CN211700237U

CN211700237U - Packaging cover plate for integrated circuit

Info

Publication number: CN211700237U
Application number: CN202020808577.6U
Authority: CN
Inventors: 俞国金
Original assignee: Shenzhen Feilongzhaofu Technology Co ltd
Current assignee: Shenzhen Feilongzhaofu Technology Co ltd
Priority date: 2020-05-14
Filing date: 2020-05-14
Publication date: 2020-10-16
Anticipated expiration: 2030-05-14

Abstract

The utility model discloses an encapsulation apron for integrated circuit, including integrated circuit encapsulation case, the bottom of encapsulation bottom apron is fixed with the encapsulation metal sheet, the inner chamber fixedly connected with heat dissipation copper pipe device of encapsulation bottom apron, heat dissipation copper pipe device's front end and rear end all run through encapsulation bottom apron and extend to the outside of encapsulation bottom apron, the bottom of encapsulation bottom apron is fixed with the encapsulation metal sheet, the utility model relates to an integrated circuit packaging technology field. This a packaging cover plate for integrated circuit, through the setting of packaging metal sheet and heat dissipation copper pipe device for integrated circuit packaging cover plate is when using, can effectively dispel the heat to integrated circuit packaging incasement portion through packaging metal sheet cooperation heat dissipation copper pipe device, very big improvement the thermal diffusivity of integrated circuit packaging cover plate, avoided the packaging metal sheet to receive the restriction of packaging cover plate, the not ideal problem of radiating effect inadequately.

Description

Packaging cover plate for integrated circuit

Technical Field

The utility model relates to an integrated circuit encapsulation technical field specifically is a encapsulation apron for integrated circuit.

Background

An integrated circuit is a microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; all the components are structurally integrated, so that electronic components are greatly improved towards microminiaturization, low power consumption, intellectualization and high reliability, an integrated circuit needs to be packaged before being used, the integrated circuit package not only has the function of electrically connecting bonding points in an integrated circuit chip with the outside, but also provides a stable and reliable working environment for the integrated circuit chip and has the function of mechanical or environmental protection for the integrated circuit chip, and therefore the integrated circuit chip can play a normal function and is ensured to have high stability and reliability.

When the existing integrated circuit packaging cover plate is used, effective heat dissipation can not be carried out on the inside of an integrated circuit packaging box, a packaging metal plate is limited by the packaging cover plate, the heat dissipation effect is not ideal enough, the integrated circuit packaging box needs to carry out integrated circuit packaging cover plate sealing cover after the integrated circuit is processed, however, the packaging fixing groove of the packaging box is packaged by the packaging cover plate easily to have deviation, so that the packaging solder ring can not be accurately welded with the packaging solder groove after being melted, and the packaging of the integrated circuit packaging box easily has gaps.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides a packaging cover plate for integrated circuit has solved current integrated circuit packaging cover plate and can not effectively dispel the heat to integrated circuit packaging incasement portion, and packaging cover plate encapsulates the problem that has the deviation easily to packaging box's encapsulation fixed slot.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a package cover plate for integrated circuit, includes integrated circuit package box, the top fixedly connected with integrated circuit package cover plate of integrated circuit package box, integrated circuit package cover plate is including encapsulating top apron, the bottom fixedly connected with of encapsulation top apron encapsulates the bottom apron, the bottom of encapsulation bottom apron is fixed with the encapsulation metal sheet, the bottom fixedly connected with encapsulation solder circle of encapsulation metal sheet, the bottom of encapsulation metal sheet just is located the equal fixedly connected with encapsulation gag lever post all around of encapsulation solder circle, the bottom fixedly connected with encapsulation solder lug of encapsulation top apron.

Preferably, the inner cavity of the packaging bottom cover plate is fixedly connected with a heat dissipation copper tube device, and the front end and the rear end of the heat dissipation copper tube device penetrate through the packaging bottom cover plate and extend to the outside of the packaging bottom cover plate.

Preferably, a package filling groove is formed in the top of the package bottom cover plate in a penetrating mode, and the outer surface of the package solder bump is welded with the inner surface of the package filling groove.

Preferably, the top of the integrated circuit packaging box is provided with a packaging fixing groove, and the top of the integrated circuit packaging box is provided with a limiting rod groove.

Preferably, the packaging fixing groove is communicated with the limiting rod groove, and a packaging solder groove is formed in the top of the packaging fixing groove.

Preferably, the package fixing groove is communicated with the package solder groove, and the top of the package fixing groove is provided with an integrated circuit placing groove.

Preferably, the packaging solder groove is communicated with the integrated circuit placing groove, and the outer surface of the packaging limiting rod is clamped with the inner surface of the limiting rod groove.

Advantageous effects

The utility model provides a packaging cover plate for integrated circuit. Compared with the prior art, the method has the following beneficial effects:

(1) this a packaging cover plate for integrated circuit, there is the encapsulation metal sheet through the bottom of enclosing the bottom apron is fixed, the inner chamber fixedly connected with heat dissipation copper pipe device of encapsulation bottom apron, the outside of encapsulation bottom apron and extending to encapsulation bottom apron is all run through to heat dissipation copper pipe device's front end and rear end, setting through encapsulation metal sheet and heat dissipation copper pipe device, make integrated circuit packaging cover plate when using, can effectively dispel the heat to integrated circuit packaging incasement portion through encapsulation metal sheet cooperation heat dissipation copper pipe device, the thermal diffusivity of integrated circuit packaging cover plate has been improved, avoided the encapsulation metal sheet to receive the restriction of packaging cover plate, the not ideal problem of radiating effect inadequately.

(2) The packaging cover plate for the integrated circuit is characterized in that a packaging metal plate is fixed at the bottom of a packaging bottom cover plate, a packaging limiting rod is fixedly connected at the bottom of the packaging metal plate and positioned around a packaging solder ring, a packaging fixing groove is formed in the top of an integrated circuit packaging box, a limiting rod groove is formed in the top of the integrated circuit packaging box, and the packaging limiting rod and the limiting rod groove are arranged, so that when the integrated circuit packaging cover plate is packaged, the packaging limiting rod can be matched with the limiting rod groove to effectively limit the welding package between the integrated circuit packaging box and the integrated circuit packaging cover plate, the sealing performance of the integrated circuit packaging box is guaranteed, the packaging fixing groove of the packaging box is prevented from being packaged by the packaging cover plate to cause deviation easily, and the packaging solder ring cannot be accurately welded with the packaging solder groove after being melted, the integrated circuit packaging box is easy to have a gap problem.

Drawings

Fig. 1 is a perspective view of the external structure of the present invention;

FIG. 2 is a perspective view of the bottom cover plate structure of the present invention;

fig. 3 is a perspective view of the explosion structure of the present invention.

FIG. 1 shows an integrated circuit package; 2. an integrated circuit package cover plate; 3. packaging the top cover plate; 4. packaging the bottom cover plate; 5. packaging the metal plate; 6. packaging the limiting rod; 7. packaging the solder ring; 8. a heat dissipating copper tube device; 9. packaging the solder bumps; 10. packaging and filling the groove; 11. packaging the fixed groove; 12. a limiting rod groove; 13. packaging a solder groove; 14. an integrated circuit placing groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a package cover plate for an integrated circuit comprises an integrated circuit package box 1, the top of the integrated circuit package box 1 is fixedly connected with an integrated circuit package cover plate 2, the integrated circuit package cover plate 2 comprises a package top cover plate 3, the bottom of the package top cover plate 3 is fixedly connected with a package bottom cover plate 4, the bottom of the package bottom cover plate 4 is fixedly provided with a package metal plate 5, the bottom of the package metal plate 5 is fixedly connected with a package solder ring 7, the bottom of the package metal plate 5 and the periphery of the package solder ring 7 are fixedly connected with package limiting rods 6, the bottom of the package top cover plate 3 is fixedly connected with a package solder lug 9, the inner cavity of the package bottom cover plate 4 is fixedly connected with a heat dissipation copper pipe device 8, the heat dissipation copper pipe device 8 effectively absorbs heat conducted by the package metal plate 5 and dissipates heat, the front end and the rear end of the heat dissipation copper pipe device 8 both penetrate through the package bottom cover plate 4 and extend to the outside of the package bottom cover, the top of encapsulation bottom apron 4 is run through and has been seted up encapsulation and fill recess 10, the surface of encapsulation solder lug 9 and the internal surface welding of encapsulation and filling recess 10, encapsulation fixed slot 11 has been seted up at the top of integrated circuit encapsulation case 1, gag lever post recess 12 has been seted up at the top of integrated circuit encapsulation case 1, intercommunication between encapsulation fixed slot 11 and the gag lever post recess 12, encapsulation solder groove 13 has been seted up at the top of encapsulation fixed slot 11, intercommunication between encapsulation fixed slot 11 and the encapsulation solder groove 13, integrated circuit standing groove 14 has been seted up at the top of encapsulation fixed slot 11, intercommunication between encapsulation solder groove 13 and the integrated circuit standing groove 14, the surface of encapsulation gag lever post 6 and the internal surface joint of gag lever post recess 12.

And those not described in detail in this specification are well within the skill of those in the art.

During operation, at first, the user places integrated circuit in integrated circuit standing groove 14, place encapsulation bottom apron 4 in integrated circuit standing groove 14 top again, encapsulation gag lever post 6 carries out spacing joint with gag lever post recess 12, the user welds with encapsulation solder groove 13 through encapsulation solder circle 7 after the melting again, weld between encapsulation metal sheet 5 and the encapsulation fixed slot 11, the user carries out chip processing with integrated circuit through encapsulation filling recess 10 again, after processing, the user welds encapsulation top apron 3 through encapsulation solder lug 9 after encapsulation filling recess 10 cooperation melting again, accomplish the closing cap of integrated circuit encapsulation apron 2 to integrated circuit encapsulation case 1 from here, 8 cooperation encapsulation metal sheets 5 of heat dissipation copper pipe device can effectively dispel the heat to integrated circuit encapsulation case 1 inside.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A package cover plate for an integrated circuit, comprising an integrated circuit package box (1), the top of the integrated circuit package box (1) is fixedly connected with an integrated circuit package cover plate (2), characterized in that: integrated circuit encapsulation apron (2) are including encapsulation top apron (3), the bottom fixedly connected with encapsulation bottom apron (4) of encapsulation top apron (3), the bottom of encapsulation bottom apron (4) is fixed to have encapsulation metal sheet (5), the bottom fixedly connected with encapsulation solder circle (7) of encapsulation metal sheet (5), the bottom of encapsulation metal sheet (5) just is located all around equal fixedly connected with encapsulation gag lever post (6) of encapsulation solder circle (7), the bottom fixedly connected with encapsulation solder lug (9) of encapsulation top apron (3).

2. The package cover plate for an integrated circuit of claim 1, wherein: the inner cavity of the packaging bottom cover plate (4) is fixedly connected with a heat dissipation copper pipe device (8), and the front end and the rear end of the heat dissipation copper pipe device (8) penetrate through the packaging bottom cover plate (4) and extend to the outside of the packaging bottom cover plate (4).

3. The package cover plate for an integrated circuit of claim 1, wherein: and a packaging filling groove (10) is formed in the top of the packaging bottom cover plate (4) in a penetrating manner, and the outer surface of the packaging solder bump (9) is welded with the inner surface of the packaging filling groove (10).

4. The package cover plate for an integrated circuit of claim 1, wherein: the top of the integrated circuit packaging box (1) is provided with a packaging fixing groove (11), and the top of the integrated circuit packaging box (1) is provided with a limiting rod groove (12).

5. The package cover plate for an integrated circuit of claim 4, wherein: the packaging fixing groove (11) is communicated with the limiting rod groove (12), and a packaging solder groove (13) is formed in the top of the packaging fixing groove (11).

6. The package cover plate for an integrated circuit of claim 5, wherein: the packaging fixing groove (11) is communicated with the packaging solder groove (13), and the top of the packaging fixing groove (11) is provided with an integrated circuit placing groove (14).

7. The package cover plate for an integrated circuit of claim 5, wherein: the packaging solder groove (13) is communicated with the integrated circuit placing groove (14), and the outer surface of the packaging limiting rod (6) is clamped with the inner surface of the limiting rod groove (12).