CN211406491U

CN211406491U - Sensor and FPC welding mechanism

Info

Publication number: CN211406491U
Application number: CN202020150750.8U
Authority: CN
Inventors: 黄锦辉; 陈富
Original assignee: Audiowell Electronics Guangdong Co ltd
Current assignee: Audiowell Electronics Guangdong Co ltd
Priority date: 2020-02-03
Filing date: 2020-02-03
Publication date: 2020-09-01
Anticipated expiration: 2030-02-03

Abstract

The utility model relates to a sensor and FPC welding mechanism, FPC welding mechanism includes: first assembly pad, first contact pin and first FPC pad subassembly. When the FPC welding mechanism is assembled, the first FPC bonding pad component is bent towards the first assembling bonding pad, and in the process, the first FPC bonding pad component is clamped with the first contact pin through the first clamping portion. At this moment, the first FPC pad assembly and the first assembling pad can be positioned. And further pushing the first FPC bonding pad assembly by using welding equipment. Because, spacing has been realized here in-process to first joint portion and first contact pin to can avoid appearing dislocation or aversion phenomenon bulldozing in-process first FPC pad subassembly and first assembly pad, realize fixed-position welding.

Description

Sensor and FPC welding mechanism

Technical Field

The utility model relates to a technical field of sensor especially relates to a sensor and FPC welding mechanism.

Background

When the sensor is assembled, the FPC and the bonding pad need to be assembled and welded. When the FPC is welded with the welding pad, the FPC is often required to be pre-bent, but after the FPC is placed on the welding pad (before the FPC probe core and the probe assembly are welded), the FPC cannot be relatively fixed with the welding pad, so that the FPC and the welding pad can be dislocated or shifted during welding assembly, namely, the FPC and the welding pad are difficult to position during welding, and the using effect is influenced.

SUMMERY OF THE UTILITY MODEL

Accordingly, it is desirable to provide a sensor and an FPC bonding mechanism that can achieve tack welding between an FPC and a bonding pad and improve the use effect.

The technical scheme is as follows:

an FPC soldering mechanism comprising: first assembly pad, first contact pin and first FPC pad subassembly, first contact pin is installed on the first assembly pad, just first assembly pad with first contact pin electric connection, be equipped with first joint portion on the first FPC pad subassembly, first joint portion with the cooperation of first contact pin joint, first FPC pad subassembly with first assembly pad is counterpointed the welding.

When the FPC welding mechanism is assembled, the first FPC bonding pad component is bent towards the first assembling bonding pad, and in the process, the first FPC bonding pad component is clamped with the first contact pin through the first clamping portion. At this moment, the first FPC pad assembly and the first assembling pad can be positioned. And further pushing the first FPC bonding pad assembly by using welding equipment. Because, spacing has been realized here in-process to first joint portion and first contact pin to can avoid appearing dislocation or aversion phenomenon bulldozing in-process first FPC pad subassembly and first assembly pad, realize fixed-position welding.

An FPC soldering mechanism comprising: second mounting disc, second assembly pad, second contact pin and second FPC pad subassembly, the second assembly pad is installed on the second mounting disc, the second contact pin is installed on the second assembly pad, just the second assembly pad with second contact pin electric connection, be equipped with second joint portion on the second FPC pad subassembly, be equipped with on the second mounting disc with second joint portion matched with third joint portion, second FPC pad subassembly with the welding of counterpointing of second assembly pad.

When the FPC welding mechanism is used, the second assembly pad and the second contact pin are installed on the second installation disc according to preset assembly requirements, then the second FPC pad assembly is bent towards the second assembly pad, and in the process, the second FPC pad assembly is clamped with the third clamping portion through the second clamping portion. At this time, the second FPC pad assembly and the second mounting pad can be positioned. And further pushing the second FPC pad assembly by using welding equipment. Because, second joint portion and third joint portion have realized spacingly at this in-process to can avoid appearing dislocation or aversion phenomenon bulldozing in-process second FPC pad subassembly and second assembly pad, realize fixed-position welding.

A sensor, including FPC welding mechanism still include: the FPC welding mechanism is arranged inside the mounting shell.

When the sensor is assembled, a welded FPC welding mechanism is arranged inside the mounting shell. When assembling the FPC welding mechanism, the first FPC welding pad assembly is bent towards the first assembling welding pad, and in the process, the first FPC welding pad assembly is clamped with the first contact pin through the first clamping portion. At the moment, the first FPC welding disc assembly and the first assembling welding disc are positioned, so that the phenomenon of dislocation or displacement of the first FPC welding disc assembly and the first assembling welding disc in the pushing and pressing process can be avoided, and the using effect of the sensor is improved.

Or when the sensor is assembled, a welded FPC welding mechanism is arranged in the mounting shell. And bending the second FPC pad assembly towards the second assembly pad, wherein the second FPC pad assembly is clamped with the third clamping part through the second clamping part. At the moment, the second FPC pad assembly and the second assembling pad are positioned, so that the phenomenon of dislocation or displacement of the second FPC pad assembly and the second assembling pad in the pushing and pressing process can be avoided, and the using effect of the sensor is improved.

The technical solution is further explained below:

the first FPC pad assembly comprises a flexible conductive belt and an FPC pad, one end of the flexible conductive belt is electrically connected with the FPC pad, the other end of the flexible conductive belt is used for being connected with a related electrical structure, and the FPC pad is in alignment welding with the first assembling pad.

FPC welding mechanism still includes first mounting disc and surveys the core, it installs to visit the core one of them of first mounting disc, first assembly pad with first FPC pad subassembly is located the another side of first mounting disc, the erection joint has been seted up on the first mounting disc, flexible conductive band process the erection joint with visit core electric connection.

The first clamping portion comprises an assembling clamping plate and a connecting plate, the assembling clamping plate and the first FPC bonding pad component are arranged at intervals, the connecting plate is located between the assembling clamping plate and the FPC bonding pad, one end of the connecting plate is connected with the assembling clamping plate, the other end of the connecting plate is connected with the FPC bonding pad, and the assembling clamping plate, the connecting plate and the FPC bonding pad are surrounded to form a concave portion used for clamping the first contact pin.

The first contact pin comprises a first sub-contact pin and a second sub-contact pin, the first sub-contact pin and the second sub-contact pin are both arranged on the FPC bonding pad, and a mounting gap is reserved between the first sub-contact pin and the second sub-contact pin.

First minute contact pin includes first insulating cover and first probe spare, first probe spare protrusion in the FPC pad, just first probe spare with first assembly pad electric connection, first insulating ways is established the outside of first probe spare, the second divides the contact pin to include second insulating cover and second probe spare, second probe spare protrusion in the FPC pad, just second probe spare with first assembly pad electric connection, second insulating ways establishes the outside of second probe spare.

One end of the connecting plate is connected with the middle of the assembling clamping plate, the other end of the connecting plate is connected with the middle of the FPC bonding pad, the concave part is divided into a first clamping concave part and a second clamping concave part, the first clamping concave part is in clamping fit with the first sub-contact pin, and the second clamping concave part is in clamping fit with the second sub-contact pin.

The connecting plate card is gone into installation clearance, just one of them side of connecting plate be used for with first minute contact pin is inconsistent, the opposite side of connecting plate be used for with second minute contact pin is inconsistent.

Drawings

Fig. 1 is a schematic structural view of an FPC welding mechanism according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a first FPC pad assembly according to an embodiment of the present invention;

fig. 3 is a schematic side view of the FPC welding mechanism according to an embodiment of the present invention.

Description of reference numerals:

100. the flexible printed circuit board comprises a first assembly pad, 110, a concave part, 111, a first clamping concave part, 112, a second clamping concave part, 200, a first contact pin, 211, a first sub-contact pin, 212, a second sub-contact pin, 300, a first FPC (flexible printed circuit) pad assembly, 310, a first clamping part, 311, an assembly clamping plate, 312, a connecting plate, 320, a flexible conductive strip, 330, an FPC pad, 400, a first mounting plate, 500 and a probe core.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In the present invention, the terms "first" and "second" do not denote any particular quantity or order, but are merely used to distinguish names.

As shown in fig. 1 to 3, in one embodiment, an FPC soldering mechanism includes: first assembly pad 100, first contact pin 200 and first FPC pad subassembly 300, first contact pin 200 is installed on first assembly pad 100, just first assembly pad 100 with first contact pin 200 electric connection, be equipped with first joint portion 310 on the first FPC pad subassembly 300, first joint portion 310 with the cooperation of first contact pin 200 joint, first FPC pad subassembly 300 with first assembly pad 100 is to the butt joint.

When the FPC welding mechanism is used, the first FPC bonding pad assembly 300 is bent toward the first assembly bonding pad 100, and in this process, the first FPC bonding pad assembly 300 is clamped with the first pin 200 by the first clamping portion 310. At this time, the first FPC pad assembly 300 can be positioned with respect to the first mounting pad 100. The first FPC pad assembly 300 is further pushed by a soldering apparatus. Because, first joint portion 310 and first contact pin 200 have realized spacingly in this in-process to can avoid pushing and pressing in-process second FPC pad subassembly and second assembly pad to appear misplacing or the aversion phenomenon, realize tack welding.

As shown in fig. 1 and 2, in one embodiment, the first FPC pad assembly 300 includes a flexible conductive tape 320 and an FPC pad 330, one end of the flexible conductive tape 320 is electrically connected to the FPC pad 330, the other end of the flexible conductive tape 320 is used for connecting to an associated electrical structure (e.g., a probe), and the FPC pad 330 is soldered to the first mounting pad 100 in an aligned manner. FPC welding mechanism still includes first mounting disc 400 and visits core 500, it installs to visit core 500 one of them one side of first mounting disc 400, first assembly pad 100 with first FPC pad subassembly 300 is located the another side of first mounting disc 400, the mounting seam has been seted up on the first mounting disc 400, flexible conductive band 320 passes through the mounting seam with visit core 500 electric connection.

Specifically, the flexible conductive tape 320 is provided with a hard electrical device such as a copper foil inside, and is bonded and fixed by an adhesive. Therefore, when the first FPC pad assembly 300 and the first assembly pad 100 are welded in an alignment manner, the extending direction of the mounting seam is parallel to the long side direction of the second tray-loading pad, so that the flexible conductive tape 320 can be bent in a specific direction, and the flexible conductive tape 320 is prevented from being folded. Further, the probe core 500 and the first assembly pad 100 are fixed by the first mounting plate 400, so that the first FPC pad assembly 300 is electrically connected to the probe core 500, and the first FPC pad assembly 300 is more conveniently welded to the first assembly pad 100. In addition, when the FPC welding mechanism needs to be installed in the whole equipment, only the space for installing the first installation disc 400 needs to be reserved in the whole equipment, namely, the installation of the FPC welding mechanism is more convenient.

As shown in fig. 1 and 2, in one embodiment, the first clamping portion 310 includes an assembling clamping plate 311 and a connecting plate 312, the assembling clamping plate 311 is disposed at a distance from the first FPC pad assembly 300, the connecting plate 312 is disposed between the assembling clamping plate 311 and the FPC pad 330, one end of the connecting plate 312 is connected to the assembling clamping plate 311, the other end of the connecting plate 312 is connected to the FPC pad 330, and the assembling clamping plate 311, the connecting plate 312 and the FPC pad 330 enclose a recess 110 for clamping the first pin 200. Specifically, the interval between the assembling clamping plate 311 and the FPC pad 330 is determined according to the needle diameter of the first contact pin 200, and the assembling clamping plate 311 and the FPC pad 330 are connected through the connecting plate 312. Before the FPC pad 330 and the first assembly pad 100 are welded by using a welding device, the FPC pad 330 is pre-bent, and the first pin 200 is in abutting joint with the concave portion 110. At this time, although there is still a space between the FPC pad 330 and the first mounting pad 100, the FPC pad 330 will not move laterally or longitudinally with respect to the first mounting pad 100 under the interference engagement of the first pin 200 and the recess 110. That is, the FPC pad 330 is further pressed directly by the soldering device, so that the FPC pad 330 and the first mounting pad 100 are soldered in alignment.

As shown in fig. 1 to 3, in one embodiment, the first pin 200 includes a first sub-pin 211 and a second sub-pin 212, the first sub-pin 211 and the second sub-pin 212 are both mounted on the FPC pad 330, and a mounting gap is left between the first sub-pin 211 and the second sub-pin 212. First minute contact pin 211 includes first insulating cover and first probe spare, first probe spare protrusion in FPC pad 330, just first probe spare with first assembly pad 100 electric connection, first insulating ways is established the outside of first probe spare, second minute contact pin 212 includes second insulating cover and second probe spare, second probe spare protrusion in FPC pad 330, just second probe spare with first assembly pad 100 electric connection, second insulating ways is established the outside of second probe spare. One end of the connecting plate 312 is connected with the middle part of the assembling clamping plate 311, the other end of the connecting plate 312 is connected with the middle part of the FPC pad 330, the concave part 110 is divided into a first clamping concave part 111 and a second clamping concave part 112, the first clamping concave part 111 is in clamping fit with the first sub-contact pin 211, and the second clamping concave part 112 is in clamping fit with the second sub-contact pin 212. The connecting plate 312 is clamped into the mounting gap, one side of the connecting plate 312 is used for abutting against the first sub-pin 211, and the other side of the connecting plate 312 is used for abutting against the second sub-pin 212.

Specifically, compared to the embodiment in which the third engaging portion is engaged with only one pin, in this embodiment, the first engaging portion 310 is engaged with the first sub-pin 211 and the second sub-pin 212 at the same time, so that the contact area between the concave portion 110 and the first pin 200 is increased. Meanwhile, a mounting gap is left between the first sub-pin 211 and the second sub-pin 212. When the FPC pad 330 is pushed and moved along with the soldering device, the connecting plate 312 and the assembling clamping plate 311 can be effectively attached to the first mounting plate 400, that is, after the FPC pad 330 is welded to the first assembling pad 100 in an aligned manner, the assembling clamping plate 311, the connecting plate 312 and the FPC pad 330 can be located on the same plane. Meanwhile, the above embodiment can avoid the tilting phenomenon of the first clamping portion 310 after the alignment welding of the FPC pad 330 and the first assembly pad 100 is realized. Further, after the connecting plate 312 is installed in the installation gap, two sides of the connecting plate 312 respectively contact with the first sub-pin 211 and the second sub-pin 212, that is, the connecting plate 312 contacts with the first sub-pin 211 and the second sub-pin 212, so that the lateral movement of the FPC pad 330 relative to the first assembly pad 100 can be limited, the first pin 200 simultaneously contacts with one side of the assembly clamping plate 311 and one side of the FPC pad 330, so that the longitudinal movement of the FPC pad 330 relative to the first assembly pad 100 can be limited.

In one embodiment, an FPC soldering mechanism includes: second mounting disc, second assembly pad, second contact pin and second FPC pad subassembly, the second assembly pad is installed on the second mounting disc, the second contact pin is installed on the second assembly pad, just the second assembly pad with second contact pin electric connection, be equipped with second joint portion on the second FPC pad subassembly, be equipped with on the second mounting disc with second joint portion matched with third joint portion, second FPC pad subassembly with the welding of counterpointing of second assembly pad.

When the FPC welding mechanism is assembled, the second assembly pad and the second contact pin are installed on the second installation disc according to preset assembly requirements, then the second FPC pad assembly is bent towards the second assembly pad, and in the process, the second FPC pad assembly is clamped with the third clamping portion through the second clamping portion. At this time, the second FPC pad assembly and the second mounting pad can be positioned. And further pushing the second FPC pad assembly by using welding equipment. Because, second joint portion and third joint portion have realized spacingly at this in-process to can avoid appearing dislocation or aversion phenomenon bulldozing in-process second FPC pad subassembly and second assembly pad, realize fixed-position welding.

In one embodiment, the second clamping portion is a collar or a connecting plate 312 with an opening. The third clamping connection part is a convex block or a positioning column. Firstly, after the second FPC welding disc component and the second assembling welding disc are positioned, the contact part of the second clamping part and the second installing disc is determined, and a third clamping part is additionally arranged on the contact part. Afterwards, when carrying out second FPC pad subassembly and second assembly pad counterpoint welding once more, only need carry out the counterpoint of second joint portion and third joint portion and contradict the joint, can guarantee the counterpoint of second FPC pad subassembly and second assembly pad.

In one embodiment, a sensor includes the FPC soldering mechanism according to any one of the above embodiments, and further includes: the FPC welding mechanism is arranged inside the mounting shell.

When the sensor is assembled, a welded FPC welding mechanism is arranged inside the mounting shell. When the FPC welding mechanism is assembled, the first FPC pad assembly 300 is bent toward the first assembly pad 100, and in this process, the first FPC pad assembly 300 is clamped with the first pin 200 by the first clamping portion 310. At this time, the first FPC bonding pad assembly 300 and the first assembly bonding pad 100 can be positioned, so that the phenomenon of dislocation or displacement between the first FPC bonding pad assembly 300 and the first assembly bonding pad 100 in the pushing process can be avoided, and the use effect of the sensor is improved.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An FPC welding mechanism, characterized by includes: first assembly pad, first contact pin and first FPC pad subassembly, first contact pin is installed on the first assembly pad, just first assembly pad with first contact pin electric connection, be equipped with first joint portion on the first FPC pad subassembly, first joint portion with the cooperation of first contact pin joint, first FPC pad subassembly with first assembly pad is counterpointed the welding.

2. The FPC soldering mechanism of claim 1, wherein the first FPC pad assembly comprises a flexible conductive tape and an FPC pad, one end of the flexible conductive tape is electrically connected with the FPC pad, the other end of the flexible conductive tape is used for being connected with a related electrical structure, and the FPC pad is soldered to the first assembly pad in an aligned manner.

3. The FPC welding mechanism of claim 2, further comprising a first mounting disk and a probe core, wherein the probe core is mounted on one surface of the first mounting disk, the first assembly bonding pad and the first FPC bonding pad assembly are located on the other surface of the first mounting disk, a mounting seam is formed in the first mounting disk, and the flexible conductive tape is electrically connected with the probe core through the mounting seam.

4. The FPC welding mechanism of claim 3, wherein the first clamping portion comprises an assembling clamping plate and a connecting plate, the assembling clamping plate and the first FPC pad assembly are arranged at intervals, the connecting plate is located between the assembling clamping plate and the FPC pad, one end of the connecting plate is connected with the assembling clamping plate, the other end of the connecting plate is connected with the FPC pad, and the assembling clamping plate, the connecting plate and the FPC pad enclose a concave portion for clamping the first contact pin.

5. The FPC soldering mechanism of claim 4, wherein the first contact pin comprises a first sub-contact pin and a second sub-contact pin, the first sub-contact pin and the second sub-contact pin are both mounted on the FPC pad, and a mounting gap is left between the first sub-contact pin and the second sub-contact pin.

6. The FPC welding mechanism of claim 5, wherein the first sub-contact pin comprises a first insulating sleeve and a first probe piece, the first probe piece protrudes out of the FPC pad, the first probe piece is electrically connected with the first assembly pad, the first insulating sleeve is sleeved outside the first probe piece, the second sub-contact pin comprises a second insulating sleeve and a second probe piece, the second probe piece protrudes out of the FPC pad, the second probe piece is electrically connected with the first assembly pad, and the second insulating sleeve is sleeved outside the second probe piece.

7. The FPC welding mechanism according to claim 5, wherein one end of the connecting plate is connected with the middle of the assembling clamping plate, the other end of the connecting plate is connected with the middle of the FPC bonding pad, the concave portion is divided into a first clamping concave portion and a second clamping concave portion, the first clamping concave portion is in clamping fit with the first sub-contact pin, and the second clamping concave portion is in clamping fit with the second sub-contact pin.

8. The FPC welding mechanism of claim 7, wherein the connecting plate is clamped into the mounting gap, one side of the connecting plate is used for abutting against the first sub-contact pin, and the other side of the connecting plate is used for abutting against the second sub-contact pin.

9. An FPC welding mechanism, characterized by includes: second mounting disc, second assembly pad, second contact pin and second FPC pad subassembly, the second assembly pad is installed on the second mounting disc, the second contact pin is installed on the second assembly pad, just the second assembly pad with second contact pin electric connection, be equipped with second joint portion on the second FPC pad subassembly, be equipped with on the second mounting disc with second joint portion matched with third joint portion, second FPC pad subassembly with the welding of counterpointing of second assembly pad.

10. A sensor comprising the FPC soldering mechanism of any one of claims 1 to 9, further comprising: the FPC welding mechanism is arranged inside the mounting shell.