CN211654796U - Heterojunction solar energy silicon chip heating clamping device - Google Patents
Heterojunction solar energy silicon chip heating clamping device Download PDFInfo
- Publication number
- CN211654796U CN211654796U CN202020410736.7U CN202020410736U CN211654796U CN 211654796 U CN211654796 U CN 211654796U CN 202020410736 U CN202020410736 U CN 202020410736U CN 211654796 U CN211654796 U CN 211654796U
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- Prior art keywords
- clamping
- spring
- connecting rod
- clamping frame
- strip
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 41
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 38
- 239000010703 silicon Substances 0.000 title claims abstract description 38
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 2
- 238000002161 passivation Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 26
- 229910021417 amorphous silicon Inorganic materials 0.000 description 7
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 238000010248 power generation Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses a heterojunction solar silicon wafer heating and clamping device, which adopts the technical proposal that the device comprises a clamping frame; two oppositely arranged clamping strips are arranged in the clamping frame; the clamping strip is abutted with the clamping frame through a spring, so that the relative position of the clamping strip in the clamping frame is changed; the clamping strip is provided with a limiting groove; the limiting groove limits the solar silicon wafer; t-shaped blocks are arranged at two ends of the clamping strip; t-shaped grooves matched with the T-shaped blocks are formed in the two sides of the clamping frame; a through hole is formed in one side of the clamping frame opposite to the clamping strip; the clamping strip is provided with a connecting rod; the spring is sleeved on the connecting rod; the connecting rod is provided with threads; the connecting rod is in interference fit with the through hole; the connecting rod penetrates through the through hole and then is in threaded connection with the nut; the utility model discloses have convenient centre gripping, be heated evenly to guarantee the beneficial effect that passivation effect promoted.
Description
Technical Field
The utility model relates to a solar energy silicon chip clamping device, more specifically say that it relates to a heterojunction solar energy silicon chip heating clamping device.
Background
With the development of solar cell technology, the development of high-efficiency cells is more and more emphasized; among them, a silicon-based heterojunction solar cell (HJT cell) passivated with an amorphous silicon intrinsic layer (a-Si: h (i)) is one of the major research directions. In the prior art, the mass production efficiency of the ultra-high efficiency heterojunction cell reaches 22.27%, and the mass production front power of 60 double-sided assemblies reaches 332.6W through tests. Due to the characteristic of double-sided power generation, under the scenes of grasslands, cement grounds, snowfields, reflective cloth and the like, the back of the module can generate 10% -30% of extra power generation, the power temperature coefficient is as low as-0.27%/DEG C, and compared with a common polycrystalline module, the heterojunction module can recover 34% of power generation loss at the working temperature of 75 ℃.
However, since the heterojunction solar cell device heats the silicon wafer directly by using the resistance wire in the manufacturing process, the heating is not uniform in the manufacturing process, and the amorphous silicon has defects, so that the efficiency is difficult to further improve, and therefore, how to break through the prior art to further improve the mass production efficiency of the HJT cell can further accelerate the large-area industrialization process of the HJT cell.
At present, chinese patent No. CN210136850U discloses a heating device for a heterojunction solar cell apparatus, which includes a silicon wafer carrier for carrying a silicon wafer, an upper heating device located above the silicon wafer carrier, and a lower heating device located below the silicon wafer carrier, wherein the upper heating device and the lower heating device are arranged in parallel in front of or behind the heterojunction solar cell apparatus, lamps are arranged on the upper heating device and the lower heating device, and the lamps of the upper heating device and the lamps of the lower heating device are arranged oppositely and can respectively perform illumination heating on the upper surface and the lower surface of the silicon wafer. In practical use, the silicon wafer carrier of the heating device is not disclosed, and when heating is needed, the common plane carrier is difficult to ensure uniform heating.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model provides a heterojunction solar energy silicon chip heating clamping device has convenient centre gripping, is heated evenly to guarantee the beneficial effect that passivation effect promotes.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a heterojunction solar energy silicon chip heating clamping device which characterized in that: comprises a clamping frame; two oppositely arranged clamping strips are arranged in the clamping frame; the clamping strip is abutted with the clamping frame through a spring, so that the relative position of the clamping strip in the clamping frame is changed; the clamping strip is provided with a limiting groove; the limiting groove limits the solar silicon wafer; t-shaped blocks are arranged at two ends of the clamping strip; and T-shaped grooves matched with the T-shaped blocks are formed in two sides of the clamping frame.
Through the above setting, when heating the solar wafer of centre gripping between two centre gripping strips through last heating device and lower heating device, because the centre gripping strip can change its relative do in the centre gripping frame, and the spring can carry out the elastic response to it, thereby have elastic centre gripping case, thereby adapt to the solar wafer of different width, and because the solar wafer sets up at spacing inslot, the centre gripping strip only shelters from the edge of solar wafer, therefore, can guarantee to be heated evenly, thereby the restoration of amorphous silicon defect has been strengthened, the effect of passivation reinforcing has been reached, thereby further improve heterojunction solar cell's conversion efficiency.
The utility model discloses further set up to: a spring is arranged in the T-shaped groove; the spring is limited by the T-shaped groove; one end of the spring is abutted against the T-shaped block, and the other end of the spring is abutted against the clamping frame on the end face of the T-shaped groove.
Through the arrangement, the spring is arranged in the T-shaped groove and is extruded to the clamping strip, the clamping capacity of the clamping strip on the solar silicon wafer is guaranteed, and the T-shaped groove can limit the spring.
The utility model discloses further set up to: a through hole is formed in one side of the clamping frame opposite to the clamping strip; the clamping strip is provided with a connecting rod; the spring is sleeved on the connecting rod; one end of the spring is abutted against the clamping strip, and the other end of the spring is abutted against one surface of the clamping frame opposite to the clamping strip.
The utility model discloses further set up to: the connecting rod is provided with threads; the connecting rod is in interference fit with the through hole; the connecting rod penetrates through the through hole and then is in threaded connection with the nut.
Through the setting, the centre gripping strip does not carry out elasticity through the spring in the T type recess and resumes and maintain the centre gripping, power, but through the connecting rod, the spring on the connecting rod provides extrusion and clamping-force, utilizes nut threaded connection to carry on spacingly simultaneously, and too big extrusion force to the solar wafer can be avoided to such mode to lead to the fact destruction to the silicon chip.
The utility model discloses further set up to: the side edge of the clamping frame is also provided with an inserting rod; the insertion rod is provided with an insertion hole; the plug-in rod can be in transitional plug-in connection with an output shaft of the motor under the condition of heating the solar silicon wafer.
The utility model discloses further set up to: and a high-temperature-resistant antirust coating is also arranged in the limiting groove.
Through the arrangement, the insertion rod can be connected with the output shaft of the motor, so that the clamping frame is driven to rotate, and the clamping frame is heated by the heating device in the rotating process, so that the clamping frame is heated uniformly, certainly, the clamping frame can not be connected with the motor and is connected with other common fixing rods, and fixed heating is realized.
To sum up, the utility model discloses following beneficial effect has: in the actual use process, the solar silicon wafers with different widths can be clamped through the clamping strips, and the clamped parts are positioned on two sides of the solar energy, so that the solar silicon wafers can be uniformly heated, the repair of amorphous silicon defects is enhanced, the passivation enhancing effect is achieved, and the conversion efficiency of the heterojunction solar cell is further improved; and this simple structure is practical, can place a plurality of solar energy silicon chips between the centre gripping strip and heat, has efficient characteristics.
Drawings
FIG. 1 is a schematic structural diagram of this embodiment 1;
FIG. 2 is a schematic structural diagram of the present embodiment 1;
FIG. 3 is a schematic structural diagram of the present embodiment 2;
FIG. 4 is a schematic structural diagram of the present embodiment 2;
fig. 5 is a schematic cross-sectional structure diagram of the holding strip of the present embodiment.
Reference numerals: 1. a clamping frame; 2. a clamping bar; 3. a spring; 4. a limiting groove; 5. a T-shaped block; 6. a T-shaped groove; 7. a connecting rod; 8. a nut; 9. a plug rod; 10. inserting holes; 11. high temperature resistant antirust coating.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The embodiment discloses a heterojunction solar energy silicon chip heating clamping device, as shown in fig. 1-5, has convenient centre gripping, is heated evenly to guarantee the beneficial effect that passivation effect promotes. Comprises a clamping frame 1; two oppositely arranged clamping strips 2 are arranged in the clamping frame 1; the clamping strip 2 is abutted with the clamping frame 1 through a spring 3, so that the relative position of the clamping strip 2 in the clamping frame 1 is changed; the clamping strip 2 is provided with a limiting groove 4; the limiting groove 4 limits the solar silicon wafer; the two ends of the clamping strip 2 are provided with T-shaped blocks 5; and T-shaped grooves 6 matched with the T-shaped blocks 5 are formed in the two sides of the clamping frame 1.
Through the above setting, when heating the solar wafer of centre gripping between two centre gripping strips 2 through last heating device and lower heating device, because centre gripping strip 2 can change its relative do in centre gripping frame 1, and spring 3 can carry out the elastic response to it, thereby have elastic centre gripping case, thereby adapt to the solar wafer of different width, and because solar wafer sets up in spacing groove 4, centre gripping strip 2 only shelters from the edge of solar wafer, therefore, can guarantee to be heated evenly, thereby the restoration of amorphous silicon defect has been strengthened, the effect of passivation reinforcing has been reached, thereby further improve heterojunction solar cell's conversion efficiency.
Example one
A spring 3 is arranged in the T-shaped groove 6; the spring 3 is limited by a T-shaped groove 6; one end of the spring 3 is abutted with the T-shaped block 5, and the other end of the spring is abutted with the clamping frame 1 on the end face of the T-shaped groove 6.
Through the setting, the spring 3 is arranged in the T-shaped groove 6, the spring 3 extrudes the clamping strip 2, the clamping capacity of the clamping strip 2 on the solar silicon wafer is guaranteed, and the T-shaped groove 6 can limit the spring 3.
Example two
A through hole is formed in one side of the clamping frame 1 opposite to the clamping strip 2; the clamping strip 2 is provided with a connecting rod 7; the spring 3 is sleeved on the connecting rod 7; and one end of the spring 3 is abutted against the clamping strip 2, and the other end of the spring is abutted against one surface of the clamping frame 1 opposite to the clamping strip 2. The connecting rod 7 is provided with threads; the connecting rod 7 is in interference fit with the through hole; the connecting rod 7 penetrates through the through hole and then is in threaded connection with the nut 8.
Through the setting, the centre gripping strip 2 does not carry out elasticity through spring 3 in the T type recess 6 and resumes and maintain the centre gripping, power, but through connecting rod 7, spring 3 on the connecting rod 7 provides extrusion and clamping-force, utilizes 8 threaded connection of nut to carry on spacingly simultaneously, and too big extrusion force to the solar energy silicon chip can be avoided to such mode to lead to the fact destruction to the silicon chip.
The side edge of the clamping frame 1 is also provided with an inserting rod 9; the insertion rod 9 is provided with an insertion hole 10; the plug-in rod 9 can be in transition plug-in connection with an output shaft of the motor under the condition of heating the solar silicon wafer. And a high-temperature-resistant antirust coating 11 is also arranged in the limiting groove 4.
Through the arrangement, the inserting rod 9 can be connected with the output shaft of the motor, so that the clamping frame 1 is driven to rotate, and is heated by the heating device in the rotating process, so that the heating is uniform, and the inserting rod can be connected with other common fixing rods without being connected with the motor, so that the fixed heating is realized.
In the actual use process, the solar silicon wafers with different widths can be clamped through the clamping strips 2, and the clamped parts are positioned on two sides of the solar energy, so that the solar silicon wafers can be uniformly heated, the repair of amorphous silicon defects is enhanced, the passivation enhancing effect is achieved, and the conversion efficiency of the heterojunction solar cell is further improved; and this simple structure is practical, can place a plurality of solar energy silicon chips between centre gripping strip 2 and heat, has efficient characteristics.
The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, any modification, equivalent replacement, or improvement made within the design concept of the present invention should be included within the protection scope of the present invention.
Claims (6)
1. The utility model provides a heterojunction solar energy silicon chip heating clamping device which characterized in that: comprises a clamping frame (1); two oppositely arranged clamping strips (2) are arranged in the clamping frame (1); the clamping strip (2) is abutted against the clamping frame (1) through a spring (3), so that the relative position of the clamping strip (2) in the clamping frame (1) is changed; a limiting groove (4) is formed in the clamping strip (2); the limiting groove (4) limits the solar silicon wafer; t-shaped blocks (5) are arranged at two ends of the clamping strip (2); and T-shaped grooves (6) matched with the T-shaped blocks (5) are formed in the two sides of the clamping frame (1).
2. The heterojunction solar silicon wafer heating clamping device of claim 1, wherein: a spring (3) is arranged in the T-shaped groove (6); the spring (3) is limited by the T-shaped groove (6); one end of the spring (3) is abutted with the T-shaped block (5), and the other end of the spring is abutted with the clamping frame (1) on the end face of the T-shaped groove (6).
3. The heterojunction solar silicon wafer heating clamping device of claim 1, wherein: a through hole is formed in one side, opposite to the clamping strip (2), of the clamping frame (1); the clamping strip (2) is provided with a connecting rod (7); the spring (3) is sleeved on the connecting rod (7); one end of the spring (3) is abutted with the clamping strip (2), and the other end of the spring is abutted with one surface of the clamping frame (1) opposite to the clamping strip (2).
4. The heterojunction solar silicon wafer heating clamping device of claim 3, wherein: the connecting rod (7) is provided with threads; the connecting rod (7) is in interference fit with the through hole; the connecting rod (7) penetrates through the through hole and then is in threaded connection with the nut (8).
5. The heterojunction solar silicon wafer heating clamping device of claim 2 or 4, wherein: the side edge of the clamping frame (1) is also provided with an inserting rod (9); the insertion rod (9) is provided with an insertion hole (10); the plug-in rod (9) can be in transition plug-in connection with an output shaft of the motor under the condition of heating the solar silicon wafer.
6. The heterojunction solar silicon wafer heating clamping device of claim 5, wherein: and a high-temperature-resistant antirust coating (11) is also arranged in the limiting groove (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020410736.7U CN211654796U (en) | 2020-03-26 | 2020-03-26 | Heterojunction solar energy silicon chip heating clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020410736.7U CN211654796U (en) | 2020-03-26 | 2020-03-26 | Heterojunction solar energy silicon chip heating clamping device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211654796U true CN211654796U (en) | 2020-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020410736.7U Expired - Fee Related CN211654796U (en) | 2020-03-26 | 2020-03-26 | Heterojunction solar energy silicon chip heating clamping device |
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| Country | Link |
|---|---|
| CN (1) | CN211654796U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113370243A (en) * | 2021-06-30 | 2021-09-10 | 浙江天能动力能源有限公司 | Mechanical arm clamping device for storage battery and control system |
-
2020
- 2020-03-26 CN CN202020410736.7U patent/CN211654796U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113370243A (en) * | 2021-06-30 | 2021-09-10 | 浙江天能动力能源有限公司 | Mechanical arm clamping device for storage battery and control system |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201009 |