CN211640024U

CN211640024U - Semiconductor board slitting device

Info

Publication number: CN211640024U
Application number: CN202020079315.0U
Authority: CN
Inventors: 林明生
Original assignee: Shenzhen Longjing Micro Electronics Co ltd
Current assignee: Shenzhen Longjing Micro Electronics Co ltd
Priority date: 2020-01-15
Filing date: 2020-01-15
Publication date: 2020-10-09
Anticipated expiration: 2030-01-15

Abstract

The utility model relates to the technical field of semiconductors, in particular to a semiconductor board slitting device which can precisely cut a semiconductor board, saves time and labor, improves the working efficiency, has smooth cutting section, is convenient to install and cooperate and improves the practicability; the automatic welding machine comprises a workbench, a fixed baffle, a top beam, a cylinder and a piston, wherein four corners of the bottom end of the workbench are respectively provided with supporting legs, the fixed baffle is positioned at the left part of the top end of the workbench, the top end of the workbench is provided with two parallel T-shaped grooves, two groups of stand columns are connected with the workbench through a transmission device, two ends of the top beam are respectively connected with the inner sides of the two groups of stand columns, the top end of the cylinder is connected with the bottom end of the top beam through a moving device, the cylinder is connected with an air pump, the bottom end of the cylinder is.

Description

Semiconductor board slitting device

Technical Field

The utility model relates to a technical field of semiconductor especially relates to a device is cut to semiconductor board.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power conversion, and the like. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications. A cutting process is involved in the production process of a semiconductor, and in the traditional cutting process of a semiconductor board, the cutting process is complex due to the fact that the area of the semiconductor board is small, the cutting section is irregular, the matching performance is poor when the semiconductor board is installed in the later period, and the practicability is low.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a can carry out accurate cutting to the semiconductor board, labour saving and time saving improves work efficiency, and the cutting section is leveled, and the semiconductor board that is convenient for install the cooperation, has improved the practicality cuts the device.

The utility model discloses a device is cut to semiconductor board, comprises a workbench, fixed stop, sliding baffle, the nut, the stand, the back timber, cylinder and piston, workstation bottom four corners is provided with the supporting leg respectively, fixed stop is located workstation top left part, the workstation top is provided with the T type groove of two parallels, sliding baffle places with T type groove is perpendicular, the sliding baffle top is provided with the through-hole, T type bolt has been placed in the T type groove, sliding baffle is passed on T type bolt top and nut cooperation is connected, two sets of stands pass through transmission and are connected with the workstation, the back timber both ends are connected with two sets of stands inboardly respectively, the cylinder top is connected with the back timber bottom through mobile device, the cylinder is connected with the air pump, cylinder bottom and piston top sliding connection, the piston bottom is provided with the soldered connection, the soldered connection is.

The utility model discloses a device is cut to semiconductor board, wherein transmission includes first lead screw, the second sprocket, chain and first motor, the workstation both ends are provided with two sets of curb plates respectively, install first lead screw between per two sets of curb plates, first lead screw both ends respectively with two sets of inboard rotatable coupling of curb plates, the stand bottom is connected with first lead screw cooperation, be provided with first sprocket on the first lead screw of every group, the workstation bottom is provided with two sets of risers, second sprocket both ends are connected two sets of first sprockets and second sprocket respectively with two sets of inboard rotatable coupling chains of riser, first motor left end is connected with the riser right-hand member, first motor right-hand member is connected with the power, first motor left part output passes the riser and is connected with second sprocket right-hand member.

The utility model discloses a device is cut to semiconductor board, wherein the mobile device includes second lead screw, second motor and derailleur, and the back timber bottom is provided with the lead screw groove, and the second lead screw is located the lead screw inslot, and the cylinder top is connected with second lead screw cooperation, and the second motor is connected with the power, and second motor right part output is connected with derailleur left part input, and the derailleur right-hand member is connected with the stand left end, and derailleur right part output passes stand and back timber and is connected with second lead screw left end.

The utility model discloses a device is cut to semiconductor board, the supporting leg bottom is provided with the multiunit truckle, and the truckle top is connected with the supporting leg bottom, truckle bottom and ground relative slip.

The utility model discloses a device is cut to semiconductor board, the truckle right-hand member is provided with the locking plate, locking plate left end and truckle right-hand member rotatable coupling pull the locking plate and can lock the truckle, prevent that it from taking place relative slip with ground.

The utility model discloses a device is cut to semiconductor board is provided with the stiffening beam between per two sets of supporting legs, and the stiffening beam both ends are connected with two sets of curb plates inboards respectively, and the stand can be on the stiffening beam horizontal slip.

The utility model discloses a device is cut to semiconductor board, the workstation left end is provided with the handle, and the handle right-hand member is connected with the workstation left end.

The utility model discloses a device is cut to semiconductor board is provided with the handle cover on hand, and the handle cover suit is on hand.

Compared with the prior art, the beneficial effects of the utility model are that: the semiconductor board cutting device comprises a worktable top, a semiconductor board left end, a fixed baffle right end, a sliding baffle left end, a sliding baffle right end, a nut, a transmission device, a cylinder, a piston, a welding head and a cylinder.

Drawings

Fig. 1 is a schematic front view of the present invention;

fig. 2 is a left side view structure diagram of the present invention;

fig. 3 is a schematic top view of the present invention;

FIG. 4 is a schematic view of the transmission of the present invention;

fig. 5 is a schematic structural diagram of the mobile device of the present invention;

in the drawings, the reference numbers: 1. a work table; 2. supporting legs; 3. fixing a baffle plate; 4. a T-shaped groove; 5. a sliding baffle; 6. a nut; 7. a column; 8. a top beam; 9. a cylinder; 10. a piston; 11. welding a head; 12. a side plate; 13. a first lead screw; 14. a first sprocket; 15. a vertical plate; 16. a second sprocket; 17. a chain; 18. a first motor; 19. a second lead screw; 20. a second motor; 21. a transmission; 22. a caster wheel; 23. a locking plate; 24. a reinforcing beam; 25. a handle; 26. a handle sleeve.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

As shown in figures 1 to 5, the semiconductor board cutting device of the utility model comprises a workbench 1, a fixed baffle 3, a sliding baffle 5, a nut 6, upright posts 7, a top beam 8, a cylinder 9 and a piston 10, wherein four corners of the bottom end of the workbench 1 are respectively provided with a supporting leg 2, the fixed baffle 3 is positioned at the left part of the top end of the workbench 1, the top end of the workbench 1 is provided with two parallel T-shaped grooves 4, the sliding baffle 5 is vertically arranged with the T-shaped grooves 4, the top end of the sliding baffle 5 is provided with a through hole, T-shaped bolts are arranged in the T-shaped grooves 4, the top ends of the T-shaped bolts pass through the sliding baffle 5 and are matched and connected with the nut 6, the two groups of upright posts 7 are connected with the workbench 1 through a transmission device, two ends of the top beam 8 are respectively connected with the inner sides of the two groups of upright posts 7, the top end of, the bottom end of the piston 10 is provided with a welding head 11, and the welding head 11 is connected with a welding device; place the semiconductor board on 1 top of workstation, the contact of semiconductor board left end and 3 right-hand members of fixed stop, slip slide damper 5 makes 5 left ends of slide damper and semiconductor board right-hand member contact, it is fixed with slide damper 5 to twist nut 6, later make two sets of stand 7 synchronous motion through transmission, drive soldered connection 11 and remove, later start cylinder 9, piston 10 drives soldered connection 11 and reciprocates, cut the semiconductor board, through setting up above device, can carry out accurate cutting to the semiconductor board, time saving and labor saving, and the work efficiency is improved, the cutting section is level and smooth, be convenient for the installation cooperation, and the practicability is improved.

The utility model discloses a semiconductor board cutting device, wherein transmission includes first lead screw 13, second sprocket 16, chain 17 and first motor 18, workstation 1 both ends are provided with two sets of curb plates 12 respectively, install first lead screw 13 between every two sets of curb plates 12, first lead screw 13 both ends respectively with two sets of curb plates 12 inboard rotatable coupling, stand 7 bottom and first lead screw 13 cooperation are connected, be provided with first sprocket 14 on every set of first lead screw 13, workstation 1 bottom is provided with two sets of risers 15, second sprocket 16 both ends respectively with two sets of risers 15 inboard rotatable coupling chains 17 respectively with two sets of risers 14 with second sprocket 16 be connected, first motor 18 left end is connected with riser 15 right-hand member, first motor 18 right-hand member is connected with the power, first motor 18 left part output passes riser 15 and is connected with second sprocket 16 right-hand member; the first motor 18 is powered on to drive the second chain wheel 16 to rotate, and the two groups of first lead screws 13 are driven to synchronously rotate through the two groups of chains 17, so that the two groups of stand columns 7 can stably and synchronously move, and the practicability is improved.

The utility model discloses a semiconductor board cutting device, wherein the mobile device includes second lead screw 19, second motor 20 and derailleur 21, 8 bottom ends of back timber are provided with the lead screw groove, second lead screw 19 is located the lead screw groove, 9 tops of cylinders are connected with second lead screw 19 cooperation, second motor 20 is connected with the power, 20 right part output ends of second motor are connected with 21 left part input ends of derailleur, 21 right-hand member is connected with 7 left ends of upright posts, 21 right part output ends of derailleur pass upright posts 7 and back timber 8 and are connected with 19 left ends of second lead screw; the second motor 20 is started, the right end of the second motor 20 outputs power, and the second lead screw 19 is driven to rotate through the speed changer 21, so that the air cylinder 9 is moved left and right, and the practicability is improved.

The semiconductor board cutting device of the utility model is characterized in that a plurality of groups of trundles 22 are arranged at the bottom ends of supporting legs 2, the top ends of the trundles 22 are connected with the bottom ends of the supporting legs 2, and the bottom ends of the trundles 22 slide relative to the ground; by providing the caster 22, the operator can easily move the device, improving convenience.

In the semiconductor board slitting device of the utility model, the right end of the caster 22 is provided with the locking plate 23, the left end of the locking plate 23 is rotatably connected with the right end of the caster 22, and the caster 22 can be locked by pulling the locking plate 23 to prevent relative sliding with the ground; when the device runs, the caster 22 easily slides relative to the ground, and the locking plate 23 is arranged to lock the caster 22 by pulling the locking plate 23, so that the caster is prevented from sliding relative to the ground, and the stability is improved.

In the semiconductor board slitting device of the utility model, the stiffening beam 24 is arranged between every two groups of supporting legs 2, the two ends of the stiffening beam 24 are respectively connected with the inner sides of the two groups of side plates 12, and the upright post 7 can slide left and right on the stiffening beam 24; through setting up stiffening beam 24, can provide the holding power for stand 7, reduce the pressure that first lead screw 13 received, prolong first lead screw 13 life, improve the practicality.

The utility model discloses a semiconductor board slitting device, the left end of a workbench 1 is provided with a handle 25, and the right end of the handle 25 is connected with the left end of the workbench 1; through setting up handle 25, operating personnel can hold handle 25 thrust unit, has improved the practicality.

In the semiconductor board slitting device of the utility model, the handle 25 is provided with the handle sleeve 26, and the handle sleeve 26 is sleeved on the handle 25; through set up handle cover 26 on handle 25, can increase the frictional force of operating personnel hand and handle 25, the thrust unit of being convenient for has improved the practicality.

The utility model discloses a semiconductor board cutting device, it is at work, at first operating personnel holds handle 25 and pushes away the device to the work area, later pull locking plate 23 and lock truckle 22, then place the semiconductor board on workstation 1 top, the semiconductor board left end contacts with fixed stop 3 right-hand member, slide stop 5 makes slide stop 5 left end and semiconductor board right-hand member contact, twist nut 6 fixes slide stop 5, later put through the power with first motor 18, drive second sprocket 16 and rotate, drive two sets of first lead screw 13 synchronous rotation through two sets of chains 17, make two sets of stand 7 synchronous movement, drive soldered connection 11 and move, later start cylinder 9, piston 10 drives soldered connection 11 and reciprocates, then start second motor 20, second motor 20 right-hand member output power, drive second lead screw 19 through derailleur 21 and rotate, thereby make cylinder 9 move, and cutting the semiconductor plate.

The semiconductor board slitting device of the utility model has the advantages that the installation mode, the connection mode or the arrangement mode are common mechanical modes, and the semiconductor board slitting device can be implemented as long as the beneficial effects can be achieved; the utility model discloses a welding set, motor, derailleur and the cylinder of device are cut to semiconductor board for purchase on the market, and this industry technical staff only need according to its subsidiary operating specification install and operate can.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. A semiconductor board cutting device is characterized by comprising a workbench (1), fixed baffles (3), sliding baffles (5), nuts (6), upright posts (7), top beams (8), cylinders (9) and pistons (10), wherein supporting legs (2) are respectively arranged at four corners of the bottom end of the workbench (1), the fixed baffles (3) are positioned at the left part of the top end of the workbench (1), two parallel T-shaped grooves (4) are formed in the top end of the workbench (1), the sliding baffles (5) are vertically arranged with the T-shaped grooves (4), through holes are formed in the top ends of the sliding baffles (5), T-shaped bolts are arranged in the T-shaped grooves (4), the top ends of the T-shaped bolts penetrate through the sliding baffles (5) to be connected with the nuts (6) in a matched manner, the two groups of upright posts (7) are connected with the workbench (1) through a transmission device, and two ends of the top beams (8) are respectively, the top end of the air cylinder (9) is connected with the bottom end of the top beam (8) through a moving device, the air cylinder (9) is connected with an air pump, the bottom end of the air cylinder (9) is connected with the top end of the piston (10) in a sliding mode, the bottom end of the piston (10) is provided with a welding head (11), and the welding head (11) is connected with a welding device.

2. A semiconductor board slitting device as claimed in claim 1, wherein the transmission device comprises a first lead screw (13), a second sprocket (16), chains (17) and a first motor (18), two ends of the table (1) are respectively provided with two sets of side plates (12), the first lead screw (13) is installed between each two sets of side plates (12), two ends of the first lead screw (13) are respectively rotatably connected with the inner sides of the two sets of side plates (12), the bottom end of the upright column (7) is connected with the first lead screw (13) in a matching manner, the first sprocket (14) is arranged on each set of first lead screw (13), two sets of vertical plates (15) are arranged at the bottom end of the table (1), two ends of the second sprocket (16) are respectively rotatably connected with the inner sides of the two sets of vertical plates (15) by two chains (17) respectively connecting the two sets of first sprockets (14) with the second sprocket (16), the left end of the first motor (18) is connected with the right end of the, the right end of the first motor (18) is connected with a power supply, and the output end of the left part of the first motor (18) penetrates through the vertical plate (15) to be connected with the right end of the second chain wheel (16).

3. A semiconductor board slitting device according to claim 2, wherein the moving device comprises a second lead screw (19), a second motor (20) and a transmission (21), a lead screw groove is formed in the bottom end of the top beam (8), the second lead screw (19) is located in the lead screw groove, the top end of the cylinder (9) is connected with the second lead screw (19) in a matching manner, the second motor (20) is connected with a power supply, the right output end of the second motor (20) is connected with the left input end of the transmission (21), the right end of the transmission (21) is connected with the left end of the upright (7), and the right output end of the transmission (21) penetrates through the upright (7) and the top beam (8) to be connected with the left end of the second lead screw (19).

4. A semiconductor board slitting device as claimed in claim 3, characterized in that a plurality of sets of casters (22) are provided at the bottom ends of the supporting legs (2), the top ends of the casters (22) being connected to the bottom ends of the supporting legs (2), the bottom ends of the casters (22) sliding relative to the ground.

5. A semiconductor board slitting device as claimed in claim 4, characterized in that the right end of the caster (22) is provided with a locking plate (23), the left end of the locking plate (23) is rotatably connected to the right end of the caster (22), and the caster (22) can be locked by pulling the locking plate (23) to prevent relative sliding with the ground.

6. A semiconductor board slitting device as claimed in claim 5, characterized in that a stiffening beam (24) is arranged between each two sets of support legs (2), both ends of the stiffening beam (24) are connected to the inner sides of the two sets of side plates (12) respectively, and the columns (7) can slide left and right on the stiffening beam (24).

7. A semiconductor board slitting device as claimed in claim 6, characterized in that the left end of the table (1) is provided with a handle (25), and the right end of the handle (25) is connected to the left end of the table (1).

8. A semiconductor board dividing and cutting apparatus as claimed in claim 7, wherein the handle (25) is provided with a grip (26), and the grip (26) is fitted around the handle (25).