CN211507623U - Integrated circuit support structure for preventing chip from shifting - Google Patents
Integrated circuit support structure for preventing chip from shifting Download PDFInfo
- Publication number
- CN211507623U CN211507623U CN202020267394.8U CN202020267394U CN211507623U CN 211507623 U CN211507623 U CN 211507623U CN 202020267394 U CN202020267394 U CN 202020267394U CN 211507623 U CN211507623 U CN 211507623U
- Authority
- CN
- China
- Prior art keywords
- support
- integrated circuit
- chip
- fixed part
- support body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 4
- 206010066054 Dysmorphism Diseases 0.000 abstract description 3
- 238000001746 injection moulding Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to an integrated circuit technical field especially relates to an integrated circuit supporting structure that skew is prevented to chip. The utility model provides an integrated circuit supporting structure of skew is prevented to chip, includes the sensor support body, locates a plurality of PAD regions in the sensor support body, the sensor support body is including transversely setting up first support, and the symmetry sets up in the second support at first support both ends, crisscross a plurality of connecting portions that are provided with perpendicularly on the first support, the connecting portion both sides are equipped with a plurality of PAD regions respectively, PAD region includes the fixed part, installs chip and the convex part of setting both ends about the fixed part all around on the fixed part. The utility model discloses an useful part: the problem of the skew phenomenon of pasting the chip when the back process is used is solved, the emergence of great dysmorphism has been avoided.
Description
Technical Field
The utility model relates to an integrated circuit technical field especially relates to an integrated circuit supporting structure that skew is prevented to chip.
Background
The sensor support is used for welding wires after injection molding and sealing, placing chips and soldering pins, and the sensor support is too soft during injection molding production, has deformation and distortion, has the phenomenon of deviation when being adhered with the chip during post-process use, and makes changes of some processes in order to avoid serious abnormity.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an integrated circuit supporting structure of skew is prevented to chip to overcome the above-mentioned not enough that prior art exists at present.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an integrated circuit supporting structure of skew is prevented to chip, includes the sensor support body, locates a plurality of PAD regions in the sensor support body, the sensor support body is including transversely setting up first support, and the symmetry sets up in the second support at first support both ends, crisscross a plurality of connecting portions that are provided with perpendicularly on the first support, the connecting portion both sides are equipped with a plurality of PAD regions respectively, PAD region includes the fixed part, installs chip and the convex part of setting both ends about the fixed part all around on the fixed part.
Preferably, a support glue sealing positioning hole and a circular hole are formed in the second support, and the support glue sealing positioning hole and the circular hole are arranged in the second support at intervals.
Preferably, a semi-arc process groove is formed in the edge of the second support.
Preferably, a circle of welding wire is arranged on the periphery of the fixing part.
Preferably, the convex portion has a length not exceeding the PAD area, and the convex portion is in contact with the connection portion.
The utility model has the advantages that: the effectual problem of avoiding of connecting portion in the first support that the support is too soft when moulding plastics into products, and strengthen fixedly, avoid warping, distortion, when having solved the back process and using, paste the skew phenomenon of chip, avoided great dysmorphism to send out to become.
Drawings
Fig. 1 is a schematic structural diagram of an integrated circuit supporting structure for preventing chip shift according to the present invention;
in the figure: 1. a sensor holder body; 11. a first bracket; 12. a second bracket; 13. a connecting portion; 14. sealing glue positioning holes of the bracket; 15. a circular hole; 16. a semi-arc process tank; 2. a PAD region; 21. a fixed part; 22. a chip; 23. a convex portion; 24. and (7) welding wires.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1, the embodiment is an integrated circuit support structure for preventing a chip from shifting, which includes a sensor support body 1 and a plurality of PAD areas 2 disposed in the sensor support body 1;
the sensor support body 1 comprises a first support 11 arranged transversely and second supports 12 symmetrically arranged at two ends of the first support 11, a plurality of connecting parts 13 are vertically and alternately arranged on the first support 11, a plurality of PAD regions 2 are respectively arranged at two sides of each connecting part 13, and each PAD region 2 comprises a fixing part 21, chips 22 arranged on the periphery of the fixing part 21 and convex parts 23 arranged at the upper end and the lower end of the fixing part;
the chip 22 is connected with the fixing part by glue;
a bracket glue sealing positioning hole 14 and a circular hole 15 are formed in the second bracket 12, and the bracket glue sealing positioning hole 14 and the circular hole 15 are arranged in the second bracket 12 at intervals;
a semi-arc process groove 16 is formed at the edge of the second bracket 12;
a circle of bonding wires 24 are arranged around the fixing part 21, and the bonding wires 24 are square and arranged around the chip 22;
the length of the convex portion 23 does not exceed the PAD area 2, and the convex portion 23 is connected with the connecting portion 13;
this embodiment is when implementing, the effectual too soft problem of support when moulding plastics into products of avoiding of connecting portion 13 through setting up in first support 11, and strengthen fixedly, avoid warping, distortion, when having solved the use of back process, paste the skew phenomenon of chip, avoided the sending out of great dysmorphism.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. The utility model provides an integrated circuit supporting structure of skew is prevented to chip, includes sensor support body (1), locates a plurality of PAD regions (2) in sensor support body (1), its characterized in that: sensor support body (1) is including transversely setting up first support (11), and the symmetry sets up in second support (12) at first support (11) both ends, perpendicular crisscross a plurality of connecting portion (13) of being provided with on first support (11), connecting portion (13) both sides are equipped with a plurality of PAD regions (2) respectively, PAD region (2) include fixed part (21), install chip (22) all around on fixed part (21) and set up convex part (23) at both ends about the fixed part.
2. The integrated circuit support structure of claim 1, wherein: a support glue sealing positioning hole (14) and a circular hole (15) are formed in the second support (12), and the support glue sealing positioning hole (14) and the circular hole (15) are arranged in the second support (12) at intervals.
3. The integrated circuit support structure of claim 1, wherein: and a semi-arc process groove (16) is formed at the edge of the second bracket (12).
4. The integrated circuit support structure of claim 1, wherein: a circle of welding wires (24) are arranged on the periphery of the fixing part (21).
5. The integrated circuit support structure of claim 1, wherein: the length of the convex portion (23) does not exceed the PAD region (2), and the convex portion (23) is in contact with the connecting portion (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020267394.8U CN211507623U (en) | 2020-03-06 | 2020-03-06 | Integrated circuit support structure for preventing chip from shifting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020267394.8U CN211507623U (en) | 2020-03-06 | 2020-03-06 | Integrated circuit support structure for preventing chip from shifting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211507623U true CN211507623U (en) | 2020-09-15 |
Family
ID=72402380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020267394.8U Expired - Fee Related CN211507623U (en) | 2020-03-06 | 2020-03-06 | Integrated circuit support structure for preventing chip from shifting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211507623U (en) |
-
2020
- 2020-03-06 CN CN202020267394.8U patent/CN211507623U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200915 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |