CN211702522U - Circuit board, electronic equipment and vehicle - Google Patents
Circuit board, electronic equipment and vehicle Download PDFInfo
- Publication number
- CN211702522U CN211702522U CN202020044899.8U CN202020044899U CN211702522U CN 211702522 U CN211702522 U CN 211702522U CN 202020044899 U CN202020044899 U CN 202020044899U CN 211702522 U CN211702522 U CN 211702522U
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- circuit board
- copper
- heat dissipation
- area
- clad
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Abstract
The utility model discloses a circuit board, an electronic device and a vehicle, which comprises a substrate; a copper-clad region disposed on the substrate; one or more heat dissipation areas are arranged in the copper-clad area. The copper-clad area is arranged in a grid shape, and the heat dissipation area is formed by copper digging treatment in the copper-clad area. The utility model provides a circuit board makes the circuit board in the course of working, and its heat is concentrated in the radiating area and is gived off, and the copper sheet heat dissipation becomes even, has improved the thermal diffusivity. Because the heat dissipation of copper sheet is comparatively even, and then show to improve copper sheet tension, the copper sheet is difficult for the perk. In addition, the toughness of the circuit board can be increased.
Description
Technical Field
The utility model relates to an electronic equipment field especially relates to a circuit board.
Background
In electronic devices, a printed circuit board is a carrier for electrical connection of electronic components as a support for the electronic components, and is a very important electronic component. The Printed circuit board is generally referred to as a PCB (Printed circuit board), and the Printed circuit board further includes a flexible circuit board and a flexible-rigid board. The rigid-flex board is generally formed by laminating a plurality of signal layers, the corresponding layers in the printed circuit board are designed symmetrically, if the difference of the areas of copper paved on the corresponding layers is too large, the corresponding layers are designed asymmetrically, and the flatness of the board is affected in the process of manufacturing the printed circuit board. In the design process of the circuit board, if the copper sheet is not designed reasonably, the circuit board is warped. Meanwhile, in the process of manufacturing the circuit board, if the jointed boards are too large and the quality of the used materials is poor, or the moisture of the boards before pressing is not baked, the flatness of the circuit board is affected, the circuit board is easy to warp, and the performance of the circuit board is affected.
Wherein, need heating in the circuit board course of working, copper sheet heating expansion, then cool to room temperature, copper sheet can contract, if the temperature variation is inhomogeneous when contracting, leads to the copper sheet perk easily. This is more serious in the case where the size of the circuit board is long and narrow.
Therefore, the technical personnel in the field are dedicated to develop a circuit board, and the copper sheet on the circuit board is reasonably designed, so that the situation that the copper sheet is not tilted and the like due to uneven change of the shrinkage temperature in the shrinkage process of the copper sheet is avoided, and the quality of the circuit board is improved.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned defect of prior art, the utility model aims to solve the technical problem that how to make the heat dissipation of copper sheet comparatively even to improve copper sheet tension, difficult perk.
In order to achieve the above object, the present invention provides a circuit board, including:
a substrate;
a copper-clad region disposed on the substrate;
one or more heat dissipation areas are arranged in the copper-clad area.
Further, the heat dissipation area is a structure formed by copper digging treatment on the copper-clad area.
Further, the shape of the heat dissipation area is one or more of a circle, a square, an ellipse, a parallelogram, a triangle, a trapezoid or an irregular shape.
Further, at least some of the heat dissipation areas are different in size.
Further, the shape of the copper-clad area is a grid shape.
Further, the grid is a square grid or a diamond grid.
Further, the substrate is provided with a through hole, and the through hole is at least partially positioned in the heat dissipation area.
The utility model also provides an electronic equipment, include as above the circuit board.
The utility model also provides a vehicle, include as above electronic equipment.
The utility model provides a circuit board has following technological effect: when the circuit board is designed, particularly for the circuit board with long and narrow size and single-sided arrangement of electronic components, the copper-clad area of the side without the components of the circuit board is designed to be in a grid shape, copper digging treatment is carried out on the copper-clad area to form a heat dissipation area, so that heat is concentrated and dissipated in the heat dissipation area, the heat dissipation of the copper sheet is uniform, and the heat dissipation performance is improved. Because the heat dissipation of copper sheet is comparatively even, and then show to improve copper sheet tension, the copper sheet is difficult for the perk. In addition, the toughness of the circuit board can be increased.
The conception, the specific structure and the technical effects of the present invention will be further described with reference to the accompanying drawings, so as to fully understand the objects, the features and the effects of the present invention.
Drawings
Fig. 1 is a schematic structural diagram of a preferred embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It is to be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be noted that the drawings provided in the following embodiments are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Some exemplary embodiments of the invention have been described for illustrative purposes, and it is to be understood that the invention may be practiced otherwise than as specifically described.
As shown in fig. 1, which shows an embodiment of a circuit board according to the present invention, the circuit board includes a substrate 1, a copper-clad area 2, and a heat dissipation area 3.
The copper-clad region 2 is provided on the substrate 1. The substrate 1 is generally made of epoxy glass substrate, phenolic resin substrate, etc., and these substrates have excellent electrical properties and processability, but in the circuit board processing process, the problem of copper sheet warping and the like occurs because the stress generated by the unmatched expansion of the copper sheet and the substrate is aggravated, and especially for the circuit board with long and narrow size and single-side arranged devices, the problem of board warping is more likely to occur.
In order to effectively solve the above problem, the copper clad region 2 is provided on the side of the circuit board where no device is provided, and the heat dissipation region 3 is provided on the copper clad region 2. Preferably, the heat dissipation area 3 is obtained by copper-digging treatment on the copper sheet of the copper-clad area 1. When the circuit board passes through a furnace (over high temperature of 250-300 ℃), the copper sheet expands, and then is cooled to room temperature for shrinkage, and during the shrinkage process, the copper sheet is easy to tilt due to uneven temperature change during shrinkage. After the copper is dug, the temperature is concentrated on the region where the copper is dug, namely the heat dissipation region 3, so that the heat dissipation of the copper sheet is uniform, and the copper sheet is not easy to tilt up.
In order to optimize the heat dissipation performance better, the shape of the copper-clad region 2 is preferably set to be a grid shape. The latticed copper-clad area 2 does not influence the electrical conductivity, has better heat dissipation performance, can meet the requirement of high-temperature treatment, and simultaneously can save the use of copper and reduce the production cost.
The grid shape of the copper-clad area 2 can be square or rhombus, and the distance between grids is preferably 10 mil.
The heat dissipation section 3 is obtained by performing a copper-digging process on the copper-clad section 2, the copper-digging process being performed over the entire copper-clad section 2. The number of the heat dissipation areas 3 can be one or more, and the heat dissipation areas are set according to the actual conditions of the size of the circuit board, the arrangement of components and the like. There is no special requirement for the shape of copper digging, the shape of the heat dissipation area 3 can be circular, square, oval, rectangle, parallelogram, trapezoid, triangle or other irregular figures, meanwhile, there is no special definition for the size of the heat dissipation area 3, the shape of each heat dissipation area 3 obtained by copper digging treatment can be the same or different, and the sizes can be the same or different. The size, the shape and the like can be set according to actual requirements.
The circuit board is also provided with a through hole 4 for mounting various electronic components. The through holes 4 can also be arranged outside the heat dissipation area 3 according to the layout design of the actual electronic components. Preferably, in order to further enhance the heat dissipation effect and prevent the copper sheet from warping, the through hole 4 may be disposed in a part of the heat dissipation area 3.
The utility model provides a circuit board, its manufacturing method includes following step:
providing a substrate 1, placing an electronic component on one surface of the substrate 1, and covering copper on the other surface without the electronic component, wherein the shape of a copper-covered area 2 is square or rhombic; drilling a hole in the substrate 1 for mounting an electronic component; the copper-clad area 2 is subjected to copper digging treatment, one or more heat dissipation areas 3 are formed according to the size of the substrate 1, the heat dissipation areas 3 can be arranged at the through holes 4, the heat dissipation areas 3 can also be arranged at positions without the through holes 4, and the shape or size of the heat dissipation areas 3 is not particularly limited.
The present invention also provides an electronic device (not shown in the figures) comprising the circuit board or its equivalent in the above embodiments.
The utility model also provides a vehicle (not shown in the figure), especially a sharing bicycle or vehicle using motor, including the electronic equipment who has used the circuit board in above embodiment. In a shared bicycle or a moped, an intelligent lock is used, and due to space limitation, a circuit board is usually long and narrow in shape so as to adapt to a narrow installation space. Through using the circuit board in the above embodiment, the quality of the circuit board can be improved, the heat dissipation of the circuit board is enhanced, and the service life of electronic equipment such as an intelligent lock is longer.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (8)
1. A circuit board, comprising:
a substrate;
a copper-clad region disposed on the substrate;
one or more heat dissipation areas are arranged in the copper-clad area;
the heat dissipation area is a structure formed by copper digging treatment in the copper-clad area.
2. The circuit board of claim 1, wherein the heat dissipation area has one or more of a circular, square, oval, parallelogram, triangular, trapezoidal, or irregular shape.
3. The circuit board of claim 1, wherein at least some of the plurality of heat dissipation areas are different sizes.
4. The circuit board of claim 1, wherein the copper-clad region is in the shape of a grid.
5. The circuit board of claim 4, wherein the grid is a square grid or a diamond grid.
6. The circuit board of claim 1, wherein the substrate has a via hole therein, the via hole being at least partially located in the heat dissipation area.
7. An electronic device, characterized in that it comprises a circuit board according to any one of claims 1-6.
8. A vehicle characterized by comprising the electronic device of claim 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020044899.8U CN211702522U (en) | 2020-01-09 | 2020-01-09 | Circuit board, electronic equipment and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020044899.8U CN211702522U (en) | 2020-01-09 | 2020-01-09 | Circuit board, electronic equipment and vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211702522U true CN211702522U (en) | 2020-10-16 |
Family
ID=72800228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020044899.8U Active CN211702522U (en) | 2020-01-09 | 2020-01-09 | Circuit board, electronic equipment and vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211702522U (en) |
-
2020
- 2020-01-09 CN CN202020044899.8U patent/CN211702522U/en active Active
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