CN211457814U

CN211457814U - Heat dissipation device of integrated circuit board

Info

Publication number: CN211457814U
Application number: CN201922326206.4U
Authority: CN
Inventors: 纪冰
Original assignee: Chizhou Xinsheng Electronic Technology Co ltd
Current assignee: Chizhou Xinsheng Electronic Technology Co ltd
Priority date: 2019-12-20
Filing date: 2019-12-20
Publication date: 2020-09-08
Anticipated expiration: 2029-12-20

Abstract

The utility model discloses an integrated circuit board heat abstractor, including gear box, mount pad, catheter, air duct, first gear, second gear, incomplete gear, pivot, third gear, fourth gear, axostylus axostyle, motor, mounting groove, apron, gag lever post, lead screw, blast pipe, coolant liquid chamber, shower nozzle, drive seat, baffle, through wires hole, commentaries on classics board, air exhauster, refrigeration chamber, semiconductor refrigeration piece and heat-conducting plate. The utility model discloses a through setting up the mutual cooperation between air duct, semiconductor refrigeration piece, lead screw, shower nozzle, coolant liquid chamber and the refrigeration chamber, can be better dispel the heat to integrated circuit plate, make the radiating of integrated circuit board more quick, abundant, very big improvement radiating efficiency, also avoided the chinese characters to be high to integrated circuit board burning loss simultaneously; the clockwise and anticlockwise rotation that relapse of drive lead screw that can be better, very big improvement work efficiency, also strengthened the practicality simultaneously.

Description

Heat dissipation device of integrated circuit board

Technical Field

The utility model relates to a heat abstractor specifically is an integrated circuit board heat abstractor belongs to integrated circuit board technical field.

Background

An integrated circuit board is a miniature electronic device or component, and adopts a certain process to interconnect elements such as transistors, resistors, capacitors, inductors and the like required in a circuit and wiring, and the elements are manufactured on one or more small semiconductor wafers or medium substrates and then packaged in a tube shell to form a miniature structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability.

When the integrated circuit board in the existing computer host dissipates heat, most of the integrated circuit board dissipates heat through the heat dissipation fan, and the host case is large, so that the heat generated by the integrated circuit board is difficult to dissipate, the heat dissipation efficiency is greatly reduced, the heat dissipation effect is not obvious, and the integrated circuit board is easily burnt by overhigh temperature. Therefore, a heat dissipation device for an integrated circuit board is proposed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a heat sink for an integrated circuit board.

The utility model achieves the above purpose through the following technical proposal, the integrated circuit board heat dissipation device comprises a mounting seat and a gear case arranged on the side wall of the mounting seat, the inner side wall of the mounting seat is fixedly connected with a clapboard, the bottom end of the clapboard is fixedly connected with a heat conducting plate, the heat conducting plate is used for sequentially dividing the inner cavity of the mounting seat below the clapboard into a cooling liquid cavity and a refrigeration cavity from left to right, the inner side wall of the refrigeration cavity is embedded and provided with a semiconductor refrigeration sheet, the inner side wall of the mounting seat is sequentially matched with two horizontally arranged lead screws from top to bottom in a rotating way, the surface of the lead screw is connected with a driving seat in a threaded way, the top end of the driving seat is fixedly connected with a nozzle, one end of the nozzle is fixedly connected with an exhaust pipe, one end of the lead screw penetrates through the inner side wall, the mount pad lateral wall articulates there is the commentaries on classics board, the through wires hole has been seted up on the commentaries on classics board surface, the mounting groove has been seted up to the mount pad inside wall, and the mounting groove is located same as the horizontal plane with changeing the board bottom, install the air exhauster on the mount pad inside wall, the air exhauster is aired exhaust and is served and install the air duct, and the air duct from the right side to left runs through refrigeration chamber and coolant liquid chamber in proper order and extend to the gear to the inner chamber, and the air duct end is connected with the blast pipe, the air duct is located refrigeration chamber.

Preferably, the rotation adjusting mechanism comprises two first gears, a horizontally arranged rotating shaft, two horizontally arranged shaft rods and a motor, each first gear is mounted on a lead screw, one end of the rotating shaft is in rotating fit with the inner side wall of the gear box, a second gear and a third gear are sequentially arranged on the surface of the rotating shaft from the driven side to the right side, the second gear is meshed with the two first gears, the number of teeth of the second gear is 6-7 times that of the first gears, one end of one shaft lever is rotationally matched with the side wall of the mounting seat, one end of the other shaft lever is connected with the driving end of the motor, an incomplete gear and a fourth gear are sequentially mounted on the surface of each shaft lever from left to right, and two fourth gears are meshed, one incomplete gear is always meshed with the third gear, and the number of teeth of the incomplete gear is 3-4 times that of the fourth gear.

Preferably, a liquid guide pipe with an electric gate valve is installed on the side wall of the installation seat, one end of the liquid guide pipe penetrates through the side wall of the installation seat and extends into the cooling liquid cavity, and the other end of the liquid guide pipe penetrates through the side wall of the gear box and extends to the outer side of the gear box.

Preferably, the heat absorption end of the semiconductor refrigeration piece is located in the refrigeration cavity, the heat release end of the semiconductor refrigeration piece is located on the outer side of the mounting seat, and the semiconductor refrigeration piece is externally connected with the controller.

Preferably, the top end of the mounting seat is hinged with a cover plate.

The utility model has the advantages that:

1. through setting up mutually supporting between air duct, semiconductor refrigeration piece, lead screw, shower nozzle, coolant liquid chamber and the refrigeration chamber, can be better dispel the heat to integrated circuit plate, make radiating more quick, abundant of integrated circuit board, very big improvement the radiating efficiency, also avoided simultaneously the file to burn to integrated circuit board too high.

2. Through setting up the mutual cooperation between incomplete gear, the not gear of equidimension, axostylus axostyle and the pivot, clockwise and the anticlockwise rotation that relapses of drive lead screw that can be better, avoided the regulation motor that relapses to drive the lead screw clockwise and anticlockwise relapse, very big improvement work efficiency, also strengthened the practicality simultaneously.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the overall top view structure of the present invention;

fig. 3 is a schematic view of the connection structure of the incomplete gear and the third gear of the present invention.

In the figure: 1. gear box, 2, mount pad, 3, catheter, 4, air duct, 5, first gear, 6, second gear, 7, incomplete gear, 8, pivot, 9, third gear, 10, fourth gear, 11, axostylus axostyle, 12, motor, 13, mounting groove, 14, apron, 15, gag lever post, 16, lead screw, 17, blast pipe, 18, coolant liquid chamber, 19, shower nozzle, 20, drive seat, 21, baffle, 22, through wires hole, 23, commentaries on classics board, 24, air exhauster, 25, refrigeration chamber, 26, semiconductor refrigeration piece, 27, heat-conducting plate.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Please refer to fig. 1-3, a heat dissipation device for an integrated circuit board, comprising a mounting base 2 and a gear box 1 on the side wall of the mounting base 2, wherein a partition 21 is fixedly connected to the inner side wall of the mounting base 2, a heat conducting plate 27 is fixedly connected to the bottom end of the partition 21, the heat conducting plate 27 sequentially partitions the inner cavity of the mounting base 2 below the partition 21 from left to right to form a cooling liquid cavity 18 and a cooling cavity 25, a semiconductor cooling plate 26 is embedded in the inner side wall of the cooling cavity 25, two horizontally arranged screws 16 are sequentially and rotatably fitted to the inner side wall of the mounting base 2 from top to bottom, a driving base 20 is screwed on the surface of the screw 16, a nozzle 19 is fixedly connected to the top end of the driving base 20, an exhaust pipe 17 is fixedly connected to one end of the nozzle 19, one end of the screw 16 penetrates through the inner side wall of the mounting base 2 and extends to the inner cavity of Festival mechanism, 2 lateral walls of mount pad articulate there is commentaries on classics board 23, change board 23 surface and seted up through wires hole 22, mounting groove 13 has been seted up to 2 inside walls of mount pad, and mounting

groove

13 and 23 bottoms of commentaries on classics board are located and are the same as on the horizontal plane, install air exhauster 24 on 2 inside walls of mount pad, air exhauster 24 is aired exhaust and is served and install air duct 4, and air duct 4 runs through refrigeration chamber 25 and coolant liquid chamber 18 in proper order from the right side left and extend to the gear to the inner chamber, and air duct 4 is terminal to be connected with blast pipe 17, air duct 4 is located refrigeration chamber 25 and coolant liquid chamber 18 one section and is the structure.

The rotation adjusting mechanism comprises two first gears 5, a rotating shaft 8 arranged horizontally, two shaft rods 11 arranged horizontally and a motor 12, wherein each first gear 5 is arranged on a lead screw 16, one end of the rotating shaft 8 is in running fit with the inner side wall of the gear box 1, the surface of the rotating shaft 8 is driven to the right and is sequentially provided with a second gear 6 and a third gear 9, the second gear 6 is meshed with the two first gears 5, the number of teeth of the second gear 6 is 6-7 times of that of the first gear 5, one end of one shaft rod 11 is in running fit with the side wall of the mounting seat 2, one end of the other shaft rod 11 is connected with the driving end of the motor 12, an incomplete gear 7 and a fourth gear 10 are sequentially arranged on the surface of each shaft rod 11 from left to right, the two fourth gears 10 are meshed, one incomplete gear 7 of the two incomplete gears 7 is always meshed with the third gear 9, the number of teeth of the incomplete gear 7 is 3-4 times that of the fourth gear 10; a liquid guide pipe 3 with an electric gate valve is arranged on the side wall of the mounting seat 2, one end of the liquid guide pipe 3 penetrates through the side wall of the mounting seat 2 and extends into the cooling liquid cavity 18, and the other end of the liquid guide pipe 3 penetrates through the side wall of the gear box 1 and extends to the outer side of the gear box 1, so that cooling liquid can be injected into the cooling liquid cavity 18 better; the heat absorption end of the semiconductor refrigeration piece 26 is positioned in the refrigeration cavity 25, the heat release end of the semiconductor refrigeration piece 26 is positioned outside the mounting seat 2, and the semiconductor refrigeration piece 26 is externally connected with a controller, so that heat in the refrigeration cavity 25 can be absorbed better, and the refrigeration cavity 25 can be refrigerated; the top end of the mounting base 2 is hinged with a cover plate 14, so that the circuit board can be mounted better.

The utility model discloses when using, the electrical components that appear in this application all external intercommunication power and control switch when using, when installing the circuit board, at first the pulling changes board 23, make and change

board

23 and 2 lateral walls separation of mount pad, impel the circuit board again 2 inner chambers of mount pad and cooperate with mounting groove 13 joint, run through wires hole 22 and extend to the 2 outsides of mount pad with the connecting wire on the circuit board again, thereby to the installation of circuit board, when the circuit board carries out the during operation, at first open air exhauster 24, semiconductor refrigeration piece 26 and motor 12, make semiconductor refrigeration piece 26 refrigerate to refrigeration chamber 25, make the air conditioning in refrigeration chamber 25 refrigerate through the refrigeration liquid of heat-conducting plate 27 in to cooling liquid chamber 18 simultaneously, make motor 12 drive end pass through axostylus axostyle 11 and drive incomplete gear 7 and fourth gear 10 clockwise rotation, make fourth gear 10 drive another incomplete gear 7 anticlockwise rotation of incomplete gear through another fourth gear 10 and another axostylus axostyle 11, make When the incomplete gear 7 rotating clockwise drives the third gear 9 to rotate clockwise, the third gear 9 drives the two first gears 5 to rotate clockwise through the rotating shaft 8 and the second gear 6, the first gear 5 drives the screw rod to rotate clockwise, so that the screw rod 16 drives the spray head 19 to move leftwards through the driving seat 20, when the incomplete gear 7 rotating clockwise is separated from the third gear 9, the incomplete gear 7 rotating anticlockwise drives the third gear 9 to rotate clockwise, the third gear 9 drives the two first gears 5 to rotate anticlockwise through the rotating shaft 8 and the second gear 6, the first gear 5 drives the screw rod to rotate anticlockwise, so that the screw rod 16 drives the spray head 19 to move rightwards through the driving seat 20, so that the spray head 19 moves back and forth in the horizontal direction, and the exhaust fan 24 guides gas into the gas guide tube 4, so that the gas in the gas guide tube 4 passes through the refrigerating cavity 25, thereby make the air conditioning in the refrigeration chamber 25 carry out the preliminary refrigeration to the gas in the air duct 4, when gas in the air duct was through coolant liquid chamber 18, thereby make the air conditioning in the coolant liquid chamber 18 carry out the secondary refrigeration to the gas in the air duct 4, thereby make the gas in the air duct 4 carry out abundant refrigeration, make the gas after the refrigeration lead into in horizontal direction round trip movement's shower nozzle 19 through blast pipe 17, thereby make the interior spun gas of shower nozzle 19 carry out abundant cooling heat dissipation to the circuit board surface.

The motor 12 is a GMP56-TEC5760 motor produced by Shenzhen Shenhong Motor Co., Ltd, and the supporting circuit thereof can be provided by the merchant.

The exhaust fan 24 is a HXD4020S12M exhaust fan produced by Huaxuandao electronics, Inc. of Dongguan city, and its related power supply and circuit.

The semiconductor refrigeration piece 26 is made of HT064200 semiconductor refrigeration piece produced by Shenzhen Yiliangjin limited science and technology, and its related power supply and circuit.

It is well within the skill of those in the art to implement, without undue experimentation, the present invention does not relate to software and process improvements, as related to circuits and electronic components and modules.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The utility model provides an integrated circuit board heat abstractor, includes gear box (1) on mount pad (2) and mount pad (2) lateral wall, its characterized in that: mount pad (2) inside wall fixedly connected with baffle (21), baffle (21) bottom fixedly connected with heat-conducting plate (27), and heat-conducting plate (27) are located mount pad (2) inner chamber baffle (21) below from left to right in proper order the interval become coolant liquid chamber (18) and refrigeration chamber (25), semiconductor refrigeration piece (26) are installed to refrigeration chamber (25) inside wall gomphosis, mount pad (2) inside wall from the top down in proper order normal running fit has lead screw (16) that two levels set up, lead screw (16) surface threaded connection has drive seat (20), drive seat (20) top fixedly connected with shower nozzle (19), shower nozzle (19) one end fixedly connected with blast pipe (17), lead screw (16) one end runs through mount pad (2) inside wall and extends to gear box (1) inner chamber, gear box (1) inner chamber is installed and is driven two lead screws (16) and is carried out anticlockwise and is adjusted with anticlockwise and rotate the regulation repeatedly to rotate clockwise and to gear Mechanism, mount pad (2) lateral wall articulates there is commentaries on classics board (23), through wires hole (22) have been seted up on commentaries on classics board (23) surface, mounting groove (13) have been seted up to mount pad (2) inside wall, and mounting groove (13) and commentaries on classics board (23) bottom are located and are the same as the horizontal plane, install air exhauster (24) on mount pad (2) inside wall, air exhauster (24) are aired exhaust and are served and install air duct (4), and air duct (4) from the right side to left run through refrigeration chamber (25) and coolant liquid chamber (18) in proper order and extend to the gear to the inner chamber, and air duct (4) end is connected with blast pipe (17), air duct (4) are located refrigeration chamber (25) and coolant liquid chamber (18) and are one.

2. The heat sink of claim 1, wherein: the rotation adjusting mechanism comprises two first gears (5), a rotating shaft (8) arranged horizontally, two shaft levers (11) arranged horizontally and a motor (12), wherein each first gear (5) is arranged on a lead screw (16), one end of the rotating shaft (8) is in rotating fit with the inner side wall of the gear box (1), a second gear (6) and a third gear (9) are sequentially arranged on the surface of the rotating shaft (8) from right to right, the second gear (6) is meshed with the two first gears (5), the number of teeth of the second gear (6) is 6-7 times of that of the first gears (5), one end of one shaft lever (11) is in rotating fit with the side wall of the mounting base (2), one end of the other shaft lever (11) is connected with the driving end of the motor (12), an incomplete gear (7) and a fourth gear (10) are sequentially arranged on the surface of each shaft lever (11) from left to right, and two fourth gears (10) are meshed, two incomplete gears (7) are always meshed with one incomplete gear (7) and the third gear (9), and the number of teeth of the incomplete gears (7) is 3-4 times that of the fourth gears (10).

3. The heat sink of claim 1, wherein: the side wall of the mounting seat (2) is provided with a liquid guide pipe (3) with an electric gate valve, one end of the liquid guide pipe (3) penetrates through the side wall of the mounting seat (2) and extends into the cooling liquid cavity (18), and the other end of the liquid guide pipe (3) penetrates through the side wall of the gear box (1) and extends to the outer side of the gear box (1).

4. The heat sink of claim 1, wherein: the heat absorption end of the semiconductor refrigeration piece (26) is positioned in the refrigeration cavity (25), the heat release end of the semiconductor refrigeration piece (26) is positioned on the outer side of the mounting seat (2), and the semiconductor refrigeration piece (26) is externally connected with a controller.

5. The heat sink of claim 1, wherein: the top end of the mounting seat (2) is hinged with a cover plate (14).