CN211759064U - Novel soldering head structure - Google Patents
Novel soldering head structure Download PDFInfo
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- CN211759064U CN211759064U CN201921849759.1U CN201921849759U CN211759064U CN 211759064 U CN211759064 U CN 211759064U CN 201921849759 U CN201921849759 U CN 201921849759U CN 211759064 U CN211759064 U CN 211759064U
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- soldering head
- soldering
- heat
- layer
- head structure
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Abstract
The utility model discloses a novel soldering head structure, soldering head structure includes soldering head body (1), be provided with on soldering head body (1) electrically conductive layer (2) that generates heat with the power intercommunication, soldering head body (1) are nonmetal heat conduction material. The utility model discloses can solve among the prior art uneven and the soldering head of soldering head heat distribution have magnetic technical problem.
Description
The technical field is as follows:
the utility model relates to a soldering technical field, more specifically say and relate to a novel soldering head structure.
Background art:
in the prior art, a metal tin welding head is adopted for soldering, heat is generated through magnetic induction eddy current and is conducted to a soldering bar through the heat to complete the soldering process, but the soldering mode has uneven heat distribution, and the soldering is completed through the magnetic induction, so that the metal tin soldering head has magnetism, and the magnetism can influence various electronic elements of products, particularly PCB soldering.
The utility model has the following contents:
an object of the utility model is to provide a novel soldering tin head structure, it can solve among the prior art soldering tin head heat distribution inequality and soldering tin head have magnetic technical problem.
In order to achieve the above object, the utility model discloses a novel soldering tin head structure, soldering tin head structure includes the soldering tin head body, be provided with the electrically conductive layer that generates heat with the power intercommunication on the soldering tin head body, the soldering tin head body is nonmetal heat conduction material.
Preferably, a heat insulation layer is arranged on the conductive heating layer.
Preferably, the length of the heat insulation layer is smaller than that of the conductive heating layer.
Preferably, the conductive heating layer is attached to the surface of the soldering head body, and the conductive heating layer is in a strip shape.
Preferably, the strip-shaped conductive heating layer is distributed on the surface of the tin soldering head body in a ring shape.
Preferably, the heat insulation layer is attached to the surface of the conductive heating layer, and the heat insulation layer is in a belt shape.
Preferably, the width of the heat insulation layer is equal to the width of the conductive heating layer.
Preferably, the lower end of the soldering head body has a tooth-shaped portion that fits with the core wire to be soldered.
The beneficial effects of the utility model reside in that: the utility model discloses can solve among the prior art uneven and the soldering head of soldering head heat distribution have magnetic technical problem.
Description of the drawings:
the invention will be further explained with reference to the drawings:
fig. 1 is a schematic structural diagram of an embodiment of the present invention.
In the figure: 1. a tin soldering head body; 2. a conductive heating layer; 3. a thermal insulation layer; 4. a tooth-shaped portion.
The specific implementation mode is as follows:
the following description is only for the purpose of illustrating the preferred embodiments of the principles of the present invention and is not intended to limit the scope of the present invention.
Example (b): fig. 1 shows that the utility model relates to a novel embodiment of tin soldering head structure, tin soldering head structure includes tin welding head body 1, be provided with the electrically conductive layer 2 that generates heat that communicates with the power on tin welding head body 1, tin soldering head body 1 is nonmetal heat-conducting material.
In this embodiment, the heat insulating layer 3 is disposed on the conductive heating layer 2, and the heat insulating layer 3 can perform a heat insulating function.
In this embodiment, the length of the heat insulating layer 3 is smaller than that of the conductive heating layer 2.
In this embodiment, the conductive heating layer 2 is attached to the surface of the soldering tip body 1, and the conductive heating layer 2 is in a band shape.
In this embodiment, the strip-shaped conductive heating layer 2 is distributed on the surface of the solder head body 1 in a ring shape.
The banded electrically conductive layer 2 that generates heat can have better heating effect, and the installation is also more convenient moreover, also convenient and the wire connection of circular telegram simultaneously.
In this embodiment, the heat insulating layer 3 is attached to the surface of the conductive heating layer 2, and the heat insulating layer 3 is in a band shape.
In this embodiment, the width of the thermal insulation layer 3 is equal to the width of the conductive heating layer 2, which can improve the thermal insulation effect.
In this embodiment, the lower end of the solder head body 1 has a tooth-shaped portion 4 that fits with a core wire to be soldered.
The tooth-shaped portions 4 are provided to prevent the core wires from moving during soldering and affecting the soldering effect, and more specifically, in the present embodiment, the tooth-shaped portions 4 are provided by providing a plurality of notches corresponding to the number of core wires to be soldered.
In the working process of the embodiment, the electric conduction heating layer 2 generates heat, the core wire needing soldering is limited by the tooth-shaped part 4, the welding rod is melted by the heat conducted by the soldering head body 1 to realize soldering, the soldering head body 1 in the embodiment is made of non-metal heat-conducting materials, and the electric conduction heating layer 2 is adopted to generate heat, so that the soldering heat is uniformly distributed, the soldering effect is better, and the soldering head can be prevented from having magnetism.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (8)
1. The utility model provides a novel soldering head structure, soldering head structure includes soldering head body (1), its characterized in that, be provided with on soldering head body (1) and electrically conduct the layer (2) that generates heat with the power intercommunication, soldering head body (1) is nonmetal heat-conducting material.
2. A novel tin soldering head structure as claimed in claim 1, characterized in that the conductive heating layer (2) is provided with a heat insulating layer (3).
3. A novel tin solder head structure as claimed in claim 2, characterized in that the length of the thermal insulating layer (3) is smaller than that of the conductive heat generating layer (2).
4. A novel tin soldering head structure as claimed in claim 3, characterized in that the conductive heat-generating layer (2) is attached to the surface of the tin soldering head body (1), and the conductive heat-generating layer (2) is in the shape of a strip.
5. A novel tin soldering head structure as claimed in claim 4, characterized in that the band-shaped conductive heating layer (2) is distributed on the surface of the tin soldering head body (1) in a ring shape.
6. A novel tin soldering head structure as claimed in claim 5, characterized in that the heat insulating layer (3) is attached to the surface of the conductive heat generating layer (2), and the heat insulating layer (3) is in a belt shape.
7. A novel tin soldering head structure as claimed in claim 6, characterized in that the width of the heat insulation layer (3) is equal to the width of the conductive heat generating layer (2).
8. A novel soldering tip structure according to any one of claims 1 to 7, characterized in that the lower end of the soldering tip body (1) has teeth (4) which cooperate with the core wire to be soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921849759.1U CN211759064U (en) | 2019-10-30 | 2019-10-30 | Novel soldering head structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921849759.1U CN211759064U (en) | 2019-10-30 | 2019-10-30 | Novel soldering head structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211759064U true CN211759064U (en) | 2020-10-27 |
Family
ID=72934616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921849759.1U Active CN211759064U (en) | 2019-10-30 | 2019-10-30 | Novel soldering head structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211759064U (en) |
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2019
- 2019-10-30 CN CN201921849759.1U patent/CN211759064U/en active Active
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