CN211607117U - Singlechip mounting bracket with heat dissipation function - Google Patents
Singlechip mounting bracket with heat dissipation function Download PDFInfo
- Publication number
- CN211607117U CN211607117U CN201921945193.2U CN201921945193U CN211607117U CN 211607117 U CN211607117 U CN 211607117U CN 201921945193 U CN201921945193 U CN 201921945193U CN 211607117 U CN211607117 U CN 211607117U
- Authority
- CN
- China
- Prior art keywords
- mounting
- heat dissipation
- heating panel
- frame body
- dissipation function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 238000010438 heat treatment Methods 0.000 claims abstract description 20
- 239000004519 grease Substances 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 10
- 240000004282 Grewia occidentalis Species 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003139 buffering Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Abstract
The utility model discloses a singlechip mounting rack with heat dissipation function, which comprises a mounting rack body and a movable rack; the mounting frame comprises a mounting frame body, wherein mounting seats are integrally formed at four corners of the mounting frame body, bolts are vertically mounted at the tops of two sides of the mounting frame body, through holes are symmetrically formed in two sides of a movable frame, the bolts penetrate through the through holes, and the movable frame is mounted above the mounting frame body; the nut is rotatably installed above the bolt, a corrugated heating panel is installed inside the movable frame, and silicone grease is smeared at the bottom of the corrugated heating panel. The utility model discloses a ripple heating panel bottom is in the laminating of singlechip surface, and the silicone grease can improve the heat conduction efficiency of singlechip between ripple heating panel this moment, and the work of can dispelling the heat when heat conduction is put on the ripple heating panel, and ripple heating panel surface is the ripple design, and the area of contact of greatly increased and air improves the radiating efficiency.
Description
Technical Field
The utility model relates to a singlechip mounting bracket technical field specifically is a singlechip mounting bracket with heat dissipation function.
Background
The present single chip microcomputer is an integrated circuit chip, which is a small and perfect microcomputer system formed by integrating the functions of a central processing unit CPU with data processing capacity, a random access memory RAM, a read only memory ROM and the like on a silicon chip by adopting a super-large scale integrated circuit technology, and the single chip microcomputer mounting rack is a rack body for mounting the single chip microcomputer on a circuit board or at a designated position, but the existing single chip microcomputer mounting rack with a heat dissipation function has some defects, for example;
notice that number is CN 207650746U's a singlechip mounting bracket with heat dissipation function, this mounting bracket passes through spring and shock pad and can be held with the singlechip card, not only can fix the singlechip of different models, and can play better buffering and guard action to the singlechip, can adjust bearing and clamp plate through screw rod and solenoid simultaneously to can fix the singlechip at the singlechip inslot portion, make the fixed more firm of singlechip, but this mounting bracket still has following shortcoming:
1. firstly, the heat dissipation efficiency of the device is poor, so that the service life of the single chip microcomputer is shortened;
2. the device has an unsatisfactory fixing effect on a singlechip, is inconvenient to operate and is not beneficial to later-stage disassembly work;
3. the device can not protect the circuit board when being arranged on the circuit board, thereby causing the damage of the circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a singlechip mounting bracket with heat dissipation function has solved the problem that proposes in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a singlechip mounting rack with a heat dissipation function comprises a mounting rack body and a movable rack;
the mounting frame comprises a mounting frame body, wherein mounting seats are integrally formed at four corners of the mounting frame body, bolts are vertically mounted at the tops of two sides of the mounting frame body, through holes are symmetrically formed in two sides of a movable frame, the bolts penetrate through the through holes, and the movable frame is mounted above the mounting frame body;
the nut is rotatably installed above the bolt, a corrugated heating panel is installed inside the movable frame, and silicone grease is smeared at the bottom of the corrugated heating panel.
As an embodiment of the utility model, the inside four corners department fixed mounting of mounting bracket body has the telescopic link, the terminal fixed mounting of telescopic link has the fixation clamp, the spring has been put to the telescopic link outside cover.
As a preferred embodiment of the present invention, the inner wall of the fixing clip is adhered with a non-slip mat.
As a preferred embodiment of the present invention, a rubber pad is adhered to the bottom of the mounting seat.
As an optimized embodiment of the present invention, the mounting hole is longitudinally opened in the mounting seat, and the mounting screw is inserted into the mounting hole.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model relates to a singlechip mounting bracket with heat dissipation function, through ripple heating panel bottom in the laminating of singlechip surface, the silicone grease can improve the heat conduction efficiency of singlechip between ripple heating panel this moment, heat conduction can carry out the work of dispelling the heat when putting on the ripple heating panel, and ripple heating panel surface is the ripple design, the area of contact of greatly increased and air, improve the radiating efficiency, thereby support tight adjustable shelf through the rotatory downstream of nut, ensure that ripple heating panel and singlechip surface closely laminate, avoid becoming flexible.
2. The utility model relates to a singlechip mounting bracket with heat dissipation function can drive the fixation clamp shrink through the flexible of telescopic link and spring, can realize the fixed centre gripping work of equidimension singlechip not this moment, and easy operation is convenient, and it is laborsaving to save trouble, and the flexibility improves greatly.
3. The utility model relates to a singlechip mounting bracket with heat dissipation function can ensure through the rubber pad that the mount pad is located the protection of circuit board when installing on the circuit board, avoids hard thing to cause the damage of circuit board.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic front view of a single chip mounting bracket with a heat dissipation function according to the present invention;
fig. 2 is a schematic top view of the single chip mounting bracket with heat dissipation function according to the present invention;
fig. 3 is a schematic diagram of a formal cross-sectional structure of the movable frame and the corrugated heat dissipating plate of the single chip mounting bracket with a heat dissipating function according to the present invention;
fig. 4 is a schematic view of the downward-looking structure of the adjustable shelf and the corrugated heat dissipating plate of the single chip mounting rack with heat dissipating function of the present invention.
In the figure: 1. a mounting bracket body; 2. a mounting seat; 3. a rubber pad; 4. mounting screws; 5. a bolt; 6. a movable frame; 7. a nut; 8. a corrugated heat dissipation plate; 9. silicone grease; 10. Mounting holes; 11. a telescopic rod; 12. a spring; 13. a fixing clip; 14. a non-slip mat; 15. and (6) perforating.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inner", "outer" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience of description of the present invention and for simplicity of description, but do not indicate or imply that the device or element referred to must have a specific shape or simplified description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly, e.g., as meaning fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the present invention provides a technical solution: a singlechip mounting rack with a heat dissipation function comprises a mounting rack body 1 and a movable rack 6;
the mounting frame comprises a mounting frame body 1, wherein mounting seats 2 are integrally formed at four corners of the mounting frame body 1, bolts 5 are vertically mounted at the tops of two sides of the mounting frame body 1, through holes 15 are symmetrically formed in two sides of a movable frame 6, the bolts 5 penetrate through the through holes 15, and the movable frame 6 is mounted above the mounting frame body 1;
the nut 7 is rotatably installed above the bolt 5, the corrugated heat dissipation plate 8 is installed inside the movable frame 6, and the bottom of the corrugated heat dissipation plate 8 is coated with silicone grease 9.
In this embodiment (please refer to fig. 1 and 2, fig. 3 and 4), the bottom of the corrugated heat dissipation plate 8 is attached to the surface of the single chip microcomputer, at this time, the silicone grease 9 can improve the heat conduction efficiency between the single chip microcomputer and the corrugated heat dissipation plate 8, the heat conduction can be performed when the heat conduction is placed on the corrugated heat dissipation plate 8, and the surface of the corrugated heat dissipation plate 8 is corrugated, so that the contact area with the air is greatly increased, the heat dissipation efficiency is improved, and the nut 7 rotates to move downwards to tightly support the movable frame 6, thereby ensuring that the corrugated heat dissipation plate 8 is tightly attached to the surface of the single chip microcomputer, and.
Wherein, 1 inside four corners department fixed mounting of mounting bracket body has telescopic link 11, 11 terminal fixed mounting of telescopic link has fixation clamp 13, spring 12 has been put to the 11 outside covers of telescopic link.
In this embodiment (please refer to fig. 2), the fixing clamp 13 can be driven to contract by the expansion of the expansion rod 11 and the spring 12, so that the fixing and clamping work of the singlechips with different sizes can be realized, the operation is simple and convenient, the trouble and the labor are saved, and the flexibility is greatly improved.
Wherein, the inner wall of the fixing clip 13 is stuck with a non-slip mat 14.
In this embodiment (see fig. 2), the anti-slip pad 14 can increase the friction force to make the clamping more stable and prevent the falling.
Wherein, a rubber pad 3 is pasted at the bottom of the mounting seat 2.
In this embodiment (see fig. 1), the rubber pad 3 can protect the circuit board when the mounting base 2 is mounted on the circuit board, so as to prevent the circuit board from being damaged by hard objects.
Mounting holes 10 are longitudinally formed in the mounting base 2, and mounting screws 4 are inserted into the mounting holes 10.
In this embodiment (please refer to fig. 1 and fig. 2), the mounting screws 4 penetrate through the mounting holes 10 to fix the mounting bracket body 1.
The utility model relates to a singlechip mounting rack with heat dissipation function, which comprises a mounting rack body 1; 2. a mounting seat; 3. a rubber pad; 4. mounting screws; 5. a bolt; 6. a movable frame; 7. a nut; 8. a corrugated heat dissipation plate; 9. silicone grease; 10. mounting holes; 11. a telescopic rod; 12. a spring; 13. a fixing clip; 14. a non-slip mat; 15. the components are universal standard components or components known by technicians in the field, the structure and the principle of the components are known by technicians through technical manuals or conventional experimental methods, when in use, the single chip microcomputer is firstly placed in the fixing clamp 13, the fixing clamp 13 can be driven to contract through the expansion of the expansion rod 11 and the spring 12, the fixing clamping work of the single chip microcomputers with different sizes can be realized, the operation is simple and convenient, the trouble and the labor are saved, the friction force can be improved through the anti-skid pad 14 in the clamping process, the clamping process is more stable, the single chip microcomputer is prevented from falling off, the mounting frame body 1 can be mounted above the circuit board or the mounting frame after the clamping process is finished, the fixing work can be carried out through the mounting holes 10 through the mounting screws 4, the single chip microcomputer can be welded on the circuit board at the moment, the movable frame 6 can be, and bolt 5 runs through in perforation 15, make 8 bottoms of ripple heating panel laminate in the singlechip surface again, silicone grease 9 can improve the heat conduction efficiency of singlechip in ripple heating panel 8 this moment, heat conduction can carry out the work of dispelling the heat when putting ripple heating panel 8 on, and 8 surfaces of ripple heating panel are the ripple design, the area of contact of greatly increased and air, improve the radiating efficiency, thereby it supports tight adjustable shelf 6 to just move downwards through the rotation of nut 7, ensure that ripple heating panel 8 and singlechip surface closely laminate, avoid becoming flexible.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. A single chip microcomputer mounting frame with a heat dissipation function is characterized by comprising a mounting frame body (1) and a movable frame (6);
the mounting frame comprises a mounting frame body (1), wherein mounting seats (2) are integrally formed at four corners of the mounting frame body (1), bolts (5) are vertically mounted at the tops of two sides of the mounting frame body (1), through holes (15) are symmetrically formed in two sides of a movable frame (6), the bolts (5) penetrate through the through holes (15), and the movable frame (6) is mounted above the mounting frame body (1);
the bolt (5) top is rotatory to be installed nut (7), adjustable shelf (6) internally mounted has ripple heating panel (8), ripple heating panel (8) bottom is paintd with silicone grease (9).
2. The single chip mounting bracket with the heat dissipation function of claim 1, wherein: the mounting bracket body (1) is inside four corners department fixed mounting has telescopic link (11), telescopic link (11) end fixed mounting has fixation clamp (13), spring (12) have been put to telescopic link (11) outside cover.
3. The single chip mounting bracket with the heat dissipation function of claim 2, characterized in that: the inner wall of the fixing clamp (13) is stuck with a non-slip mat (14).
4. The single chip mounting bracket with the heat dissipation function of claim 1, wherein: and a rubber pad (3) is stuck at the bottom of the mounting seat (2).
5. The single chip mounting bracket with the heat dissipation function of claim 1, wherein: mounting holes (10) are longitudinally formed in the mounting base (2), and mounting screws (4) are inserted into the mounting holes (10).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921945193.2U CN211607117U (en) | 2019-11-12 | 2019-11-12 | Singlechip mounting bracket with heat dissipation function |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921945193.2U CN211607117U (en) | 2019-11-12 | 2019-11-12 | Singlechip mounting bracket with heat dissipation function |
Publications (1)
Publication Number | Publication Date |
---|---|
CN211607117U true CN211607117U (en) | 2020-09-29 |
Family
ID=72587634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921945193.2U Expired - Fee Related CN211607117U (en) | 2019-11-12 | 2019-11-12 | Singlechip mounting bracket with heat dissipation function |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN211607117U (en) |
-
2019
- 2019-11-12 CN CN201921945193.2U patent/CN211607117U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200929 Termination date: 20211112 |
|
CF01 | Termination of patent right due to non-payment of annual fee |