CN211700267U - Electromagnetic shielding packaging part - Google Patents

Electromagnetic shielding packaging part Download PDF

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Publication number
CN211700267U
CN211700267U CN202020931228.3U CN202020931228U CN211700267U CN 211700267 U CN211700267 U CN 211700267U CN 202020931228 U CN202020931228 U CN 202020931228U CN 211700267 U CN211700267 U CN 211700267U
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CN
China
Prior art keywords
chip
pins
shielding
base island
package
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Active
Application number
CN202020931228.3U
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Chinese (zh)
Inventor
吴涛
岳茜峰
吴奇斌
吕磊
汪阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changjiang Electronics Technology Chuzhou Co Ltd
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Changjiang Electronics Technology Chuzhou Co Ltd
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Priority to CN202020931228.3U priority Critical patent/CN211700267U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The utility model discloses an electromagnetic shield packaging part belongs to semiconductor package technical field. The packaging part of the utility model comprises a base island, a shielding cover, a chip, a first plastic packaging material and a second plastic packaging material, wherein pins are arranged on two sides or around the base island, an enclosure wall is arranged outside the pins, the chip is electrically connected with the pins through an electrical connection part, and the shielding cover covers the first plastic packaging material and is electrically connected with the enclosure wall; the first plastic packaging material is used for coating the base island, the pins, the upper part of the enclosing wall, the electric connection part and the chip; the second molding compound is used for coating the upper part of the remaining part of the enclosing wall and the shielding case. The utility model aims to overcome prior art, the complicated and higher not enough of the technology degree of difficulty of electromagnetic shield packaging structure provides an electromagnetic shield packaging part, electromagnetic shield packaging part simple structure, greatly reduced electromagnetic shield packaging technology's the degree of difficulty, further improved the efficiency of electromagnetic shield encapsulation.

Description

Electromagnetic shielding packaging part
Technical Field
The utility model relates to a semiconductor package technical field, more specifically say, relate to an electromagnetic shield packaging part.
Background
The packaging technology is a technology for packaging an integrated circuit by using an insulating plastic or ceramic material, taking a CPU as an example, the actual volume and appearance are not the real size and appearance of a CPU core, but the CPU core and other elements are packaged. Packaging techniques are necessary and critical for the chip. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air. With the increasing demands for portability, low weight, and small size of electronic products, system-in-package technology has been developed vigorously. An important trend in system-in-package is to package different chips, such as high-speed digital circuits, analog circuits and radio frequency circuits, in one package to achieve the required degree of integration. However, this creates problems of electromagnetic interference between chips within the package, and electromagnetic radiation out of the package.
In view of the above problems, the prior art also proposes solutions, such as the invention name: the scheme discloses a manufacturing method of the electromagnetic shielding packaging assembly, and the manufacturing method thereof (application date: 2015, 12, 24 and application number: 2015110080740), and the scheme comprises the following specific steps: step 1: electroplating the substrate and the first mask plate to form a chip carrier and the bottom of the side wall of the electromagnetic shielding cover; step 2: electroplating by using a second mask plate to form the upper part of the side wall of the electromagnetic shielding cover; and step 3: bonding the chip by using the adhesive and connecting the chip and the pins through the electric connection part; and 4, step 4: plastic packaging, namely, packaging the chip electrical connection part, the chip carrier and the side wall of the electromagnetic shielding cover by using a plastic packaging material to form a first plastic packaging body; and 5: grinding, namely exposing the top of the side wall of the electromagnetic shielding cover, and then setting a third mask plate to continue electroplating to form the top of the electromagnetic shielding cover; step 6: and carrying out plastic packaging again to form a second plastic packaging body, and then separating the substrate from the first plastic packaging body and the second plastic packaging body in a corrosion or mechanical stripping mode. The packaging assembly manufactured by the method has better electromagnetic shielding property, but the manufacturing process of the packaging assembly is carried out by electroplating for many times, the manufacturing process is complex and the process difficulty is higher, and the packaging substrate needs to be peeled off when a product is formed, so that the manufacturing cost is higher.
In summary, how to reduce the difficulty of the electromagnetic shielding packaging process and improve the efficiency of the electromagnetic shielding packaging is an urgent problem to be solved in the prior art.
SUMMERY OF THE UTILITY MODEL
1. Problems to be solved
The utility model aims to overcome prior art, the complicated and higher not enough of the technology degree of difficulty of electromagnetic shield packaging structure provides an electromagnetic shield packaging part, electromagnetic shield packaging part simple structure, greatly reduced electromagnetic shield packaging technology's the degree of difficulty, further improved the efficiency of electromagnetic shield encapsulation.
2. Technical scheme
In order to solve the above problem, the utility model discloses the technical scheme who adopts as follows:
the utility model discloses an electromagnetic shielding packaging part, which comprises a base island, wherein pins are arranged on two sides or the periphery of the base island, and enclosing walls are arranged outside the pins; the chip is electrically connected with the pins through the electrical connection parts; the first plastic packaging material is used for coating the upper part of the base island, the upper parts of the pins, the upper parts of the partial enclosing walls, the electric connection parts and the chip; the shielding cover covers the first plastic packaging material, and the bottom of the shielding cover is electrically connected with the enclosing wall; and the second plastic packaging material is used for coating the upper part of the remaining part of the enclosing wall and the shielding cover, and the second plastic packaging material does not coat the lower part of the base island, the lower parts of the pins and the lower part of the enclosing wall.
Furthermore, the electrical connection part is a welding wire or a welding ball, if the chip is packaged in a normal mounting mode, the chip is electrically connected with the pin through the welding wire, and the welding wire is arranged at the top of the chip; if the chip is packaged in a flip-chip manner, the chip is electrically connected with the base island and the pins through solder balls, wherein the solder balls are arranged at the bottom of the chip.
Furthermore, the bottom of the shielding case is electrically connected to the wall through a conductive adhesive, and the upper portion of the wall is a plurality of metal posts or metal rings disposed outside the pins. In addition, an anti-oxidation metal layer is arranged on the lower portion of the base island, the lower portion of the pin and the lower portion of the enclosing wall.
3. Advantageous effects
Compared with the prior art, the beneficial effects of the utility model are that:
the electromagnetic shielding packaging piece of the utility model is provided with the enclosing wall and the shielding cover electrically connected with the enclosing wall, so that an integral and closed metal shielding cover can be formed, and the electromagnetic shielding characteristic of the packaging piece is further realized; furthermore, the utility model discloses an electromagnetic shield packaging part simple structure, preparation simple process and its cost of manufacture are low.
Drawings
Fig. 1 is a schematic view illustrating a packaging process of the electromagnetic shielding package according to the embodiment 1;
fig. 2 is a schematic structural view of an electromagnetic shielding package packaged in a normal mounting manner in embodiment 1;
fig. 3 is a schematic view illustrating a flip-chip packaging process of the electromagnetic shielding package according to embodiment 2;
fig. 4 is a schematic structural diagram of an electromagnetic shielding package flip-chip packaged in embodiment 2.
The reference numerals in the schematic drawings illustrate:
110. a base island; 120. a pin; 130. a wall; 140. a shield case; 200. a chip; 210. an electrical connection part; 310. a first molding compound; 320. a second plastic packaging material; 400. an oxidation-resistant metal layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention; moreover, the embodiments are not relatively independent, and can be combined with each other according to needs, so that a better effect is achieved. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
For a further understanding of the present invention, reference will be made to the following detailed description taken in conjunction with the accompanying drawings and examples.
Example 1
Referring to fig. 1, the method for manufacturing an electromagnetic shielding package of the present invention includes the following steps:
s1, half-etching the upper part of the first substrate to form the upper part of the base island 110, the upper part of the lead 120 and the upper part of the fence 130; it is worth noting that the upper portion of the surrounding wall 130 is composed of a plurality of metal posts or metal rings disposed outside the leads 120.
S2, electrically disposing the chip 200 such that the chip 200 is electrically connected to the upper portions of the leads 120; specifically, the chip 200 is electrically connected to the upper portions of the leads 120 through the electrical connection portions 210; in the embodiment, the electrical connection portion 210 is a bonding wire, and the chip 200 is mounted by a normal mounting method, in which the chip 200 is first placed on the base island 110, and then the chip 200 is electrically connected to the upper portions of the leads 120 by the bonding wire.
S3, plastic-sealing the chip 200 with the first molding compound 310, so that the first molding compound 310 covers the upper portion of the base island 110, the upper portions of the leads 120, the upper portions of the partial walls 130, the electrical connection portions 210, and the chip 200; it should be noted that the upper portion of the wrapped partial enclosure 130 is close to the upper portion of the pins 120, so that the amount of the conductive adhesive used can be reduced when the shielding can 140 is mounted later by wrapping the upper portion of the partial enclosure 130, and the bottom of the shielding can 140 can be disposed in the middle area of the upper portion of the enclosure 130, thereby preventing the shielding can 140 from falling off the enclosure 130.
The specific process of plastic packaging by using the first plastic packaging material 310 is as follows: the first substrate connected with the chip 200 is placed in an injection mold, and then the first molding compound 310 in a molten state is injected into the injection mold, so that the first molding compound 310 covers the upper portion of the base island 110, the upper portions of the pins 120, the upper portions of the partial walls 130, the electrical connection portions 210 and the chip 200.
S4, manufacturing the shield 140 by using the second substrate, specifically, forming the shield 140 by half-etching or stamping the second substrate; it should be noted that the formed shielding cases 140 are arranged in an array, and since the first base material is provided with the plurality of plastic packaged chips 200 arranged in an array, the shielding cases 140 arranged in an array can be correspondingly arranged on the plastic packaged chips 200 arranged in an array, thereby simplifying the process, reducing the production cost, and further improving the production efficiency of the product. Further, the shielding can 140 covers the first molding compound 310, and the bottom of the shielding can 140 is electrically connected to the upper portion of the enclosing wall 130; thereby forming an integral, closed metal shield and further achieving the electromagnetic shielding characteristics of the package. Specifically, the shielding case 140 is integrally bonded to the first molding compound 310 by using a conductive adhesive, and the bottom of the shielding case 140 is bonded to the upper portion of the enclosing wall 130 by using the conductive adhesive, so that the shielding case 140 is electrically connected to the enclosing wall 130, the shielding case 140 is mounted at one time, and the process difficulty is greatly reduced.
S5, plastic-molding the upper portion of the remaining portion of the enclosure wall 130 and the shielding can 140 by using the second plastic-molding compound 320, specifically, placing the first substrate connected with the shielding can 140 into an injection mold, and then injecting the second plastic-molding compound 320 in a molten state into the injection mold, so that the second plastic-molding compound 320 covers the shielding can 140 and the upper portion of the remaining portion of the enclosure wall 130, and the second plastic-molding compound 320 does not cover the lower portion of the base island 110, the lower portions of the pins 120, and the lower portion of the enclosure wall 130. It is worth saying that the injection mold used for secondary injection molding has a simple structure, and can improve the demolding efficiency and the production efficiency of the packaged product.
S6, half-etching the lower portion of the first substrate to form the lower portion of the island 110, the lower portion of the lead 120 and the lower portion of the fence 130, so that the island 110, the lead 120 and the fence 130 are separated from each other; it should be noted that, when the electromagnetic shielding package needs to be grounded, the lower portion of the enclosing wall 130 is not half-etched; if the emi shielding package does not need to be grounded or has no electrical connection requirement, the lower portion of the enclosing wall 130 is half-etched, so that the lower portion of the enclosing wall 130 is eliminated, thereby avoiding the risk of short circuit between the metal at the lower portion of the enclosing wall 130 and the other pins 120 after SMT processing of the package.
And S7, electroplating the lower part of the base island 110, the lower parts of the pins 120 and the lower part of the enclosing wall 130 to form an anti-oxidation metal layer 400, and cutting and separating the base island 110, the pins 120 and the enclosing wall 130 as a whole to obtain a single electromagnetic shielding packaging part. The utility model discloses a mode of machinery or laser cuts.
The utility model discloses a manufacturing method of electromagnetic shielding packaging part, through covering shield 140 and bonding on first plastic envelope material 310, and the bottom of shield 140 and enclosure 130 electric connection, thereby realize the disposable installation to shield 140, reduced the technology degree of difficulty greatly; further, an integral and closed metal shielding can be formed, thereby realizing the electromagnetic shielding property of the packaging piece. Furthermore, the utility model discloses carry out the plastic envelope earlier, once only install shield 140 again, then carry out the secondary plastic envelope and obtain the electromagnetic shield packaging spare, simple process easily operates, greatly reduced the degree of difficulty of electromagnetic shield packaging technology, further improved the efficiency of electromagnetic shield packaging.
The utility model discloses an electromagnetic shielding packaging part, including base island 110, pin 120, enclosure 130, shield 140, chip 200, first plastic-sealed material 310 and second plastic-sealed material 320, the both sides of base island 110 perhaps are equipped with pin 120 all around, and the outside of pin 120 is equipped with enclosure 130, and it is worth explaining that the upper portion of enclosure 130 sets up in the metal column or the becket in the pin 120 outside for a plurality of. The chip 200 of the present invention is electrically connected to the pins 120 through the electrical connection portion 210. Referring to fig. 2, the electrical connection portion 210 of the present embodiment is a bonding wire, the chip 200 is mounted in a normal mounting manner, the bonding wire is disposed on the top of the chip 200, and the chip 200 is electrically connected to the pin 120 through the bonding wire.
The first molding compound 310 of the present invention is used to coat the upper portion of the base island 110, the upper portions of the pins 120, the electrical connection portion 210 and the chip 200; note that the first molding compound 310 also covers the upper portion of the partial wall 130, and the upper portion of the covered partial wall 130 is close to the pins 120. Further, the utility model discloses a shield cover 140 covers on first plastic-sealed material 310, and the bottom of shield cover 140 and the upper portion electric connection of enclosure 130, specifically, shield cover 140 covers the bonding on first plastic-sealed material 310 through the conducting resin, and shield cover 140's bottom is through conducting resin and enclosure 130 electric conduction, thereby realizes the disposable installation to shield cover 140, has reduced the technology degree of difficulty greatly; furthermore, an integral and closed metal shielding cover can be formed, and the electromagnetic shielding property of the electromagnetic shielding packaging piece is further realized. In addition, the second molding compound 320 of the present invention is used to coat the upper portion of the remaining portion of the enclosing wall 130 and the shielding case 140, and in this embodiment, the first molding compound 310 and the second molding compound 320 are epoxy molding compounds. Further, the lower portion of the base island 110, the lower portions of the pins 120, and the lower portion of the fence 130 are provided with the oxidation preventing metal layer 400, so that the electromagnetic shielding package may be prevented from being oxidized.
Example 2
Referring to fig. 3, the present embodiment is basically the same as embodiment 1, except that: in the present embodiment, the chip 200 is flip-chip packaged, and as shown in fig. 4, the electrical connection portions 210 are solder balls disposed at the bottom of the chip 200, and the chip 200 is electrically connected to the leads 120 through the solder balls. In step S2, solder balls are disposed on the bottom of the chip 200 in advance, specifically, solder balls are disposed on two sides or four sides and the middle of the bottom of the chip 200, the chip 200 with the solder balls is disposed above the base island 110 and the leads 120, and the solder balls are electrically connected to the upper portions of the base island 110 and the leads 120 correspondingly. The remaining steps of the method of manufacturing the electromagnetic shielding package of the present embodiment are consistent with embodiment 1. It should be noted that, in the flip-chip packaging method, both the base island 110 and the leads 120 function as the carrier chip 200, and particularly, if the base island 110 is not provided with an electrical output, the base island 110 may not be provided, and only the leads 120 are required to carry the chip 200.
The invention has been described above in detail with reference to specific exemplary embodiments. It will, however, be understood that various modifications and changes may be made without departing from the scope of the invention as defined by the appended claims. The detailed description and drawings are to be regarded as illustrative rather than restrictive, and any such modifications and variations are intended to be included within the scope of the present invention as described herein. Furthermore, the background is intended to illustrate the present state of the art and the meaning of the present development and is not intended to limit the present invention or the present application and the field of application of the present invention.

Claims (8)

1. An electromagnetic shielding package, comprising
The device comprises a base island (110), wherein pins (120) are arranged on two sides or four sides of the base island (110), and enclosing walls (130) are arranged on the outer sides of the pins (120);
a chip (200), wherein the chip (200) is electrically connected with the pins (120) through the electrical connection parts (210);
the first molding compound (310), the first molding compound (310) is used for coating the upper part of the base island (110), the upper parts of the pins (120), the upper parts of the partial enclosing walls (130), the electric connection parts (210) and the chip (200);
the shielding cover (140), the shielding cover (140) covers on the first plastic packaging material (310), and the bottom of the shielding cover (140) is electrically connected with the enclosing wall (130);
and a second molding compound (320), wherein the second molding compound (320) is used for coating the upper part of the remaining part of the fence (130) and the shielding cover (140), and the second molding compound (320) does not coat the lower part of the base island (110), the lower part of the pin (120) and the lower part of the fence (130).
2. The electromagnetic shielding package of claim 1, wherein the electrical connection (210) is a solder wire, and the chip (200) is electrically connected to the pin (120) through the solder wire.
3. The EMI shielding package as claimed in claim 1, wherein the electrical connection portion (210) is a solder ball, and the chip (200) is electrically connected to the pad (110) and the leads (120) through the solder ball.
4. The EMI package of claim 1, wherein the bottom of said shielding enclosure (140) is electrically connected to said perimeter wall (130) by a conductive adhesive.
5. The EMI package as claimed in claim 2, wherein said wire bond is disposed on top of the chip (200) and the leads (120).
6. The electromagnetic shielding package of claim 3, wherein the solder balls are disposed on a bottom of the chip (200).
7. The EMI package as claimed in any one of claims 1-6, wherein the upper portion of the enclosure (130) is a plurality of metal posts or rings disposed outside the pins (120).
8. The EMI shielding package as claimed in claim 7, wherein the lower portion of the base island (110), the lower portions of the leads (120) and the lower portion of the fence (130) are provided with an oxidation-resistant metal layer (400).
CN202020931228.3U 2020-05-27 2020-05-27 Electromagnetic shielding packaging part Active CN211700267U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020931228.3U CN211700267U (en) 2020-05-27 2020-05-27 Electromagnetic shielding packaging part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020931228.3U CN211700267U (en) 2020-05-27 2020-05-27 Electromagnetic shielding packaging part

Publications (1)

Publication Number Publication Date
CN211700267U true CN211700267U (en) 2020-10-16

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