CN111479050A

CN111479050A - Imaging device and electronic apparatus

Info

Publication number: CN111479050A
Application number: CN202010375894.8A
Authority: CN
Inventors: 石峣
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-05-07
Filing date: 2020-05-07
Publication date: 2020-07-31

Abstract

The application discloses an imaging device and an electronic apparatus. Frame subassembly, imaging module and module circuit board. The imaging module is accommodated in the frame assembly and can move relative to the frame assembly. The imaging module comprises a lens component and a photosensitive component. Light reaches the photosensitive assembly through the lens assembly, and the photosensitive assembly is used for converting optical signals into electric signals to form images. The module circuit board comprises a first connecting part and a second connecting part. One end of the first connecting portion is connected with the photosensitive assembly, and the other end of the first connecting portion is connected with the second connecting portion. The second connecting portion comprises a first face and a second face which are opposite to each other, and the second connecting portion is provided with a through groove which penetrates through the first face and the second face. In the imaging device and the electronic apparatus of the embodiment of the application, the module circuit board includes a first connecting portion and a second connecting portion. Wherein, logical groove has been seted up to the second connecting portion, leads to the groove and can reduce the anti-torque effect of module circuit board to the formation of image module motion, avoids the damage of module circuit board.

Description

Imaging device and electronic apparatus

Technical Field

The present disclosure relates to the field of imaging technologies, and more particularly, to an imaging device and an electronic apparatus.

Background

The imaging module of the electronic equipment and the mainboard of the electronic equipment can be connected through a circuit board so as to realize signal transmission between the imaging module and the mainboard. However, when the imaging module moves, the circuit board is also driven, and at this time, the circuit board is twisted and generates a corresponding torque. Thus, the circuit board is easily damaged.

Disclosure of Invention

The embodiment of the application provides an imaging device and an electronic device.

The imaging device of the embodiment of the application comprises a frame assembly, an imaging module and a module circuit board. The imaging module is accommodated in the frame assembly and can move relative to the frame assembly. The imaging module comprises a lens component and a photosensitive component. Light passes through the lens subassembly and reaches the sensitization subassembly, the sensitization subassembly is used for converting light signal into the electrical signal with formation of image. The module circuit board comprises a first connecting part and a second connecting part. One end of the first connecting portion is connected with the photosensitive assembly, and the other end of the first connecting portion is connected with the second connecting portion. The second connecting portion comprises a first face and a second face which are opposite to each other, and the second connecting portion is provided with a through groove which penetrates through the first face and the second face.

The imaging device of the embodiment of the application comprises a frame assembly, an imaging module and a module circuit board. The imaging module is accommodated in the frame assembly and can move relative to the frame assembly. The imaging module comprises a lens component and a photosensitive component. Light passes through the lens subassembly and reaches the sensitization subassembly, the sensitization subassembly is used for converting light signal into the electrical signal with formation of image. The module circuit board comprises a first connecting part and a second connecting part. One end of the first connecting portion is connected with the photosensitive assembly, and the other end of the first connecting portion is connected with the second connecting portion. The second connecting part comprises a plurality of first sub-connecting parts and at least one second sub-connecting part. The plurality of first sub-connecting parts are arranged at intervals along a direction perpendicular to the plane where the first connecting parts are located. The two opposite ends of the second sub-connecting portion are respectively connected with the two first sub-connecting portions.

The electronic equipment of the embodiment of the application comprises a shell and an imaging device. The imaging device is coupled to the housing. The imaging device comprises a frame assembly, an imaging module and a module circuit board. The imaging module is accommodated in the frame assembly and can move relative to the frame assembly. The imaging module comprises a lens component and a photosensitive component. Light passes through the lens subassembly and reaches the sensitization subassembly, the sensitization subassembly is used for converting light signal into the electrical signal with formation of image. The module circuit board comprises a first connecting part and a second connecting part. One end of the first connecting portion is connected with the photosensitive assembly, and the other end of the first connecting portion is connected with the second connecting portion. The second connecting portion comprises a first face and a second face which are opposite to each other, and the second connecting portion is provided with a through groove which penetrates through the first face and the second face.

The electronic equipment of the embodiment of the application comprises a shell and an imaging device. The imaging device is coupled to the housing. The imaging device comprises a frame assembly, an imaging module and a module circuit board. The imaging module is accommodated in the frame assembly and can move relative to the frame assembly. The imaging module comprises a lens component and a photosensitive component. Light passes through the lens subassembly and reaches the sensitization subassembly, the sensitization subassembly is used for converting light signal into the electrical signal with formation of image. The module circuit board comprises a first connecting part and a second connecting part. One end of the first connecting portion is connected with the photosensitive assembly, and the other end of the first connecting portion is connected with the second connecting portion. The second connecting part comprises a plurality of first sub-connecting parts and at least one second sub-connecting part. The plurality of first sub-connecting parts are arranged at intervals along a direction perpendicular to the plane where the first connecting parts are located. The two opposite ends of the second sub-connecting portion are respectively connected with the two first sub-connecting portions.

In the imaging device and the electronic apparatus of the embodiment of the application, the module circuit board includes a first connecting portion and a second connecting portion. The second connecting part is provided with a through groove which can reduce the torsion resistance of the module circuit board on the movement of the imaging module, and avoid the damage of the module circuit board; or the second connecting part is composed of the first sub-connecting part and the second sub-connecting part to form a bent circuit board structure, and the bent circuit board structure can also reduce the torsion resistance of the module circuit board on the movement of the imaging module, so that the damage of the module circuit board is avoided.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic perspective assembly view of an imaging device according to certain embodiments of the present application;

FIG. 2 is an exploded perspective view of the imaging device of FIG. 1;

FIG. 3 is a schematic plan view of the imaging device of FIG. 1;

FIG. 4 is a schematic partial cross-sectional view of the imaging device of FIG. 1 taken along line IV-IV;

FIG. 5 is a schematic partial cross-sectional view of the imaging device of FIG. 1 taken along line V-V;

FIG. 6 is a schematic view of a cover and hinge assembly of the imaging device of FIG. 1;

FIG. 7 is a schematic view of the cover and hinge of the imaging device of FIG. 1 from another perspective;

FIG. 8 is a partially exploded perspective view of the imaging device of FIG. 1;

FIG. 9 is a schematic plan view of an imaging device according to certain embodiments of the present application;

FIG. 10 is a schematic view of the position relationship of the first driving member and the magnetic induction device in the imaging apparatus according to some embodiments of the present application;

FIG. 11 is a schematic view of the position relationship between the first driving member and the magnetic induction device in the imaging apparatus according to some embodiments of the present application;

fig. 12 is a schematic perspective view illustrating an assembly of a module circuit board and a position limiter in an imaging device according to some embodiments of the present disclosure;

FIG. 13 is a schematic plan view of the module circuit board and the position-limiting member shown in FIG. 12;

fig. 14 is an exploded perspective view of the module circuit board and the position limiting member in fig. 12;

fig. 15 is a schematic plan view of a module circuit board in an image forming apparatus according to some embodiments of the present application;

FIG. 16 is a schematic plan view of an electronic device according to some embodiments of the present application.

Detailed Description

Embodiments of the present application will be further described below with reference to the accompanying drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present application described below in conjunction with the accompanying drawings are exemplary and are only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the present application.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, 2 and 4, an imaging device 100 is provided. The imaging device 100 includes a frame assembly, an imaging module 30 and a module circuit board 90. The imaging module 30 is housed within the frame assembly and is capable of movement relative to the frame assembly. The imaging module 30 includes a lens assembly 31 and a photosensitive assembly 32. The light passes through the lens assembly 31 to the photosensitive assembly 32. The photosensitive element 32 is used to convert the optical signal into an electrical signal for imaging. The module circuit board 90 includes a first connecting portion 91 and a second connecting portion 92, wherein one end of the first connecting portion 91 is connected to the photosensitive assembly 32, and the other end is connected to the second connecting portion 92. The second connection portion 92 includes a first surface 9201 and a second surface 9202 opposite to each other. The second connecting portion 92 has a through groove 94 penetrating the first surface 9201 and the second surface 9202.

In the imaging device 100 according to the embodiment of the present application, the module circuit board 90 connected to the imaging module 30 includes the first connection portion 91 and the second connection portion 92. The second connecting portion 92 is provided with a through groove 94. The through groove 94 can reduce the torsional force action of the module circuit board 90 on the movement of the imaging module 30, on one hand, the imaging module 30 can be ensured to be capable of performing accurate shake compensation, on the other hand, the influence of the movement of the imaging module 30 on the module circuit board 90 can be reduced, and the damage of the module circuit board 90 is avoided.

Referring to fig. 1, 2, 4 and 5, an imaging device 100 is provided. The imaging device 100 includes a frame assembly, an imaging module 30 and a module circuit board 90. The imaging module 30 is housed within the frame assembly and is capable of movement relative to the frame assembly. The imaging module 30 includes a lens assembly 31 and a photosensitive assembly 32. The light passes through the lens assembly 31 to the photosensitive assembly 32. The photosensitive element 32 is used to convert the optical signal into an electrical signal for imaging. The module circuit board 90 includes a first connecting portion 91 and a second connecting portion 92, wherein one end of the first connecting portion 91 is connected to the photosensitive assembly 32, and the other end is connected to the second connecting portion 92. The second connection portion 92 includes a plurality of first sub-connection portions 921 and at least one second sub-connection portion 922. The first sub-connecting portions 921 are spaced apart from each other in a direction perpendicular to a plane where the first connecting portions 91 are located, and the opposite ends of the second sub-connecting portions 922 are connected to the first sub-connecting portions 921 respectively.

In the imaging device 100 according to the embodiment of the present application, the module circuit board 90 connected to the imaging module 30 includes the first connection portion 91 and the second connection portion 92. The second connection portion 92 includes a first sub-connection portion 921 and a second sub-connection portion 922, and the first sub-connection portion 921 and the second sub-connection portion 922 are alternately disposed to make the second connection portion 92 have a bending structure. Second connecting portion 92 of type of buckling structure can reduce the torsional action of module circuit board 90 to the motion of imaging module 30, can ensure on the one hand that imaging module 30 can carry out accurate shake compensation, and on the other hand can reduce the influence of the motion of imaging module 30 to module circuit board 90, avoids module circuit board 90's damage.

Referring to fig. 2, 4, 5, 6 and 8, an imaging apparatus 100 according to an embodiment of the present disclosure includes a frame assembly, an imaging module 30, a cover 40, a first hinge 51, a second hinge 52, a driving circuit board 60, a driving assembly 70, a magnetic induction device 80 and a module circuit board 90. The frame assembly includes a first frame 10 and a second frame 10.

Referring to fig. 2, the first frame 10 includes a first sub-frame 13 and a second sub-frame 14 connected to each other. The first subframe 13 defines a first receiving space 12 for receiving the second frame 20, the first subframe 13 includes a first inner sidewall 101 and a first outer sidewall 102, which are opposite to each other, and the first inner sidewall 101 is closer to the second frame 20 than the first outer sidewall 102. The first inner sidewall 101 is recessed toward the first outer sidewall 102 to form two first receiving cavities 11. The second sub-frame 14 extends from the first outer sidewall 10 in a direction away from the first receiving space 12, and the second sub-frame 14 defines a receiving cavity 141 for receiving a portion of the module circuit board 90 (shown in fig. 5).

With reference to fig. 2, the second frame 20 is accommodated in the first frame 10, and specifically, the second frame 20 is accommodated in the first accommodating space 12 of the first subframe 13. The second frame 20 includes a second inner sidewall 201 and a second outer sidewall 202, the second inner sidewall 201 and the second outer sidewall 202 are opposite, and the second inner sidewall 201 is closer to the imaging module 30 than the second outer sidewall 202. The second inner sidewall 201 of the second frame 20 encloses a second receiving space 22. The second inner sidewall 201 is recessed toward the second outer sidewall 202 to form two second receiving cavities 21. The second outer sidewall 202 is recessed toward the second inner sidewall 201 to form a mounting groove 23 (shown in fig. 8).

Referring to fig. 2 and 4, the imaging module 30 is accommodated in the second frame 20, and specifically, the imaging module 30 is accommodated in the second accommodating space 22 of the second frame 20. The imaging module 30 includes a lens assembly 31, a photosensitive assembly 32, and a module holder 33. The module holder 33 is formed with a third housing space 331, and the lens assembly 31 is housed in the third housing space 331. The light passes through the lens assembly 31 to the photosensitive assembly 32, and the photosensitive assembly 32 is used for converting the optical signal into an electrical signal to form an image.

Referring to fig. 2, the cover 40 is fixedly connected to the imaging module 30 and movably connected to both the first frame 10 and the second frame 20. The driving force applied to the second frame 20 can drive the imaging module 30 to move relative to the first frame 10 through the cover 40 to compensate for the shaking amount of the imaging module 30. Referring to fig. 3, the cover 40 is movably connected to the first frame 10 to form two first joints 901, a connection line of the two first joints 901 is defined as a first axis D1, the cover 40 is movably connected to the second frame 20 to form two second joints 902, and a connection line of the two second joints 902 is defined as a second axis D2. In one example, the first axis D1 may be perpendicular to the second axis D2. Of course, the included angle between the first axis D1 and the second axis D2 may be other angles, and is not limited herein. In the case where the cover 40, the first frame 10 and the second frame 20 shown in fig. 3 are all of a square structure, the extending direction of the first axis D1 and the extending direction of the second axis D2 may be two diagonal directions of the square structure. Of course, in other embodiments, the cover 40, the first frame 10 and the second frame 20 may be all circular structures, and in this case, the extending direction of the first axis D1 and the extending direction of the second axis D2 may be two radial directions of the circular structures, respectively, and are not limited herein. The driving force can drive the imaging module 30 to rotate around the first axis D1 relative to the first frame 10 through the cover 40 to compensate for the shaking amount of the imaging module 30; alternatively, the driving force can drive the imaging module 30 to rotate around the second axis D2 relative to the first frame 10 and the second frame 20 through the cover 40 to compensate for the shaking amount of the imaging module 30; or the driving force can drive the imaging module 30 to rotate around the first axis D1 relative to the first frame 10 through the cover 40, and can drive the imaging module 30 to rotate around the first axis D1 and around the second axis D2 relative to the first frame 10 and the second frame 20 through the cover 40 (the rotation around the first axis D1 and the rotation around the second axis D2 can be performed in a time-sharing manner) to compensate the shaking amount of the imaging module 30.

Referring to fig. 1, 2, 4 and 6, the cover 40 is disposed on the top of the imaging module 30, and the cover 40 includes a first surface 401, a second surface 402, a cover body 41, a first hinge arm 42 and a second hinge arm 43. The first surface 401 is opposite the second surface 402. The second surface 402 is closer to the imaging module 30 than the first surface 401. The cover body 41 is provided with a light hole 411, and one end of the lens assembly 31 far away from the photosensitive assembly 32 extends out of the light hole 411.

Referring to fig. 3 and 6, the number of the first hinge arms 42 is two, and the extending direction of the two first hinge arms 42 is coincident with the first axis D1. Each of the first hinge arms 42 has one end connected to the cover body 41 and the other end hinged to the first frame 10. At an end of each first hinge arm 42 away from the cover body 41, the first surface 401 is recessed toward the second surface 402 to form a first receiving groove 421.

Referring to fig. 3 and 7, the number of the second hinge arms 43 is two, and the extending directions of the two second hinge arms 43 are both coincident with the second axis D2. One end of each second hinge arm 43 is connected to the cover body 41, and the other end is hinged to the second frame 20. At an end of each second hinge arm 43 away from the cover body 41, a second receiving groove 431 is formed by the first surface 401 being recessed toward the second surface 402.

Referring to fig. 2, 3 and 6, the number of the first hinge members 51 is two. The two first hinge members 51 correspond to the two first receiving cavities 11. Each of the first hinge members 51 is disposed on the first frame 10 and received in the corresponding first receiving cavity 11. An end of the first hinge arm 42 remote from the cover body 41 is connected to the first hinge 51. Each first hinge 51 includes a first hinge body 511 and a first ball 512. The first hinge body 511 has a first through hole 5111. The first ball 512 is partially received in the first through hole 5111. A portion of the first ball 512 not received in the first through hole 5111 is at least partially received in the first receiving groove 421. In this way, the cover 40 can rotate the imaging module 30 relative to the first frame 10 about the first axis D1 to compensate for the shake of the imaging module 30 by the movable connection between the first hinge 51 and the first hinge arm 42.

Referring to fig. 2, 3 and 7, the number of the second hinge parts 52 is two. The two second hinge members 52 correspond to the two second receiving cavities 21. Each of the second hinge members 52 is disposed on the second frame 20 and is received in the corresponding second receiving cavity 21. An end of the second hinge arm 43 remote from the cover body 41 is connected to the second hinge 52. Each second hinge 52 includes a second hinge body 521 and a second ball 522. The second hinge body 521 has a second through hole 5211. The second ball 522 is partially received in the second through hole 5211. A portion of the second ball 522 not received in the second through hole 5211 is at least partially received in the second receiving groove 431. In this way, the cover 40 can drive the imaging module 30 to rotate around the second axis D2 relative to the first frame 10 and the second frame 20 through the movable connection between the second hinge 52 and the second hinge arm 43 to compensate for the shake amount of the imaging module 30.

Referring to fig. 2, 4 and 8, the driving circuit board 60 is mounted on the first inner sidewall 101 of the first frame 10 and penetrates the first frame 10 such that the connector end extends toward a side away from the first receiving space 12. The driving circuit board 60 includes a first side 601 and a second side 602, and the first side 601 is opposite to the second side 602. The first side 601 is closer to the second frame 20 than the second side 602.

The drive assembly 70 comprises a first drive member 71 and a second drive member 72. The first driving member 71 is mounted on a side of the driving circuit board 60 close to the second frame 20, that is, the first driving member 71 is mounted on the first side 601 of the driving circuit board 60. The second driving member 72 is installed at a side of the second frame 20 close to the first frame 10, that is, the second driving member 72 is installed at the second outer sidewall 202 of the second frame 20. The first drive member 71 interacts with the second drive member 72 to generate a driving force. Illustratively, as shown in fig. 4, the first driving member 71 is a coil, the second driving member 72 is a magnet, and the driving circuit board 60 supplies current to the coil, so that the coil and the magnet interact to generate driving force. Illustratively, as shown in fig. 8, the second driving member 72 is mounted in the mounting groove 23 of the second frame 20, thus facilitating reduction in the lateral dimension of the image forming apparatus 100.

The number of drive assemblies 70 may be one, two, three, four, etc., and is not limited herein. As shown in fig. 2 and 8, the number of the driving assemblies 70 is two, and two driving assemblies 70 are respectively located at adjacent both sides of the second frame 20. Of course, in other embodiments, two driving assemblies 70 may be located on two opposite sides of the second frame 20, and are not limited herein. Providing two driving assemblies 70 to apply driving force to the second frame 20 can reduce the number of components required for the imaging apparatus 100 and the weight of the imaging apparatus 100 while ensuring that sufficient driving force can be applied to achieve the anti-shake effect. As shown in fig. 2 and 9, the number of the driving assemblies 70 is four, and four driving assemblies 70 are respectively located on four second outer sidewalls 202 of the second frame 20. The provision of the four driving assemblies 70 can ensure that a sufficient driving force can be applied to the second frame 20, so that the cover 40 can better drive the imaging module 30 to move for anti-shake.

Referring to fig. 4, the driving assembly 70 may further include a third driving member 73. The third driving member 73 is mounted on a side wall of the lens assembly 31. The third driving member 73 interacts with the second driving member 72 to generate a driving force, which can drive the lens assembly 31 to move along the optical axis of the lens assembly 31, so as to realize zooming or focusing of the imaging module 30. In one example, the second driving member 72 is a magnet, and the third driving member 73 is a coil.

In the embodiment shown in fig. 4, the first driving member 71 can interact with the second driving member 72 to provide a driving force for the shake compensation movement of the imaging module 30, and the second driving member 72 can interact with the third driving member 73 to provide a driving force for the focusing movement of the lens assembly 31, which can reduce the number of components required for the imaging device 100 and is beneficial to reducing the lateral size and weight of the imaging module 30.

Referring to fig. 8, 10 and 11, the magnetic induction device 80 is disposed on a side (i.e., the first side 601) of the driving circuit board 60 close to the second frame 20. As shown in fig. 10, when the magnetic induction device 80 is disposed on the side of the driving circuit board 60 close to the second frame 20, it can also be disposed in the space surrounded by the first driving member 71 (i.e., the coil); alternatively, as shown in fig. 11, when the magnetic induction device 80 is disposed on the side of the driving circuit board 60 close to the second frame 20, it may be disposed outside the space surrounded by the first driving member 71 (i.e., the coil). The magnetic induction device 80 can detect the movement position of the imaging module 30, and the detected movement position can be used to determine whether the imaging module 30 moves to the target position, and further correct the movement position of the imaging module 30 when the imaging module 30 does not move to the target position. In this way, the data detected during the magnetic induction 80 forms feedback information, and the motion position of the imaging module 30 is further adjusted based on the feedback information, so that the shake compensation of the imaging module 30 is more accurate.

Referring to fig. 2, fig. 4 and fig. 5, the module circuit board 90 can be used to supply power to the photosensitive elements 32 in the imaging module 30, and can also be used to supply current to the third driving element 73, of course, the third driving element 73 can also be electrically connected to the driving circuit board 60, and at this time, the current of the third driving element 73 can be supplied by the driving circuit board 60. The module circuit board 90 is partially received in the first frame 10, and specifically, the module circuit board 90 is partially received in the receiving cavity 141 of the second subframe 14. The module circuit board 90 includes a first connection portion 91, a second connection portion 92, and a third connection portion 93 connected in sequence. The first connection portion 91 is received in the first receiving space 12 of the first sub-frame 13, and the photosensitive element 32 is disposed on the first connection portion 91 and electrically connected to the first connection portion 91. One end of the first connecting portion 91, which is far away from the photosensitive assembly 32, is connected to the second connecting portion 92. The second connecting portion 92 is received in the receiving cavity 141, and the second subframe 14 may function to protect the second connecting portion 92. The second connecting portion 92 includes a plurality of first sub-connecting portions 921, at least one second sub-connecting portion 922 and a pad 923. The first sub-connection portions 91 are spaced apart from each other in a direction perpendicular to a plane in which the first connection portions 91 are located. The two opposite ends of one second sub-connection portion 922 are respectively connected with the two first sub-connection portions 921. Every first sub-connecting portion 921 all includes first face 9201 and the second face 9202 that carries on the back mutually, offers the logical groove 94 that runs through first face 9201 and second face 9202 on at least one first sub-connecting portion 921. The extending direction of the through groove 94 is parallel to the extending direction of the first sub-connection part 921. The cushion block 923 is disposed between the adjacent two first sub-connecting portions 921. The cushion block 923 includes opposite surfaces, one of which is in contact with one of the first sub-connection portions 921, and the other of which is in contact with the other of the first sub-connection portions 921. As shown in fig. 5, the second connecting portion 92 includes five first sub-connecting portions 921, four second sub-connecting portions 922 and four cushion blocks 923. The five first sub-connection portions 921 are arranged at intervals in a stack in a direction perpendicular to a plane in which the first connection portions 91 are located. A cushion block 923 is arranged at one end of any two adjacent first sub-connecting portions 921, which is connected with the second sub-connecting portion 922, and the height of the cushion block 923 is substantially equal to the distance between two adjacent first sub-connecting portions 921. The pad 923 may make the connection between the first sub-connector 921 and the second sub-connector 922 more secure. In one example, the cushion block 923 may include two sub cushion blocks, which are stacked. Each sub-spacer is integrally formed with the first sub-connecting portion 921 in contact therewith. The design of the sub-spacer integrally formed with the first sub-connection part 921 can simplify the manufacturing process of the second connection part 92. Of course, the cushion block 923 may not be divided into a plurality of sub cushion blocks, but may be a complete structure, which is not limited herein. An end of the second connecting portion 92 remote from the first connecting portion 91 extends from a through hole passing through the first inner side wall 101 and the first outer side wall 102 of the second subframe 14, and is connected to the third connecting portion 93. The end of the third connecting portion 93 away from the second connecting portion 92 is a connector end, which is used for connecting with another external circuit board, such as a motherboard. It can be understood that, since the module circuit board 90 supplies power to the imaging module 30, and for anti-shake, the driving force can drive the imaging module 30 to move integrally relative to the first frame 10 through the cover 40, in the process of the overall movement of the imaging module 30, the module circuit board 90 can also be driven, and at this time, the existence of the module circuit board 90 can generate a torsional force effect on the movement of the imaging module 30, which affects shake compensation of the imaging module 30. Moreover, the movement of the imaging module 30 may cause damage to the module circuit board 90. Therefore, through setting up first connecting portion 91, second connecting portion 92 and third connecting portion 93 in module circuit board 90, wherein second connecting portion 92 is including first sub-connecting portion 921 and the second sub-connecting portion 922 that set up in turn, second connecting portion 92 that is formed by first sub-connecting portion 921 and the second sub-connecting portion 922 that set up in turn is many bending type structure, the second connecting portion 92 of many bending type structure can reduce the torsional force effect of module circuit board 90 to the motion of imaging module group 30, ensure that imaging module group 30 can carry out accurate shake compensation, and simultaneously, also can reduce the influence of the motion of imaging module group 30 to module circuit board 90, avoid the damage of module circuit board 90. In addition, through groove 94 has still been seted up to first sub-connecting portion 921, and the seting up of through groove 94 makes first sub-connecting portion 921 be separated for two parts, and imaging module 30 moves when making module circuit board 90 produce deformation, and first sub-connecting portion 921 is by the independent atress of two parts of through groove 94 divided, so can reduce the torsional forces effect of module circuit board 90 to imaging module 30 motion.

In summary, in the imaging apparatus 100 according to the embodiment of the present disclosure, the imaging module 30 is fixedly connected to the cover 40, and the cover 40 is movably connected to the first frame 10 and the second frame 20, so that the cover 40 can drive the imaging module 30 to move relative to the first frame 10 to compensate for the shaking amount of the imaging module 30. Thus, in the whole anti-shake process, the imaging module 30 moves integrally, the lens assembly 31 does not move horizontally relative to the photosensitive assembly 32, and the imaging module 30 can obtain an image with better quality.

Further, the driving assembly 70 comprises a first driving member 71, a second driving member 72 and a third driving member 73, wherein the first driving member 71 and the second driving member 72 can interact to provide a driving force for the shake compensation movement of the imaging module 30; the second drive member 72 and the third drive member 73 can interact to provide a driving force for focusing or zooming the lens assembly 31. This drive sharing approach may reduce the number of components required for the imaging device 100 and may facilitate reducing the lateral size and weight of the imaging module 30.

In addition, module circuit board 90 includes first connecting portion 91, contains first sub-connecting portion 921 and second sub-connecting portion 922 and has second connecting portion 92 and the third connecting portion 93 of fluting design, and this kind of design can reduce the torsional force effect of module circuit board 90 to the motion of imaging module 30, and the guarantee imaging module 30 can carry out accurate shake compensation, and simultaneously, also can reduce the influence of imaging module 30 motion to module circuit board 90, avoids module circuit board 90's damage.

Referring to fig. 12-14, in some embodiments, the imaging device 100 further includes a limiting member 94. The stopper 96 may define the structure of the second connection part 92 such that the second connection part 92 has a multi-bending structure including a first sub-connection part 921 and a second sub-connection part 922. The number of the stoppers 96 may be one or more, and is not limited herein. The position limiting member 96 includes a position limiting member body 961, two first position limiting portions 962 and a third position limiting portion 963. The stopper body 961 is at least partially accommodated in a space formed by two adjacent first sub-connection portions 921. The two first limiting parts 962 are disposed on the limiting part body 961, the two first limiting parts 962 are disposed at opposite ends of the limiting part body 961, and the two first limiting parts 962 are disposed outside a space formed by the two adjacent first sub-connecting portions 921. As shown in fig. 12 to 14, the two first position-limiting portions 962 are both circular rings sleeved on the position-limiting member body 961. The diameter of the circular ring should be larger than the maximum distance between two adjacent first sub-connecting portions 921, so as to prevent the limiting member 96 from falling off from the space formed by two adjacent first sub-connecting portions 921. The third position-limiting portion 963 is disposed on the position-limiting member body 961 and located between the two first position-limiting portions 962. The third limiting portion 961 is accommodated in a space formed by two adjacent first sub-connection portions 921, and contacts with both of the two adjacent first sub-connection portions 921. When the third stopper portion 961 is accommodated in the space formed by the two adjacent first sub-connection portions 921, the third stopper portion 961 is located close to the second sub-connection portion 922 connecting the two adjacent first sub-connection portions 921. At this time, the third limiting portion 961 may play a role of opening the two adjacent first sub-connection portions 921, so as to avoid a problem that the distance between the two adjacent first sub-connection portions 921 is too short, which causes the second sub-connection portion 922 connecting the two adjacent first sub-connection portions 921 to be damaged due to excessive bending. In the module circuit board 90 shown in fig. 12 to 14, the first sub-connecting portion 921 and the second sub-connecting portion 922 commonly define a through slot 94. In other embodiments, the first sub-connecting portion 921 may have a through groove 94; or, the second sub-connecting portion 922 is provided with a through groove 94; alternatively, neither the first sub-connection portion 921 nor the second sub-connection portion 922 has the through groove 94, which is not limited herein. The module circuit board 90 shown in fig. 12 to 14 has the second connecting portion 92 with the multi-bending structure and the through groove 94 formed in the second connecting portion 92, so as to reduce the torsion resistance of the module circuit board 90 to the movement of the imaging module 30, ensure that the imaging module 30 can perform accurate shake compensation, reduce the influence of the movement of the imaging module 30 on the module circuit board 90, and avoid the damage of the module circuit board 90.

Referring to fig. 15, in some embodiments, the second connection portion 92 of the module circuit board 90 may not include the first sub-connection portion 921 and the second sub-connection portion 922, and at this time, the second connection portion 92 extends along a plane. For example, the second connection portion 92 extends in parallel to a plane in which the first connection portion 91 is located. Wherein, the second connecting portion 92 is provided with a through groove 94. So, only reduce the torsional action of module circuit board 90 to the motion of formation of image module 30 through the mode of seting up logical groove 94, ensure that formation of image module 30 can carry out accurate shake compensation to reduce the influence of formation of image module 30 motion to module circuit board 90, avoid module circuit board 90's damage.

Referring to fig. 2, 12 and 16, the present application further provides an electronic device 300. The electronic device 300 includes the housing 200 and the imaging apparatus 100 according to any of the above embodiments. The image forming apparatus 100 is combined with the housing 200, for example, the image forming apparatus 100 is mounted in the housing 200. The electronic device 300 may be a mobile phone, a notebook computer, a tablet computer, an intelligent wearable device (such as an intelligent watch, an intelligent bracelet, an intelligent helmet, an intelligent glasses, etc.), a virtual reality device, etc., without limitation.

In the electronic apparatus 300 according to the embodiment of the present application, the module circuit board 90 includes the first connection portion 91 and the second connection portion 92. The second connecting portion 91 is provided with a through groove 94, and the through groove 94 can reduce the torsional force action of the module circuit board 90 on the movement of the imaging module 30, so as to avoid the damage of the module circuit board 30; or the second connecting portion 92 is formed by the first sub-connecting portion 921 and the second sub-connecting portion 922 to form a bent circuit board structure, and the bent circuit board structure can also reduce the torsion resistance of the module circuit board 90 on the movement of the imaging module 30, thereby avoiding the damage of the module circuit board 30.

In the description herein, reference to the description of the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present application, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims

1. An image forming apparatus, comprising:

a frame assembly;

the imaging module is accommodated in the frame assembly and can move relative to the frame assembly, the imaging module comprises a lens assembly and a photosensitive assembly, light passes through the lens assembly and reaches the photosensitive assembly, and the photosensitive assembly is used for converting optical signals into electric signals to form images; and

the module circuit board comprises a first connecting portion and a second connecting portion, one end of the first connecting portion is connected with the photosensitive assembly, the other end of the first connecting portion is connected with the second connecting portion, the second connecting portion comprises a first face and a second face which are opposite to each other, and a through groove which penetrates through the first face and the second face is formed in the second connecting portion.

2. The imaging apparatus of claim 1, wherein the second connecting portion extends along a plane.

3. The imaging device according to claim 1, wherein the second connecting portion includes a plurality of first sub-connecting portions and at least one second sub-connecting portion, the plurality of first sub-connecting portions are arranged at intervals along a direction perpendicular to a plane where the first connecting portions are located, the through groove is formed in at least one first sub-connecting portion, and two opposite ends of the second sub-connecting portion are respectively connected with the two first sub-connecting portions.

4. An image forming apparatus, comprising:

a frame assembly;

the module circuit board comprises a first connecting portion and a second connecting portion, one end of the first connecting portion is connected with the photosensitive assembly, the other end of the first connecting portion is connected with the second connecting portion, the second connecting portion comprises a plurality of first sub-connecting portions and at least one second sub-connecting portion, the first sub-connecting portions are arranged at intervals along the direction perpendicular to the plane where the first connecting portions are located, and the two ends, back to the back, of the second sub-connecting portions are respectively connected with the two first sub-connecting portions.

5. The image forming apparatus as claimed in claim 3 or 4, wherein the second connecting portion further includes a spacer disposed between adjacent two of the first sub-connecting portions, the spacer including opposite surfaces, one of which is in contact with one of the first sub-connecting portions and the other of which is in contact with the other of the first sub-connecting portions.

6. The imaging device according to claim 3 or 4, further comprising a limiting member, wherein the limiting member comprises a limiting member body and two first limiting portions, the two first limiting portions are disposed on the limiting member body and located at two opposite ends of the limiting member body, respectively, the limiting member body is at least partially accommodated in a space formed by two adjacent first sub-connecting portions, and the two first limiting portions are located outside the space formed by two adjacent first sub-connecting portions.

7. The image forming apparatus according to claim 6, wherein the stopper further includes a third stopper portion provided on the stopper body and located between the two first stopper portions, the third stopper portion being accommodated in a space formed by two adjacent first sub-connecting portions and contacting both of the two adjacent first sub-connecting portions.

8. The imaging device according to claim 3 or 4, wherein the module circuit board further includes a third connecting portion, the frame assembly includes a first frame, the first frame includes a first sub-frame and a second sub-frame connected to each other, the first sub-frame defines a first receiving space for receiving the imaging module, the second sub-frame defines a receiving cavity for receiving the second connecting portion, a through hole is defined in a sidewall of the second sub-frame, and an end of the second connecting portion, which is far away from the first connecting portion, extends out of the through hole to connect with the third connecting portion.

9. The imaging device according to claim 1 or 4, wherein the frame assembly comprises a first frame and a second frame, the second frame is accommodated in a first accommodating space formed in the first frame, and the imaging module is accommodated in a second accommodating space formed in the second frame;

the imaging device further comprises a cover body, the cover body is fixedly connected with the imaging module, the cover body is movably connected with the first frame and the second frame, and the driving force applied to the second frame can drive the imaging module to move relative to the first frame through the cover body so as to compensate the shaking amount of the imaging module.

10. An electronic device, comprising:

a housing; and

the imaging device of any one of claims 1-9, in combination with the housing.