CN211530391U - Semiconductor high-power laser device easy to radiate heat - Google Patents

Abstract

The utility model discloses an easy radiating high-power laser instrument of semiconductor, which comprises a housin, a plurality of radiating grooves have all been seted up to the both sides of casing, just the inner wall of casing all be provided with radiating groove matched with adjusting part, the casing perpendicular to the both sides of radiating groove all are provided with a plurality of pins, the top of casing is provided with light-transmitting window. Has the advantages that: can realize closing or opening the radiating groove according to the demand, when the laser instrument is in unoperated state, remove the strip and remove the middle part to the radiating groove and play and block up the effect, when the laser instrument is in operating condition, remove the strip and stagger with the radiating groove for the radiating groove is opened, thereby is convenient for with the inside heat effluvium of casing, the utility model discloses not only can play certain dustproof effect through closing of radiating groove, but also can easily realize the heat dissipation to semiconductor laser through opening of radiating groove.

Description

Semiconductor high-power laser device easy to radiate heat

Technical Field

The utility model relates to a laser device technical field particularly, relates to an easy radiating high-power laser of semiconductor.

Background

Semiconductor lasers, as a solid state laser, have evolved rapidly due to the expansion of their wavelengths, the emergence of high power laser arrays, and the emergence of compatible laser light guiding and laser energy parameter microcomputer control. The semiconductor laser has small volume, light weight, low cost and selectable wavelength, and the application range of the semiconductor laser is wider and wider.

At present, the existing semiconductor laser mostly adopts an open structure, namely, a light source part is exposed or is completely exposed, during installation, the light source part can be installed outside equipment, and also the whole laser can be installed outside the equipment. Therefore, in order to improve the heat dissipation effect of the laser, a plurality of heat dissipation grooves are generally required to be formed in the housing of the laser, and for the laser integrally installed outside the device, due to the existence of the heat dissipation grooves, the inside of the laser is easily polluted by dust, and the normal use of the laser is affected.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

To the problem in the correlation technique, the utility model provides an easy radiating high-power laser of semiconductor to overcome the above-mentioned technical problem that current correlation technique exists.

Therefore, the utility model discloses a specific technical scheme as follows:

the high-power semiconductor laser easy to radiate comprises a shell, wherein a plurality of radiating grooves are formed in the two sides of the shell, adjusting assemblies matched with the radiating grooves are arranged on the inner wall of the shell, a plurality of pins are arranged on the two sides, perpendicular to the radiating grooves, of the shell, and a light-transmitting window is arranged at the top of the shell.

Further, in order to facilitate the installation and the fixation of the shell, the bottom of the shell is provided with a connecting wing, and a plurality of connecting holes are formed in both sides of the top of the connecting wing in a penetrating manner.

Further, in order to facilitate the installation and placement of the adjusting component, the inner walls of the two sides of the shell perpendicular to the pins are provided with installing cavities matched with the adjusting component.

Furthermore, in order to enable the installation cavity to better realize the installation of the adjusting assembly, the installation cavity comprises a first cavity body, a second cavity body is arranged at the bottom of the first cavity body, the two sides of the second cavity body are communicated with the heat dissipation grooves, and a third cavity body is arranged at the bottom of the second cavity body.

Further, in order to not only play certain dustproof effect through closing of radiating groove, but also can easily realize the heat dissipation to semiconductor laser through opening of radiating groove, adjusting part is including two sets of first pulleys that the symmetry was provided with, the bottom of first pulley all sets up the second pulley, and second pulley and first pulley all install respectively in the inside of third cavity and first cavity through the axis of rotation, all around being equipped with first stay cord between second pulley and the first pulley, be provided with a plurality of removal strips between the corresponding position of first stay cord, the surface of second pulley is all fixed and is provided with the third pulley, all be provided with the second stay cord between the third pulley, be provided with the regulating block on the second stay cord, and bottom one side of casing has seted up the spout with regulating block matched with, the one end of regulating block extends to the outside of casing through the spout.

Further, in order to facilitate the realization of connection and fixation between the moving strip and the first pull rope, both ends of the moving strip are fixedly connected with the first pull rope through a connecting block.

The utility model has the advantages that: through adjusting part's use for remove the strip and can realize closing or opening the radiating groove as required, when the laser instrument is in unoperated state, remove the strip and remove the middle part to the radiating groove and play and block up the effect, thereby can play certain dustproof effect, when the laser instrument is in operating condition, remove the strip and stagger with the radiating groove, make the radiating groove open, thereby be convenient for spill the heat of casing inside, the utility model discloses not only can play certain dustproof effect through closing of radiating groove, but also can easily realize the heat dissipation to semiconductor laser through opening of radiating groove.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a semiconductor high-power laser device with easy heat dissipation according to an embodiment of the present invention;

FIG. 2 is an enlarged view of the structure according to A in FIG. 1;

fig. 3 is a schematic view illustrating an installation of an adjusting assembly in a semiconductor high-power laser device with easy heat dissipation according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of an adjusting assembly in a semiconductor high-power laser device easy to dissipate heat according to an embodiment of the present invention.

In the figure:

1. a housing; 2. a connecting wing; 3. connecting holes; 4. a heat sink; 5. an adjustment assembly; 6. a pin; 7. a light-transmitting window; 8. a first cavity; 9. a second cavity; 10. a third cavity; 11. a first pulley; 12. a second pulley; 13. a rotating shaft; 14. a first pull cord; 15. a moving bar; 16. a third pulley; 17. a second pull cord; 18. an adjusting block; 19. a chute; 20. and (4) connecting the blocks.

Detailed Description

For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.

According to the utility model discloses an embodiment provides an easy radiating high-power laser of semiconductor.

Now combine the attached drawing and detailed description to explain the utility model further, as shown in fig. 1-4, according to the utility model discloses a high-power laser instrument of easy radiating semiconductor, including casing 1 and the semiconductor laser module that is located casing 1 inside, a plurality of radiating grooves 4 have all been seted up to casing 1's both sides, and casing 1's inner wall is provided with the dust screen with radiating grooves 4 matched with, and casing 1's inner wall all is provided with radiating grooves 4 matched with adjusting part 5, and casing 1 perpendicular to radiating grooves 4's both sides all are provided with a plurality of pins 6, and casing 1's top is provided with light-transmitting window 7.

By means of the above technical scheme, through the use of adjusting part 5, make the utility model discloses not only can play certain dustproof effect through closing of radiating groove 4, but also can easily realize the heat dissipation to semiconductor laser through opening of radiating groove 4.

In one embodiment, the bottom of the housing 1 is provided with a connecting wing 2, and a plurality of connecting holes 3 are formed through both sides of the top of the connecting wing 2. By such an arrangement, the mounting and fixing of the housing 1 is facilitated.

In one embodiment, the inner walls of the housing 1 perpendicular to the pins 6 are both provided with mounting cavities matched with the adjusting components 5. By means of the arrangement, installation and placement of the adjusting assembly 5 are facilitated.

In one embodiment, the installation cavity comprises a first cavity 8, a second cavity 9 is arranged at the bottom of the first cavity 8, two sides of the second cavity 9 are communicated with the heat dissipation groove 4, and a third cavity 10 is arranged at the bottom of the second cavity 9. By this arrangement, the installation of the adjustment assembly 5 can be better achieved by the installation space. In specific application, in order to enable the moving strip 15 to have a certain sealing effect on the heat dissipation groove 4 while moving, the width of the second cavity 9 is slightly larger than the width of the moving strip 15, and the height of the moving strip 15 is larger than the height of the heat dissipation groove 4.

In one embodiment, the adjusting assembly 5 includes two sets of first pulleys 11 symmetrically disposed, a second pulley 12 is disposed at a bottom of each first pulley 11, and the second pulleys 12 and the first pulleys 11 are respectively mounted inside the third cavity 10 and the first cavity 8 through a rotation shaft 13, a first pull rope 14 is wound between each second pulley 12 and each first pulley 11, a plurality of moving strips 15 are disposed between corresponding positions of the first pull ropes 14, a third pulley 16 is fixedly disposed on a surface of each second pulley 12, a second pull rope 17 is disposed between each third pulley 16, an adjusting block 18 is disposed on each second pull rope 17, a sliding groove 19 matched with the adjusting block 18 is disposed on one side of the bottom of the housing 1, and one end of the adjusting block 18 extends to an outer side of the housing 1 through the sliding groove 19. Through adjusting part 5's use for remove strip 15 can realize closing or opening heat sink 4 as required, when the laser instrument is in unoperated state, remove strip 15 and remove the middle part of heat sink 4 and play the jam effect, thereby can play certain dustproof effect, when the laser instrument is in operating condition, remove strip 15 and stagger with heat sink 4, make heat sink 4 open, be convenient for dispel the heat of 1 inside of casing, thereby make the utility model discloses not only can play certain dustproof effect through closing of heat sink 4, but also can easily realize the heat dissipation to semiconductor laser through opening of heat sink 4. In particular, in order to avoid the moving strip 15 from moving automatically under the action of gravity, two sets of concave parts for fixing the adjusting block 18 are further arranged at the inner bottom of the sliding groove 19.

In one embodiment, the two ends of the moving bar 15 are fixedly connected to the first pulling rope 14 through the connecting blocks 20. By this arrangement, the connection and fixation between the moving strip 15 and the first cord 14 are facilitated. During specific application, in order to ensure that the two ends of the movable strip 15 move in the same direction, the connecting blocks 20 at the two ends are fixedly connected with the right half relative position of the first pull rope 14, and the right end of the movable strip 15 is provided with a through hole matched with the left half of the first pull rope 14 on the right side.

For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.

When the semiconductor laser is in a non-working state, the movable strip 15 is positioned in the middle of the heat dissipation groove 4 to achieve the effect of closing the heat dissipation groove 4, and at the moment, the adjusting block 18 is positioned in the right-side concave part in the sliding groove 19 and achieves a fixing effect on the adjusting block 18 through the concave part; when semiconductor laser is in operating condition, then need control radiating groove 4 to open the heat dissipation of being convenient for this moment, at first operating personnel only need take out regulating block 18 from the depressed part on right side and drive it and move to the left side, thereby make it drive second stay cord 17 and carry out anticlockwise rotation, thereby make third pulley 16 drive second pulley 12 anticlockwise rotation, thereby make first stay cord 14 drive connecting block 20 upward movement, thereby make connecting block 20 drive and remove strip 15 upward movement, and remove to the middle part of radiating groove 4 and play the separation effect, at this moment, alright place regulating block 18 in the depressed part on left side and play fixed effect.

In conclusion, with the aid of the above technical scheme of the utility model, through the use of adjusting part 5, make removal strip 15 can realize closing or opening heat sink 4 according to the demand, when the laser instrument is in unoperated state, remove strip 15 and remove the middle part to heat sink 4 and play the jam effect, thereby can play certain dustproof effect, when the laser instrument is in operating state, remove strip 15 and heat sink 4 stagger, make heat sink 4 open, thereby be convenient for spill the heat of casing 1 inside, the utility model discloses not only can play certain dustproof effect through closing of heat sink 4, but also can easily realize the heat dissipation to semiconductor laser through opening of heat sink 4.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. The high-power semiconductor laser easy to radiate is characterized by comprising a shell (1), wherein a plurality of radiating grooves (4) are formed in the two sides of the shell (1), adjusting assemblies (5) matched with the radiating grooves (4) are arranged on the inner wall of the shell (1), the shell (1) is perpendicular to the two sides of the radiating grooves (4) and is provided with a plurality of pins (6), and a light-transmitting window (7) is arranged at the top of the shell (1).

2. The high-power semiconductor laser easy to dissipate heat according to claim 1, wherein the bottom of the housing (1) is provided with a connecting wing (2), and both sides of the top of the connecting wing (2) are provided with a plurality of connecting holes (3) in a penetrating manner.

3. The high-power semiconductor laser easy to dissipate heat according to claim 1, wherein the inner walls of the two sides of the shell (1) perpendicular to the pins (6) are provided with mounting cavities matched with the adjusting components (5).

4. The high-power semiconductor laser easy to dissipate heat according to claim 3, wherein the mounting cavity comprises a first cavity (8), a second cavity (9) is arranged at the bottom of the first cavity (8), two sides of the second cavity (9) are communicated with the heat dissipation groove (4), and a third cavity (10) is arranged at the bottom of the second cavity (9).

5. The high-power semiconductor laser with easy heat dissipation according to claim 4, wherein the adjusting assembly (5) comprises two sets of first pulleys (11) symmetrically arranged, a second pulley (12) is arranged at the bottom of each first pulley (11), the second pulleys (12) and the first pulleys (11) are respectively installed inside the third cavity (10) and the first cavity (8) through rotating shafts (13), first pulling ropes (14) are wound between the second pulleys (12) and the first pulleys (11), a plurality of moving strips (15) are arranged between corresponding positions of the first pulling ropes (14), third pulleys (16) are fixedly arranged on the surface of each second pulley (12), second pulling ropes (17) are arranged between the third pulleys (16), and adjusting blocks (18) are arranged on the second pulling ropes (17), and one side of the bottom of the shell (1) is provided with a sliding groove (19) matched with the adjusting block (18), and one end of the adjusting block (18) extends to the outer side of the shell (1) through the sliding groove (19).

6. The high-power semiconductor laser device easy to dissipate heat according to claim 5, wherein both ends of the moving bar (15) are fixedly connected with the first pulling rope (14) through connecting blocks (20).

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