CN211413338U - Mechanism for restricting warpage of flexible metal substrate and production apparatus - Google Patents

Abstract

A warp limiting mechanism of a flexible metal substrate is used for limiting the warp of the flexible metal substrate conveyed by a conveying mechanism and comprises a supporting unit and a warp limiting unit. The warpage limiting unit is connected with the supporting unit, arranged on the edge of the flexible metal substrate and configured to limit the warpage of the edge of the flexible metal substrate. The utility model discloses a warpage limiting mechanism can promote the product yield through the warpage of restriction flexible metal base plate. Furthermore, the utility model discloses a conveying mechanism is directly applied to warpage limiting mechanism for warpage limiting mechanism can be integrated on current board, and then can compromise bulk production and high yield.

Description

Mechanism for restricting warpage of flexible metal substrate and production apparatus

Technical Field

The present invention relates to a warpage limiting mechanism and a production apparatus, and more particularly to a warpage limiting mechanism for a flexible metal substrate.

Background

Flexible copper Foil (FCCL) has advantages of light weight, thinness, and flexibility, and thus is widely used in printed Circuit boards (pcbs) and Chip On Film (COF) in electronic devices.

The existing flexible copper foil base materials are divided into two main categories: the conventional three-layer flexible copper foil substrate (3LFCCL) with an adhesive agent type and the novel two-layer flexible copper foil substrate (2L FCCL) without the adhesive agent type. The two-layer flexible copper foil base material is composed of a flexible insulating base film and a metal foil, and the three-layer flexible copper foil base material is formed by compounding a copper foil, a flexible insulating base film and an adhesive. Regardless of the type of flexible copper foil substrate, when the flexible copper foil substrate is subjected to a heat dehydration step during the manufacturing process, the edge of the flexible copper foil substrate often warps, thereby reducing the product yield.

Therefore, there is a need to provide a warpage limiting mechanism for a flexible metal substrate and a production apparatus that can solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a warpage limiting mechanism and apparatus for producing of flexible metal substrate can restrict the warpage of the flexible metal substrate on conveying mechanism, and then promotes the product yield.

An object of the utility model is to provide a warpage limiting mechanism of flexible metal substrate, it is used for restricting the warpage of the flexible metal substrate that is carried by conveying mechanism to including supporting unit and warpage limiting unit. The warpage limiting unit is connected with the supporting unit, is configured to be arranged on the edge of the flexible metal substrate and is configured to limit the warpage of the edge of the flexible metal substrate.

According to an embodiment of the present invention, the edge is a side of the flexible metal substrate, or a range extending from the side to the inside of the flexible metal substrate, or a range adjacent to the side.

According to an embodiment of the present invention, the warpage limiting unit is provided with a non-sticky portion adjacent to one side of the flexible metal substrate, and the non-sticky portion is disposed opposite to the edge.

According to an embodiment of the present invention, the warpage limiting unit includes a plurality of limiting elements disposed at intervals, and the limiting elements are disposed along a conveying direction of the conveying mechanism.

According to an embodiment of the present invention, the warpage limiting mechanism is shaped like ㄈ.

According to an embodiment of the present invention, the warpage limiting unit has a protrusion extending toward an edge of the flexible metal substrate along a normal direction of the flexible metal substrate.

According to an embodiment of the present invention, the warpage limiting mechanism further includes a pivot structure, and the protruding portion is foldable through the pivot structure.

According to an embodiment of the present invention, the warpage limiting mechanism of the flexible metal substrate further includes an adjusting unit. The adjusting unit is connected with the supporting unit and/or the warping limiting unit and is configured to adjust the overlapping width and/or the vertical distance between the warping limiting unit and the flexible metal substrate.

According to the above object of the present invention, there is provided a flexible metal substrate manufacturing apparatus including a conveying mechanism and a warpage limiting mechanism. The conveying mechanism is configured to convey the flexible metal substrate. The warp limiting mechanism is adjacent to the conveying mechanism and comprises a supporting unit and a warp limiting unit. The warpage limiting unit is connected with the supporting unit, arranged on the edge of the flexible metal substrate and configured to limit the warpage of the edge of the flexible metal substrate.

According to an embodiment of the present invention, the warpage limiting mechanism is directly or indirectly connected to the conveying mechanism.

According to an embodiment of the present invention, the conveying mechanism includes a plurality of winding units, and the flexible metal substrate is wound on the winding units.

In summary, in the warpage limiting mechanism and the manufacturing apparatus of the present invention, the warpage limiting unit is disposed on the edge of the flexible metal substrate, and when the edge of the flexible metal substrate is warped to a certain degree, the warpage limiting unit can contact the edge to limit the warpage of the flexible metal substrate, thereby improving the yield of the product. Furthermore, the utility model discloses a conveying mechanism is directly applied to warpage limiting mechanism for warpage limiting mechanism can be integrated on current board, and then can compromise bulk production and high yield.

In order to make the aforementioned and other features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

The aspects of the present invention will be better understood from the following detailed description taken in conjunction with the accompanying drawings. It is noted that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.

Fig. 1 is a schematic top view of an apparatus for manufacturing a flexible metal substrate according to an embodiment of the present invention;

FIG. 2 is a schematic sectional view of the apparatus for manufacturing a flexible metal substrate of FIG. 1 along the sectional line A-A;

fig. 3A to 3C are schematic diagrams of various ranges of the edge of the flexible metal substrate according to an embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of an apparatus for manufacturing a flexible metal substrate according to another embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of an apparatus for manufacturing a flexible metal substrate according to another embodiment of the present invention;

fig. 6 is a schematic top view of an apparatus for manufacturing a flexible metal substrate according to another embodiment of the present invention;

fig. 7 is a schematic view of a warpage limiting unit according to another embodiment of the present invention;

fig. 8 is a schematic cross-sectional view of an apparatus for manufacturing a flexible metal substrate according to another embodiment of the present invention;

fig. 9A and 9B are schematic views of a warpage limiting mechanism according to another embodiment of the present invention in different states;

fig. 10 is a schematic view of a warpage limiting mechanism according to another embodiment of the present invention;

fig. 11 is a schematic top view of an apparatus for manufacturing a flexible metal substrate according to another embodiment of the present invention;

fig. 12 is a schematic sectional view of the apparatus for manufacturing a flexible metal substrate of fig. 11 taken along a sectional line B-B.

[ notation ] to show

1. 1a, 1b, 1c, 1d, 1e, 1 h: production device

11. 11 h: conveying mechanism

111: conveying belt

112: rack body

113a, 113 b: winding unit

12. 12a, 12b, 12d, 12e, 12f, 12 h: warpage limiting mechanism

121. 121a, 121b, 121d, 121e, 121f, 121 h: support unit

1211: support member

1212: adapter

122. 122a, 122b, 122c, 122d, 122e, 122f, 122g, 122 h: warp limiting unit

123: non-sticky part

124. 124e, and (3): projection part

125 e: extension part

126: adjusting unit

2: flexible metal substrate

21: edge of a container

A-A, B-B: section line

D: direction of conveyance

L1: width of overlap

L2: vertical spacing

LD: limiting element

P: pivot structure

T: thickness of

W: width of

Detailed Description

Embodiments of the present invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable concepts that can be embodied in a wide variety of specific contexts. The embodiments discussed and disclosed are merely illustrative and are not intended to limit the scope of the present invention. Various features are disclosed in all of the embodiments of the invention, but these features can be implemented separately or in combination as desired. In addition, as used herein, the terms "first," "second," …, and the like, do not particularly denote an order or sequence, but rather are used to distinguish one element or operation from another element or operation described in the same technical language. In addition, the spatial relationship between the two elements described in the present invention is not only applicable to the orientations shown in the drawings, but also applicable to orientations not shown in the drawings, such as inverted orientations.

Fig. 1 is a schematic top view of a production apparatus 1 for a flexible metal substrate 2 according to an embodiment of the present invention, and fig. 2 is a schematic cross-sectional view of the production apparatus 1 for the flexible metal substrate 2 of fig. 1 along a sectional line a-a. Referring to fig. 1 and 2, the production apparatus 1 includes a conveying mechanism 11 and a warpage limiting mechanism 12. The conveying mechanism 11 can convey the flexible metal substrate 2. In the embodiment of fig. 1 and 2, the conveying mechanism 11 can be driven by a roller or a belt (not shown) to convey the flexible metal substrate 2 in the conveying direction D. In other embodiments, such as those in which rolls are continuously produced, the transport mechanism 11 may be comprised of rollers, reels, and/or wheels, rather than a conveyor belt.

The flexible metal substrate 2 of the present embodiment is, for example, a flexible copper foil substrate, and the flexible copper foil substrate is, for example, a two-layer flexible copper foil substrate without an adhesive, however, the present invention is not limited thereto. In other embodiments, the flexible metal substrate 2 may be, for example, a three-layer flexible copper foil substrate, a single-sided board (single-sided), a double-sided board (double-sided), a multi-layer board (multi-layer), a rigid-flex board (rigid-flex), and so on. In addition, other metals, such as aluminum foil or copper-beryllium alloy foil, may be used in addition to copper for the flexible metal substrate 2.

In one embodiment, the flexible metal substrate 2 to be baked may include a metal layer and a polymer material layer to be baked, and the polymer material layer is disposed on the metal layer. And baking the high polymer material layer to finish the manufacture of the flexible metal substrate 2. For example, in the present embodiment, the flexible metal substrate 2 is exemplified by a two-layer flexible copper foil substrate, and includes a copper foil layer and a Polyimide (PI) layer, and the PI layer is disposed on the copper foil layer. In the process, the synthesis of polyimide is carried out in two stages. The first stage is the synthesis of polyamic acid (polyamic acid), and the second stage is the dehydration of polyamic acid via thermal imidization to polyimide. However, during the heating step of thermal imidization, the edge of the flexible metal substrate 2 may warp due to uneven heating, unequal expansion coefficients, or other reasons, which reduces the yield of the product. And the production device 1 and the warpage limiting mechanism 12 of the present invention can improve the warpage and thus improve the yield of the product. The present embodiment does not limit the heating means, and for example, the heating is performed by a far infrared heater.

The warp limiting mechanism 12 is provided adjacent to the conveying mechanism 11. In the present embodiment, the warp limiting mechanisms 12 are provided on both sides of the conveying mechanism 11. As shown in fig. 2, the warpage limiting mechanism 12 includes a supporting unit 121 and a warpage limiting unit 122, and the warpage limiting unit 122 is connected to the supporting unit 121. In the present embodiment, the warpage limiting unit 122 and the supporting unit 121 are directly connected, for example, integrally formed. In other embodiments, the warpage limiting unit 122 and the supporting unit 121 may be connected to each other by two members, or the warpage limiting unit 122 and the supporting unit 121 are indirectly connected by another member. The warpage limiting unit 122 can limit warpage of the edge 21 of the flexible metal substrate 2. The warpage limiting unit 122 may be disposed on the edge 21, and when the edge 21 of the flexible metal substrate 2 is warped beyond a predetermined degree during the manufacturing process, the warpage limiting unit 122 may contact the edge 21, thereby limiting the warpage of the edge 21. The aforementioned "predetermined level" is defined according to the process requirement, or defined according to the specification of the relevant unit, for example.

Due to process requirements and/or industry standards, the edge 21 of the flexible metal substrate 2 described herein may have a variety of ranges, as illustrated in fig. 3A-3C below. As shown in fig. 3A, the edge 21 refers to one side of the flexible metal substrate 2. As shown in fig. 3B, the edge 21 is a range extending from one side of the flexible metal substrate 2 to the inside of the flexible metal substrate 2. As shown in fig. 3C, the edge 21 is a range adjacent to one side of the flexible metal substrate 2. The range of the edge 21 is only illustrated as one side of the flexible metal substrate 2, and in some embodiments, the range of the edge 21 may be applied to other sides of the flexible metal substrate 2, such as four sides of the flexible metal substrate 2. Furthermore, the ranges of the above-described edges 21 may be applied individually or in combination. In some embodiments, the warpage-limiting unit 122 may contact at least a portion of the edge of the flexible metal substrate 2, or only the edge of the flexible metal substrate 2 without contacting other portions of the flexible metal substrate 2.

Referring to fig. 2 again, in the present embodiment, the warpage limiting unit 122 and the flexible metal substrate 2 may have an overlapping width L1. The overlap width L1 may also be adjusted according to the extent of the edge 21 in different embodiments. In other embodiments, the overlapping width L1 may also be implemented according to the width W of the flexible metal substrate 2. For example, the overlap width L1 may be less than 1/5 of the width W of the flexible metal substrate 2. Here, the overlapping width L1 and the width W are both taken as an example in a direction perpendicular to the conveying direction D. In general, since the larger the width of the flexible metal substrate 2, the larger the range of edge warpage, there is a relationship between the overlapping width L1 of the warpage-limiting unit 122 and the flexible metal substrate 2 and the width W of the flexible metal substrate 2, and here, the 1/5 in which the overlapping width L1 of the warpage-limiting unit 122 and the flexible metal substrate 2 is smaller than the width W of the flexible metal substrate 2 is taken as an example for explanation. In other embodiments, as the process parameters change, the relationship between the two changes. In one embodiment, the overlapping width L1 of the warpage limiting unit 122 and the flexible metal substrate 2 may be, for example, less than 1/4 of the width W of the flexible metal substrate 2; in another embodiment, the overlapping width L1 of the warpage-limiting unit 122 and the flexible metal substrate 2 may be, for example, less than 1/6 of the width W of the flexible metal substrate 2. In other embodiments, the overlapping width L1 may be set according to the warping standard of the flexible metal substrate 2 in the industry, for example, according to the warping rule of the flexible metal substrate by government or civil authorities.

As shown in fig. 2, in the present embodiment, the vertical distance L2 between the warpage limiting unit 122 and the flexible metal substrate 2 is set according to the warpage standard of the flexible metal substrate 2 in the industry, for example, according to the warpage regulation of the flexible metal substrate by government or public authorities. In other embodiments, the vertical distance L2 may be implemented according to the thickness T of the flexible metal substrate 2, for example, the vertical distance L2 is less than a multiple of the thickness T of the flexible metal substrate 2. Here, the vertical pitch L2 and the thickness T are both taken as an example in a direction parallel to the normal direction of the flexible metal substrate 2. In other embodiments, the vertical spacing L2 may be implemented according to process requirements or process parameters.

Note that the production apparatus 1 of the present embodiment only shows a portion where the flexible metal substrate 2 is baked on the conveying mechanism 11 and is limited by the warpage limiting mechanism 12. In practice, the production apparatus 1 may further comprise other parts as required, such as a roll-out (feed) mechanism for feeding copper foil, a coating mechanism for coating polyamic acid, a cooling mechanism for cooling the flexible metal substrate 2, and a take-up (take-up) mechanism for taking up the completed flexible metal substrate 2 for subsequent application. In addition, the warpage limiting mechanism 12 of the present embodiment can also be applied to other apparatuses than the production apparatus 1, and is not limited thereto.

In the present embodiment, the warpage-limiting mechanism 12 and the conveying mechanism 11 are provided separately, i.e., not connected to each other. In other embodiments, the warpage limiting mechanism 12 and the conveying mechanism 11 may be directly connected or indirectly connected. Fig. 4 is a schematic cross-sectional view of a production apparatus 1a according to another embodiment of the present invention. As shown in fig. 4, the conveying mechanism 11 of the production apparatus 1a includes a conveyor belt 111 and a frame 112, and the conveyor belt 111 is disposed on the frame 112. The warp limiting mechanism 12a includes a support unit 121a and a warp limiting unit 122a connected to each other. In the present embodiment, the warp limiting mechanism 12a is connected to the conveying mechanism 11, and specifically, the support unit 121a of the warp limiting mechanism 12a is connected to the frame body 112 of the conveying mechanism 11. Of course, in practice, the warpage-limiting mechanism 12a may be connected to the conveying mechanism 11 via another element.

Fig. 5 is a schematic cross-sectional view of a production apparatus 1b according to another embodiment of the present invention. As shown in fig. 5, the warp limiting mechanism 12b includes a support unit 121b and a warp limiting unit 122b connected to each other. The warpage limiting unit 122b is provided with a non-adhesive portion 123 on a side thereof close to the flexible metal substrate 2, and the non-adhesive portion 123 is disposed opposite to the edge 21. When the flexible metal substrate 2 warps beyond a certain degree, the non-sticky portion 123 contacts the flexible metal substrate 2 to limit the warping of the edge thereof. Meanwhile, the non-sticking portion 123 does not stick the material on the flexible metal substrate 2, such as the un-dehydrated polyamic acid. In other embodiments, the warpage limiting unit 122b can be made of a non-adhesive material, so that the non-adhesive portion 123 is not required.

Fig. 6 is a schematic top view of a production apparatus 1c according to another embodiment of the present invention. As shown in fig. 6, the warp limiting unit 122c of the production apparatus 1c includes a plurality of limiting elements LD arranged at intervals, the limiting elements LD being arranged in the conveying direction D of the conveying mechanism 11.

Fig. 7 is a schematic diagram of a warpage limiting unit 122g according to another embodiment of the present invention, and as shown in fig. 7, the warpage limiting unit 122g is in a ring shape, which is a closed ring shape as an example. From the above view, the warpage limiting unit 122g is in a "" return "" shape, so as to correspond to (even contact) the four side edges 21 of the flexible metal substrate 2.

Fig. 8 is a schematic cross-sectional view of a production apparatus 1d according to another embodiment of the present invention. The warp limiting mechanism 12d includes a supporting unit 121d and a warp limiting unit 122d connected to each other. The warpage limiting unit 122d has a protruding portion 124, and the protruding portion 124 extends toward the edge 21 of the flexible metal substrate 2 in the normal direction of the flexible metal substrate 2. When the edge 21 of the flexible metal substrate 2 warps more than a certain degree, the protrusion 124 contacts the edge 21 to limit the warping of the edge 21.

Fig. 9A and 9B are schematic views of a warpage limiting mechanism 12e according to another embodiment of the present invention in different states. The warp limiting mechanism 12e includes a support unit 121e and a warp limiting unit 122e connected to each other. The warpage limiting unit 122e includes an extension 125e and a protrusion 124 e. The extension 125e is connected to the supporting unit 121e and extends in a direction away from the supporting unit 121 e. The protrusion 124e is connected to the extension 125e and extends toward the flexible metal substrate 2 (see the protrusion 124 in fig. 8). The protruding portion 124e of the present embodiment is foldable. In the present embodiment, a pivot structure P is disposed between the protruding portion 124e and the extending portion 125e, so that the protruding portion 124e can be folded by the pivot structure P, as shown in fig. 9B.

Fig. 10 is a schematic view of a warpage limiting mechanism 12f according to another embodiment of the present invention. As shown in fig. 10, in the present embodiment, the warpage limiting mechanism 12f includes a supporting unit 121f and a warpage limiting unit 122 f. The supporting unit 121f includes a supporting member 1211 and an adaptor member 1212. The holder 1211 is connected to the adaptor 1212 and the warpage-limiting unit 122f, respectively. In the present embodiment, the warpage-limiting mechanism 12f further includes an adjusting unit 126. The adjusting unit 126 is connected to the supporting unit 121f and/or the warpage limiting unit 122f to adjust the overlapping width (see the overlapping width L1 of fig. 2) and/or the vertical spacing (see the vertical spacing L2 of fig. 2) of the warpage limiting unit and the flexible metal substrate. In the present embodiment, the adjusting unit 126 is connected to the supporting unit 121f and the warpage limiting unit 122f to adjust the overlapping width and vertical pitch of the warpage limiting unit and the flexible metal substrate. In the present embodiment, the adjusting unit 126 may include a plurality of nuts. When the nut is in a loosened state, the adaptor 1212 and/or the warpage limiting unit 122f may be adjusted to a desired position, and then the nut may be tightened, thereby adjusting the overlapping width and vertical distance between the warpage limiting unit and the flexible metal substrate. In other embodiments, the adjustment unit 126 may comprise a nut and hole combination, or may be implemented by other adjustable techniques, such as locking, engaging, magnetic attraction, or any combination thereof.

The conveying mechanism 11 of the above embodiment is exemplified by having the conveyor belt 111, but in other embodiments, the conveying mechanism may not have a conveyor belt, such as a roll-to-roll (roll) conveying mechanism, which can convey the flexible metal substrate only by a reel or a reel, and selectively utilize a roller to support the flexible metal substrate during the conveying process. Fig. 11 and 12 are schematic top views of a production apparatus 1h according to another embodiment of the present invention, and fig. 12 is a schematic cross-sectional view of the production apparatus 1h of fig. 11 along a section line B-B. As shown in fig. 11 and 12, in the present embodiment, the conveying mechanism 11h does not have a conveyor belt, for example, the conveying mechanism 11h may include a plurality of winding units, such as winding units 113a and 113b, wherein the flexible metal substrate 2 may be wound on the winding units 113a and 113 b. The winding unit 113a may serve as a roll-out unit to feed the flexible metal substrate 2, and the other winding unit 113b may serve as a roll-up unit to roll up the processed flexible metal substrate 2 for subsequent use. In some embodiments, rollers (not shown) may be optionally used to support the flexible metal substrate 2 during the transportation process.

As shown in fig. 12, the warp limiting mechanism 12h includes a support unit 121h and a warp limiting unit 122 h. The warpage limiting unit 122h is connected to two ends of the supporting unit 121h and disposed on the edge 21 of the flexible metal substrate 2, so as to limit the warpage of the edge 21 of the flexible metal substrate 2. Particularly, the conveying mechanism of the present embodiment does not include a conveyor belt, so the flexible metal substrate 2 does not need to contact the conveyor belt, and therefore the warpage limiting units 122h of the present embodiment can be disposed on two opposite sides of the flexible metal substrate 2, so that the cross section of the entire warpage limiting mechanism 12h is ㄈ -shaped. In other words, the flexible metal substrate 2 is inserted into the slit of the warpage-regulating mechanism 12 h. Thus, the warpage limiting mechanism 12h of the present embodiment can limit the warpage of the flexible metal substrate 2.

As can be seen from the above description, in the warpage limiting mechanism and the manufacturing apparatus of the present invention, the warpage limiting unit is disposed on the edge of the flexible metal substrate, and when the edge of the flexible metal substrate is warped, the warpage limiting unit contacts the edge to limit the warpage, thereby improving the yield of the product. Furthermore, the utility model discloses a conveying mechanism is directly applied to warpage limiting mechanism for warpage limiting mechanism can be integrated on current board, and then can compromise bulk production and high yield.

Although the invention has been described in detail with reference to certain embodiments, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

It will be apparent to those skilled in the art that various modifications and variations can be made in the structure of the present invention without departing from the scope or spirit of the invention. In view of the above, it is intended that the present invention covers modifications and variations of this invention provided they come within the scope of the following claims.

The foregoing has outlined features of several embodiments so that those skilled in the art may better understand the aspects of the present invention. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments. It should also be understood by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the invention, and that they may make various changes, substitutions and alterations herein without departing from the spirit and scope of the invention.

Claims (10)

1. A warpage limiting mechanism for a flexible metal substrate for limiting warpage of a flexible metal substrate conveyed by a conveying mechanism, comprising:

a support unit; and

and the warping limiting unit is connected with the supporting unit, arranged on one edge of the flexible metal substrate and configured to limit the warping of the edge of the flexible metal substrate.

2. The mechanism of claim 1, wherein the edge is a side of the flexible metal substrate, a region extending from the side to an inside of the flexible metal substrate, or a region adjacent to the side.

3. The mechanism as claimed in claim 1, wherein the warpage limiting unit has a non-adhesive portion disposed on a side thereof adjacent to the flexible metal substrate, the non-adhesive portion being opposite to the edge.

4. The warpage-limiting mechanism of claim 1, wherein the warpage-limiting unit comprises a plurality of limiting elements disposed at intervals, the limiting elements being disposed along a conveying direction of the conveying mechanism.

5. The warp limiting mechanism for a flexible metal substrate as recited in claim 1, wherein the warp limiting mechanism is shaped in ㄈ.

6. The warpage limiting mechanism of claim 1, wherein the warpage limiting unit has a protruding portion extending toward the edge of the flexible metal substrate along a normal direction of the flexible metal substrate.

7. The warpage limiting mechanism of claim 6, wherein the warpage limiting mechanism further comprises a pivot structure, the protrusion being retractable through the pivot structure.

8. The warpage-limiting mechanism for a flexible metal substrate of claim 1, further comprising:

an adjusting unit connected with the supporting unit and/or the warpage limiting unit and configured to adjust an overlapping width and/or a vertical spacing of the warpage limiting unit and the flexible metal substrate.

9. A production apparatus for a flexible metal substrate, comprising:

a conveying mechanism configured to convey a flexible metal substrate; and

a warp limiting mechanism disposed adjacent to the conveying mechanism, the warp limiting mechanism comprising: a support unit; and a warpage limiting unit connected with the supporting unit and arranged on one edge of the flexible metal substrate and configured to limit warpage of the edge of the flexible metal substrate.

10. The apparatus of claim 9, wherein the conveying mechanism comprises a plurality of winding units, and the flexible metal substrate is wound around the winding units.

Images