CN211762957U

CN211762957U - Electronic chip packaging mold convenient to move

Info

Publication number: CN211762957U
Application number: CN201922267375.5U
Authority: CN
Inventors: 夏广清; 杨治兵; 钟旭光
Original assignee: Suzhou Yishunhua Intelligent Equipment Co ltd
Current assignee: Suzhou Yishunhua Intelligent Equipment Co ltd
Priority date: 2019-12-17
Filing date: 2019-12-17
Publication date: 2020-10-27
Anticipated expiration: 2029-12-17

Abstract

The utility model discloses an electronic chip packaging mold convenient to remove, including the packaging mold body, the top both sides fixedly connected with supporting shoe of packaging mold body, and the first rubber pad of top fixedly connected with of supporting shoe, the both sides fixedly connected with stopper of packaging mold body, the both sides bottom of packaging mold body articulates there is articulated piece, and the right side top fixedly connected with fixed block of articulated piece, the right side fixed welding machine of fixed block has first spring, and the inboard welding of first spring is on the surface of packaging mold body. The utility model discloses be provided with snap ring and interior pole, insert the limiting groove inside with interior pole, make the snap ring block inside the stopper simultaneously to convenient stack transportation removes, through setting up the baffle, when the encapsulation mould body receives the collision, the baffle receives rocks, and the elasticity of second spring is offset the part and is rocked the impact of production, avoids electronic chip to receive the damage.

Description

Electronic chip packaging mold convenient to move

Technical Field

The utility model relates to a packaging mold technical field specifically is an electronic chip packaging mold convenient to remove.

Background

An integrated circuit is a miniature electronic device or component, and the components and wiring of transistor, diode, resistor, capacitor and inductor required in a circuit are interconnected together by a certain process, and then are made into a small piece or several small pieces of semiconductor wafers or medium substrates, and then are packaged in a package, so that the miniature structure with the required circuit function is formed.

Electronic chip on the market can put electronic chip and carry out holistic encapsulation in relevant packaging mold when encapsulating at present, and once when encapsulating quantity is more, the packaging mold body is great, and the workman needs carrying packaging mold one by one, and the transport number of times is many, and is comparatively inconvenient, consequently needs the plastic pellet heat-seal device of a convenient dismantlement hot pressboard to solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic chip packaging mold convenient to remove to the workman who proposes carries inconvenient problem to packaging mold among the above-mentioned background of solution.

In order to achieve the above object, the utility model provides a following technical scheme: an electronic chip packaging mould convenient to move comprises a packaging mould body, wherein supporting blocks are fixedly connected to two sides of the top end of the packaging mould body, a first rubber pad is fixedly connected to the top end of each supporting block, limiting blocks are fixedly connected to two sides of the packaging mould body, hinged blocks are hinged to the bottom ends of two sides of the packaging mould body, a fixed block is fixedly connected to the top end of the right side of each hinged block, a first spring is fixedly welded to the right side of each fixed block, the inner side of each first spring is welded to the surface of the packaging mould body, a clamping ring is hinged to the central position of each hinged block, a second partition plate is fixedly connected to the interior of the packaging mould body, a first partition plate is inserted into the interior of the packaging mould body, second rubber pads are fixedly connected to two sides of the first partition plate, and a second spring is welded to the, and the right side fixed welding of second spring has the baffle, the top fixedly connected with outer pole of packaging mold body, and the inside of outer pole is inserted and is equipped with interior pole, the bottom welding of interior pole has the third spring, and the bottom welding of third spring is at the inner wall of outer pole, the bottom fixedly connected with slider of first baffle, the spacing groove has been seted up on the bottom surface of packaging mold body.

Preferably, the surface of the packaging mold body and the position corresponding to the sliding block are provided with sliding grooves, the inner walls of the sliding grooves are abutted to the surface of the sliding block, and the sliding block and the sliding grooves form a sliding structure.

Preferably, the inner side surface of the hinge block is provided with an arc-shaped groove, and the inner wall of the groove is a rough surface.

Preferably, the inner wall of the limiting block is abutted to the surface of the clamping ring, and the clamping ring and the limiting block form a clamping structure.

Preferably, the surface of the inner rod is abutted against the inner wall of the outer rod, and the inner rod and the outer rod form a telescopic structure.

Preferably, the inner side surface of the second partition board is provided with a sliding chute, the inner wall of the sliding chute is abutted to the surface of the baffle, and the baffle and the second partition board form a sliding structure.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model is provided with the snap ring and the inner rod, the inner rod is inserted into the limiting groove, and the snap ring is clamped inside the limiting block, so that the stacking, transportation and movement are convenient;

1. the utility model discloses be provided with snap ring and interior pole, through folding packaging mold body together, interior pole inserts the limiting groove inside, makes the snap ring block inside the stopper simultaneously, superposes multiunit packaging mold body together, and the staff moves away the packaging mold body that superposes together through relevant transport means to convenient transportation removes, saves the number of times of round trip transportation, thereby reduces workman's working time;

2. through being provided with second rubber pad and baffle, when the encapsulation mould body received the collision, electronic chip received the collision in the die cavity of first baffle and second baffle cross formation, and the baffle received and rocks to with second spring compression deformation, the impact that the part rocked the production is offset to the elasticity of second spring, avoid electronic chip to receive the damage, cause unnecessary product loss.

Drawings

FIG. 1 is a schematic sectional view of the front view of the structure of the present invention;

FIG. 2 is a schematic top view of the structure of the present invention;

fig. 3 is a schematic top view of the packaging mold body and the slider structure of the present invention.

In the figure: 1. packaging the mold body; 2. a snap ring; 3. a hinged block; 4. a fixed block; 5. a first spring; 6. a limiting block; 7. a support block; 8. a first rubber pad; 9. a second spring; 10. a baffle plate; 11. a second rubber pad; 12. a first separator; 13. an inner rod; 14. a third spring; 15. an outer rod; 16. a limiting groove; 17. a second separator; 18. a slide block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides an embodiment:

the utility model provides an electronic chip packaging mold convenient to remove, including packaging mold body 1, packaging mold body 1's top both sides fixedly connected with supporting shoe 7, and the first rubber pad of top fixedly connected with 8 of supporting shoe 7, packaging mold body 1's both sides fixedly connected with stopper 6, stopper 6's inner wall is inconsistent with snap ring 2's surface, snap ring 2 forms the block structure with stopper 6, snap ring 2 and stopper 6 block, thereby that two sets of packaging mold body 1 are together fixed, avoid when storing the transportation, there is packaging mold body 1 to receive external collision, the factor of jolting slips, thereby cause the damage to inside electronic chip, packaging mold body 1's both sides bottom articulates there is articulated piece 3, and articulated piece 3's right side top fixedly connected with fixed block 4.

The arc recess has been seted up to the inboard surface of articulated piece 3, and the inner wall of recess is the rough surface, when needs are separately with two sets of packaging mold body 1, the workman catches on the arc recess with the hand, it is rotatory left, make 2 atress downstream of snap ring, thereby break away from the block of stopper 6, the fixed welding machine in right side of fixed block 4 has first spring 5, and the inboard welding of first spring 5 is on packaging mold body 1's surface, the central point department of putting of articulated piece 3 articulates there is snap ring 2, packaging mold body 1's inside fixedly connected with second baffle 17.

The inner side surface of the second clapboard 17 is provided with a sliding groove, the inner wall of the sliding groove is abutted against the surface of the baffle 10, the baffle 10 and the second clapboard 17 form a sliding structure, the baffle 10 moves in the second clapboard 17 to reduce the impact force during collision and play a certain role in force release, when the packaging mould body 1 is prevented from colliding, an electronic chip collides against the inner wall of the packaging mould body 1 to generate unnecessary damage, the inside of the packaging mould body 1 is inserted with the first clapboard 12, the two sides of the first clapboard 12 are fixedly connected with the second rubber pads 11, the inner wall of the left side of the packaging mould body 1 is welded with the second spring 9, the right side of the second spring 9 is fixedly welded with the baffle 10, the top end of the packaging mould body 1 is fixedly connected with the outer rod 15, the inside of the outer rod 15 is inserted with the inner rod 13, the surface of the inner rod 13 is abutted against the inner wall of the outer rod 15, and the, the inner rod 13 interacts with the inner part of the outer rod 15, the inner rod 13 is abutted to the other group of limiting grooves 16 under the action of the elastic force of the third spring 14, the packaging mold body 1 is supported, tension is provided for the two groups of clamping rings 2, and therefore the clamping of the clamping rings 2 and the limiting blocks 6 is fastened.

The bottom welding of interior pole 13 has third spring 14, and the bottom welding of third spring 14 is at the inner wall of outer pole 15, the bottom fixedly connected with slider 18 of first baffle 12, the spout has been seted up with the corresponding position department of slider 18 in the surface of packaging mold body 1, and the inner wall of spout is inconsistent with the surface of slider 18, slider 18 forms the slidingtype structure with the spout, slider 18 slides at packaging mold body 1 inside, thereby drive first baffle 12 motion, the track that the spout provided for the slider 18 motion simultaneously, the stationarity when having guaranteed to slide, prevent to take place the skew, spacing groove 16 has been seted up on the bottom surface of packaging mold body 1.

The working principle is as follows: when the packaging mold is used, according to the attached drawings 1, 2 and 3, after the mold packaging is completed, when the packaging mold is moved and carried, one group of packaging mold bodies 1 is overlapped on the surface of the other group of packaging mold bodies 1, the surfaces of the limiting grooves 16 and the inner rods 13 are opposite to each other, the inner rods 13 are inserted in the limiting grooves 16, the inner rods 13 slide on the inner wall of the outer rod 15, the third springs 14 are compressed and deformed, meanwhile, the surface of the first rubber pad 8 is in contact with the bottom end of the packaging mold bodies 1, the hinge blocks 3 are rotated towards one side, the top ends of the hinge blocks 3 are moved, the first springs 5 are pulled up and deformed, meanwhile, the top ends of the hinge blocks 3 are moved, the clamp ring 2 moves downwards, the bottom end of the clamp ring 2 is rotated to the bottom end of the limiting block 6, the pulling force on the hinge blocks 3 is released, the hinge blocks 3 are pulled back to the original positions under the elastic force of the first springs 5, make 2 blocks of snap ring inside stopper 6, when packaging mold body 1 received the collision, the impact made electronic chip at the inside motion of packaging mold body 1, baffle 10 atress was at the motion of 17 inner walls of second baffle, thereby with second spring 9 compression downwards, chip collision second rubber pad 11 simultaneously, make second rubber pad 11 promote first baffle 12 motion, first baffle 12 drives slider 18 and slides at the inside spout of packaging mold body 1, the flexibility of second rubber pad 11 and the elasticity of second spring 9 slow down the impact, avoid making electronic chip receive the damage in the striking, to this end, the operation is accomplished.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides an electronic chip packaging mold convenient to remove, includes packaging mold body (1), its characterized in that: the packaging mold comprises a packaging mold body (1), supporting blocks (7) are fixedly connected to two sides of the top end of the packaging mold body (1), first rubber pads (8) are fixedly connected to the top ends of the supporting blocks (7), limiting blocks (6) are fixedly connected to two sides of the packaging mold body (1), hinged blocks (3) are hinged to the bottom ends of two sides of the packaging mold body (1), fixed blocks (4) are fixedly connected to the top ends of the right sides of the hinged blocks (3), first springs (5) are fixedly welded to the right sides of the fixed blocks (4), the inner sides of the first springs (5) are welded to the surface of the packaging mold body (1), clamping rings (2) are hinged to the central positions of the hinged blocks (3), second partition plates (17) are fixedly connected to the inside of the packaging mold body (1), first partition plates (12) are inserted into the inside of the packaging mold body (1), and second rubber pads (11) are fixedly connected to two, the utility model discloses a packaging mold, including encapsulation mould body (1), the left side inner wall welding of encapsulation mould body (1) has second spring (9), and the right side fixed welding of second spring (9) has baffle (10), the top fixedly connected with outer pole (15) of encapsulation mould body (1), and the inside of outer pole (15) is inserted and is equipped with interior pole (13), the bottom welding of interior pole (13) has third spring (14), and the bottom welding of third spring (14) is at the inner wall of outer pole (15), the bottom fixedly connected with slider (18) of first baffle (12), spacing groove (16) have been seted up on the bottom surface of encapsulation mould body (1).

2. A portable electronic chip packaging mold according to claim 1, wherein: the surface of the packaging mold body (1) is provided with a sliding groove at a position corresponding to the sliding block (18), the inner wall of the sliding groove is abutted against the surface of the sliding block (18), and the sliding block (18) and the sliding groove form a sliding structure.

3. A portable electronic chip packaging mold according to claim 1, wherein: the inner side surface of the hinge block (3) is provided with an arc-shaped groove, and the inner wall of the groove is a rough surface.

4. A portable electronic chip packaging mold according to claim 1, wherein: the inner wall of the limiting block (6) is abutted to the surface of the clamping ring (2), and the clamping ring (2) and the limiting block (6) form a clamping structure.

5. A portable electronic chip packaging mold according to claim 1, wherein: the surface of the inner rod (13) is abutted against the inner wall of the outer rod (15), and the inner rod (13) and the outer rod (15) form a telescopic structure.

6. A portable electronic chip packaging mold according to claim 1, wherein: the inner side surface of the second partition plate (17) is provided with a sliding groove, the inner wall of the sliding groove is abutted to the surface of the baffle plate (10), and the baffle plate (10) and the second partition plate (17) form a sliding structure.