CN211718339U

CN211718339U - S parameter test fixture of thin film microstrip filter

Info

Publication number: CN211718339U
Application number: CN201922056504.6U
Authority: CN
Inventors: 苏祺益; 黄星凡; 潘甲东; 严勇
Original assignee: Fujian Mmelec Electronics Co ltd
Current assignee: Fujian Mmelec Electronics Co ltd
Priority date: 2019-11-25
Filing date: 2019-11-25
Publication date: 2020-10-20
Anticipated expiration: 2029-11-25

Abstract

The utility model provides a film microstrip filter' S S parameter test fixture, film microstrip filter has the ground plane, including the test base, two connectors, two test microstrip lines, two gold wires and conducting resin, two connectors set up respectively at test base both ends, film microstrip filter fixes at test base middle part through setting up the conducting resin in its ground plane, two test microstrip line one end is connected with two connectors respectively, the other end is connected through the input/output electrode bonding of gold wire and film microstrip filter respectively, two test microstrip line length the same and through TRL calibration, test base surface is through metallization processing. The utility model discloses can guarantee that the ground connection of product is respond well, can not cause destruction to the product, repeatedly usable, test reliability and precision are high, also are applicable to small-size product.

Description

S parameter test fixture of thin film microstrip filter

Technical Field

The utility model relates to a film microstrip filter' S S parameter test anchor clamps.

Background

In the production process of the thin-film microstrip filter, the product needs to be tested for the S parameter (namely the insertion loss S21 and the return loss S11 of the filter) so as to ensure the quality and the reliability of the product. The traditional clamp method is to weld the connector at the input end and the output end of a product and then carry out a test, and the method has the defects of easy damage to the product, incapability of recycling, low test accuracy and the like. Secondly, in the process of testing S parameters of the filter, the grounding end of a product is required to have good grounding effect. The traditional method is to weld the outer conductor of the connector with the grounding end of the filter, but due to welding uncertainty, a cold joint condition may occur, so that the grounding effect is not ideal, in addition, a planar circuit and the coaxial transmission of the connector are directly welded, so that balance-unbalance conversion occurs, high-frequency current occurs, external errors are introduced, the test is not accurate, and S parameter distortion is caused. Moreover, the traditional clamp adopts soldering tin, and the gold layer electrode of the filter is easily damaged due to high temperature, so that the reliability and the result of the test are influenced; each time the test fails, the test needs to be repeated, and the test efficiency is influenced. In particular, small-sized products cannot be effectively tested. Therefore, the conventional jig has a great disadvantage.

SUMMERY OF THE UTILITY MODEL

The utility model aims at prior art not enough, provide a film microstrip filter' S S parameter test fixture, can guarantee that the ground connection of product is respond well, can not cause destruction to the product, repeatedly usable, test reliability and precision are high, also are applicable to the small-size product.

The utility model discloses a following technical scheme realizes:

the S parameter test fixture of the film microstrip filter is characterized in that the film microstrip filter is provided with a ground plane and comprises a test base, two connectors, two test microstrip lines, two gold wires and conductive adhesive, wherein the two connectors are respectively arranged at two ends of the test base, the film microstrip filter is fixed in the middle of the test base through the conductive adhesive arranged on the ground plane of the film microstrip filter, one ends of the two test microstrip lines are respectively connected with the two connectors, the other ends of the two test microstrip lines are respectively in bonding connection with input and output electrodes of the film microstrip filter through gold wires, the two test microstrip lines are identical in length and are calibrated through TRL, and the surface of the test base is subjected to metallization treatment.

Furthermore, the connector comprises a shell and a core wire arranged in the shell, the shell is fixed on the test base, and the core wire is connected with one end of the test microstrip line.

Further, a hardened gold-plated layer is arranged on the surface of the test base.

Furthermore, a groove matched with the thin film microstrip filter is arranged in the middle of the upper surface of the test base and serves as a test station.

Furthermore, a plurality of test stations are longitudinally arranged in the middle of the upper surface of the test base at intervals.

Further, the conductive adhesive is coated on the ground plane of the thin-film microstrip filter and is cured.

Furthermore, the input and output electrodes of the thin-film microstrip filter are aligned with the 50 ohm transmission line of the test microstrip line and are connected through gold wire bonding.

The utility model discloses following beneficial effect has:

1. the ground plane of the film microstrip filter is fixed on the test base through the conductive adhesive, so that the good grounding effect of the product can be ensured; the surface of the test base is metallized, is not easy to oxidize and wear, and is matched with the grounding end of the filter, so that the test is more accurate; introducing a test microstrip line which is subjected to TRL calibration, and connecting an input/output end electrode of the thin-film microstrip filter with the connector in a gold wire bonding mode to avoid high-frequency current generated in balance-unbalance conversion, thereby avoiding introducing external errors and improving test accuracy; the utility model discloses repeatedly usable, and film microstrip filter passes through the test microstrip line and is connected with the connector, and the connector does not carry out the welding relevant with film microstrip filter, consequently can not cause destruction to film microstrip filter, also can not influence efficiency of software testing, just the utility model is suitable for a small-size product.

2. The utility model discloses a test base upper surface middle part longitudinal separation is provided with a plurality of test stations, can carry out a plurality of film microstrip filter's test simultaneously, further improves efficiency of software testing.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings.

Fig. 1 is a schematic top view of the present invention.

Fig. 2 is a schematic sectional view of the present invention.

Wherein, 1, testing the base; 2. a connector; 3. testing the microstrip line; 31. a 50 ohm transmission line; 4. gold wire; 5. a conductive adhesive; 6. a thin film microstrip filter.

Detailed Description

As shown in fig. 1 and 2, the thin film microstrip filter 6 has a ground plane, and an S-parameter testing fixture thereof includes a testing base 1, two connectors 2, two testing microstrip lines 3, two gold wires 4, and a conductive adhesive 5, where the two connectors 2 are respectively disposed at two ends of the testing base 1, the thin film microstrip filter 6 is fixed in the middle of the testing base 1 through the conductive adhesive 5 disposed on the ground plane, one ends of the two testing microstrip lines 3 are respectively connected with the two connectors 2, and the other ends are respectively connected with input and output electrodes of the thin film microstrip filter 6 through the gold wires 4 in a bonding manner, the two testing microstrip lines 3 have the same length and are calibrated by TRL, and the surface of the testing base 1 is metallized, specifically, provided with a hardened gold plating layer.

The connector 2 comprises a conductive shell and a core wire arranged in the shell, the shell is tightly fixed on the test base 1, and the core wire is connected with one end of the test microstrip line 3.

In order to enable the thin film microstrip filter 6 to be connected with the test base 1 more easily through the conductive adhesive 5, a groove matched with the ground surface of the thin film microstrip filter 6 is arranged in the middle of the upper surface of the test base 1 to serve as a test station. In other embodiments, a plurality of test stations can be longitudinally arranged at intervals in the middle of the upper surface of the test base 1, and one test station corresponds to the two connectors 2, the two test microstrip lines 3 and the two gold wires 4, so that a plurality of thin film microstrip filters 6 can be tested simultaneously, and the test efficiency is further improved.

In use, the conductive adhesive 5 is coated on the ground plane of the thin-film microstrip filter 6 and then cured, so that the thin-film microstrip filter 6 is quickly and reliably connected with the test base 1.

To facilitate gold wire 4 bonding, the input and output electrodes of the thin-film microstrip filter 6 should be aligned with the 50 ohm transmission line 31 of the test microstrip line 3.

The utility model discloses also be applicable to other two port small-size individual layer piece formula components of input/output port collineation.

The above description is only a preferred embodiment of the present invention, and therefore the scope of the present invention should not be limited thereby, and all equivalent changes and modifications made within the scope of the claims and the specification should be considered within the scope of the present invention.

Claims

1. The utility model provides a film microstrip filter' S S parameter test fixture, film microstrip filter has the ground plane, its characterized in that: the device comprises a test base, two connectors, two test microstrip lines, two gold wires and conductive adhesive, wherein the two connectors are respectively arranged at two ends of the test base, a thin-film microstrip filter is fixed in the middle of the test base through the conductive adhesive arranged on the ground surface of the thin-film microstrip filter, one end of each test microstrip line is respectively connected with the two connectors, the other end of each test microstrip line is respectively connected with an input electrode and an output electrode of the thin-film microstrip filter in a bonding mode through a gold wire, the two test microstrip lines are identical in length and are subjected to TRL calibration, and the surface of the test base is.

2. The S-parameter test fixture of a thin film microstrip filter according to claim 1, characterized in that: the connector comprises a shell and a core wire arranged in the shell, the shell is fixed on the test base, and the core wire is connected with one end of the test microstrip line.

3. The S-parameter test fixture of a thin film microstrip filter according to claim 1, characterized in that: the surface of the test base is provided with a hardened gold-plated layer.

4. An S-parameter test fixture of a thin film microstrip filter according to claim 1, 2 or 3 wherein: and a groove matched with the thin film microstrip filter is arranged in the middle of the upper surface of the test base and serves as a test station.

5. The S parameter test fixture of the thin film microstrip filter according to claim 4, characterized in that: the middle of the upper surface of the test base is longitudinally provided with a plurality of test stations at intervals.

6. An S-parameter test fixture of a thin film microstrip filter according to claim 1, 2 or 3 wherein: and the conductive adhesive is coated on the ground plane of the thin-film microstrip filter and is cured.

7. An S-parameter test fixture of a thin film microstrip filter according to claim 1, 2 or 3 wherein: and the input and output electrodes of the thin-film microstrip filter are aligned with the 50 ohm transmission line of the test microstrip line and are connected through gold wire bonding.