CN211441986U - Heat radiation structure of alternating current pile - Google Patents
Heat radiation structure of alternating current pile Download PDFInfo
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- CN211441986U CN211441986U CN201922465976.7U CN201922465976U CN211441986U CN 211441986 U CN211441986 U CN 211441986U CN 201922465976 U CN201922465976 U CN 201922465976U CN 211441986 U CN211441986 U CN 211441986U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02T90/10—Technologies relating to charging of electric vehicles
- Y02T90/12—Electric charging stations
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Abstract
The utility model provides a heat radiation structure of alternating-current pile, including alternating-current charging pile box and metal stand, metal stand upper end sets up at alternating-current charging pile box rear, alternating-current charging pile box front side is provided with alternating-current charging pile apron, the rear side installs the mainboard in the alternating-current charging pile box, semiconductor refrigeration piece is installed to mainboard rear side intermediate position, install the heat dissipation box between alternating-current charging pile box and the metal stand, the embedding of heat dissipation box left end is installed in alternating-current charging pile box and semiconductor refrigeration piece laminating, install the radiator in the heat dissipation box, install the fan below the heat dissipation box, the wind direction of fan is blown the fan below by the heat dissipation box; the utility model discloses utilize covering copper in the semiconductor refrigeration piece and the good performance of ceramic heat conduction effect directly to realize heat conduction and radiating effect with mainboard and radiator contact, solved prior art and dispel the heat through heat conduction silica gel pad, make the stake heat dissipation inhomogeneous that exchanges, and the not good problem of radiating effect.
Description
Technical Field
The utility model belongs to the technical field of new energy automobile fills electric pile, mainly used new energy automobile alternating-current charging stake's heat dissipation technique, concretely relates to heat radiation structure of alternating-current pile.
Background
With the popularization of electric vehicles, the application of common household alternating current piles is gradually increased, but at present, electronic products are rapidly developing towards miniaturization and multi-functionalization, the internal power consumption density of the alternating current piles is gradually improved, the protection level of IP55 of the alternating current piles also forces the alternating current piles not to use a forced air cooling refrigeration mode, and the alternating current piles urgently need a new refrigeration mode.
The defects and shortcomings of the prior art are as follows:
1. the heat dissipation mode that current interchange stake adopted is mainly at the combination of adding heat conduction silica gel pad and soaking version of the corresponding PCB board back position of heat dissipation device, the heat conduction silica gel pad thickness of current scheme and the difference in temperature of heat dissipation device and stake internal environment are less can only do horizontal conduction with a small amount of heat, play the effect of soaking, but the heat still exchanges inside the stake, heat exchange is not done to this kind of heat dissipation mode external environment, it still separates the two-layer thermal resistance of air and plastic casing with the service environment, and air and plastic casing thermal resistance are very big, so exchange the most heat of stake still inside the pile body, do not play better radiating effect.
2. At present, manufacturers install the turbulence fan inside the alternating current pile, the mode of installing the turbulence fan on the back of the alternating current pile is used for enabling the heat inside the alternating current pile to be uniform, the fan belongs to a rotating part, the fan works in a high environment inside the alternating current pile for a long time, grease of a rotating bearing of the fan can be influenced, the service life of the fan is further influenced, if the fan is damaged, the alternating current pile needs to be disassembled and assembled, and the maintenance cost is increased.
SUMMERY OF THE UTILITY MODEL
The utility model discloses solve prior art and dispel the heat through heat conduction silica gel pad, make the stake heat dissipation inhomogeneous of exchanging, and the not good problem of radiating effect provides a heat radiation structure of exchanging the stake for this reason.
The utility model provides a technical scheme that its technical problem adopted is:
the utility model provides a heat radiation structure of alternating-current pile, includes alternating-current charging stake box and metal stand, metal stand upper end sets up at alternating-current charging stake box rear, alternating-current charging stake box front side is provided with the alternating-current charging stake apron, the mainboard is installed to alternating-current charging stake box inner rear side, semiconductor refrigeration piece is installed to mainboard rear side intermediate position, install the heat dissipation box between alternating-current charging stake box and the metal stand, heat dissipation box left end embedding is installed in alternating-current charging stake box and the laminating of semiconductor refrigeration piece, install the radiator in the heat dissipation box, the fan is installed to heat dissipation box below, the wind direction of fan is blown the fan below by the heat dissipation box.
Furthermore, the semiconductor refrigeration piece comprises a semiconductor refrigeration piece cold end, a semiconductor refrigeration piece hot end and a plurality of semiconductor refrigeration end silicon materials, the semiconductor refrigeration piece cold end is installed on the front side of the mainboard, and the semiconductor refrigeration piece hot end is installed on the rear side of the semiconductor refrigeration piece cold end through the plurality of semiconductor refrigeration end silicon materials.
Further, the semiconductor refrigeration piece cold junction includes that semiconductor refrigeration piece cold junction solder, semiconductor refrigeration piece cold junction cover copper and semiconductor refrigeration piece cold junction pottery, semiconductor refrigeration piece cold junction covers copper and welds in the mainboard rear side through semiconductor refrigeration piece cold junction solder, semiconductor refrigeration piece cold junction pottery laminating is installed and is covered copper the rear side at semiconductor refrigeration piece cold junction, semiconductor refrigeration piece cold junction pottery trailing flank contacts a plurality of semiconductor refrigeration end silicon materials and carries out the heat conduction.
Furthermore, the hot end of the semiconductor refrigeration piece comprises semiconductor refrigeration piece hot end welding flux, semiconductor refrigeration piece hot end copper-clad and semiconductor refrigeration piece hot end ceramic, the semiconductor refrigeration piece hot end copper-clad is welded on the front side of the heat dissipation box through the semiconductor refrigeration piece hot end welding flux, the semiconductor refrigeration piece hot end ceramic is attached to the front side of the semiconductor refrigeration piece hot end copper-clad, and the front side surface of the semiconductor refrigeration piece hot end ceramic is in contact with a plurality of semiconductor refrigeration end silicon materials for heat dissipation.
Further, the sealing washer is installed in the heat dissipation box and is located alternating-current charging stake box embedding department outside.
Furthermore, the size and the shape of the cold end of the semiconductor refrigeration piece are consistent with those of the hot end of the semiconductor refrigeration piece.
Compared with the prior art, the beneficial effects of the utility model are as follows:
(1) on the basis of not influencing the waterproof grade of the alternating-current pile above IP55, the structure conducts heat inside the pile to the outside of the pile body in a heat conduction mode through the semiconductor refrigerating sheet, is connected with the metal upright column through the radiator, conducts the heat to the metal upright column, and further utilizes the larger heat dissipation area of the pile body made of metal to dissipate heat; the structure is additionally provided with the heat radiation fan on the basis of heat conduction, and the heat radiation effect is enhanced in a heat convection mode;
(2) this structure utilizes the characteristics that copper and pottery thermal conductivity are good, cover copper and semiconductor refrigeration piece cold junction pottery and carry out the conduction temperature through mainboard rear portion contact semiconductor refrigeration piece cold junction, the two-sided copper that covers of semiconductor refrigeration piece cold junction and semiconductor refrigeration piece hot junction, with the direct and mainboard welding of semiconductor film-making cold junction, semiconductor refrigeration piece hot junction and radiator welding, with this realization reach two kinds of functions of reducing the thermal resistance and guaranteeing insulation, and the thermal resistance of solder is less than the heat conduction silicone grease that current semiconductor refrigeration piece was used commonly, conduction temperature that can be better dispels the heat.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic external structural view of an embodiment of the present invention;
fig. 2 is a cross-sectional view of an embodiment of the present invention;
fig. 3 is a partial cross-sectional view of an embodiment of the invention;
the most important element symbols of the embodiment of the utility model are as follows:
the device comprises an alternating-current charging pile box-1, an alternating-current charging pile cover plate-101, a metal column-2, a mainboard-3, a semiconductor chilling plate-4, a semiconductor chilling plate cold end-401, semiconductor chilling plate cold end solder-402, semiconductor chilling plate cold end copper-coated-403, semiconductor chilling plate cold end ceramic-404, semiconductor chilling plate hot end-410, semiconductor chilling plate hot end solder-411, semiconductor chilling plate hot end copper-412, semiconductor chilling plate hot end ceramic-413, semiconductor chilling plate cold end silicon material-420, a heat dissipation box-5, a heat dissipation device-501, a fan-6 and a sealing ring-7.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
As shown in fig. 1 to 3, a heat radiation structure of alternating-current pile, including alternating-current charging stake box 1 and metal column 2, 2 upper ends of metal column set up in alternating-current charging stake box 1 rear, alternating-current charging stake box 1 front side is provided with alternating-current charging stake apron 101, mainboard 3 is installed to the rear side in the alternating-current charging stake box 1, semiconductor refrigeration piece 4 is installed to 3 rear side intermediate positions of mainboard, install heat dissipation box 5 between alternating-current charging stake box 1 and the metal column 2, 5 left ends embedding of heat dissipation box are installed in alternating-current charging stake box 1 and are laminated with semiconductor refrigeration piece 4, install radiator 501 in the heat dissipation box 5, fan 6 is installed to heat dissipation box 5 below, fan 6's wind direction is blown the fan 6 below by heat dissipation box 5.
On the basis of not influencing the waterproof grade of the alternating-current pile above IP55, the heat inside the pile is conducted to the outside of the pile body through the semiconductor refrigerating sheet 4 in a heat conduction mode, and is connected with the metal upright post 2 through the radiator 501 to conduct the heat to the metal upright post 2, so that the heat is radiated by utilizing the larger radiating area of the pile body made of metal; this structure has still increased radiator fan 6 on heat-conducting basis, will strengthen the radiating effect through the mode of thermal convection.
Semiconductor refrigeration piece cold junction 401 includes that semiconductor refrigeration piece cold junction solder 402, semiconductor refrigeration piece cold junction cover copper 403 and semiconductor refrigeration piece cold junction pottery 404, semiconductor refrigeration piece cold junction covers copper 403 and passes through semiconductor refrigeration piece cold junction solder 402 welding in mainboard 3 rear side, the laminating of semiconductor refrigeration piece cold junction pottery 404 is installed and is covered copper 403 rear side at semiconductor refrigeration piece cold junction, the ceramic 404 trailing flank contact of semiconductor refrigeration piece cold junction carries out the heat conduction by a plurality of semiconductor refrigeration cold junction silicon materials 420.
The semiconductor refrigeration piece hot end 410 comprises semiconductor refrigeration piece hot end welding flux 411, semiconductor refrigeration piece hot end copper-clad 412 and semiconductor refrigeration piece hot end ceramic 413, the semiconductor refrigeration piece hot end copper-clad 412 is welded on the front side of the heat dissipation box 5 through the semiconductor refrigeration piece hot end welding flux 411, the semiconductor refrigeration piece hot end ceramic 413 is installed on the front side of the semiconductor refrigeration piece hot end copper-clad 412 in an attaching mode, and the front side face of the semiconductor refrigeration piece hot end ceramic 413 is in contact with a plurality of semiconductor refrigeration end silicon materials 420 for heat dissipation.
This structure utilizes the characteristics that copper and pottery thermal conductivity are good, cover copper 403 and semiconductor refrigeration piece cold junction pottery 404 through mainboard 3 rear portion contact semiconductor refrigeration piece cold junction and carry out the biography temperature, semiconductor refrigeration piece cold junction 401 covers copper with semiconductor refrigeration piece hot junction 410 two-sidedly, with the direct and mainboard 3 welding of semiconductor film production cold junction, semiconductor refrigeration piece hot junction 410 and radiator 501 welding, with this realize reaching two kinds of functions of reducing the thermal resistance and guaranteeing insulation, and the thermal resistance of solder is less than the current thermal grease that semiconductor refrigeration piece 4 is commonly used, conduction temperature that can be better dispels the heat.
And the heat dissipation box 5 is positioned outside the embedded part of the alternating-current charging pile box 1 and is provided with a sealing ring 7.
The size and the shape of the cold end 401 of the semiconductor refrigeration piece are consistent with those of the hot end 410 of the semiconductor refrigeration piece, so that the cold end 401 of the semiconductor refrigeration piece and the hot end 410 of the semiconductor refrigeration piece are ensured to conduct heat uniformly.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (6)
1. The utility model provides a heat radiation structure of alternating-current pile, includes alternating-current charging stake box (1) and metal stand (2), metal stand (2) upper end sets up in alternating-current charging stake box (1) rear, alternating-current charging stake box (1) front side is provided with alternating-current charging stake apron (101), its characterized in that: mainboard (3) are installed to the rear side in alternating-current charging stake box (1), semiconductor refrigeration piece (4) are installed to mainboard (3) rear side intermediate position, install heat dissipation box (5) between alternating-current charging stake box (1) and metal stand (2), heat dissipation box (5) left end embedding is installed in alternating-current charging stake box (1) and semiconductor refrigeration piece (4) laminating, install radiator (501) in heat dissipation box (5), fan (6) are installed to heat dissipation box (5) below, the wind direction of fan (6) is blown fan (6) below by heat dissipation box (5).
2. The heat dissipation structure according to claim 1, wherein: semiconductor refrigeration piece (4) include semiconductor refrigeration piece cold junction (401), semiconductor refrigeration piece hot junction (410) and a plurality of semiconductor refrigeration end silicon material (420), semiconductor refrigeration piece cold junction (401) are installed in mainboard (3) front side, semiconductor refrigeration piece hot junction (410) are installed in semiconductor refrigeration piece cold junction (401) rear side through a plurality of semiconductor refrigeration cold junction silicon materials (420).
3. The heat dissipation structure according to claim 2, wherein: semiconductor refrigeration piece cold junction (401) include that semiconductor refrigeration piece cold junction solder (402), semiconductor refrigeration piece cold junction cover copper (403) and semiconductor refrigeration piece cold junction pottery (404), the semiconductor refrigeration piece cold junction covers copper (403) and welds at mainboard (3) rear side through semiconductor refrigeration piece cold junction solder (402), semiconductor refrigeration piece cold junction pottery (404) laminating is installed and is covered copper (403) rear side at semiconductor refrigeration piece cold junction, semiconductor refrigeration piece cold junction pottery (404) trailing flank contacts a plurality of semiconductor refrigeration cold junction silicon materials (420) and carries out the heat conduction.
4. The heat dissipation structure according to claim 3, wherein: the semiconductor refrigeration piece hot end (410) comprises semiconductor refrigeration piece hot end welding flux (411), semiconductor refrigeration piece hot end copper-clad (412) and semiconductor refrigeration piece hot end ceramic (413), the semiconductor refrigeration piece hot end copper-clad (412) is welded on the front side of the heat dissipation box (5) through the semiconductor refrigeration piece hot end welding flux (411), the semiconductor refrigeration piece hot end ceramic (413) is attached to the front side of the semiconductor refrigeration piece hot end copper-clad (412), and the front side face of the semiconductor refrigeration piece hot end ceramic (413) is in contact with a plurality of semiconductor system cold end silicon materials (420) for heat dissipation.
5. The heat dissipation structure according to claim 4, wherein: the heat dissipation box (5) is located the outer side of the embedding part of the alternating-current charging pile box (1) and is provided with a sealing ring (7).
6. The heat dissipation structure of claim 5, wherein: the size and the shape of the cold end (401) of the semiconductor refrigeration piece are consistent with those of the hot end (410) of the semiconductor refrigeration piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922465976.7U CN211441986U (en) | 2019-12-31 | 2019-12-31 | Heat radiation structure of alternating current pile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922465976.7U CN211441986U (en) | 2019-12-31 | 2019-12-31 | Heat radiation structure of alternating current pile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211441986U true CN211441986U (en) | 2020-09-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922465976.7U Active CN211441986U (en) | 2019-12-31 | 2019-12-31 | Heat radiation structure of alternating current pile |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211441986U (en) |
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2019
- 2019-12-31 CN CN201922465976.7U patent/CN211441986U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Room 149, 18 Xinya Road, Wujin national high tech Industrial Development Zone, Changzhou City, Jiangsu Province 213164 Patentee after: Guochuang mobile energy innovation center (Jiangsu) Co.,Ltd. Address before: Room 149, 18 Xinya Road, Wujin national high tech Industrial Development Zone, Changzhou City, Jiangsu Province 213164 Patentee before: National innovation energy automobile intelligent energy equipment innovation center (Jiangsu) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |