CN211378373U - Large-size display module circuit board - Google Patents
Large-size display module circuit board Download PDFInfo
- Publication number
- CN211378373U CN211378373U CN202020166398.7U CN202020166398U CN211378373U CN 211378373 U CN211378373 U CN 211378373U CN 202020166398 U CN202020166398 U CN 202020166398U CN 211378373 U CN211378373 U CN 211378373U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- finger
- bonding
- nation
- display module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a jumbo size display module group circuit board, including circuit board and the nation decides the finger of setting on the circuit board, nation decides finger one end and wire connection, nation decides the finger and includes first nation decides the finger and the second nation decides the finger, the second nation decides the finger and is located between the wire of two adjacent first nation decides the finger. The utility model discloses under the prerequisite of same circuit board size, can hold more nation and decide the finger, reduce the volume of circuit board, the make full use of space, save material reduces material cost to reduce nation and decide the flow, improve the product yield.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a jumbo size display module assembly circuit board.
Background
Along with the development of automobile electronization, the vehicle-mounted display product is rapidly increased, the large screen trend of the vehicle-mounted display product is obvious, the size of the display screen of a part of automobiles reaches 17 inches, along with the increase of the display screen, the size of an ACF bonding finger area on a circuit board (including a rigid circuit board and a flexible circuit board) in a display module is increased to a certain degree due to the factor of the industry processing capability limit, and the size tolerance of the bonding finger of the circuit board cannot be well matched with the size tolerance of a bonding electrode of a display panel in the module, so that a process bottleneck is formed. How to further improve the size matching between the ACF bonding fingers of the circuit board in the large-size display module and the bonding electrodes of the display panel becomes the focus of the current research.
In the manufacturing scheme of the existing display module, bonding electrodes of the display panel and bonding fingers of the circuit board are both in single-row structural design, in order to complete manufacturing of a large-size display module, a plurality of small-size flexible circuit boards and rigid circuit boards are generally adopted, one end of a single small-size flexible circuit board is bonded on the display panel in a segmented mode, and the other side of the small-size flexible circuit board is bonded on the circuit board in a segmented mode. The large-size display module finished by the scheme has the adverse effects on the industry and energy consumption, such as high material cost, space waste, low manufacturing automation degree, high scrappage, low yield, low product reliability and the like, caused by the use of a plurality of flexible circuit boards or rigid circuit boards and a plurality of bonding processes.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a jumbo size display module group circuit board to solve above-mentioned technical problem.
In order to realize the above object, the utility model provides a jumbo size display module assembly circuit board, including circuit board 3 and the bonding finger 1 of setting on circuit board 3, 1 one end of bonding finger and wire 2 are connected, bonding finger 1 includes first bonding finger 101 and second bonding finger 102, second bonding finger 102 is located between 2 of the wire of two adjacent first bonding fingers 101.
Further, the circuit board 3 is a flexible circuit board or a rigid circuit board.
Further, the bonding finger 1 is rectangular.
Furthermore, a chamfer is arranged at the vertex of the bonding finger 1.
Furthermore, a round angle is arranged at the vertex of the bonding finger 1.
The utility model discloses following beneficial effect has: under the prerequisite of the same circuit board size, can hold more nation and decide the finger, reduce the volume of circuit board, make full use of space, save material reduces material cost to reduce nation and decide the flow, improve the product yield. The obtained larger space can increase the width of a single bonding finger and the pitch between the bonding fingers, so that the bonding alignment tolerance between a large-size display panel and a circuit board can be met, and the large-size display module only needs a rigid or flexible circuit board and can be subjected to one-time automatic bonding process.
The chamfer or the fillet is arranged at the top point of the bonding finger, so that the occupied area of the bonding finger on the circuit board is reduced, the signal interference among the bonding fingers is further reduced, and the reliability is improved.
In addition to the above-described objects, features and advantages, the present invention has other objects, features and advantages. The present invention will be described in further detail with reference to the drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:
FIG. 1 is a schematic diagram of a single row structure of a prior art circuit board;
FIG. 2 is a schematic diagram of a circuit board according to a preferred embodiment of the present invention;
FIG. 3 is a schematic diagram of a bonding finger with chamfer according to a preferred embodiment of the present invention;
fig. 4 is a schematic diagram of a bonding finger with rounded corners according to a preferred embodiment of the present invention.
Wherein: 1. bonding the finger; 2. a wire; 3. a circuit board; 101. a first bonding finger; 102. the second bonding finger.
Detailed Description
The embodiments of the invention will be described in detail hereinafter with reference to the accompanying drawings, but the invention can be implemented in many different ways, which are defined and covered by the claims.
Referring to fig. 2, fig. 3 and fig. 4, the utility model relates to a jumbo size display module assembly circuit board, including circuit board 3 and the bonding finger 1 of setting on circuit board 3, 1 one end of bonding finger and wire 2 are connected, bonding finger 1 includes first bonding finger 101 and second bonding finger 102, second bonding finger 102 is located between 2 of the wire of two adjacent first bonding fingers 101.
The double-row dislocation type structure design can accommodate more bonding fingers on the premise of the same circuit board size; suppose that the circuit board nation of single row structural design finger number is N in FIG. 1, under the prerequisite that does not change the circuit board width, adopt the utility model discloses double dislocation formula structural design, nation finger number can reach 2N-1, consequently, can reduce the volume of circuit board, save material to reduce nation and decide the flow.
The circuit board 3 is a flexible circuit board or a rigid circuit board.
The bonding finger 1 is rectangular.
And a chamfer is arranged at the vertex of the bonding finger 1.
And the top point of the bonding finger 1 is provided with a round angle.
The chamfer or the fillet is arranged at the top point of the bonding finger, so that the occupied area of the bonding finger on the circuit board is reduced, and the signal interference among the bonding fingers is further reduced.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a jumbo size display module group circuit board, its characterized in that includes circuit board (3) and sets up bonding finger (1) on circuit board (3), bonding finger (1) one end and wire (2) are connected, bonding finger (1) is including first bonding finger (101) and second bonding finger (102), second bonding finger (102) are located between wire (2) of two adjacent first bonding fingers (101).
2. The wiring board according to claim 1, characterized in that the wiring board (3) is a flexible wiring board or a rigid wiring board.
3. Wiring board according to claim 1, characterized in that the bonding fingers (1) are rectangular.
4. Wiring board according to claim 3, characterized in that the bonding fingers (1) are chamfered at their vertices.
5. Wiring board according to claim 3, characterized in that the bonding fingers (1) are provided with rounded corners at their vertices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020166398.7U CN211378373U (en) | 2020-02-13 | 2020-02-13 | Large-size display module circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020166398.7U CN211378373U (en) | 2020-02-13 | 2020-02-13 | Large-size display module circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211378373U true CN211378373U (en) | 2020-08-28 |
Family
ID=72152399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020166398.7U Active CN211378373U (en) | 2020-02-13 | 2020-02-13 | Large-size display module circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211378373U (en) |
-
2020
- 2020-02-13 CN CN202020166398.7U patent/CN211378373U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109212852B (en) | Display panel and display device | |
| CN110579917B (en) | Display module and display device | |
| US11624956B2 (en) | Display panel and display device | |
| CN113126375B (en) | Display module and display device | |
| CN202172179U (en) | Electric connector | |
| CN210142246U (en) | Drive circuit and display device | |
| CN213876254U (en) | Array substrate and display device thereof | |
| CN111326073A (en) | Array substrate, display panel, display device and preparation method | |
| CN107808863B (en) | Array substrate and display panel | |
| CN105578756A (en) | Printed board | |
| CN211378373U (en) | Large-size display module circuit board | |
| CN203217208U (en) | Liquid crystal module | |
| CN110636688A (en) | Flexible circuit board assembly and flexible display device | |
| CN112163464A (en) | Electronic device | |
| CN110428739B (en) | Display panel and display device | |
| CN218383583U (en) | Array substrate, electronic paper display screen and display device | |
| CN216902915U (en) | Double-sided pin packaging structure | |
| CN215453382U (en) | Display device | |
| CN114168015B (en) | Touch panel, touch panel group and touch display panel | |
| CN209882224U (en) | Flexible circuit board and liquid crystal display module | |
| CN102508371B (en) | Tape winding substrate with flexible chip-on-board structures of liquid crystal panel | |
| CN102323682B (en) | Liquid crystal panel and wound tape base plate with chip-on-flex (COF) structure | |
| CN201489231U (en) | Flexible printed circuit board and liquid crystal display device | |
| CN209017359U (en) | A kind of flexible circuitry plate structure | |
| CN212229620U (en) | Capacitive touch membrane assembly and interactive display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |