CN211527597U - Embedded double-layer pressure sensitive membrane and FP (Fabry-Perot) cavity optical fiber acoustic sensor based on MEMS (micro-electromechanical system) process - Google Patents
Embedded double-layer pressure sensitive membrane and FP (Fabry-Perot) cavity optical fiber acoustic sensor based on MEMS (micro-electromechanical system) process Download PDFInfo
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- CN211527597U CN211527597U CN202020069572.6U CN202020069572U CN211527597U CN 211527597 U CN211527597 U CN 211527597U CN 202020069572 U CN202020069572 U CN 202020069572U CN 211527597 U CN211527597 U CN 211527597U
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- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 7
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims abstract 2
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- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims description 5
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims description 5
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims description 5
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 5
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
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Abstract
The utility model provides an embedded double-deck pressure-sensitive membrane based on MEMS technology, including mantle and the inside medium dura mater of embedding mantle, the diameter of mantle is greater than the diameter of medium dura mater, the mantle is the rubber membrane or the pellosil of making by PDMS, the medium dura mater includes a plurality of first dielectric layers and a plurality of second dielectric layers, the refracting index of first dielectric layer is greater than the refracting index of second dielectric layer, first dielectric layer and second dielectric layer are by lower supreme range upon range of in proper order. The utility model also provides a FP chamber optic fibre acoustic sensor, when utilizing this acoustic sensor to collect the transmitted light and carrying out the demodulation, because the reflectivity that film technology made two chamber faces in FP chamber is close 99%, consequently the transmission spectrum is sharp pectination spectral line, and at this moment, the received transmitted light obtains the acoustic pressure signal through demodulating to the light signal. The utility model discloses the sensitive membrane periphery deformation volume that produces is big, and the regional almost nothing deformation and the reflectivity height of optic fibre mode field diameter within range.
Description
Technical Field
The utility model relates to an acoustic sensor technical field especially relates to a FP chamber optic fibre acoustic sensor, embedded double-deck pressure sensitive membrane and this embedded double-deck pressure sensitive membrane's preparation method based on MEMS technology.
Background
In recent years, with the development of optoelectronics and various optoelectronic devices, the optical fiber sensor technology has been developed greatly, forming various optical fiber sensors, such as optical fiber vibration sensor, optical fiber acoustic sensor, optical fiber pressure sensor, optical fiber temperature sensor, etc.; there are also various principles employed by these fiber optic sensors, such as the reflection intensity type, the fiber grating type, the Mickelson interferometer type, the MZ interferometer type, the Signac interferometer type, and the FP cavity fiber optic sensor.
Among optical fiber acoustic sensors based on various principles, FP cavity optical fiber acoustic sensors are widely studied due to their simple structure, high sensitivity, and simple demodulation method. As a novel sensor, compared with a traditional voltage capacitance sensor, the optical fiber acoustic sensor based on the FP cavity has the characteristics of simple structure, small size, light weight, no electromagnetic interference and easy integration, and has the development trend of miniaturization and integration.
The sensitive film is a key component of the FP cavity fiber optic acoustic sensor, and the FP cavity fiber optic acoustic sensor based on the sensitive film made of different materials and with different structures has been reported for many times: for example, (1) Dai, Majun et al use graphene thin film as a sensitive film, and combine with single-mode fiber sleeved with capillary to form an FP cavity, thereby making an FP cavity fiber acoustic sensor; however, the sensitive film made of single-layer graphene or multi-layer graphene has large deformation, low reflectivity and flat spectral curve; (2) the metal silver or photonic crystal reflector with high emissivity is used as a sensitive film, although the reflectivity is high, the material is hard, and the deformation is relatively small; (3) the FP cavity is made by a probe manufacturing technology that a silicon film is welded with an optical fiber etched into a groove and the redundant diaphragm part is removed by wet etching, the reflectivity of the film is low, and the material hardness is small.
The existing sensitive membrane has only a single characteristic of high reflectivity or high deformation, even does not have the single characteristic, and can not meet certain special use requirements of an actual FP cavity optical fiber acoustic sensor, such as requirements of higher sensitivity, good low-frequency response and the like.
Disclosure of Invention
In view of this, the present invention provides an embedded double-layer pressure-sensitive membrane based on a Micro-Electro-mechanical system (MEMS) process, a method for manufacturing the embedded double-layer pressure-sensitive membrane, and an FP cavity optical fiber acoustic sensor formed by the embedded double-layer pressure-sensitive membrane.
The utility model provides an embedded double-deck pressure-sensitive membrane based on MEMS technology, including mantle and the inside medium dura mater of embedding mantle, the diameter of mantle is greater than the diameter of medium dura mater for mantle and medium dura mater form embedded structure, the medium dura mater includes a plurality of first dielectric layers and a plurality of second dielectric layer, the refracting index of first dielectric layer is greater than the refracting index of second dielectric layer, first dielectric layer and second dielectric layer are by supreme stack in proper order down, form the alternate structure of refracting index height … height.
Further, the soft membrane is a rubber membrane or a silicon membrane made of PDMS (polydimethylsiloxane), and the surface of the soft membrane is smooth and clean.
Further, the first dielectric layer is made of niobium pentoxide, and the second dielectric layer is made of magnesium fluoride.
Furthermore, the first dielectric layer and the second dielectric layer are made of transparent, hard and chemically stable materials, the refractive index difference between the material for making the first dielectric layer and the material for making the second dielectric layer is large, and the materials meet the characteristics of small deformation, high hardness and high reflectivity in a certain wavelength range.
Further, the thickness of the medium hard film is 500-2000 nm.
Further, the thickness of the soft film is 0.5-10 μm.
The utility model also provides an above-mentioned preparation method based on embedded double-deck pressure sensitive membrane of MEMS technology, including following step:
s1, plating a medium hard film (prepared by a laminating method of niobium pentoxide and magnesium fluoride) with small deformation, high hardness and high reflectivity on a clean silicon dioxide substrate;
s2, spin-coating a layer of negative photoresist on the medium hard film by using a spin coater, exposing the negative photoresist through a specific pattern through hole formed on a mask plate by high-energy radiation, removing the negative photoresist with changed properties by using a developing solution, and obtaining a cylindrical negative photoresist on the medium hard film, wherein the part of the negative photoresist has a protective effect on the medium hard film; removing the medium hard film except the negative photoresist by ICP (inductively coupled plasma) technology, reserving the medium hard film covered at the lower part of the negative photoresist, and removing the negative photoresist covered at the upper part of the medium hard film by using acetone to expose the medium hard film with a specific pattern;
s3, a layer of positive photoresist is spin-coated on the silicon dioxide substrate by using a spin coater, the other mask plate with the same position as the mask plate in the step S2 and provided with through holes with the same pattern is used for positioning, the positive photoresist is exposed by high-energy radiation penetrating through the mask plate, the property of the positive photoresist in the middle part is changed, the positive photoresist in the middle part is melted by using a developing solution to obtain a cylindrical groove, and the bottom of the cylindrical groove is covered with a medium hard film;
s4, filling the soft film solution into the cylindrical groove, and using ICP to knock off the redundant soft film on the upper layer to flatten the surface;
and S5, removing the positive photoresist and the silicon dioxide base layer to obtain the embedded double-layer pressure sensitive film.
The utility model also provides a FP chamber optic fibre acoustic sensor based on MEMS technology, including the embedded double-deck pressure sensitive membrane that above-mentioned embedded double-deck pressure sensitive membrane or utilize the above-mentioned preparation method to make, still include capillary glass pipe and single mode fiber, single mode fiber is located capillary glass intraductal, capillary glass pipe includes capillary glass pipe left end and capillary glass pipe right-hand member, single mode fiber includes single mode fiber left end and single mode fiber right-hand member, capillary glass pipe left end and single mode fiber left end are connected, capillary glass pipe right-hand member is connected with the mantle, form an air cavity as the FP cavity between single mode fiber right-hand member and the medium dura mater.
Further, the medium hard film is arranged opposite to the cross section of the fiber core of the single-mode optical fiber, and the diameter of the medium hard film is equal to or larger than the diameter of the cross section of the fiber core of the single-mode optical fiber.
Further, the diameter of the soft film is equal to the outer diameter of the capillary glass tube.
Further, the center of the cross section of the single-mode optical fiber and the center of the embedded double-layer pressure sensitive film are both on the axis of the capillary glass tube.
Further, the diameter of the single mode fiber is equal to the inner diameter of the annular end face of the capillary glass tube.
Furthermore, the right end of the single-mode optical fiber is plated with a high-reflectivity film, the high-reflectivity film and the medium hard film are used as two cavity surfaces of the FP cavity and form a 90-degree angle with the axial direction of the capillary glass tube to form an FP cavity interference structure, so that the round-trip loss of light can be effectively reduced, the round-trip times of the light in the FP cavity are increased, the Q value and the transmission spectrum fineness of the FP cavity are improved, and the soft films on the periphery are greatly deformed when being pressed, so that the cavity length variation is increased, and the spectrum offset is increased.
The utility model provides a beneficial effect that technical scheme brought is: the utility model provides an embedded double-deck pressure sensitive membrane based on MEMS technology includes the mantle that elastic modulus is little and the medium dura mater (as increasing anti-membrane) that elastic modulus is big and reflectivity is high, and the diameter of mantle is greater than the diameter of medium dura mater, forms an embedded structure, and the sensitive membrane periphery of making like this has fine deformability and high reflectivity, and the region in the diameter range of mould field is then almost not out of shape; when the FP chamber optical fiber acoustic sensor based on the MEMS technology is utilized to collect the transmission light for demodulation, the reflectivity of two cavity surfaces of the FP chamber is close to 99 percent due to the film technology, so the transmission spectrum is a sharp comb-shaped spectral line, at the moment, the transmission light is received, and the sound pressure signal is obtained by demodulating the light signal; the utility model provides an embedded double-deck pressure sensitive membrane can be used in various miniature sensor based on FP chamber, reduces the loss in chamber, improves the Q value and the sensor sensitivity in FP chamber.
Drawings
Fig. 1 is a schematic structural diagram of an embedded double-layer pressure-sensitive membrane based on the MEMS process.
Fig. 2 is a schematic structural diagram of an FP cavity optical fiber acoustic sensor based on the MEMS technology.
Fig. 3 is a schematic flow chart of a method for manufacturing an embedded double-layer pressure-sensitive membrane based on the MEMS process.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be further described below with reference to the accompanying drawings.
Referring to fig. 1, an embodiment of the present invention provides an embedded dual-layer pressure-sensitive membrane 1 based on a MEMS process, including a soft membrane 11 and a hard medium membrane 12 embedded inside the soft membrane 11, wherein a diameter of the soft membrane 11 is greater than a diameter of the hard medium membrane 12, so that the soft membrane 11 and the hard medium membrane 12 form an embedded structure, the soft membrane 11 is a rubber membrane or a silicon membrane made of PDMS, a surface of the soft membrane 11 is smooth, and a thickness of the soft membrane 11 is 0.5-10 μm.
The thickness of the medium hard film 12 is 500-2000nm, and the medium hard film comprises a plurality of first medium layers 121 and a plurality of second medium layers 122, the refractive index of the first medium layers 121 is larger than that of the second medium layers 122, the first medium layers 121 and the second medium layers 122 are sequentially and alternately laminated from bottom to top to form a structure with high, low, high and high alternative refractive index of …, in fig. 1, the lowest layer and the uppermost layer of the medium hard film 12 are both the first medium layers 121, the first medium layers 121 and the second medium layers 122 are made of transparent, hard and chemically stable materials, the difference between the refractive indexes of the materials for making the first medium layers 121 and the materials for making the second medium layers 122 is large, and the materials meet the characteristics of small shape, high hardness and high reflectivity in a certain wavelength range.
Preferably, the first dielectric layer 121 is made of niobium pentoxide and the second dielectric layer 122 is made of magnesium fluoride.
Referring to fig. 2, the embodiment of the present invention further provides an FP cavity optical fiber acoustic sensor based on MEMS technology, which includes an embedded double-layer pressure sensitive film 1, a capillary glass tube 2 and a single-mode optical fiber 3, the single-mode optical fiber 3 is located in the capillary glass tube 2, the cross section center of the single-mode optical fiber 3 and the center of the embedded double-layer pressure sensitive film 1 are all on the axis of the capillary glass tube 2, and the diameter of the single-mode optical fiber 3 is equal to the inner diameter of the annular end face of the capillary glass tube 2.
Capillary glass manages 2 including capillary glass pipe left end 21 and capillary glass pipe right-hand member 22, single mode fiber 3 includes single mode fiber left end 31 and single mode fiber right-hand member 32, capillary glass pipe left end 21 and single mode fiber left end 31 are connected, capillary glass pipe right-hand member 22 is connected with mantle 11, the diameter of mantle 11 equals with the external diameter of capillary glass pipe 2, medium dura mater 12 sets up with single mode fiber 3's fibre core cross section relatively, the diameter of medium dura mater 12 equals or is slightly more than single mode fiber 3's fibre core cross section diameter, form an air chamber 4 as the FP cavity between single mode fiber right-hand member 32 and the medium dura mater 12.
The right end 32 of the single-mode optical fiber is plated with a high-reflectivity film 321, the high-reflectivity film 321 and the medium hard film 12 are used as two cavity surfaces of the FP cavity and form a 90-degree angle with the axial direction of the capillary glass tube 2 to form an FP cavity interference structure, so that the round-trip loss of light can be effectively reduced, the round-trip times of the light in the FP cavity are increased, and the Q value and the transmission spectrum fineness of the FP cavity are improved.
In fig. 2, arrows indicate the propagation of light in the FP cavity fiber optic acoustic sensor.
Referring to fig. 3A to 3K, an embodiment of the present invention further provides a method for preparing the embedded double-layer pressure-sensitive membrane 1, including the following steps:
step S1, plating a dielectric hard film 12 (made of niobium pentoxide and magnesium fluoride by a lamination method) with small deformation, high hardness and high reflectivity on the clean silicon dioxide substrate 5, as shown in fig. 3A;
step S2, spin-coating a layer of negative photoresist 6 (as shown in FIG. 3B) on the medium hard film 12 by using a spin coater, exposing the negative photoresist 6 by ultraviolet light through a specific pattern through hole formed on a mask plate, removing the negative photoresist 6 with changed properties by using a developing solution, and obtaining a cylindrical negative photoresist 6 (as shown in FIG. 3C) on the medium hard film, wherein the part of the negative photoresist 6 has a protective effect on the medium hard film 12; removing the dielectric hard film 12 except the negative photoresist 6 by using an ICP (inductively coupled plasma) technology, leaving the dielectric hard film 12 covered on the lower part of the negative photoresist 6 (as shown in figure 3D), and removing the negative photoresist 6 covered on the upper part of the dielectric hard film 12 by using acetone to expose the dielectric hard film 12 with a specific pattern (as shown in figure 3E); the model of the negative photoresist 6 is AZ5214, and the negative photoresist 6 can retain an exposed area through photoetching development;
step S3, a layer of positive photoresist 7 is spin-coated on the silicon dioxide substrate 5 by using a spin coater (as shown in FIG. 3F), another mask plate with through holes with the same patterns and arranged at the same positions as the mask plate in the step S2 is used for positioning, the positive photoresist 7 is exposed by ultraviolet light penetrating through the mask plate, the property of the positive photoresist 7 in the middle part is changed, the positive photoresist 7 in the middle part is melted by using a developing solution to obtain a cylindrical groove 8, and the bottom of the cylindrical groove 8 is covered with a medium hard film 12 (as shown in FIG. 3G); positive photoresist 7 is model PW1500s, and positive photoresist 7 can be developed by photolithography to dissolve the exposed region;
step S4, spin-coating a layer of PDMS in the cylindrical groove 8 by using a spin coater (as shown in fig. 3H), and removing excess PDMS on the upper layer by using ICP to flatten the surface, thereby obtaining a soft film 11 (as shown in fig. 3I);
step S5, removing the positive photoresist 7 outside the cylindrical groove 8 by using acetone (as shown in fig. 3J), and inverting the silicon dioxide substrate 5 in hydrofluoric acid to react the hydrofluoric acid with the silicon dioxide substrate 5, thereby detaching the embedded double-layer pressure sensitive film 1 (as shown in fig. 3K).
The process for preparing the FP cavity optical fiber acoustic sensor comprises the following steps: the single mode optical fiber 3 is inserted into the capillary glass tube 2 by using a lens barrel and fixed by using glue, the embedded double-layer pressure sensitive membrane 1 is fished out by using a filter membrane, put into a solution to float, and then aligned under a microscope to be adsorbed on the capillary glass tube 2 by van der waals force.
In this document, the terms front, back, upper and lower are used to define the components in the drawings and the positions of the components relative to each other, and are used for clarity and convenience of the technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.
The features of the embodiments and embodiments described herein above may be combined with each other without conflict.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (9)
1. The utility model provides an embedded double-deck pressure-sensitive membrane based on MEMS technology which characterized in that, includes the mantle and imbeds the inside medium dura mater of mantle, the diameter of mantle is greater than the diameter of medium dura mater for mantle and medium dura mater form embedded structure, the medium dura mater includes a plurality of first dielectric layers and a plurality of second dielectric layer, the refracting index of first dielectric layer is greater than the refracting index of second dielectric layer, first dielectric layer and second dielectric layer are by lower supreme range upon range of in proper order in turn.
2. The MEMS process based embedded bi-layer pressure sensitive membrane according to claim 1, wherein the soft membrane is a rubber membrane or a silicone membrane made of PDMS.
3. The MEMS process based embedded bi-layer pressure sensitive membrane of claim 1, wherein the first dielectric layer is made of niobium pentoxide and the second dielectric layer is made of magnesium fluoride.
4. The MEMS process based embedded bilayer pressure sensitive membrane of claim 1, wherein the thickness of the dielectric hard film is 500-2000 nm.
5. The MEMS process based embedded bi-layer pressure sensitive membrane of claim 1, wherein the soft membrane has a thickness of 0.5-10 μm.
6. The utility model provides a FP chamber optic fibre acoustic sensor based on MEMS technology which characterized in that, includes claim 1 embedded double-deck pressure-sensitive membrane, still includes capillary glass pipe and single mode fiber, single mode fiber is located capillary glass intraductal, capillary glass pipe includes capillary glass pipe left end and capillary glass pipe right-hand member, single mode fiber includes single mode fiber left end and single mode fiber right-hand member, capillary glass pipe left end and single mode fiber left end are connected, capillary glass pipe right-hand member is connected with the mantle, form an air cavity as the FP cavity between single mode fiber right-hand member and the medium dura mater.
7. The FP-cavity optical fiber acoustic sensor based on the MEMS technology of claim 6, wherein the medium hard film is arranged opposite to the cross section of the fiber core of the single-mode optical fiber, and the diameter of the medium hard film is equal to or larger than the diameter of the cross section of the fiber core of the single-mode optical fiber.
8. The FP-cavity optical fiber acoustic sensor based on the MEMS process of claim 6, wherein the diameter of the soft membrane is equal to the outer diameter of the capillary glass tube.
9. The FP-cavity optical fiber acoustic sensor based on the MEMS technology of claim 6, wherein the cross-sectional center of the single-mode optical fiber and the center of the embedded double-layer pressure sensitive membrane are both on the axis of the capillary glass tube.
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| CN202020069572.6U CN211527597U (en) | 2020-01-13 | 2020-01-13 | Embedded double-layer pressure sensitive membrane and FP (Fabry-Perot) cavity optical fiber acoustic sensor based on MEMS (micro-electromechanical system) process |
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| CN202020069572.6U CN211527597U (en) | 2020-01-13 | 2020-01-13 | Embedded double-layer pressure sensitive membrane and FP (Fabry-Perot) cavity optical fiber acoustic sensor based on MEMS (micro-electromechanical system) process |
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