CN211507622U - Low cost IC support structure - Google Patents
Low cost IC support structure Download PDFInfo
- Publication number
- CN211507622U CN211507622U CN202020267392.9U CN202020267392U CN211507622U CN 211507622 U CN211507622 U CN 211507622U CN 202020267392 U CN202020267392 U CN 202020267392U CN 211507622 U CN211507622 U CN 211507622U
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- die bonding
- circuit support
- area
- support structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Abstract
The utility model relates to an integrated circuit technical field especially relates to a low-cost integrated circuit supporting structure. The integrated circuit support structure comprises an integrated circuit support body and a plurality of die bonding wire area connecting supports arranged on the integrated circuit support body, wherein the die bonding wire area connecting supports are sequentially arranged on one side of the integrated circuit support body, the end parts of the die bonding wire area connecting supports are connected with connecting parts, die bonding wire areas are arranged at the ends of the connecting parts, and PAD areas are arranged in the die bonding wire areas. The utility model discloses an useful part: and the cost is saved.
Description
Technical Field
The utility model relates to an integrated circuit technical field especially relates to a low-cost integrated circuit supporting structure.
Background
The PAD at the head part of the integrated circuit bracket is a functional area, and the integrated circuit bracket needs die bonding, wire bonding, bending and glue sealing in the use process, so that the cost is only increased by installing the conventional bracket production;
in order to reduce the cost, the PAD area of the integrated circuit support is reduced by technical means at present, the volume of a chip is reduced under the condition of not influencing normal use, and the cost is greatly saved.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a low-cost integrated circuit supporting structure to overcome the above-mentioned not enough that prior art exists at present.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the integrated circuit support structure comprises an integrated circuit support body and a plurality of die bonding wire area connecting supports arranged on the integrated circuit support body, wherein the die bonding wire area connecting supports are sequentially arranged on one side of the integrated circuit support body, the end parts of the die bonding wire area connecting supports are connected with connecting parts, die bonding wire areas are arranged at the ends of the connecting parts, and PAD areas are arranged in the die bonding wire areas.
Preferably, the PAD area occupies one quarter to three quarters of the die bond wire area.
Preferably, the connecting part is a square block.
Preferably, the integrated circuit bracket body is provided with a circular hole and a waist-shaped process groove, the circular hole and the waist-shaped process groove are arranged at intervals and are arranged corresponding to the die bonding and wire bonding area connecting bracket.
Preferably, the connecting part is provided with a sealing glue grabbing hole.
The utility model has the advantages that: the round hole and the waist-shaped process groove formed in the integrated circuit bracket body and the glue sealing and grabbing hole formed in the connecting part are used for quickly and accurately installing in place, so that the installation steps and time are saved; a plurality of die bonding and wire bonding area connecting supports arranged on the integrated circuit support body are sequentially arranged at equal intervals, so that the integrated circuit support can be accurately positioned and deviation can be avoided; the outer diameter of the soil bag at the position where the chip in the PAD area on the integrated circuit support body is fixed is reduced all around, so that the cost is saved, and the function is not reduced.
Drawings
FIG. 1 is a schematic diagram of a low-cost IC carrier structure according to the present invention;
FIG. 2 is a diagram illustrating the overall effect of the low-cost IC carrier structure after packaging;
in the figure: 1. an integrated circuit carrier body; 11. a circular hole; 12. a waist-shaped process tank; 2. the die bonding and wire bonding area is connected with the bracket; 3. a connecting portion; 31. sealing glue and grabbing glue holes; 4. a die bonding wire area; 5. a PAD region; 6. and (3) a chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1 and 2, the present embodiment is a low-cost ic bracket structure, which includes an ic bracket body 1, and a plurality of die bond wire area connection brackets 2 disposed on the ic bracket body 1;
the die bonding and wire bonding area connecting supports 2 are sequentially arranged on one side of the integrated circuit support body 1, the end parts of the die bonding and wire bonding area connecting supports 2 are connected with connecting parts 3, the ends of the connecting parts 3 are provided with die bonding and wire bonding areas 4, and PAD areas 5 are arranged in the die bonding and wire bonding areas 4;
the PAD area 5 occupies one quarter to three quarters of the die bonding wire area 4;
the connecting part 3 is a square block;
a circular hole 11 and a waist-shaped process groove 12 are formed in the integrated circuit bracket body 1, the circular hole 11 and the waist-shaped process groove 12 are arranged at intervals and are arranged corresponding to the die bonding and wire bonding area connecting bracket 2; the connecting part 3 is provided with a sealing glue grabbing hole 31;
in the implementation of the embodiment, the circular hole 11 and the waist-shaped process groove 12 formed in the integrated circuit bracket body 1 and the glue sealing and grabbing hole 31 formed in the connecting part 3 are used for quickly and accurately installing in place, so that the installation steps and time are saved; a plurality of die bonding and wire bonding area connecting supports 2 arranged on the integrated circuit support body 1 are sequentially arranged at equal intervals, so that the integrated circuit support can be accurately positioned and deviation can be avoided; the periphery of the outer diameter of the soil bag at the position where the chip 6 of the PAD area 5 on the integrated circuit support body 1 is fixed is reduced, so that the cost is saved, and the function is not reduced.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. A low-cost integrated circuit support structure, comprising: the die bonding and wire bonding integrated circuit comprises an integrated circuit support body (1) and a plurality of die bonding and wire bonding area connecting supports (2) arranged on the integrated circuit support body (1), wherein the die bonding and wire bonding area connecting supports (2) are sequentially arranged on one side of the integrated circuit support body (1), the end parts of the die bonding and wire bonding area connecting supports (2) are connected with connecting parts (3), die bonding and wire bonding areas (4) are arranged at the ends of the connecting parts (3), and a PAD area (5) is arranged in each die bonding and wire bonding area (4).
2. A low cost integrated circuit support structure according to claim 1, wherein: the PAD area (5) occupies one quarter to three quarters of the die bonding wire area (4).
3. A low cost integrated circuit support structure according to claim 1, wherein: the connecting part (3) is a square block.
4. A low cost integrated circuit support structure according to claim 1, wherein: the integrated circuit bracket comprises an integrated circuit bracket body (1), wherein a circular hole (11) and a waist-shaped process groove (12) are formed in the integrated circuit bracket body (1), the circular hole (11) and the waist-shaped process groove (12) are arranged at intervals and are arranged corresponding to the die bonding and wire bonding area connecting bracket (2).
5. A low cost integrated circuit support structure according to claim 1, wherein: the connecting part (3) is provided with a sealing glue grabbing hole (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020267392.9U CN211507622U (en) | 2020-03-06 | 2020-03-06 | Low cost IC support structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020267392.9U CN211507622U (en) | 2020-03-06 | 2020-03-06 | Low cost IC support structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211507622U true CN211507622U (en) | 2020-09-15 |
Family
ID=72402398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020267392.9U Expired - Fee Related CN211507622U (en) | 2020-03-06 | 2020-03-06 | Low cost IC support structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211507622U (en) |
-
2020
- 2020-03-06 CN CN202020267392.9U patent/CN211507622U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200915 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |