CN211580428U - Hinge and electronic device - Google Patents
Hinge and electronic device Download PDFInfo
- Publication number
- CN211580428U CN211580428U CN202020696578.6U CN202020696578U CN211580428U CN 211580428 U CN211580428 U CN 211580428U CN 202020696578 U CN202020696578 U CN 202020696578U CN 211580428 U CN211580428 U CN 211580428U
- Authority
- CN
- China
- Prior art keywords
- rotating shaft
- base
- heat conducting
- heat
- arrangement structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A hinge and an electronic device are provided, the electronic device includes a first body, a second body, at least one hinge and a heat-conducting member. The first body includes a heat generating source. At least one hinge is arranged between the first body and the second body, and the hinge comprises a base, a first rotating shaft, a second rotating shaft and a heat conducting component. The first rotating shaft is rotatably arranged on the base in a penetrating mode and comprises a first arrangement structure which is arranged on the first machine body and made of high-thermal-conductivity materials. The second rotating shaft is rotatably arranged on the base in a penetrating mode and comprises a second arrangement structure which is arranged on the second machine body and made of high-thermal-conductivity materials. The heat conducting component is connected between the first arrangement structure and the second arrangement structure and is made of high-heat-conductivity materials. The heat conducting piece is connected between the heating source of the first machine body and the first arrangement structure of the first rotating shaft. Therefore, the heat energy generated by the heating source of the first body is transferred to the second body through the hinge and the heat conducting piece, so that the heat dissipation efficiency of the electronic device is enhanced.
Description
Technical Field
The present invention relates to a hinge, and more particularly to a hinge and an electronic device.
Background
In recent years, the processing performance of electronic devices such as notebook computers and tablet computers has been increasing. However, as performance increases, the need for heat dissipation also increases. Therefore, how to improve the heat dissipation efficiency of electronic devices such as notebook computers or tablet computers is an important issue.
Disclosure of Invention
It is an object of the present invention to provide a hinge that improves at least one of the disadvantages of the prior art.
The utility model discloses a hinge is applicable to the setting between first organism and second organism in some implementation modes appearance, the hinge contains base, first pivot, second pivot to and heat conduction component. The first rotating shaft is rotatably arranged on the base in a penetrating mode and comprises a first arrangement structure which is used for being arranged on the first machine body and made of high-thermal-conductivity materials. The second rotating shaft is rotatably arranged on the base in a penetrating mode and comprises a second arrangement structure which is used for being arranged on the second machine body and is made of high-thermal-conductivity materials. The heat conducting member is connected between the first arrangement structure and the second arrangement structure and is made of a high heat conducting material.
In some embodiments, the first shaft further includes a first body penetrating through the base, the first setting structure has a first connecting portion extending from the first connecting portion and configured to be disposed on the first body, and a first setting portion extending from the first connecting portion and configured to be disposed on the first body, the second shaft further includes a second body penetrating through the base, the second setting structure has a second connecting portion extending from the second connecting portion and configured to be disposed on the second body and configured to be connected to the heat conducting member, and a second setting portion extending from the second connecting portion and configured to be disposed on the second body.
In some embodiments, the first connecting portion of the first disposing structure is sleeved on the first body, and the second connecting portion of the second disposing structure is sleeved on the second body.
In some embodiments, the heat conducting member is sleeved between the first body and the second body and between the first disposing structure, the second disposing structure and the base.
In some implementations, the first body has a first spacer interposed between and spacing the base and the heat conductive member, and the second body has a second spacer interposed between and spacing the base and the heat conductive member.
In some embodiments, the first arrangement structure of the first rotating shaft, the second arrangement structure of the second rotating shaft and the heat conducting member are made of chromium zirconium copper.
In some embodiments, the first rotation shaft is rotatable about a first rotation axis, the first arrangement structure has a first contact surface perpendicular to the first rotation axis and facing the heat conducting member, the second rotation shaft is rotatable about a second rotation axis parallel to the first rotation axis, the second arrangement structure has a second contact surface perpendicular to the second rotation axis and facing the heat conducting member, and the heat conducting member has at least one heat conducting contact surface perpendicular to the first rotation axis and the second rotation axis and respectively contacting the first contact surface and the second contact surface.
An object of the present invention is to provide an electronic device capable of overcoming at least one of the disadvantages of the prior art.
The utility model discloses an electronic device contains first organism, second organism, at least one hinge in some implementation aspect to and heat-conducting piece. The first body includes a heat generating source. The hinge is disposed between the first body and the second body, and includes a base, a first rotating shaft, a second rotating shaft, and a heat-conducting member. The first rotating shaft is rotatably arranged on the base in a penetrating mode and comprises a first arrangement structure which is arranged on the first machine body and made of high-thermal-conductivity materials. The second rotating shaft is rotatably arranged on the base in a penetrating mode and comprises a second arrangement structure which is arranged on the second machine body and made of high-thermal-conductivity materials. The heat conducting member is connected between the first arrangement structure and the second arrangement structure and is made of a high heat conducting material. The heat conducting member is connected between the heat source of the first body and the first setting structure of the first rotating shaft.
In some embodiments, the first shaft further includes a first body penetrating through the base, the first mounting structure has a first connecting portion extending from the first connecting portion and disposed on the first body, and a first mounting portion extending from the first connecting portion and disposed on the first body, the second shaft further includes a second body penetrating through the base, the second mounting structure has a second connecting portion extending from the second body and connected to the heat conducting member, and a second mounting portion extending from the second connecting portion and disposed on the second body.
In some embodiments, the first connecting portion of the first disposing structure is sleeved on the first body, and the second connecting portion of the second disposing structure is sleeved on the second body.
In some embodiments, the heat conducting member is sleeved between the first body and the second body and between the first disposing structure, the second disposing structure and the base.
In some implementations, the first body has a first spacer interposed between and spacing the base and the heat conductive member, and the second body has a second spacer interposed between and spacing the base and the heat conductive member.
In some embodiments, the first arrangement structure of the first rotating shaft, the second arrangement structure of the second rotating shaft and the heat conducting member are made of chromium zirconium copper.
In some embodiments, the first rotation shaft is rotatable about a first rotation axis, the first arrangement structure has a first contact surface perpendicular to the first rotation axis and facing the heat conducting member, the second rotation shaft is rotatable about a second rotation axis parallel to the first rotation axis, the second arrangement structure has a second contact surface perpendicular to the second rotation axis and facing the heat conducting member, and the heat conducting member has at least one heat conducting contact surface perpendicular to the first rotation axis and the second rotation axis and respectively contacting the first contact surface and the second contact surface.
The utility model discloses a make with high heat conductivity material and connect each other first set up the structure the second set up the structure with heat conduction component makes the produced heat energy of the source of generating heat of first organism via the hinge with heat conduction component transmits extremely the second organism, in order to strengthen electron device's radiating efficiency.
Drawings
Other features and advantages of the present invention will become apparent from the following detailed description of the preferred embodiments with reference to the accompanying drawings, in which:
fig. 1 is a schematic diagram of an embodiment of an electronic device according to the invention, in which a first housing of a first body and a second housing of a second body are partially shown;
FIG. 2 is a perspective view of one hinge of the embodiment;
FIG. 3 is an exploded perspective view of FIG. 2;
FIG. 4 is a perspective view of the hinge of the embodiment shown with a first pivot and a second pivot of the hinge rotated at an angle relative to a base of the hinge;
FIG. 5 is a top view of FIG. 2; and
fig. 6 is a top view of fig. 4.
Detailed Description
Referring to fig. 1, an embodiment of the electronic device 100 of the present invention includes a first body 1, a second body 2, two hinges 3, a heat conducting element 4, and a heat dissipating element 5. The electronic device 100 may be, for example, a foldable device or a handheld device such as a mobile phone, a tablet, a notebook, etc., and in this embodiment, the electronic device 100 is a notebook.
The first body 1 includes a first housing 11 and a heat generating source 12. In this embodiment, the first housing 11 may be made of metal, for example, and the heat source 12 is a Central Processing Unit (CPU) 14 disposed on a circuit board 13 in the first housing 11, it should be noted that in other implementation aspects, the heat source 12 may also be a graphics processing unit (GPU, not shown) or any other electronic component. In addition, the first housing 11 may be provided with an input module such as a keyboard (not shown), for example, but is not limited thereto.
The second body 2 includes a second housing 21, and in this embodiment, the second housing 21 may be made of metal, for example. In addition, the second body 2 may be provided with an output module such as a screen (not shown), for example, but not limited thereto.
Referring to fig. 1 to 3, the two hinges 3 are respectively disposed between the first body 1 and the second body 2. Each hinge 3 includes a base 31, a first shaft 32, a second shaft 33, and a heat-conducting member 34. The first rotating shaft 32 is rotatably disposed through the base 31 along a first direction D1, and in detail, the first rotating shaft 32 can rotate around a first rotating shaft a1 parallel to the first direction D1 with respect to the base 31. In the present embodiment, the first rotating shaft 32 includes a first body 321 penetrating the base 31, and a first setting structure 322 disposed on the first body 321 and made of a high thermal conductive material. The first setting structure 322 has a first connecting portion 322a sleeved at one end of the first body 321, and a first setting portion 322b extending from the first connecting portion 322a and disposed on an inner side surface of the first housing 11 of the first body 1. In another modified embodiment, the first body 321 of the first rotating shaft 32 and the first installation structure 322 may not be two-piece and may be integrally constructed, and the first connection portion 322a of the first installation structure 322 may be provided on the first body 321 in a manner other than sleeving, for example, by riveting, welding, and the like, and is not limited in this embodiment. In addition, the first rotating shaft 32 further includes a first positioning element 323, a first elastic washer 324 and a first locking nut 325 disposed at the other end of the first body 321 in the embodiment, and the above-mentioned components are used to enable the first rotating shaft 32 to be positioned at a specific angle, but in other implementation manners, the first rotating shaft 32 may not include the first positioning element 323, the first elastic washer 324 and the first locking nut 325, which is not limited in the embodiment.
The second shaft 33 is rotatably disposed through the base 31 along the first direction D1, and is aligned with the first shaft 32 along a second direction D2 perpendicular to the first direction D1, in detail, the first shaft 32 can rotate around a second rotation axis a2 parallel to the first direction D1 relative to the base 31. In this embodiment, the second rotating shaft 33 includes a second body 331 penetrating the base 31, and a second setting structure 332 disposed on the second body 331 and made of a high thermal conductive material. The second setting structure 332 has a second connecting portion 332a sleeved at one end of the second body 331, and a second setting portion 332b formed by extending from the second connecting portion 332a and disposed on an inner side surface of the second housing 21 of the second body 2. In other modified embodiments, the second body 331 of the second rotating shaft 33 and the second installation structure 332 may not be two-piece but may be integrally configured, and the second connection portion 332a of the second installation structure 332 may be provided on the second body 331 in a manner other than a sleeve, for example, by riveting, welding, and the like, without being limited by the present embodiment. In addition, the second rotating shaft 33 further includes a second positioning member 333, a second elastic gasket 334 and a second lock nut 335 disposed at the other end of the second body 331 in the embodiment, and the above components are used to enable the second rotating shaft 33 to be positioned at a specific angle, but in other embodiments, the second rotating shaft 33 may not include the second positioning member 333, the second elastic gasket 334 and the second lock nut 335, which is not limited in the embodiment.
Referring to fig. 2 to 6, the heat conducting member 34 is connected between the first connecting portion 322a of the first mounting structure 322 and the second connecting portion 332a of the second mounting structure 332 and is made of a high heat conducting material. In this embodiment, the heat conducting member 34 is sleeved between the first body 321 and the second body 331 and located between the first disposing structure 322, the second disposing structure 332 and the base 31 in the first direction D1. In detail, the first connection portion 322a of the first disposition structure 322 has a first contact surface 322c perpendicular to the first rotation axis a1 and facing the heat conduction member 34, the second connection portion 332a of the second disposition structure 332 has a second contact surface 332c perpendicular to the second rotation axis a2 and facing the heat conduction member 34, and the heat conduction member 34 has a heat conduction contact surface 341 perpendicular to the first rotation axis a1 and the second rotation axis a2 and contacting the first contact surface 322c and the second contact surface 332c, respectively. In another embodiment, the heat-conducting member 34 may have two heat-conducting contact surfaces 341 that are in contact with the first contact surface 322c and the second contact surface 332c, respectively. The first contact surface 322c, the second contact surface 332c and the heat-conducting contact surface 341 perpendicular to the first rotation axis a1 and the second rotation axis a2 enable the first disposing structure 322 and the second disposing structure 332 to maintain planar contact with the heat-conducting member 34 during the rotation of the first rotation axis 32 and the second rotation axis 33 relative to the base 31, as shown in fig. 5 and 6. In addition, since the first disposing structure 322 and the second disposing structure 332 are sleeved on the first body 321 and the second body 331, the first contact surface 322c and the second contact surface 332c are substantially annular surfaces, so that the areas of the first contact surface 322c and the second contact surface 332c can be increased, and the thermal resistance among the first disposing structure 322, the second disposing structure 332, and the heat conducting member 34 can be reduced. However, the contact manner between the first disposing structure 322 and the second disposing structure 332 and the heat conducting member 34 in this embodiment is only an example, that is, the connection structure between the first disposing structure 322 and the second disposing structure 332 and the heat conducting member 34 can be modified according to the use requirement, and is not limited in this embodiment. In addition, the arrangement and position of the heat conducting member 34 are not limited to the embodiment, and the arrangement and position of the heat conducting member 34 can be adjusted as required under the premise that the first arrangement structure 322, the second arrangement structure 332 and the heat conducting member 34 are connected.
Referring to fig. 1 to 3, the heat conducting member 4 is connected between the heat source 12 of the first body 1 and the first arrangement structure 322 of the first rotating shaft 32 of the two hinges 3, the heat conducting member 4 may be a heat pipe, for example, and the heat conducting member 4 may also be a heat conducting element such as a high heat conducting metal member or a temperature equalizing plate in other embodiments. In addition, the heat conducting member 4 may be connected between the heat generating source 12 and the first arrangement structures 322 of the two hinges 3 by welding or locking, for example, but not limited thereto. The heat conducting member 4 can conduct the heat energy of the heat source 12 to the first installation structure 322, then the heat energy is conducted to the second installation structure 332 through the heat conducting member 34, and then conducted to the second housing 21 of the second body 2 from the second installation structure 332, because in this embodiment, the second housing 21 is made of metal, after the heat energy is conducted to the second housing 21 of the second body 2, the heat energy can be dissipated to the air through the outer side surface of the second housing 21 of the second body 2, and the heat dissipation efficiency of the electronic device 100 for the heat source 12 can be enhanced through the above heat conduction path. However, in other embodiments, other heat dissipation elements (not shown) may be disposed on the second mounting structure 332 and the second body 2, so that heat energy on the second mounting structure 332 can be dissipated smoothly, thereby enhancing the heat dissipation performance of the electronic device 100.
The heat sink 5 is disposed on the heat source 12 of the first body 1, so that the heat dissipation efficiency of the electronic device 100 with respect to the heat source 12 can be further enhanced. The heat dissipation member 5 may be, for example, a heat dissipation element such as a heat dissipation fin, but not limited thereto, and in a modified embodiment, the heat dissipation member 5 may also be omitted, but not limited to this embodiment.
In addition, in the present embodiment, the first installation structure 322 of the first rotating shaft 32, the second installation structure 332 of the second rotating shaft 33, and the heat conducting member 34 are made of chromium zirconium copper, which has good thermal conductivity and crack resistance, high hardness, wear resistance, and explosion resistance, but the first installation structure 322 of the first rotating shaft 32, the second installation structure 332 of the second rotating shaft 33, and the heat conducting member 34 may also be made of other materials with high thermal conductivity, which is not limited in the present embodiment. It should be noted that other parts of the hinge 3 may be made of a material with low thermal conductivity, so as to prevent the heat energy on the first arrangement structure 322 of the first rotating shaft 32, the second arrangement structure 332 of the second rotating shaft 33 and the heat conducting member 34 from being excessively transferred to other parts of the hinge 3. Further, in the present embodiment, the first body 321 has a first spacing portion 321a interposed between the base 31 and the heat conductive member 34 and spacing the base 31 from the heat conductive member 34, and the second body 331 has a second spacing portion 331a interposed between the base 31 and the heat conductive member 34 and spacing the base 31 from the heat conductive member 34. The first spacing portion 321a and the second spacing portion 331a are annular protrusions in this embodiment, but the first spacing portion 321a and the second spacing portion 331a may have any other structure capable of spacing the base 31 and the heat conducting member 34 in other implementation manners, for example, the first spacing portion 321a and the second spacing portion 331a may have a protrusion shape, which is not limited in this embodiment.
To sum up, the utility model discloses a make and connect each other with high heat conductivity material first set up the structure 322 the second set up the structure 332 with heat conduction member 34 makes the produced heat energy of the source of generating heat 12 of first organism 1 via hinge 3 with heat conduction member 4 transmits extremely second organism 2 is in order to strengthen electron device 100's radiating efficiency.
The above description is only an example of the present invention, and the scope of the present invention should not be limited thereby, and all the simple equivalent changes and modifications made according to the claims and the description of the present invention are still within the scope of the present invention.
Claims (14)
1. A hinge adapted to be disposed between a first body and a second body, the hinge comprising:
a base;
the first rotating shaft is rotatably arranged on the base in a penetrating mode and comprises a first arrangement structure which is arranged on the first machine body and made of high-thermal-conductivity materials;
the second rotating shaft is rotatably arranged on the base in a penetrating mode and comprises a second arrangement structure which is arranged on the second machine body and made of high-thermal-conductivity materials; and
and the heat conduction component is connected between the first arrangement structure and the second arrangement structure and is made of a high-heat-conductivity material.
2. The hinge according to claim 1, wherein: the first rotating shaft further comprises a first body penetrating through the base, the first setting structure is provided with a first connecting portion arranged on the first body and connected to the heat conducting member, the first connecting portion extends to form a first setting portion arranged on the first body, the second rotating shaft further comprises a second body penetrating through the base, the second setting structure is provided with a second connecting portion arranged on the second body and connected to the heat conducting member, and the second connecting portion extends to form a second setting portion arranged on the second body.
3. The hinge of claim 2, wherein: the first connecting portion of the first setting structure is sleeved on the first body, and the second connecting portion of the second setting structure is sleeved on the second body.
4. The hinge of claim 2, wherein: the heat conducting component is sleeved on the first body and the second body and is positioned between the first arrangement structure, the second arrangement structure and the base.
5. The hinge of claim 4, wherein: the first body has a first spacer interposed between and spacing the base and the heat conductive member, and the second body has a second spacer interposed between and spacing the base and the heat conductive member.
6. The hinge according to claim 1, wherein: the first arrangement structure of the first rotating shaft, the second arrangement structure of the second rotating shaft and the heat conducting member are made of chromium, zirconium and copper.
7. The hinge according to claim 1, wherein: the first rotating shaft can rotate around a first rotating shaft, the first setting structure is provided with a first contact surface which is perpendicular to the first rotating shaft and faces the heat conducting member, the second rotating shaft can rotate around a second rotating shaft which is parallel to the first rotating shaft, the second setting structure is provided with a second contact surface which is perpendicular to the second rotating shaft and faces the heat conducting member, and the heat conducting member is provided with at least one heat conducting contact surface which is perpendicular to the first rotating shaft and the second rotating shaft and correspondingly contacts with the first contact surface and the second contact surface.
8. An electronic device, comprising:
a first body including a heat generating source;
a second body;
at least one hinge disposed between the first body and the second body, the hinge including:
a base seat, a plurality of fixing holes and a plurality of fixing holes,
the first rotating shaft is rotatably arranged on the base in a penetrating way and comprises a first arrangement structure which is arranged on the first machine body and is made of high-thermal-conductivity materials,
the second rotating shaft is rotatably arranged on the base in a penetrating way and comprises a second arrangement structure which is arranged on the second machine body and is made of high-thermal-conductivity materials, and
a heat conductive member connected between the first and second arrangement structures and made of a high heat conductive material; and
and the heat conducting piece is connected between the heating source of the first machine body and the first arrangement structure of the first rotating shaft.
9. The electronic device of claim 8, wherein: the first rotating shaft further comprises a first body penetrating through the base, the first setting structure is provided with a first connecting portion arranged on the first body and connected to the heat conducting member, and a first setting portion extending from the first connecting portion and arranged on the first machine body, the second rotating shaft further comprises a second body penetrating through the base, the second setting structure is provided with a second connecting portion arranged on the second body and connected to the heat conducting member, and a second setting portion extending from the second connecting portion and arranged on the second machine body.
10. The electronic device of claim 9, wherein: the first connecting portion of the first setting structure is sleeved on the first body, and the second connecting portion of the second setting structure is sleeved on the second body.
11. The electronic device of claim 9, wherein: the heat conducting component is sleeved on the first body and the second body and is positioned between the first arrangement structure, the second arrangement structure and the base.
12. The electronic device of claim 11, wherein: the first body has a first spacer interposed between and spacing the base and the heat conductive member, and the second body has a second spacer interposed between and spacing the base and the heat conductive member.
13. The electronic device of claim 8, wherein: the first arrangement structure of the first rotating shaft, the second arrangement structure of the second rotating shaft and the heat conducting member are made of chromium, zirconium and copper.
14. The electronic device of claim 8, wherein: the first rotating shaft can rotate around a first rotating shaft, the first setting structure is provided with a first contact surface which is perpendicular to the first rotating shaft and faces the heat conducting member, the second rotating shaft can rotate around a second rotating shaft which is parallel to the first rotating shaft, the second setting structure is provided with a second contact surface which is perpendicular to the second rotating shaft and faces the heat conducting member, and the heat conducting member is provided with at least one heat conducting contact surface which is perpendicular to the first rotating shaft and the second rotating shaft and correspondingly contacts with the first contact surface and the second contact surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020696578.6U CN211580428U (en) | 2020-04-29 | 2020-04-29 | Hinge and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020696578.6U CN211580428U (en) | 2020-04-29 | 2020-04-29 | Hinge and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211580428U true CN211580428U (en) | 2020-09-25 |
Family
ID=72528087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020696578.6U Active CN211580428U (en) | 2020-04-29 | 2020-04-29 | Hinge and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211580428U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573510A (en) * | 2020-04-29 | 2021-10-29 | 深圳市富世达通讯有限公司 | Hinge and electronic device |
-
2020
- 2020-04-29 CN CN202020696578.6U patent/CN211580428U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113573510A (en) * | 2020-04-29 | 2021-10-29 | 深圳市富世达通讯有限公司 | Hinge and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6189602B1 (en) | Electronic device with improved heat dissipation | |
| US7907397B2 (en) | Heat dissipating hinge for portable electronic device | |
| US5847925A (en) | System and method for transferring heat between movable portions of a computer | |
| US5588483A (en) | Heat radiating apparatus | |
| US5880929A (en) | Heat exchanger system for cooling a hinged computing device | |
| JP3937523B2 (en) | Hinge for electronic device and electronic device having hinge | |
| US10747271B2 (en) | Dual-shaft hinge and electronic device | |
| JP2001326485A (en) | Portable electronic equipment | |
| CN211580428U (en) | Hinge and electronic device | |
| TW201238456A (en) | Portable electronic device | |
| CN110850924A (en) | Folding equipment and heat dissipation device | |
| JPH11202978A (en) | Notebook-sized computer | |
| TWI747259B (en) | Hinge and electronic device | |
| CN113573510A (en) | Hinge and electronic device | |
| US10154613B1 (en) | Electronic device and heat dissipation structure thereof | |
| TWM599075U (en) | Hinge and electronic device | |
| JP2007318210A (en) | Antenna for mobile information processor | |
| JPH11101050A (en) | Hinge for electronic equipment | |
| JP2002334958A (en) | Heat-dissipating device | |
| TW202009437A (en) | Electronic device and heat pipe assembly | |
| JP2002076217A (en) | Heat radiating device | |
| JPH05243434A (en) | Electronic component cooling device | |
| JPH11110084A (en) | Information processor | |
| JPH08286783A (en) | Heat radiating structure for electronic parts in information unit | |
| JP2007201351A (en) | Electronic appliance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |