CN211399703U - High-heat-conductivity double-sided aluminum substrate - Google Patents
High-heat-conductivity double-sided aluminum substrate Download PDFInfo
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- CN211399703U CN211399703U CN202020518994.7U CN202020518994U CN211399703U CN 211399703 U CN211399703 U CN 211399703U CN 202020518994 U CN202020518994 U CN 202020518994U CN 211399703 U CN211399703 U CN 211399703U
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Abstract
The utility model provides a high heat conduction double-sided aluminum substrate, which comprises a first circuit board layer, a first insulating layer, a first heat conduction layer, an aluminum base layer, a second heat conduction layer, a second insulating layer and a second circuit board layer which are arranged in sequence; the first insulating layer, the first circuit board layer, the first heat conduction layer, the second insulating layer, the second circuit board layer and the second heat conduction layer are centrosymmetric relative to the aluminum base layer; a plurality of heat dissipation through holes for improving heat dissipation performance are formed in the side surface of the aluminum base layer in a matrix manner, and the heat dissipation through holes transversely penetrate through the aluminum base layer; the LED lamp is characterized in that the surfaces of the first circuit board layer and the second circuit board layer are further provided with a plurality of transverse heat dissipation elongated grooves and a plurality of vertical heat dissipation elongated grooves in a crossed mode, the LED lamp beads are attached to the lamp bead bosses, and the LED lamp beads and the aluminum substrate with the outstanding lighting effect can be attached to the lamp bead bosses through line printing and other parts.
Description
[ technical field ]
The utility model relates to an aluminium base board product technical field especially relates to a performance is good, high two-sided aluminium base board of high heat conduction that the reliability is high.
[ background art ]
The aluminum substrate is a metal-based copper-clad plate with a good heat dissipation function, a single-sided plate is generally composed of three layers of structures, namely a circuit layer (copper foil), an insulating layer and a metal base layer, an LED aluminum substrate is a PCB (printed circuit board), and is also the meaning of a printed circuit board, the circuit board is made of aluminum alloy, the circuit board is made of glass fiber in the prior art, but the LED generates heat greatly, so that the circuit board for an LED lamp is generally an aluminum substrate and can conduct heat quickly, and the circuit board for other equipment or electrical appliances is also a glass fiber board.
At the present stage, aluminum substrate products are rapidly developed and advanced, but still have many defects, such as insufficient illumination uniformity of LED lamp beads, insufficient actual requirements of heat dissipation performance, and the like, which restricts better popularization and application of the products.
[ contents of utility model ]
For overcoming the problem that prior art exists, the utility model provides a high heat conduction double-sided aluminium base board that performance is good, the reliability is high.
The utility model provides a scheme for solving the technical problem provides a high heat conduction double-sided aluminum substrate, including the first circuit board layer, first insulating layer, first heat-conducting layer, aluminium basic unit, second heat-conducting layer, second insulating layer and the second circuit board layer that set gradually; the first insulating layer, the first circuit board layer, the first heat conduction layer, the second insulating layer, the second circuit board layer and the second heat conduction layer are centrosymmetric relative to the aluminum base layer; a plurality of heat dissipation through holes for improving heat dissipation performance are formed in the side surface of the aluminum base layer in a matrix manner, and the heat dissipation through holes transversely penetrate through the aluminum base layer; a plurality of transverse radiating long grooves and a plurality of vertical radiating long grooves are further formed in the surfaces of the first circuit board layer and the second circuit board layer in a crisscross mode, and the plurality of transverse radiating long grooves and the plurality of vertical radiating long grooves are separated to form a plurality of lamp bead bosses which are arranged in a matrix form; LED lamp beads are attached to the lamp bead bosses; the thicknesses of the first insulating layer and the first heat conducting layer are equal, the thicknesses of the second insulating layer and the second heat conducting layer are equal, and the aperture size range of each heat dissipation through hole formed in the aluminum base layer is 0.3-0.7 mm; and the thickness of the aluminum base layer ranges from 3 mm to 5 mm.
Preferably, the first circuit board layer and the second circuit board layer are printed with LED lamp bead circuits, and the LED lamp bead circuits include a first capacitor circuit, a first polarity capacitor circuit connected in parallel with the first capacitor circuit, and a plurality of LED lamp bead group circuits connected in parallel in sequence; the first capacitance circuit comprises a first capacitor C1 and a first steady-state diode D1 connected in series; the first polarity capacitance circuit comprises a first polarity capacitance C2 and a second steady-state diode D2 connected in series; the input ends of the first capacitor circuit, the first polarity capacitor circuit and each LED lamp bead group circuit are connected with VDD +, and the output ends of the first capacitor circuit, the first polarity capacitor circuit and each LED lamp bead group circuit are connected with VDD-; the LED lamp bead group circuit comprises a resistor and a plurality of LED lamp beads which are connected in series.
Preferably, the depth range of the transverse radiating long grooves and the plurality of vertical radiating long grooves is 10-20 μm; the thickness of the first heat conduction layer and the second heat conduction layer ranges from 15 to 20 micrometers; the thickness of the first insulating layer and the second insulating layer ranges from 12 to 17 mu m.
Preferably, the first heat conduction layer and the second heat conduction layer are also vertically provided with a plurality of vertical heat dissipation holes for improving the heat dissipation performance; and the vertical heat dissipation holes correspond to the heat dissipation through holes of the aluminum base layer in position.
Preferably, a first resistor R1 is further connected between the first capacitor circuit and the input end of the first polarity capacitor circuit; a second resistor R2 is connected between the output ends of the first capacitor circuit and the first polarity capacitor circuit; the first capacitor circuit is connected in the same direction as the first stable diode D1 and the second stable diode D2 in the first polarity capacitor circuit.
Preferably, first circuit board layer, first insulating layer, first heat-conducting layer, aluminium basic unit, second heat-conducting layer, second insulating layer and the whole square structure that is of second circuit board layer, just heat dissipation through-hole on the aluminium basic unit is vertical three, and the matrix of horizontal sixteen is arranged.
Preferably, the upper side surface and the lower side surface of the aluminum substrate are also provided with a resin film layer and a shielding layer; the thickness of the resin film layer is 0.5-2 μm; the thickness of the shielding layer is in the range of 2-5 μm.
Compared with the prior art, the high-thermal-conductivity double-sided aluminum substrate of the invention is characterized in that a first circuit board layer 11, a first insulating layer 12, a first heat-conducting layer 13, an aluminum base layer 14, a second heat-conducting layer 15, a second insulating layer 16 and a second circuit board layer 17 are simultaneously and sequentially arranged, the first insulating layer 12, the first circuit board layer 11, the first heat-conducting layer 13, the second insulating layer 16, the second circuit board layer 17 and the second heat-conducting layer 15 are centrosymmetric relative to the aluminum base layer 14, a plurality of heat-radiating through holes 141 for improving the heat-radiating performance are arranged in a matrix manner on the side surface of the aluminum base layer 14, the heat-radiating through holes 141 transversely penetrate through the aluminum base layer 14, a plurality of transverse heat-radiating long grooves and a plurality of vertical heat-radiating long grooves are further arranged on the surfaces of the first circuit board layer 11 and the second circuit board layer 17 in a crisscross manner, and a plurality of lamp, because the LED lamp pearl is provided with in the attached on lamp pearl boss 111, through the attached of circuit printing and other spare parts, can realize possessing a plurality of LED lamp pearls, the outstanding aluminium base board of illuminating effect, the setting of two-sided aluminium base board not only the result of use is better, and heat dispersion is higher, structural design is reasonable.
[ description of the drawings ]
Fig. 1 is a schematic view of a three-dimensional structure of a high thermal conductivity double-sided aluminum substrate of the present invention.
Fig. 2 is a schematic view of the explosion state structure of the high thermal conductivity double-sided aluminum substrate of the present invention.
[ detailed description of the invention ]
To make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and fig. 2, a high thermal conductivity double-sided aluminum substrate 1 of the present invention includes a first circuit board layer 11, a first insulating layer 12, a first heat conducting layer 13, an aluminum base layer 14, a second heat conducting layer 15, a second insulating layer 16, and a second circuit board layer 17, which are sequentially disposed; the first insulating layer 12, the first circuit board layer 11, the first heat conduction layer 13, the second insulating layer 16, the second circuit board layer 17 and the second heat conduction layer 15 are centrosymmetric relative to the aluminum base layer 14; a plurality of heat dissipation through holes 141 for improving heat dissipation performance are formed in the side surface of the aluminum base layer 14 in a matrix manner, and the heat dissipation through holes 141 transversely penetrate through the aluminum base layer 14; the surfaces of the first circuit board layer 11 and the second circuit board layer 17 are further provided with a plurality of transverse heat dissipation long grooves and a plurality of vertical heat dissipation long grooves in a crisscross manner, and the plurality of transverse heat dissipation long grooves and the plurality of vertical heat dissipation long grooves are separated to form a plurality of lamp bead bosses 111 arranged in a matrix form; each lamp bead boss 111 is provided with an LED lamp bead in an attached manner; the thicknesses of the first insulating layer 12 and the first heat conducting layer 13 are equal, the thicknesses of the second insulating layer 16 and the second heat conducting layer 15 are equal, and the aperture size range of each heat dissipation through hole 141 formed in the aluminum base layer 14 is 0.3-0.7 mm; and the thickness of the aluminum base layer 14 ranges from 3 mm to 5 mm.
The application sequentially arranges a first circuit board layer 11, a first insulating layer 12, a first heat conducting layer 13, an aluminum base layer 14, a second heat conducting layer 15, a second insulating layer 16 and a second circuit board layer 17 at the same time, the first insulating layer 12, the first circuit board layer 11, the first heat conducting layer 13, the second insulating layer 16, the second circuit board layer 17 and the second heat conducting layer 15 are centrosymmetric relative to the aluminum base layer 14, a plurality of heat radiating through holes 141 for improving heat radiating performance are arranged in a matrix manner on the side surface of the aluminum base layer 14, the heat radiating through holes 141 transversely penetrate through the aluminum base layer 14, a plurality of transverse heat radiating long grooves and a plurality of vertical heat radiating long grooves are further arranged on the surfaces of the first circuit board layer 11 and the second circuit board layer 17 in a crossed manner, the plurality of transverse heat radiating long grooves and the plurality of vertical heat radiating long grooves are separated to form a plurality of lamp bead bosses 111 arranged in a matrix manner, and, through the attachment of line printing and other spare parts, can realize possessing a plurality of LED lamp pearls, the outstanding aluminium base board of illuminating effect, the setting of two-sided aluminium base board is not only the result of use better, and heat dispersion is higher, structural design is reasonable.
The normal metal substrate in outside mainly refers to single face aluminium base board, and this material circuit board has that the circuit quantity of a drawback cloth is limited, and the product function is simple, and the heat dissipation is very slow, and the double-sided aluminium base board that this application disclosed and protected has increased the one deck circuit on the basis of single face, is exactly double-sided circuit, just so can increase the circuit and walk the line, increases the function of product, and the heat that produces the components and parts faster, the leading-in outside through aluminium base board promotes the performance of product.
Preferably, the first circuit board layer 11 and the second circuit board layer 17 are printed with LED lamp bead circuits, and the LED lamp bead circuits include a first capacitor circuit, a first polarity capacitor circuit connected in parallel with the first capacitor circuit, and a plurality of LED lamp bead group circuits connected in parallel in sequence; the first capacitance circuit comprises a first capacitor C1 and a first steady-state diode D1 connected in series; the first polarity capacitance circuit comprises a first polarity capacitance C2 and a second steady-state diode D2 connected in series; the input ends of the first capacitor circuit, the first polarity capacitor circuit and each LED lamp bead group circuit are connected with VDD +, and the output ends of the first capacitor circuit, the first polarity capacitor circuit and each LED lamp bead group circuit are connected with VDD-; the LED lamp bead group circuit comprises a resistor and a plurality of LED lamp beads which are connected in series.
Preferably, the depth range of the transverse radiating long grooves and the plurality of vertical radiating long grooves is 10-20 μm; the thickness of the first heat conduction layer 13 and the second heat conduction layer 15 ranges from 15 to 20 micrometers; the thickness of the first insulating layer 12 and the second insulating layer 16 is in the range of 12-17 μm.
Preferably, a plurality of vertical heat dissipation holes for improving heat dissipation performance are vertically formed in the first heat conduction layer 13 and the second heat conduction layer 15; and the vertical heat dissipation holes correspond to the heat dissipation through holes 141 of the aluminum base layer 14.
Preferably, a first resistor R1 is further connected between the first capacitor circuit and the input end of the first polarity capacitor circuit; a second resistor R2 is connected between the output ends of the first capacitor circuit and the first polarity capacitor circuit; the first capacitor circuit is connected in the same direction as the first stable diode D1 and the second stable diode D2 in the first polarity capacitor circuit.
Preferably, the first circuit board layer 11, the first insulating layer 12, the first heat conduction layer 13, the aluminum base layer 14, the second heat conduction layer 15, the second insulating layer 16 and the second circuit board layer 17 are of a square structure as a whole, and the heat dissipation through holes 141 on the aluminum base layer 14 are vertically three and horizontally sixteen matrix type arrangement.
Preferably, the upper side surface and the lower side surface of the aluminum substrate 14 are further provided with a resin film layer and a shielding layer; the thickness of the resin film layer is 0.5-2 μm; the thickness of the shielding layer is in the range of 2-5 μm.
The normal metal substrate in outside mainly refers to single face aluminium base board, and this material circuit board has that the circuit quantity of a drawback cloth is limited, and the product function is simple, and the heat dissipation is very slow, and the double-sided aluminium base board that this application disclosed and protected has increased the one deck circuit on the basis of single face, is exactly double-sided circuit, just so can increase the circuit and walk the line, increases the function of product, and the heat that produces the components and parts faster, the leading-in outside through aluminium base board promotes the performance of product.
Compared with the prior art, the high-thermal-conductivity double-sided aluminum substrate 1 of the invention is characterized in that a first circuit board layer 11, a first insulating layer 12, a first heat-conducting layer 13, an aluminum base layer 14, a second heat-conducting layer 15, a second insulating layer 16 and a second circuit board layer 17 are simultaneously and sequentially arranged, the first insulating layer 12, the first circuit board layer 11, the first heat-conducting layer 13, the second insulating layer 16, the second circuit board layer 17 and the second heat-conducting layer 15 are symmetrical relative to the center of the aluminum base layer 14, a plurality of heat-radiating through holes 141 for improving the heat-radiating performance are arranged in a matrix manner on the side surface of the aluminum base layer 14, the heat-radiating through holes 141 transversely penetrate through the aluminum base layer 14, a plurality of transverse heat-radiating long grooves and a plurality of vertical heat-radiating long grooves are further arranged on the surfaces of the first circuit board layer 11 and the second circuit board layer 17 in a crossed manner, and the plurality of, because the LED lamp pearl is provided with in the attached on lamp pearl boss 111, through the attached of circuit printing and other spare parts, can realize possessing a plurality of LED lamp pearls, the outstanding aluminium base board of illuminating effect, the setting of two-sided aluminium base board not only the result of use is better, and heat dispersion is higher, structural design is reasonable.
The above-mentioned embodiments of the present invention do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (7)
1. The utility model provides a high heat conduction double-sided aluminium base board which characterized in that: the heat-conducting type LED lamp comprises a first circuit board layer, a first insulating layer, a first heat-conducting layer, an aluminum base layer, a second heat-conducting layer, a second insulating layer and a second circuit board layer which are sequentially arranged; the first insulating layer, the first circuit board layer, the first heat conduction layer, the second insulating layer, the second circuit board layer and the second heat conduction layer are centrosymmetric relative to the aluminum base layer; a plurality of heat dissipation through holes for improving heat dissipation performance are formed in the side surface of the aluminum base layer in a matrix manner, and the heat dissipation through holes transversely penetrate through the aluminum base layer; a plurality of transverse radiating long grooves and a plurality of vertical radiating long grooves are further formed in the surfaces of the first circuit board layer and the second circuit board layer in a crisscross mode, and the plurality of transverse radiating long grooves and the plurality of vertical radiating long grooves are separated to form a plurality of lamp bead bosses which are arranged in a matrix form; LED lamp beads are attached to the lamp bead bosses; the thicknesses of the first insulating layer and the first heat conducting layer are equal, the thicknesses of the second insulating layer and the second heat conducting layer are equal, and the aperture size range of each heat dissipation through hole formed in the aluminum base layer is 0.3-0.7 mm; and the thickness of the aluminum base layer ranges from 3 mm to 5 mm.
2. The high thermal conductivity double-sided aluminum substrate of claim 1, wherein: LED lamp bead circuits are printed on the first circuit board layer and the second circuit board layer, and each LED lamp bead circuit comprises a first capacitor circuit, a first polarity capacitor circuit connected with the first capacitor circuit in parallel and a plurality of LED lamp bead group circuits connected with the first capacitor circuit in parallel in sequence; the first capacitance circuit comprises a first capacitor C1 and a first steady-state diode D1 connected in series; the first polarity capacitance circuit comprises a first polarity capacitance C2 and a second steady-state diode D2 connected in series; the input ends of the first capacitor circuit, the first polarity capacitor circuit and each LED lamp bead group circuit are connected with VDD +, and the output ends of the first capacitor circuit, the first polarity capacitor circuit and each LED lamp bead group circuit are connected with VDD-; the LED lamp bead group circuit comprises a resistor and a plurality of LED lamp beads which are connected in series.
3. The high thermal conductivity double-sided aluminum substrate of claim 1, wherein: the depth range of the transverse radiating long grooves and the plurality of vertical radiating long grooves is 10-20 mu m; the thickness of the first heat conduction layer and the second heat conduction layer ranges from 15 to 20 micrometers; the thickness of the first insulating layer and the second insulating layer ranges from 12 to 17 mu m.
4. The aluminum substrate of any one of claims 1 to 3, wherein: the first heat conduction layer and the second heat conduction layer are also vertically provided with a plurality of vertical heat dissipation holes for improving the heat dissipation performance; and the vertical heat dissipation holes correspond to the heat dissipation through holes of the aluminum base layer in position.
5. The high thermal conductivity double-sided aluminum substrate of claim 2, wherein: a first resistor R1 is connected between the first capacitor circuit and the input end of the first polarity capacitor circuit; a second resistor R2 is connected between the output ends of the first capacitor circuit and the first polarity capacitor circuit; the first capacitor circuit is connected in the same direction as the first stable diode D1 and the second stable diode D2 in the first polarity capacitor circuit.
6. The high thermal conductivity double-sided aluminum substrate of claim 1, wherein: first circuit board layer, first insulation layer, first heat-conducting layer, aluminium basic unit, second heat-conducting layer, second insulation layer and second circuit board layer wholly are square structure, just heat dissipation through-hole on the aluminium basic unit is vertical three, and horizontal sixteen matrix is arranged.
7. The high thermal conductivity double-sided aluminum substrate of claim 1, wherein: resin film layers and shielding layers are arranged on the upper side surface and the lower side surface of the aluminum substrate; the thickness of the resin film layer is 0.5-2 μm; the thickness of the shielding layer is in the range of 2-5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020518994.7U CN211399703U (en) | 2020-04-10 | 2020-04-10 | High-heat-conductivity double-sided aluminum substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020518994.7U CN211399703U (en) | 2020-04-10 | 2020-04-10 | High-heat-conductivity double-sided aluminum substrate |
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| Publication Number | Publication Date |
|---|---|
| CN211399703U true CN211399703U (en) | 2020-09-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020518994.7U Active CN211399703U (en) | 2020-04-10 | 2020-04-10 | High-heat-conductivity double-sided aluminum substrate |
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| CN (1) | CN211399703U (en) |
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- 2020-04-10 CN CN202020518994.7U patent/CN211399703U/en active Active
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