CN211466987U - Superfine diamond wire saw for stone cutting and forming - Google Patents
Superfine diamond wire saw for stone cutting and forming Download PDFInfo
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- CN211466987U CN211466987U CN201922399230.0U CN201922399230U CN211466987U CN 211466987 U CN211466987 U CN 211466987U CN 201922399230 U CN201922399230 U CN 201922399230U CN 211466987 U CN211466987 U CN 211466987U
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Abstract
The utility model provides a super fine diamond wire saw that stone material was opened board and is taken shape usefulness and manufacturing method thereof, be 0.6-2 mm's copper wire including the diameter, be equipped with insulating layer and non-insulating layer on the copper wire, the length of non-insulating layer is 1-8mm, and the length of insulating layer is 3-30mm, and insulating layer and non-insulating layer are alternate to be set up, and the external diameter of insulating layer is less than the external diameter of non-insulating layer, and the non-insulating layer is the diamond layer, adopts the mode of electroplating with diamond layer and the alternate setting of insulating layer. Adopt this superfine diamond wire saw to process the stone material, the little effectual play material rate that improves the stone material in cutting clearance has reduced the loss to the stone material, has improved cutting accuracy simultaneously, makes the stone material roughness after the cutting low, has improved the chip removal ability of superfine diamond wire saw simultaneously, the improvement of the superfine diamond wire saw cutting efficiency and life of being convenient for.
Description
Technical Field
The utility model relates to the field of cutting of hard and brittle materials, in particular to a superfine diamond wire saw for stone slab cutting and forming and a manufacturing method thereof.
Background
The plate is firstly processed into a rough plate in the stone industry by adopting a pendulum type sand saw and a free mortar superfine diamond rope saw, along with the development of stone cutting machinery, the rough plate processing of marble rough materials by adopting a diamond frame saw appears, and a circular saw, a band saw and a diamond string bead rope saw appear in succession.
The manufacturing method is that diamond is fixed on a bead steel matrix through an electroplating or powder metallurgy method to manufacture diamond beads, then the diamond beads are connected through steel wire ropes, and the beads are separated by plastic to form the rope saw cutting tool. The method is widely applied to quarry stone exploitation, reinforced concrete engineering cutting, large panel sawing forming cutting and the like. In addition, a wire saw superfine diamond wire saw for fixing a layer of diamond by inlaying electrodeposited nickel is also provided, the wire saw superfine diamond wire saw is small in diameter (0.045-0.1 mm) but mainly used for cutting silicon wafers in the photovoltaic industry, and has the characteristics of small cutting gap and high outturn rate when cutting hard and brittle materials, but can only cut 210 mm-210 mm small-size silicon wafers to the maximum extent, for example, the wire saw superfine diamond wire saw is directly used for cutting stone materials to open large plates. These problems can exist: 1. the breaking force of the steel wire is low, the tension is large during cutting, and the wire is easy to break; 2. the large stone plate has large size, cutting scraps are easy to block during cutting, and the cutting scraps are difficult to discharge; 3. the diamond fine and superfine diamond rope saw has high manufacturing cost and cannot be used for economical and practical processing.
The patent No. CN203566873U discloses a heterogeneous fixed abrasive sawing wire for multi-wire cutting, wherein a bus is a metal wire with a circular or approximately circular section, the diameter of the metal wire is between 0.05mm and 0.50mm, and the bus is a base metal wire for fixing a cutting abrasive; the surface of the bus is regularly covered with a stress partition bonding layer for fixing cutting abrasive, and the stress partition bonding layer is a metal electroplated layer and/or an alloy layer; the surface of the saw wire is covered with a grinding dynamic chip removal layer.
The conventional superfine diamond rope saw has the following defects when used for stone slab cutting forming cutting: 1. the used rope saws have the diameter of 6mm at least, and the cutting gaps are wide, so that the processing yield is low, the cutting efficiency is low, the waste material loss is as high as 40%, and stone resources are wasted; 2. the processing precision of the plate is low, the surface of the cut rough plate is rough, and the leveling and polishing quantity of the subsequent rough plate is large; 3. and the stone processing produces a lot of debris and dust materials, and has environmental problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the above-mentioned not enough of prior art, and provide a cutting gap is little, and cutting accuracy is high, and the chip removal ability is strong, is convenient for improve cutting efficiency and life's stone material and opens the superfine diamond wire saw of board shaping usefulness and manufacturing method thereof.
The technical scheme of the utility model is that: a superfine diamond rope saw for stone slab cutting and forming comprises a steel wire with the diameter of 0.6-2mm, wherein an insulating layer and a non-insulating layer are arranged on the steel wire, the length of the non-insulating layer is 1-8mm, the length of the insulating layer is 3-30mm, the insulating layer and the non-insulating layer are arranged alternately, and the outer diameter of the insulating layer is smaller than that of the non-insulating layer.
The advantage of this scheme lies in, adopts this superfine diamond wire saw to process the stone material, and the little effectual outturn percentage that has improved the stone material in cutting clearance has reduced the loss to the stone material, has improved cutting accuracy simultaneously, makes the stone material roughness after the cutting low, has improved the chip removal ability of superfine diamond wire saw simultaneously, the improvement of the superfine diamond wire saw cutting efficiency and life of being convenient for.
Further, the outer diameter of the insulating layer is at least 0.1mm smaller than that of the non-insulating layer.
Preferably, the outer diameter of the insulating layer is 0.1-1mm smaller than the outer diameter of the non-insulating layer.
More preferably, the outer diameter of the insulating layer is 0.3-0.8mm smaller than the outer diameter of the non-insulating layer.
Most preferably, the outer diameter of the insulating layer is less than 0.5mm than the outer diameter of the non-insulating layer. The cutting efficiency of superfine diamond wire saw is convenient for improve, the wearing and tearing to the insulating layer of being convenient for reduce simultaneously, and further reduction is to the damage of copper wire, makes the life of superfine diamond wire saw longer.
Further, the insulating layer is made of an insulating material which is corrosion-resistant and has wear resistance. The steel wire is protected conveniently, the steel wire is prevented from being abraded, corroded and rusted, and the service life of the steel wire is prolonged.
Further, the length of the non-insulating layer is 2-5mm, and the length of the insulating layer is 5-20 mm.
Preferably, the length of the non-insulating layer is 4mm and the length of the insulating layer is 5-10 mm.
More preferably, the length of the non-insulating layer is 4mm and the length of the insulating layer is 6, 8, 10, 12 or 15 mm.
Further, the non-insulating layer and the insulating layer are distributed at equal intervals. The ultrafine diamond wire saw is uniformly stressed due to the adoption of the equal-interval distribution, so that the service life of the ultrafine diamond wire saw is prolonged; meanwhile, different distribution modes can be adopted, and a plurality of sizes are set like an insulating layer on one steel wire, such as: 6mm and 15 mm's insulating layer alternate setting, or interval setting etc. the interval between two adjacent insulating layers is equal, is convenient for prevent the emergence of cutting in-process card saw.
Furthermore, the breaking force of the steel wire is more than 600N, the wire diameter is less than 2mm, and the torsion is more than 30 circles/meter.
Further, the non-insulating layer is formed by using 30-120 mesh diamonds as an inner layer of the composite abrasive particles and a diamond outer layer which is externally reinforced and plated with the composite abrasive particles.
Preferably, the composite abrasive particles are made of 40-60 meshes of diamond, and the reinforced plated diamond is 80-300 meshes. More preferably, the composite abrasive particles are 50-mesh diamonds, and the reinforced plated diamonds are 100-mesh diamonds. The joint strength between the inner layer and the outer layer of the diamond is convenient to improve, the overall structure strength of the diamond layer is convenient to improve, the service life of the diamond rope saw is convenient to improve, the cutting effect of the superfine diamond rope saw can be guaranteed, the undersize of diamond particles is avoided, and the cutting efficiency is low.
Furthermore, the diameter of the superfine diamond wire saw is 0.6-2.8 mm. Preferably, the diameter of the superfine diamond wire saw is 1-2.5 mm; more preferably, the diameter of the ultra-fine diamond wire saw is 2.2 mm. The diameter is the maximum diameter of the superfine diamond wire saw, namely the outer diameter of the superfine diamond wire saw, so that the cutting precision is convenient to improve, the cutting error is reduced, and the cutting yield of the stone is improved.
A preparation method of a superfine diamond wire saw for stone slab cutting forming is provided.
Further, the preparation method of the superfine diamond wire saw for stone slab opening forming comprises the following steps:
firstly, processing a steel wire insulating layer, namely selecting a steel wire with breaking force larger than 600N, wire diameter smaller than 2mm and torsion larger than 30 circles/meter; coating insulating layers on the steel wire in a continuous uniform thickness and uniform gaps, wherein the length of each insulating layer is 3-30mm, the insulating layers are arranged at intervals of 1-8mm, and the insulating material is anticorrosive and has certain wear resistance;
second, pretreatment
Oil removal: removing dirt and oil stains on the gap insulated steel wire by using an oil removing agent;
derusting: removing an oxide layer on the steel wire;
pre-plating: plating a bonding bottom layer on the uninsulated part of the steel wire;
step three, sanding and composite plating: placing the steel wire pretreated in the second step in a composite plating working tank, selecting diamond with 30-120 meshes subjected to surface metallization pretreatment as composite abrasive particles, and plating the non-insulated part of the steel wire with the diamond in a composite way;
fourthly, reinforcing plating: and (3) further thickening the coating layer by the sand composite plating in the third step, and completely covering the steel wire or the sand composite plating to form the gap electroplating superfine diamond wire saw with cutting capability.
This superfine diamond wire saw of live time is installed on stone material group saw cuts the cutting machine tool for processing the stone material, the superfine diamond wire saw in this scheme of adoption is processed the stone material, has following characteristics: 1. the cutting gap of the stone is small (the gap is less than 3 mm), so that the outturn percentage of the raw stone is high (more than 80%); 2. the cutting precision is high (up to 0.2mm), and the surface roughness is low (less than 0.1 mm); 3. the superfine diamond wire saw has strong chip removal capability during cutting, and is not easy to block when cutting large-size rough stones; 4. the linear cutting speed range is wide (10-50 m/s); 5. the superfine diamond wire saw has high breaking force, can increase the tension for cutting, and has high cutting efficiency (the cutting feed amount is 0.2-0.5 m/min).
The detailed structure of the present invention will be further described with reference to the accompanying drawings and the detailed description.
Drawings
FIG. 1 is a steel wire effect diagram after insulation treatment;
FIG. 2 is a schematic diagram of the shape and structure of an intermittent electroplating superfine diamond rope saw;
FIG. 3 is a flow chart of the manufacturing process of the ultra-fine diamond wire saw;
1-steel wire 1, 2-insulating layer 2, 3-diamond layer 3.
Detailed Description
As shown in the attached drawings: the utility model provides a super fine diamond wire saw that stone material division board takes shape usefulness, this super fine diamond wire saw's diameter is 2.8mm, is 0.6-2 mm's copper wire 1 including the diameter, is equipped with insulating layer 2 and non-insulating layer 2 on the copper wire 1, non-insulating layer 2's length is 1-8mm, and insulating layer 2's length is 3-30mm, and insulating layer 2 and non-insulating layer 2 alternate setting, and insulating layer 2's external diameter is less than non-insulating layer 2's external diameter, and non-insulating layer 2 is diamond layer 3, is convenient for improve the cutting precision, reduces cutting error, improves the cutting yield to the stone material.
The insulating layer 2 is made of insulating materials such as rubber, resin and the like, and the outer diameter of the insulating layer 2 is at least 0.1mm smaller than that of the non-insulating layer 2. Preferably, the outer diameter of the insulating layer 2 is 0.1-1mm smaller than the outer diameter of the non-insulating layer 2. More preferably, the outer diameter of the insulating layer 2 is 0.3-0.8mm smaller than the outer diameter of the non-insulating layer 2. Optimally, the outer diameter of the insulating layer 2 is less than 0.5mm than the outer diameter of the non-insulating layer 2. The cutting efficiency of superfine diamond wire saw is convenient for improve, the wearing and tearing to insulating layer 2 of being convenient for reduce simultaneously, and further reduction is to the damage of copper wire 1, makes the life of superfine diamond wire saw longer.
The insulating layer 2 is made of an insulating material which is corrosion-resistant and has wear resistance. The steel wire 1 is protected conveniently, the steel wire 1 is prevented from being worn and corroded to rust, and the service life of the steel wire 1 is prolonged.
The length of the non-insulating layer 2 is 2-5mm, and the length of the insulating layer 2 is 5-20 mm. Preferably, the length of the non-insulating layer 2 is 4mm and the length of the insulating layer 2 is 5-10 mm. More preferably, the length of the non-insulating layer 2 is 4mm and the length of the insulating layer 2 is 6, 8, 10, 12 or 15 mm. The non-insulating layer 2 and the insulating layer 2 are distributed at equal intervals. The ultrafine diamond wire saw is uniformly stressed due to the adoption of the equal-interval distribution, so that the service life of the ultrafine diamond wire saw is prolonged;
in another embodiment, the insulating layers 2 are distributed differently, as the insulating layers 2 on one steel wire 1 are provided with a plurality of sizes, such as: 6mm and 15 mm's insulating layer 2 alternate setting, or interval setting etc. the interval between two adjacent insulating layers 2 is equal, is convenient for prevent the emergence of cutting in-process card saw.
The breaking force of the steel wire 1 is more than 600N, the wire diameter is less than 2mm, and the torsion is more than 30 circles/meter. Preferably, the breaking force of the steel wire 1 is 1000N, the wire diameter is 1.5mm, and the steel wire is twisted for 60 circles/meter, so that the structural strength of the superfine diamond wire saw is improved and the service life of the superfine diamond wire saw is prolonged.
The non-insulating layer 2 is formed by using 30-80 mesh diamond as an inner layer of composite abrasive particles and a diamond outer layer outside the composite abrasive particles. Preferably, the composite abrasive particles are made of 40-120 meshes of diamond, and the reinforced plated diamond is 80-300 meshes. More preferably, the composite abrasive particles are 50-mesh diamonds, and the reinforced plated diamonds are 100-mesh diamonds. The joint strength between the inner layer and the outer layer of the diamond is convenient to improve, the overall structure strength of the diamond layer 3 is convenient to improve, the service life of the diamond rope saw is convenient to improve, the cutting effect of the superfine diamond rope saw can be guaranteed, the undersize of diamond particles is avoided, and the cutting efficiency is low.
Adopt this superfine diamond wire saw to process the stone material, the little effectual play material rate that improves the stone material in cutting clearance has reduced the loss to the stone material, has improved cutting accuracy simultaneously, makes the stone material roughness after the cutting low, has improved the chip removal ability of superfine diamond wire saw simultaneously, the improvement of the superfine diamond wire saw cutting efficiency and life of being convenient for.
The preparation method of the superfine diamond wire saw for stone plate opening and forming comprises the following treatment processes:
firstly, processing an insulating layer 2 of a steel wire 1, selecting the steel wire 1 with breaking force larger than 600N, wire diameter smaller than 2mm and torsion larger than 30 circles/meter; the method comprises the following steps that an insulating layer 2 is continuously coated on a steel wire 1 in a uniform thickness and in a uniform gap mode, the length of the insulating layer 2 is 3-30mm, the insulating layer 2 is arranged at intervals of 1-8mm, and an insulating material is anticorrosive and has certain wear resistance;
second, pretreatment
Oil removal: removing dirt and oil stains on the gap insulated steel wire 1 in the first step by using an oil removing agent; after oil removal, washing with water, wherein pure water can be adopted for washing;
derusting: removing an oxide layer on the surface of the steel wire 1 after washing, washing again after removing, and washing by using pure water;
pre-plating: plating a bonding bottom layer on the uninsulated part of the steel wire 1, so as to improve the bonding between the subsequent diamond and the steel wire 1 and improve the structural strength of the steel wire;
step three, sanding and composite plating: placing the steel wire 1 pretreated in the second step in a composite plating working tank, selecting diamond with 30-120 meshes subjected to surface metallization pretreatment as composite abrasive particles, and plating the non-insulated part of the steel wire 1 with the diamond in a composite way;
fourthly, reinforcing plating: and (3) further thickening the coating by the sand composite plating in the third step, wherein the diamond of the thickened coating is a diamond of 100 meshes, the steel wire 1 or the sand composite plating is completely covered, and the thickness of the covering layer is 0.1-1mm, so that the service life of the superfine diamond wire saw is conveniently prolonged, and the gap electroplated superfine diamond wire saw with cutting capacity is formed.
The superfine diamond rope saw is arranged on a stone group saw cutting machine tool and used for processing stone, the superfine diamond rope saw in the scheme is adopted to process the stone, the cutting gap of the stone is 2mm), and the outturn percentage of the rough stone is 90 percent higher; the cutting precision is high and can reach 0.2mm, and the surface roughness is low and is 0.05 mm; the superfine diamond wire saw has strong chip removal capability during cutting, and is not easy to block when cutting large-size rough stones; the cutting line speed range is 10-50 m/s, and the optimal cutting line speed is 45 m/s; the superfine diamond wire saw has high breaking force, can increase the tension for cutting, has high cutting efficiency, and can reach the fastest cutting feed amount of 0.5 m/min.
The preferred embodiments of the present invention have been described in detail above, but it is apparent that the present invention is not limited to the above embodiments. The technical idea of the utility model within the scope, can be right the utility model discloses a technical scheme carries out multiple equivalent variant, and these equivalent variants all belong to the utility model discloses a protection scope. In addition, it should be noted that the technical features described in the above embodiments may be separately and independently combined as long as they are within the technical concept of the present invention.
Claims (8)
1. The utility model provides a super fine diamond wire saw of shaping usefulness is opened to stone material, includes that the diameter is 0.6-2 mm's copper wire, is equipped with insulating layer and non-insulating layer on the copper wire, its characterized in that: the length of the non-insulating layer is 1-8mm, the length of the insulating layer is 3-30mm, the insulating layer and the non-insulating layer are arranged at intervals, and the outer diameter of the insulating layer is smaller than that of the non-insulating layer.
2. The ultra-fine diamond wire saw for stone slab splitting according to claim 1, wherein: the outer diameter of the insulating layer is at least 0.1mm smaller than that of the non-insulating layer.
3. The ultra-fine diamond wire saw for stone slab splitting according to claim 2, wherein: the insulating layer is made of an insulating material which is corrosion-resistant and has wear resistance.
4. The ultra-fine diamond wire saw for stone slab splitting according to claim 1, wherein: the length of the non-insulating layer is 2-5mm, and the length of the insulating layer is 5-20 mm.
5. The ultra-fine diamond wire saw for stone slab splitting according to claim 4, wherein: the non-insulating layer and the insulating layer are distributed at equal intervals.
6. The ultra-fine diamond wire saw for stone slab splitting according to claim 1, wherein: the breaking force of the steel wire is more than 600N, the wire diameter is less than 2mm, and the torsion is more than 30 circles/meter.
7. The ultra-fine diamond wire saw for stone slab splitting according to claim 1, wherein: the non-insulating layer is formed by taking 30-120 meshes of diamond as an inner layer of the composite abrasive particles and a diamond outer layer which is externally reinforced and plated with the composite abrasive particles.
8. The ultra-fine diamond wire saw for stone slab splitting according to any one of claims 1 to 7, wherein: the diameter of the superfine diamond wire saw is 0.6-2.8 mm.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110883947A (en) * | 2019-12-27 | 2020-03-17 | 长沙百川超硬材料工具有限公司 | Superfine diamond wire saw for stone plate-cutting forming and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110883947A (en) * | 2019-12-27 | 2020-03-17 | 长沙百川超硬材料工具有限公司 | Superfine diamond wire saw for stone plate-cutting forming and manufacturing method thereof |
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Effective date of registration: 20230403 Address after: No. 32, Chatingsi Road, Chengjiao Street, Ningxiang City, Changsha City, Hunan Province 410600 Patentee after: Changsha Baitong New Material Technology Co.,Ltd. Address before: 410600 Chezhan Road, Ningxiang Economic Development Zone, Changsha City, Hunan Province Patentee before: CHANGSHA BAICHUAN SUPERHARD MATERIAL TOOLS Co.,Ltd. |