42 of the fixing frame 40.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A light-sensitive imaging assembly for a camera, comprising:

an imaging module (10), the imaging module (10) having a circuit board (11) and an image sensor (12) arranged on the circuit board (11);

a lens module (20), the lens module (20) having a lens holder (21) and a lens (22) mounted on the lens holder (21), wherein the lens holder (21) is stacked on the side of the circuit board (11) having the image sensor (12), and the image sensor (12) is accommodated in the lens holder (21) and located in a visual field range of the lens (22);

a mounting cover shell (30), wherein the mounting cover shell (30) is provided with an end plate (31) and a side plate (32) bent at the side edge of the end plate (31), the end plate (31) is stacked on the side of the mirror base (21) opposite to the circuit board (11), the lens (22) is arranged in a lens hole (33) of the end plate (31) in a penetrating way, and the side plate (32) extends outwards from the side edge of the circuit board (11) to the side of the circuit board (11) opposite to the mirror base (21);

the fixing frame (40) is fixedly connected with the side plate (32) of the mounting cover shell (30) on one side, back to the mirror base (21), of the circuit board (11).

2. The photo imaging assembly as defined in claim 1, further comprising:

the heat dissipation module (50) is arranged on the fixing frame (40), and the heat dissipation module (50) is positioned between the circuit board (11) and the fixing frame (40).

3. A photo-graphic assembly as claimed in claim 2, wherein the fixing frame (40) has an escape window (400) for releasing contact stress between the heat sink module (50) and the image module (10).

4. The photo imaging assembly as defined in claim 1,

the lens base (21) is fixedly connected with the circuit board (11) through screws;

the circuit board (11) has a vent groove (110), wherein the vent groove (110) is arranged adjacent to the position of the screw-fixed connection.

5. The photo imaging assembly as defined in claim 1,

the end plate (31) has a receiving groove (310) communicating with the lens hole (33), and a catch (311) arranged at an edge of the receiving groove (310);

the edge of the lens base (21) is provided with a clamping wing (211);

when the end plate (31) is stacked and arranged on the lens base (21), the lens base (21) is accommodated in the accommodating groove (310), and the lens base (21) is clamped in the accommodating groove (310) through the clamping of the clamping buckle (311) and the clamping wing (211).

6. The photo imaging member as claimed in claim 5,

the end part of the buckle (311) is provided with a guide inclined surface (312);

the mirror base (21) further has an inclined rib (212) supporting the clip wing (211) on a side facing the clip (311);

when the end plate (31) is stacked and arranged on the mirror base (21), the buckle (311) and the clamping wing (211) avoid butt interference through inclined guiding between the guide inclined surface (312) and the inclined rib (212).

7. The photo imaging assembly as defined in claim 1,

the end plate (31) further has a positioning insertion groove (313) disposed at an edge of the receiving groove (310);

the mirror base (21) further has a lateral boss (213) which is laterally convex at the edge;

wherein, when the end plate (31) is stacked and mounted on the mirror base (21), the mirror base (21) enters the accommodating groove (310) through the sliding guide between the lateral boss (213) and the positioning insertion groove (313).

8. The photo imaging assembly as defined in claim 7,

the end plate (31) further having a positioning notch (314) formed at an edge of the lens hole (33);

the lens base (21) is further provided with a positioning column (214) which is convex along the axis of the lens (22) on the surface facing the end plate (31);

when the lens base (21) enters the accommodating groove (310) through the sliding guide between the lateral boss (213) and the positioning insertion groove (313), the lens base (21) is positioned in the accommodating groove (310) by the insertion fit of the positioning column (214) and the positioning notch (314).

9. The photo imaging assembly as defined in claim 1,

the imaging module (10) further comprises a wiring socket (13) arranged on the circuit board (11), wherein the wiring socket (13) is positioned on the surface of the circuit board (11) facing away from the mirror base (21);

the side plate (32) is provided with a threading slot hole (320) which is aligned with the wiring socket (13).

10. The photo imaging assembly as defined in claim 9,

the end plate (31) is provided with a reinforcing convex rib (315) at one side close to the threading slotted hole (320).