CN211728629U - Round-disc inner circle chamfering machine - Google Patents

Abstract

The utility model discloses a circle beveler in disk, including consecutive pay-off part, guide rail and material receiving box, the guide rail slope is arranged downwards for make the disk rely on self gravity slip transport on the guide rail, along the direction of delivery of guide rail, be equipped with first chamfer part, upset part and second chamfer part in proper order, first chamfer part and second chamfer part are used for carrying out interior chamfer to the disk, the upset part is used for overturning 180 degrees with the disk, the upset part includes upset motor and by the upset box of upset motor drive 180 degrees that can reciprocate, two sections around the guide rail divide into, the upset box is located between two sections front and back guide rails, and the upset box can hold a disk to be equipped with the disk entry, through the upset, the entry of upset box can be respectively with two sections front and back guide rail level and smooth connecing. The utility model discloses simple structure is compact, can be in succession automatically to the two-sided interior round chamfer, chamfer efficient, reliable and stable of going on of disk.

Description

Round-disc inner circle chamfering machine

Technical Field

The utility model mainly relates to a chamfering equipment field refers in particular to circle beveler in disk.

Background

In real production life, the application of the magnetic material cannot be separated. The shape of the magnetic material is various, the disc-shaped magnetic material is a very common shape, and when the disc-shaped magnetic material is processed, the inner circle of the disc is required to be chamfered. At present, chamfering equipment for the inner circle of a wafer is a single-face inner circle chamfering machine, the wafer is clamped on a chuck by a worker or a manipulator and then moved to a grinding head for chamfering, after the chamfering of one face of the wafer is finished, the wafer needs to be dismounted, the wafer is clamped on the chuck again after being turned over by 180 degrees, and then the other face of the wafer is chamfered. Therefore, the current equipment can not chamfer the two sides of the wafer continuously and automatically, the chamfering speed is low, the efficiency is low, the chamfering sizes of the two sides of the wafer are inconsistent due to the position deviation of secondary clamping, and the stability is poor.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in: aiming at the defects in the prior art, the wafer inner circle chamfering machine has a simple and compact structure, can continuously and automatically perform inner circle chamfering on the two sides of a wafer, and is high in chamfering efficiency, stable and reliable.

In order to solve the technical problem, the utility model discloses a following technical scheme:

the utility model provides a circle beveler in disk, includes consecutive pay-off part, guide rail and material receiving box, and the guide rail slope is arranged downwards for make the disk rely on self gravity slip transport on the guide rail, along the direction of delivery of guide rail, be equipped with first chamfer part, upset part and second chamfer part in proper order, first chamfer part and second chamfer part are used for carrying out interior chamfer to the disk, the upset part is used for overturning 180 degrees with the disk, the upset part is including upset motor and by the upset box of upset motor drive 180 degrees that can reciprocate, the guide rail divide into two sections around, the upset box is located between two sections front and back guide rails, and the upset box can hold a disk to be equipped with the disk entry, through the upset, the entry of upset box can be respectively with two sections front and back guide rails smooth phase to meet.

Further, first chamfer part is the same with second chamfer part structure, all includes chamfering mechanism, swager and stock stop, chamfering mechanism is used for carrying out interior round chamfer to the disk that is in the chamfer station, swager is used for compressing tightly the disk that is in the chamfer station, stock stop is located the rear of chamfer station, is used for blocking the disk that comes out from the chamfer station and makes the disk suspend and slide, just is in the chamfer station with being kept off the next disk that the disk is adjacent.

Further, chamfering mechanism includes by motor drive's lift straight line slip table and installs the chamfer bistrique on lift straight line slip table, pressing mechanism is including pressing the material cylinder and by pressing the clamp plate that the material cylinder drive goes up and down, stock stop includes the fender material cylinder and by the baffle that the drive of fender material cylinder goes up and down.

Furthermore, the turnover box comprises two L-shaped box plates, and the two L-shaped box plates form a square box body.

Further, the pressing mechanism is installed on a linear sliding table which is perpendicular to the guide rail, the stop mechanism is installed on the linear sliding table which is parallel to the guide rail, and the linear sliding table is driven by a hand wheel or a motor.

Further, the guide rail includes the bottom plate and installs in the flange of bottom plate top both sides through threaded fastener, and the flange accessible of both sides is drawn close each other or is kept away from and adjust the interior width of guide rail, set up the waist type hole that supplies threaded fastener to install on the flange, waist type hole perpendicular to guide rail.

Further, the feeding part is a vibration feeding plate.

Compared with the prior art, the utility model has the advantages of: the utility model has simple and compact structure, and the first chamfering component, the turning component and the second chamfering component are arranged in sequence along the conveying direction of the guide rail, and the turning component can realize the automatic turning of the wafer, so that the wafer can be continuously and automatically chamfered, turned and chamfered along the guide rail, and the chamfering speed and efficiency are improved; moreover, the wafer is automatically turned over, secondary clamping is not needed, the consistency of the sizes of the chamfers on the two surfaces of the wafer is also ensured, and the wafer is more stable and reliable.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is an enlarged schematic structural view of the first chamfer component (second chamfer component) in the operation of the present invention.

Fig. 3 is an enlarged schematic structural view of the turnover part of the present invention during operation.

Illustration of the drawings: 1. a feeding part; 2. a guide rail; 21. a base plate; 22. blocking edges; 23. a kidney-shaped hole; 3. a material receiving box; 4. a wafer; 5. a first chamfer member; 6. a turning part; 61. turning over a motor; 62. turning over the box; 7. a second chamfer member; 71. a linear sliding table; 72. chamfering the grinding head; 73. a material pressing cylinder; 74. pressing a plate; 75. a material blocking cylinder; 76. a baffle plate; 77. a hand wheel; 8. and a circulating water tank.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments, and it should be noted that the scope of the present invention is not limited to the following embodiments, and any modifications and decorations made by the present invention should be considered as the scope of the present invention without departing from the principle of the present invention.

As shown in fig. 1, the wafer inner circle chamfering machine comprises a feeding part 1, a guide rail 2 and a material receiving box 3 which are connected in sequence, wherein the guide rail 2 is arranged obliquely downwards and is used for enabling a wafer 4 to be conveyed on the guide rail 2 in a sliding mode by means of self gravity. Along the direction of delivery of guide rail 2, be equipped with first chamfer part 5, upset part 6 and second chamfer part 7 in proper order, first chamfer part 5 and second chamfer part 7 are used for carrying out interior chamfer to disk 4, and upset part 6 is used for overturning 180 degrees with disk 4, refers to fig. 3, and upset part 6 includes upset motor 61 and can reciprocate the upset box 62 of overturning 180 degrees by the drive of upset motor 61. The guide rail 2 is divided into a front section and a rear section, the turnover box 62 is positioned between the front section and the rear section of the guide rail 2, the turnover box 62 can contain a wafer 4 and is provided with a wafer inlet, and the inlet of the turnover box 62 can be respectively and smoothly connected with the front section and the rear section of the guide rail 2 through turnover.

Referring to fig. 2, the first chamfering component 5 and the second chamfering component 7 have the same structure and each include a chamfering mechanism, a pressing mechanism and a material stopping mechanism, the chamfering mechanism is used for performing inner circle chamfering on the wafer 4 at the chamfering station, the pressing mechanism is used for pressing the wafer 4 at the chamfering station, the material stopping mechanism is located behind the chamfering station and used for stopping the wafer 4 coming out of the chamfering station to enable the wafer 4 to pause and slide, and the next wafer 4 adjacent to the stopped wafer 4 is just at the chamfering station.

The chamfering mechanism comprises a lifting linear sliding table 71 driven by a motor and a chamfering grinding head 72 installed on the lifting linear sliding table 71, the pressing mechanism comprises a pressing cylinder 73 and a pressing plate 74 driven to lift by the pressing cylinder 73, and the material blocking mechanism comprises a material blocking cylinder 75 and a baffle plate 76 driven to lift by the material blocking cylinder 75.

The pressing mechanism is mounted on a linear slide table 71 arranged perpendicularly to the guide rail 2, and is used for adjusting the height of the pressing plate 74 in accordance with the thickness of the wafer 4. The stock stop is mounted on a linear slide table 71 arranged in parallel with the guide rail 2 for adjusting the position of the retainer 76 in accordance with the diameter of the wafer 4. The linear slide table 71 is driven by a hand wheel 77 or a motor.

The turnover box 62 includes two L-shaped box plates that form a square box body, and the two L-shaped box plates are connected by bolts or other threaded fasteners. In order to adapt to the wafers 4 with different specifications and sizes, the internal size of the turnover box 62 can be changed by adjusting the distance between the two L-shaped box plates so as to adapt to the size of the wafer 4.

The guide rail 2 comprises a bottom plate 21 and flanges 22 which are arranged on two sides above the bottom plate 21 through threaded fasteners, and the flanges 22 on the two sides can adjust the inner width of the guide rail 2 by approaching to or separating from each other so as to adapt to wafers 4 with different diameters. The flange 22 is provided with a waist-shaped hole 23 for mounting a threaded fastener, and the waist-shaped hole 23 is vertical to the guide rail 2. The kidney-shaped hole 23 is used to adjust the installation position of the rib 22.

The feeding part 1 is a vibration feeding tray which is the prior art in the field and is not described in detail herein. The receiving box 3 is positioned at the tail end of the guide rail 2 and is used for receiving the chamfered round piece 4 which slides down from the guide rail 2. A circulating water tank 8 is arranged below the material receiving box 3 and used for containing the ground magnetic powder.

The working process is as follows: the vibration feeding disc continuously feeds the wafers 4 into the front section guide rail 2, the wafers 4 slide along the front section guide rail 2 to advance, when the first wafer 4 slides to the baffle 76 of the first chamfering component 5 and is blocked by the baffle 76, the second wafer 4 is just positioned at the chamfering station of the first chamfering component 5, the material pressing cylinder 73 acts at the moment to drive the pressing plate 74 to descend to press the second wafer 4, and then the linear sliding table 71 driven by the motor on the chamfering mechanism drives the chamfering grinding head 72 to descend to chamfer the second wafer 4; when the second wafer 4 is chamfered, the material blocking cylinder 75 acts to drive the baffle 76 to ascend, so that the first wafer 4 slides into the turnover box 62 along the front section guide rail 2, and then the baffle 76 descends to the original position again; after the chamfering of the second wafer 4 is finished, the chamfering grinding head 72 and the pressure plate 74 ascend to the original position, the second wafer 4 slides to the position of the baffle 76 and is blocked by the baffle 76, the third wafer 4 slides to the chamfering station, and the operations are repeated.

The wafer 4 continuously slides into the rear section guide rail 2 after being turned over by 180 degrees along with the turning box 62, enters the second chamfering component 7, repeats the same action as the first chamfering component 5, and finally slides into the material receiving box 3.

Claims (7)

1. The utility model provides an inner circle beveler in disk which characterized in that: including consecutive pay-off part, guide rail and material receiving box, the guide rail slope is arranged downwards for make the disk rely on self gravity slip transport on the guide rail, along the direction of delivery of guide rail, be equipped with first chamfer part, upset part and second chamfer part in proper order, first chamfer part and second chamfer part are used for carrying out interior chamfer to the disk, the upset part is used for overturning 180 degrees with the disk, the upset part is including upset motor and the upset box that can overturn 180 degrees by upset motor drive, the guide rail divide into two sections around, the upset box is located between two sections front and back guide rails, and the upset box can hold a disk to be equipped with the disk entry, through the upset, the entry of upset box can be connected with two sections front and back guide rails are level and smooth respectively.

2. The wafer inner-circle chamfering machine according to claim 1, characterized in that: first chamfer part is the same with second chamfer part structure, all includes chamfer mechanism, swager and stock stop, chamfer mechanism is used for carrying out interior round chamfer to the disk that is in the chamfer station, swager is used for compressing tightly the disk that is in the chamfer station, stock stop is located the rear of chamfer station, is used for blocking the disk that comes out from the chamfer station and makes the disk suspend and slide, just is in the chamfer station with being kept off the next disk that the disk is adjacent.

3. The wafer inner-circle chamfering machine according to claim 2, characterized in that: the chamfering mechanism comprises a lifting linear sliding table driven by a motor and a chamfering grinding head arranged on the lifting linear sliding table, the material pressing mechanism comprises a material pressing cylinder and a pressing plate driven to lift by the material pressing cylinder, and the material blocking mechanism comprises a material blocking cylinder and a baffle driven to lift by the material blocking cylinder.

4. The wafer inner-circle chamfering machine according to claim 1, 2 or 3, wherein: the turnover box comprises two L-shaped box plates, and the two L-shaped box plates form a square box body.

5. The wafer inner-circle chamfering machine according to claim 2 or 3, wherein: the material pressing mechanism is arranged on a linear sliding table which is arranged perpendicular to the guide rail, the material blocking mechanism is arranged on the linear sliding table which is arranged parallel to the guide rail, and the linear sliding table is driven by a hand wheel or a motor.

6. The wafer inner-circle chamfering machine according to claim 1, 2 or 3, wherein: the guide rail comprises a bottom plate and flanges arranged on two sides above the bottom plate through threaded fasteners, the flanges on the two sides can be mutually drawn close or kept away to adjust the inner width of the guide rail, waist-shaped holes for the threaded fasteners to be arranged are formed in the flanges, and the waist-shaped holes are perpendicular to the guide rail.

7. The wafer inner-circle chamfering machine according to claim 1, 2 or 3, wherein: the feeding part is a vibration feeding plate.

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