CN211503311U - Constant temperature circulating device for semiconductor equipment - Google Patents
Constant temperature circulating device for semiconductor equipment Download PDFInfo
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- CN211503311U CN211503311U CN201922468557.9U CN201922468557U CN211503311U CN 211503311 U CN211503311 U CN 211503311U CN 201922468557 U CN201922468557 U CN 201922468557U CN 211503311 U CN211503311 U CN 211503311U
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Abstract
The utility model provides a constant temperature circulating device for semiconductor equipment, including outer box, water tank, pump and heat exchanger, the inside circulation liquid that is equipped with of water tank, the top of water tank is provided with the water inlet, install the filter on the water inlet, the bottom of water tank is provided with the delivery port, delivery port department is provided with the outlet valve, the bottom of pump is provided with delivery port and water inlet, be provided with circulation liquid water inlet, circulation liquid delivery port, cold water inlet and cold water delivery port on the heat exchanger; the water outlet valve is connected with a water inlet of the pump, a water outlet of the pump is connected with a circulating liquid water inlet of the heat exchanger, and a circulating liquid water outlet of the heat exchanger is connected with the filter; the cold water inlet is connected with a device water supply pipe, and the cold water outlet is connected with a device water return pipe. The utility model discloses the device is the semiconductor equipment cooling through the circulating fluid, and the temperature and the water resistance value of circulating fluid are more stable and satisfy the demand, and the cooling effect is better.
Description
Technical Field
The utility model relates to a constant temperature equipment for semiconductor equipment belongs to semiconductor equipment technical field.
Background
The semiconductor is taken as an important conductive material, and is widely applied to the fields of computers, large-scale precision instruments and the like at present, in the using process of the semiconductor, when the semiconductor equipment works for a long time, the semiconductor equipment is inevitably accompanied with equipment heating, in order to ensure the normal operation of the equipment, the semiconductor equipment is often required to be provided with a refrigerating or constant temperature device, heating pipes, fans, refrigerating pieces and the like are commonly used at present, the most commonly used refrigerating pieces are circulating liquid refrigeration, and in the using circulating liquid refrigeration process, high requirements are provided for the temperature of the circulating liquid and the water resistance value of the circulating liquid.
Disclosure of Invention
In order to realize semiconductor device cooling demand, the utility model provides a constant temperature circulating device that semiconductor device used sets up circulation circuit and cooling circuit, utilizes the circulation liquid to absorb the heat that outside semiconductor device produced among the circulation circuit, for equipment cooling, cooling circuit provides cold water for the heat exchanger, then utilizes cold water to realize low-cost, accurate semiconductor cooling effect for the circulation liquid cooling of high temperature.
In order to solve the technical problem, the utility model discloses a following technical means:
a constant temperature circulating device for semiconductor equipment comprises an outer box body, a water tank, a pump and a heat exchanger, wherein a pipeline connecting port is formed in the front face of the outer box body, and the water tank, the pump and the heat exchanger are respectively and fixedly installed in the outer box body; the circulating liquid is filled in the water tank, a water inlet is formed in the top of the water tank, a filter is mounted on the water inlet, a water outlet is formed in the bottom of the water tank, a water outlet valve is arranged at the water outlet, a water outlet and a water inlet are formed in the bottom of the pump, and a circulating liquid water inlet and a circulating liquid water outlet are formed in the heat exchanger; the water outlet valve is connected with a water inlet of the pump, a water outlet of the pump is connected with one end of a pump-heat exchanger pipe, the other end of the pump-heat exchanger pipe is connected with a circulating liquid water inlet of the heat exchanger, a circulating liquid water outlet of the heat exchanger is connected with one end of a DI water supply pipe, the other end of the DI water supply pipe is connected with one end of an external equipment cooling pipe through the pipeline connecting port, the other end of the equipment cooling pipe is connected with one end of a DI water return pipe through the pipeline connecting port, and the other end of the DI water return pipe is connected with the; the heat exchanger is also provided with a cold water inlet and a cold water outlet, the cold water inlet is connected with one end of an equipment water supply pipe, the other end of the equipment water supply pipe is connected with an external cold water source through a pipeline connector, and the cold water outlet is connected with an equipment water return pipe.
Furthermore, one side fixed mounting of outer box has manometer, thermometer and water resistance controller, the upper end of pipeline connector is provided with cable water joint and aviation plug.
Furthermore, a floating ball liquid level switch is also arranged at the top of the water tank and is connected with a floating ball inside the water tank through a cable; the side fixed mounting of water tank has water resistance value sensor, first temperature sensor and level gauge, water resistance value sensor is connected with water resistance value controller, cable water joint and aviation plug electricity respectively, first temperature sensor is connected with thermometer, cable water joint and aviation plug electricity respectively, the level gauge is connected with manometer, cable water joint and aviation plug electricity respectively.
Furthermore, the filter adopts Y shape filter, it has resin to fill in the Y shape filter, and Y shape filter is through to silk and water tank water inlet threaded connection.
Further, the bottom of pump is provided with the screw hole, and the pump is through the bolt fixed mounting who matches with the screw hole in the outer box, is provided with the pump cushion at the contact site of pump and outer box.
Further, the heat exchanger adopts a plate heat exchanger.
Further, the device still is provided with flowmeter, second temperature sensor and pressure sensor, the flowmeter is installed on the DI water delivery pipe, second temperature sensor installs on the equipment water delivery pipe, pressure sensor installs on DI water delivery pipe and equipment water delivery pipe, second temperature sensor is connected with thermometer, cable water joint and aviation plug electricity respectively, pressure sensor is connected with manometer, cable water joint and aviation plug electricity respectively.
Furthermore, a U-shaped rubber strip is fixedly arranged on the pipeline connecting port.
Furthermore, ball valves are arranged on the equipment water supply pipe, the equipment water outlet pipe, the DI water supply pipe and the DI water return pipe.
The following advantages can be obtained by adopting the technical means:
the utility model provides a constant temperature circulating device that semiconductor equipment used, the internal portion of external container sets up the water tank outside this device, pump and heat exchanger, inside circulating liquid that is used for the semiconductor equipment cooling that is equipped with of water tank, the heat exchanger is used for cooling for circulating liquid, circulating liquid is under the effect of pump, flow into the heat exchanger from the water tank, the semiconductor equipment of treating the cooling through the pipeline flow who connects external equipment after the heat exchanger cooling, the heat that circulating liquid absorbed semiconductor equipment and produced becomes high temperature liquid, high temperature liquid flows back to the water tank, then the effect of re-pumping is flowed into the heat exchanger cooling once more, realize incessant circulation through the pump, realize the function for the semiconductor equipment cooling. Still be equipped with the cold water return circuit in the device, through the outside cold water source of pipe connection device, cold water flows through the heat exchanger and realizes circulation liquid cooling effect, through ball valve control cold water flow, and then realizes the temperature control to the circulation liquid, makes circulation liquid temperature invariant, and then realizes stable cooling effect. This device is provided with Y shape filter at the water inlet of water tank, filters the circulating fluid through the resin, reduces the impurity in the circulating fluid, and the water resistance value of control circulating fluid satisfies the requirement of this device to the water resistance value.
Drawings
Fig. 1 is a schematic structural view of a constant temperature circulating device for a semiconductor device according to the present invention.
Fig. 2 is a front view of the constant temperature circulating device for semiconductor equipment of the present invention.
Fig. 3 is a schematic diagram of an internal structure of a constant temperature circulation device for a semiconductor device according to the present invention.
Fig. 4 is a schematic structural diagram of a water tank in the device of the present invention.
Fig. 5 is a schematic structural diagram of a pump in the device of the present invention.
Fig. 6 is a schematic structural diagram of a heat exchanger in the device of the present invention.
In the figure, 1, an outer box body, 2, a water tank, 3, a pump, 4, a heat exchanger, 5, a pressure gauge, 6, a thermometer, 7, a water resistance value controller, 8, a pipeline connector, 9, a cable waterproof joint, 10, an aviation plug, 11, a hinge, 12, a door lock, 13, a water outlet, 14, a water outlet valve, 15, a water inlet, 16, a floating ball liquid level switch, 17, a water resistance value sensor, 18, a first temperature sensor, 19, a liquid level meter, 20, a Y-shaped filter, 21, a wire, 22, a pressure relief valve, 23, a flow switch, 24, a quick connector, 25, a quick connector, 26, a liquid discharge valve, 27, a steel wire hose, 28, a pagoda connector, 29, a rubber pipe, 30, a pump rubber pad, 31, pump-heat exchange, 32, DI water supply pipe, 33, DI water return pipe, 34, an equipment water supply pipe, 35, an upper part of the equipment water return pipe, 36 and a lower part of the equipment water, 37. a flowmeter, 38, a second temperature sensor, 39, a pressure sensor, 40, a ball valve, 41 and a mounting base.
Detailed Description
The technical scheme of the utility model is further explained by combining the attached drawings as follows:
in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
A constant temperature circulating device for semiconductor equipment is disclosed, as shown in figures 1-3, the device mainly comprises an outer box body 1, a water tank 2, a pump 3 and a heat exchanger 4, a plurality of mounting bases are fixed on a bottom panel inside the outer box body, the water tank and the pump are respectively fixed on the mounting bases through bolts, the heat exchanger is hung on the inner wall of the outer box body, and the water tank, the pump and the heat exchanger are connected into a circulating loop through pipelines. The front side of the outer box body is provided with a pipeline connecting port 8, external equipment can be connected with devices inside the outer box body through the pipeline connecting port, a U-shaped adhesive tape is fixedly installed on the pipeline connecting port, and a pipeline penetrating through the pipeline connecting port can be protected when the external equipment is connected. One side fixed mounting of box has manometer 5, thermometer 6 and water resistance value controller 7 outside, and manometer, thermometer and water resistance value controller are used for showing pressure value, temperature value and water resistance value respectively, are provided with cable water joint 9 and aviation plug 10 in the upper end of pipeline connector, and cable water joint and aviation plug are used for connecting the host computer, can be with the signal transmission to the host computer that device inside was gathered. In order to facilitate the inspection and maintenance of devices inside the outer box body, a hinge 11 is further arranged on the side face of the outer box body, a door lock 12 is installed on the hinge, the door lock is opened when the inspection or maintenance is needed, and the devices inside the outer box body can be directly operated by opening the hinge.
The inside circulation liquid that is equipped with of water tank, circulation liquid mainly is used for cooling for outside semiconductor equipment. As shown in fig. 4, the top of the water tank is provided with a water inlet 15, a float ball level switch 16 and a flow switch 23, a filter is installed above the water inlet, a Y-shaped filter 20 is specifically adopted by the filter, resin is filled in the Y-shaped filter, and the Y-shaped filter is in threaded connection with the water inlet of the water tank through a pair of threads 21. The floater liquid level switch passes through the inside floater of cable junction water tank for the inside liquid level of measuring water tank, and floater liquid level switch can be outside through cable water joint or aviation plug connecting device. There are level gauge 19 and quick connector 24 at one side fixed mounting of water tank, the both ends of level gauge pass through the bolt fastening on the water tank, the level gauge respectively with the manometer, cable water joint and aviation plug electricity are connected, a pressure for measuring in the water tank, and can transmit the pressure value of measuring for manometer and host computer through the cable, install quick connector 25 on quick connector, when not using quick connector, quick connector can play and block up and guard action. The water resistance value sensor 17 is installed on the other side of the water tank through threads, the first temperature sensor 18, the pressure release valve 22 and the liquid discharge valve 26 are installed on the other side of the water tank, the water resistance value sensor is respectively connected with the water resistance value controller, the cable waterproof connector is electrically connected with the aviation plug, the water resistance value for measuring the internal circulation liquid of the water tank is used, the first temperature sensor is respectively connected with the thermometer, the cable waterproof connector is electrically connected with the aviation plug, the temperature for measuring the internal circulation liquid of the water tank is used, the water resistance value controller and the first temperature sensor can respectively transmit the measured water resistance value and the measured temperature value to the water resistance value controller through cables, the thermometer and the upper computer. The bottom of the water tank is provided with a water outlet 13 which is connected with a water outlet valve 14 through a pair of threads 21.
As shown in fig. 5, the bottom of the pump is provided with a water outlet 13 and a water inlet 15, the water outlet is connected with a section of steel wire hose 27 through a pagoda joint 28, and the water outlet is connected with a section of rubber tube 29 through a pagoda joint. The bottom of the pump is provided with a screw hole, the pump is fixedly installed on an installation base in the outer box body through a bolt matched with the screw hole, in order to increase friction and avoid looseness of the pump in the moving process of the device, and a pump rubber pad 30 is arranged at the contact part of the pump and the installation base.
The heat exchanger adopts a plate type heat exchanger, 4 openings are arranged on the heat exchanger and respectively comprise a circulating liquid water inlet, a circulating liquid water outlet, a cold water inlet and a cold water outlet, as shown in figure 6, the circulating liquid water inlet is connected with a pump-heat exchanger pipe 31, the circulating liquid water outlet is connected with a DI water supply pipe 32, the cold water inlet is connected with a device water supply pipe 34, the cold water outlet is connected with a device water return pipe, and the device water return pipe is divided into a device water return pipe upper part 35 and a device water return pipe lower part 36 due to the limited inner space of the outer box body. The device is also provided with a flow meter 37, a second temperature sensor 38 and a pressure sensor 39, wherein the flow meter 37 is installed on the DI water supply pipe and used for detecting the flow of the circulating liquid in the DI water supply pipe, the flow meter is electrically connected with the cable waterproof connector and the aviation plug, the second temperature sensor 38 is installed on the equipment water supply pipe and used for detecting the temperature of the cold water in the equipment water supply pipe, the second temperature sensor is respectively electrically connected with the temperature meter, the cable waterproof connector and the aviation plug, the pressure sensor 39 is jointly installed on the DI water supply pipe and the equipment water supply pipe and used for respectively measuring the pressure values of the circulating liquid and the cold water, and the pressure sensors are respectively electrically connected with the pressure meter, the cable waterproof connector and the aviation plug.
As can be seen from fig. 3-6, the water outlet valve of the water tank is connected to the water inlet of the pump through a steel wire hose, the rubber pipe at the water outlet of the pump is connected to the pump-heat exchanger pipe, so as to realize the connection between the water outlet of the pump and the circulating liquid water inlet of the heat exchanger, the circulating liquid water outlet of the heat exchanger is connected to one end of the DI water supply pipe, the other end of the DI water supply pipe can be connected to one end of the external equipment cooling pipe through a pipe connector, the equipment cooling pipe is generally designed according to a specific application scene, the equipment cooling pipe is fixed beside the semiconductor equipment to be cooled, the other end of the equipment cooling pipe is connected to one end of the DI water return pipe 33 through a pipe connector, and the other end; the cold water inlet of heat exchanger connects the one end of equipment water delivery pipe, and the other end of equipment water delivery pipe passes through the outside cold water source of pipe connection mouth connection, and the cold water outlet of heat exchanger connects the one end of equipment water wet return, and equipment wet return lug connection needs the department to the device outside. Ball valves 40 are installed on the service water supply pipe, the service water outlet pipe, the DI water supply pipe and the DI water return pipe in order to control the flow direction and flow rate of the liquid in the respective pipes.
The utility model discloses the theory of operation of device as follows:
the utility model discloses the device includes circulation circuit and cooling circuit, in circulation liquid return circuit, circulation liquid in the water tank is beaten away by the pump, after the heat exchanger cooling, it is outside to transmit the device from DI water delivery pipe, cool off the semiconductor equipment of outside, circulation liquid through equipment becomes high temperature liquid, rethread DI water return pipe flow return water tank, circulation liquid is at the circulation in-process, through the resin filtration in the Y shape filter, form the deionized water, obtain the resistivity that satisfies the requirement, realize the requirement of equipment to water resistance value. In the cooling water return circuit, directly introduce cold water from the device outside, cold water flows into the heat exchanger by equipment water delivery pipe, cools down the circulation liquid of high temperature, then flows out through equipment water wet return, can control the flow of cold water through the ball valve, and then the temperature of control circulation liquid.
The utility model discloses the function of semiconductor equipment cooling is realized through incessant endless circulating liquid to the device, and cold water accessible ball valve control in the device to guarantee circulating liquid constancy of temperature, and then realize stable cooling effect. This device is provided with Y shape filter at the water inlet of water tank, filters the circulating fluid through the resin, reduces the impurity in the circulating fluid, and the water resistance value of control circulating fluid satisfies the requirement of this device to the water resistance value.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (9)
1. A constant temperature circulating device for semiconductor equipment comprises an outer box body, a water tank, a pump and a heat exchanger, and is characterized in that a pipeline connecting port is formed in the front face of the outer box body, and the water tank, the pump and the heat exchanger are fixedly arranged in the outer box body respectively;
the circulating liquid is filled in the water tank, a water inlet is formed in the top of the water tank, a filter is mounted on the water inlet, a water outlet is formed in the bottom of the water tank, a water outlet valve is arranged at the water outlet, a water outlet and a water inlet are formed in the bottom of the pump, and a circulating liquid water inlet and a circulating liquid water outlet are formed in the heat exchanger;
the water outlet valve is connected with a water inlet of the pump, a water outlet of the pump is connected with one end of a pump-heat exchanger pipe, the other end of the pump-heat exchanger pipe is connected with a circulating liquid water inlet of the heat exchanger, a circulating liquid water outlet of the heat exchanger is connected with one end of a DI water supply pipe, the other end of the DI water supply pipe is connected with one end of an external equipment cooling pipe through the pipeline connecting port, the other end of the equipment cooling pipe is connected with one end of a DI water return pipe through the pipeline connecting port, and the other end of the DI water return pipe is connected with the;
the heat exchanger is also provided with a cold water inlet and a cold water outlet, the cold water inlet is connected with one end of an equipment water supply pipe, the other end of the equipment water supply pipe is connected with an external cold water source through a pipeline connector, and the cold water outlet is connected with an equipment water return pipe.
2. The constant temperature circulating device for the semiconductor equipment as claimed in claim 1, wherein a pressure gauge, a temperature gauge and a water resistance controller are fixedly installed at one side of the outer box, and a cable waterproof joint and an aviation plug are arranged at the upper end of the pipeline connecting port.
3. The constant-temperature circulating device for the semiconductor equipment as claimed in claim 2, wherein a float level switch is further arranged at the top of the water tank, and the float level switch is connected with a float inside the water tank through a cable; the side fixed mounting of water tank has water resistance value sensor, first temperature sensor and level gauge, water resistance value sensor is connected with water resistance value controller, cable water joint and aviation plug electricity respectively, first temperature sensor is connected with thermometer, cable water joint and aviation plug electricity respectively, the level gauge is connected with manometer, cable water joint and aviation plug electricity respectively.
4. The constant temperature circulating device for the semiconductor equipment as claimed in claim 1, wherein the filter is a Y-shaped filter filled with resin, and the Y-shaped filter is screwed with the water inlet of the water tank by a counter thread.
5. The constant temperature circulating device for the semiconductor device as claimed in claim 1, wherein a screw hole is formed at the bottom of the pump, the pump is fixedly installed in the outer case through a bolt matched with the screw hole, and a pump rubber pad is disposed at a contact portion of the pump and the outer case.
6. The constant-temperature circulating device for the semiconductor equipment as claimed in claim 1, wherein the heat exchanger is a plate heat exchanger.
7. The constant temperature circulation device for semiconductor equipment as claimed in claim 2, wherein a flow meter, a second temperature sensor and a pressure sensor are further provided, the flow meter is installed on the DI water supply pipe, the second temperature sensor is installed on the equipment water supply pipe, the pressure sensor is installed on the DI water supply pipe and the equipment water supply pipe, the second temperature sensor is electrically connected with the thermometer, the cable waterproof connector and the aviation plug respectively, and the pressure sensor is electrically connected with the pressure gauge, the cable waterproof connector and the aviation plug respectively.
8. The constant temperature circulating device for a semiconductor apparatus according to claim 1, wherein a U-shaped rubber strip is fixedly mounted on the pipe connection port.
9. The constant temperature circulating apparatus for semiconductor device as claimed in claim 1, wherein ball valves are installed on the device water supply pipe, the device water outlet pipe, the DI water supply pipe and the DI water return pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922468557.9U CN211503311U (en) | 2019-12-31 | 2019-12-31 | Constant temperature circulating device for semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922468557.9U CN211503311U (en) | 2019-12-31 | 2019-12-31 | Constant temperature circulating device for semiconductor equipment |
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| CN211503311U true CN211503311U (en) | 2020-09-15 |
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| CN201922468557.9U Active CN211503311U (en) | 2019-12-31 | 2019-12-31 | Constant temperature circulating device for semiconductor equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113985979A (en) * | 2021-10-25 | 2022-01-28 | 上海影谱科技有限公司 | Server water-cooling system |
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2019
- 2019-12-31 CN CN201922468557.9U patent/CN211503311U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113985979A (en) * | 2021-10-25 | 2022-01-28 | 上海影谱科技有限公司 | Server water-cooling system |
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