CN211726369U - Dispensing device for electronic components - Google Patents

Dispensing device for electronic components Download PDF

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Publication number
CN211726369U
CN211726369U CN201922110662.5U CN201922110662U CN211726369U CN 211726369 U CN211726369 U CN 211726369U CN 201922110662 U CN201922110662 U CN 201922110662U CN 211726369 U CN211726369 U CN 211726369U
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China
Prior art keywords
fixedly connected
glue
base
electronic components
gluing
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CN201922110662.5U
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Chinese (zh)
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宋亚东
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Suzhou Ansas Semiconductor Co ltd
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Suzhou Ansas Semiconductor Co ltd
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Abstract

The utility model discloses an electronic components's adhesive deposite device, the on-line screen storage device comprises a base, support column fixedly connected with horizontal pole is passed through at the top of base, the bottom fixedly connected with X axle moving mechanism of horizontal pole, X axle moving mechanism's positive fixedly connected with mounting panel, the positive left side fixedly connected with telescopic cylinder of mounting panel, telescopic cylinder's bottom fixedly connected with fixed block. The utility model discloses a driving motor, the cooperation of cleaning device and collecting box, driving motor's output shaft drives the puddler rotation, be convenient for clear up the bottom of gluing the ware, there is glue to remain in the bottom of avoiding gluing the ware and leads to a little to glue the precision and descend, through the cooperation of heating device and rotary drum, can heat the glue solution of gluing the inside storage of ware and heat up, reduce glue solution self viscosity, wire drawing phenomenon appears in the glue solution when avoiding gluing, thereby improve the point effect of gluing, the poor problem of current device point glue effect has been solved.

Description

Dispensing device for electronic components
Technical Field
The utility model relates to a point gum machine technical field specifically is an electronic components's adhesive deposite device.
Background
Along with the development of electronic technology, electronic components gradually to miniaturization, lightweight, high-frequency, heavy current, electromagnetic interference and low manufacturing cost, and high reliability development, in order to satisfy above-mentioned multiple requirement, more and more electronic components need scribble one deck glue on the wire winding of product when processing, the point gum machine of prior art is after a electronic components has been glued to the point, there is glue to remain easily in the bottom of point gum machine, lead to some glue precision to descend, when the glue solution stops flowing in the pipeline inside, lead to the glue solution cooling to turn into the sticky state easily, influence the glue solution circulation effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electronic components's adhesive deposite device possesses the effectual advantage of point, has solved the poor problem of current device point glue effect.
In order to achieve the above object, the utility model provides a following technical scheme: a glue dispensing device for electronic components comprises a base, wherein the top of the base is fixedly connected with a cross rod through a support column, the bottom of the cross bar is fixedly connected with an X-axis moving mechanism, the front surface of the X-axis moving mechanism is fixedly connected with an installation plate, a telescopic cylinder is fixedly connected on the left side of the front surface of the mounting plate, a fixed block is fixedly connected at the bottom of the telescopic cylinder, the right side of the front surface of the mounting plate is fixedly connected with a glue box, the bottom of the glue box is communicated with a glue dispenser through a glue tube, the left side of the top of the base is fixedly connected with a base, the bottom of the base is provided with a driving motor, the output shaft of the driving motor is fixedly connected with a cleaning device, the top of the base is provided with a collecting box, the left side of the top of the collecting box is provided with a rotary drum, an inner cavity of the rotary drum is provided with a heating device, and the center of the top of the base is provided with a workbench.
Preferably, cleaning device includes puddler and brush, driving motor's output shaft fixedly connected with puddler, the top of puddler is provided with the brush.
Preferably, heating device includes spring, buffer board and heating pad, one side fixedly connected with buffer board of spring, one side fixedly connected with heating pad of buffer board.
Preferably, a laser emitter is arranged on the left side of the fixed block, and a laser receiver is arranged on the right side of the rotary drum.
Preferably, chamfers are arranged at the top and the bottom of the buffer plate, and the buffer plate is arc-shaped.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a driving motor, the cooperation of cleaning device and collecting box, driving motor's output shaft drives the puddler rotation, be convenient for clear up the bottom of gluing the ware, there is glue to remain in the bottom of avoiding gluing the ware and leads to a little to glue the precision and descend, through the cooperation of heating device and rotary drum, can heat the glue solution of gluing the inside storage of ware and heat up, reduce glue solution self viscosity, wire drawing phenomenon appears in the glue solution when avoiding gluing, thereby improve the point effect of gluing, the poor problem of current device point glue effect has been solved.
2. The utility model discloses a cooperation of spring, buffer board and heating pad, spring are to the buffer board effect, make the laminating of heating pad and point gluer, improve the heating effect, through laser emitter and laser receiver's cooperation, are convenient for make the point gluer accurate insert the rotary drum inner chamber, through the design chamfer, make things convenient for the point gluer to insert.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of the drum structure of the present invention;
fig. 3 is a front sectional view of the drum structure of the present invention.
In the figure: 1. a base; 2. a cross bar; 3. an X-axis moving mechanism; 4. mounting a plate; 5. a telescopic cylinder; 6. a fixed block; 7. a glue box; 8. a hose; 9. a glue dispenser; 10. a base; 11. a drive motor; 12. a cleaning device; 121. a stirring rod; 122. a brush; 13. a collection box; 14. a rotating drum; 15. a heating device; 151. a spring; 152. a buffer plate; 153. a heating pad; 16. a work table; 17. a laser transmitter; 18. a laser receiver.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a dispensing device for electronic components comprises a base 1, a cross bar 2 is fixedly connected to the top of the base 1 through a support column, an X-axis moving mechanism 3 is fixedly connected to the bottom of the cross bar 2, a mounting plate 4 is fixedly connected to the front of the X-axis moving mechanism 3, a telescopic cylinder 5 is fixedly connected to the left side of the front of the mounting plate 4, a fixing block 6 is fixedly connected to the bottom of the telescopic cylinder 5, a laser transmitter 17 is arranged on the left side of the fixing block 6, a laser receiver 18 is arranged on the right side of a rotary drum 14, the spring 151 acts on the buffer plate 152 through the cooperation of the spring 151, the buffer plate 152, the heating pad 153 is attached to a dispenser 9, the heating effect is improved, the dispenser 9 can be conveniently and accurately inserted into the inner cavity of the rotary drum 14 through the cooperation of the laser transmitter 17 and the laser, the right side of the front surface of the mounting plate 4 is fixedly connected with a rubber box 7, the bottom of the rubber box 7 is communicated with a glue dispenser 9 through a rubber tube 8, the left side of the top of the base 1 is fixedly connected with a base 10, the bottom of the base 10 is provided with a driving motor 11, an output shaft of the driving motor 11 is fixedly connected with a cleaning device 12, the cleaning device 12 comprises a stirring rod 121 and a brush 122, the output shaft of the driving motor 11 is fixedly connected with a stirring rod 121, the top of the stirring rod 121 is provided with a brush 122, the top of the base 10 is provided with a collecting box 13, the left side of the top of the collecting box 13 is provided with a rotating cylinder 14, the inner cavity of the rotating cylinder 14 is provided with a heating device 15, the heating device 15 comprises a spring 151, a buffer plate 152 and a heating pad 153, one side of the spring 151 is fixedly connected with a buffer plate 152, one side, the center department at base 1 top is provided with workstation 16, through driving motor 11, the cooperation of cleaning device 12 and collecting box 13, driving motor 11's output shaft drives the puddler 121 rotatory, be convenient for clear up the bottom of point gluey ware 9, it has glue to remain to lead to a little to glue the precision and descend to avoid the bottom of point gluey ware 9, cooperation through heating device 15 and rotary drum 14, can heat the glue solution of the inside storage of point gluey ware 9 and heat up, reduce glue solution self viscosity, the wire drawing phenomenon appears in the glue solution when avoiding point gluing, thereby improve the effect of gluing, the poor problem of current device point gluing effect has been solved.
During the use, X axle moving mechanism 3 drives point glue ware 9 through mounting panel 4 and moves left, when laser receiver 18 received the signal that laser emitter 17 sent, telescopic cylinder 5 drove point glue ware 9 and descends, make point glue ware 9 accurately insert the inner chamber of rotary drum 14, spring 151 is to buffer plate 152 effect, make heating pad 153 with the laminating of point glue ware 9, heat the glue solution of point glue ware 9 inside storage and heat up, reduce glue solution self viscosity, the wire drawing phenomenon appears in the glue solution when avoiding point glue, make driving motor 11 work through peripheral controller simultaneously, driving motor 11's output shaft drives puddler 121, be convenient for clear up the bottom of point glue ware 9, avoid there being glue residue in the bottom of point glue ware 9 to lead to a little glue precision to descend, thereby improve the point glue effect, the problem that current device point glue effect is poor is solved.
The control mode of the present application is automatically controlled by a controller, the control circuit of the controller can be realized by simple programming by those skilled in the art, and the present application belongs to the common knowledge in the field, and the present application mainly protects the mechanical device, so the present application does not explain the control mode and the circuit connection in detail.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. The utility model provides an electronic components's adhesive deposite device, includes base (1), its characterized in that: the top of the base (1) is fixedly connected with a cross rod (2) through a support column, the bottom of the cross rod (2) is fixedly connected with an X-axis moving mechanism (3), the front of the X-axis moving mechanism (3) is fixedly connected with a mounting plate (4), the front left side of the mounting plate (4) is fixedly connected with a telescopic cylinder (5), the bottom of the telescopic cylinder (5) is fixedly connected with a fixed block (6), the front right side of the mounting plate (4) is fixedly connected with a rubber box (7), the bottom of the rubber box (7) is communicated with a glue dispenser (9) through a rubber tube (8), the left side of the top of the base (1) is fixedly connected with a base (10), the bottom of the base (10) is provided with a driving motor (11), an output shaft of the driving motor (11) is fixedly connected with a cleaning device (12), the top of the base (, a rotary drum (14) is arranged on the left side of the top of the collecting box (13), a heating device (15) is arranged in an inner cavity of the rotary drum (14), and a workbench (16) is arranged at the center of the top of the base (1).
2. A dispensing apparatus for electronic components as claimed in claim 1, wherein: the cleaning device (12) comprises a stirring rod (121) and a brush (122), the stirring rod (121) is fixedly connected with an output shaft of the driving motor (11), and the brush (122) is arranged at the top of the stirring rod (121).
3. A dispensing apparatus for electronic components as claimed in claim 1, wherein: heating device (15) include spring (151), buffer board (152) and heating pad (153), one side fixedly connected with buffer board (152) of spring (151), one side fixedly connected with heating pad (153) of buffer board (152).
4. A dispensing apparatus for electronic components as claimed in claim 1, wherein: the left side of the fixed block (6) is provided with a laser emitter (17), and the right side of the rotary drum (14) is provided with a laser receiver (18).
5. A dispensing apparatus for electronic components as claimed in claim 3, wherein: the top and the bottom of buffer board (152) all are provided with the chamfer, the shape of buffer board (152) is arc.
CN201922110662.5U 2019-11-30 2019-11-30 Dispensing device for electronic components Active CN211726369U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201922110662.5U CN211726369U (en) 2019-11-30 2019-11-30 Dispensing device for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201922110662.5U CN211726369U (en) 2019-11-30 2019-11-30 Dispensing device for electronic components

Publications (1)

Publication Number Publication Date
CN211726369U true CN211726369U (en) 2020-10-23

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201922110662.5U Active CN211726369U (en) 2019-11-30 2019-11-30 Dispensing device for electronic components

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CN (1) CN211726369U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112337740A (en) * 2020-11-20 2021-02-09 诺兰特新材料(北京)有限公司 Glue rolling equipment for glue dispenser
CN112354790A (en) * 2020-10-29 2021-02-12 江苏开创检测技术有限公司 Electronic components adhesive deposite device
CN115415085A (en) * 2022-08-10 2022-12-02 镇江市鑫泰绝缘材料有限公司 Be used for transformer insulating block processing to use rubber coating frock
CN116759515A (en) * 2023-08-21 2023-09-15 山西星心半导体科技有限公司 Packaging structure of combined LED lamp bead

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112354790A (en) * 2020-10-29 2021-02-12 江苏开创检测技术有限公司 Electronic components adhesive deposite device
CN112337740A (en) * 2020-11-20 2021-02-09 诺兰特新材料(北京)有限公司 Glue rolling equipment for glue dispenser
CN115415085A (en) * 2022-08-10 2022-12-02 镇江市鑫泰绝缘材料有限公司 Be used for transformer insulating block processing to use rubber coating frock
CN115415085B (en) * 2022-08-10 2023-11-03 镇江市鑫泰绝缘材料有限公司 Be used for transformer insulation piece processing to use rubber coating frock
CN116759515A (en) * 2023-08-21 2023-09-15 山西星心半导体科技有限公司 Packaging structure of combined LED lamp bead
CN116759515B (en) * 2023-08-21 2023-10-27 山西星心半导体科技有限公司 Packaging structure of combined LED lamp bead

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