CN211376614U

CN211376614U - Carrier for chip packaging

Info

Publication number: CN211376614U
Application number: CN201921908762.6U
Authority: CN
Inventors: 麦家通; 戴轲
Original assignee: Ansheng Technology Guangdong Co ltd
Current assignee: Ansheng Technology Guangdong Co ltd
Priority date: 2019-11-06
Filing date: 2019-11-06
Publication date: 2020-08-28
Anticipated expiration: 2029-11-06

Abstract

The utility model relates to a carrier for chip packaging, which comprises a carrier plate, a pyrolytic film and a double-sided film; the pyrolytic film is pasted on the carrier plate, the double-sided film is pasted on the pyrolytic film, and the pyrolytic film is used for pasting the matrix array of the chips; the film surface of the pyrolysis film, which is adhered to the support plate, has viscosity, the viscosity disappears after heating, and the double surfaces of the double-sided film have viscosity. The carrier can be used for pasting a matrix array of chips and provides support for the uniform packaging of the chips arranged in a matrix.

Description

Carrier for chip packaging

Technical Field

The utility model relates to a LED chip package technical field, concretely relates to carrier is used in chip package.

Background

In the manufacturing process of the LED lamp, the LED chip needs to be packaged. The traditional LED chip packaging process is to glue the LED chips one by one, so that the time is long, the production cost is high, the control is difficult, and the size and the thickness of the packaged LED chips are reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a carrier for chip package, this carrier can be used for pasting the matrix array of chip, provides the support for the unified encapsulation of chip among the matrix array.

In order to realize the purpose of the utility model, the utility model provides a carrier for chip packaging, which comprises a carrier plate, a pyrolytic film and a double-sided film; the pyrolytic film is pasted on the carrier plate, the double-sided film is pasted on the pyrolytic film, and the pyrolytic film is used for pasting the matrix array of the chips; the film surface of the pyrolysis film, which is adhered to the support plate, has viscosity, the viscosity disappears after heating, and the double surfaces of the double-sided film have viscosity.

From top to bottom, the utility model provides a carrier includes support plate, pyrolysis membrane and double faced film, and wherein the support plate can provide the support, and the support plate is pasted to the pyrolysis membrane and peel off from the support plate easily after the heating, and the double faced film has viscidity, and the one side is used for pasting the pyrolysis membrane, and the another side is used for pasting the matrix array of chip. The chips arranged in the matrix are positioned on the carrier, then glue is uniformly coated for packaging, the carrier plate is peeled off after the glue is solidified, and then cutting is carried out, so that a single chip package can be obtained. The utility model discloses a carrier can provide the support for chip mass encapsulation manufacturing.

The further technical scheme is that a matrix array mark is arranged on the surface, adhered to the pyrolytic film, of the support plate, and the matrix array mark is visible through the pyrolytic film and the double-sided film.

From top to bottom, the utility model discloses set up the matrix array mark on the support plate, pyrolysis film and double faced film have certain transparency, according to matrix array mark on the pyrolysis film chip of arranging, can improve the location accuracy of chip. Because the carrier plate can be recycled, the matrix array marks are arranged on the carrier plate, so that the positioning can be realized by utilizing the matrix array marks when the chips are arranged for many times.

The further technical scheme is that the matrix array mark is arranged in the middle of the carrier plate.

It is from top to bottom visible, the utility model discloses a matrix array mark sets up in the middle of the support plate, and in the chip package in-process, other vacant positions beyond the matrix array can supply anchor clamps to press from both sides tight carrier, bear the unnecessary glue that spills over and support use such as casting die of glue that flattens.

The further technical scheme is that the carrier plate is a steel plate, and the double-sided film is a silica gel double-sided film.

It is from top to bottom visible, the utility model discloses a support plate is the steel sheet, has higher mechanical properties, and non-deformable can provide stable supporting role. The double-sided film is a silica gel double-sided film and has good bonding performance.

The further technical proposal is that the pyrolytic film or the double-sided film is provided with a cutting mark.

It is from top to bottom visible, the utility model discloses set up the cutting mark on pyrolytic film or double faced film, help cutting the chip matrix array after the encapsulation according to the cutting mark.

The further technical scheme is that the cutting mark is arranged at the edge of the pyrolysis film or the double-sided film.

It is from top to bottom visible, the utility model discloses a cutting mark can set up in membrane edge department, avoids being covered by glue.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the carrier of the present invention.

Fig. 2 is an exploded view of an embodiment of the carrier of the present invention.

Fig. 3 is a schematic diagram of an embodiment of the present invention for fabricating a flip-chip LED chip CSP using a carrier.

Detailed Description

As shown in fig. 1 to 2, the present embodiment provides a carrier for chip packaging, which includes a carrier board 10, a pyrolytic film 11 and a double-sided film 12; the pyrolytic film 11 is attached to the carrier 10, the double-sided film 12 is attached to the pyrolytic film 11, and the pyrolytic film 11 is used for attaching the matrix array of the chips 20. The carrier plate 10 is a steel plate, and the steel plate has high strength and hardness, is not easy to deform and can play a good supporting role; the first pyrolytic film 11 has adhesiveness at least on the film surface in contact with the support plate 10, and the adhesiveness disappears after heating, and is easily peeled off; the double-sided film 12 may be a silicone double-sided film having both sides thereof with adhesive properties. The carrier plate 10, the pyrolytic film 11 and the double-sided film 12 together form a carrier of the chip 20, and the carrier plate 10, the pyrolytic film 11 and the double-sided film 12 can be attached by a cold laminating machine with a film pressing roller.

The carrier plate 10 is provided with a matrix positioning mark 13 for flipping the LED chip 20, the pyrolytic film 11 and the double-sided film 12 have certain transparency, and the matrix positioning mark 13 can be seen through the pyrolytic film 11 and the double-sided film 12. In arranging the matrix array of the chips 20, the chips 20 can be arranged on the double-sided film 12 according to the matrix positioning marks 13. In the present embodiment, the matrix array flag 13 is disposed in the middle of the carrier board 10.

The edges of the pyrolytic film 11 or the double-sided film 12 are provided with cutting marks 14. After the chip 20 is packaged, the matrix array can be cut according to the cutting marks 14.

As an example of a specific application of the above carrier embodiment, the carrier may be applied to a flip-chip LED chip CSP manufacturing method, which specifically comprises the steps of:

step 1: as shown in fig. 3(a) and fig. 1 to 2, a carrier is provided.

Step 2: as shown in fig. 3(b), the matrix array of flip LED chips 20 arranged on the first double-sided film 12, specifically, the matrix array of flip LED chips 20 arranged on the first double-sided film 12 according to the matrix positioning marks 13, may be positioned by, for example, a visual inspection apparatus, and the arrangement may be performed by a chip arranging machine or the like. Adjacent flip LED chips 20 have voids 21 between them. The first double-faced film 12 comprises a glue application area in which the matrix array is arranged and a first free area outside the glue application area. In this embodiment, the first vacant area is provided around the glue application area.

And step 3: a light-shielding glue 30 is applied to the matrix array. In the coating process of the light shielding adhesive 30, the carrier with the flip LED chip 20 may be fixed by a clamp, and a coating machine may be used to coat the film. The shading glue comprises the following components: 90 to 110 parts by mass of silica gel, 1 to 5 parts by mass of silicon dioxide powder, 1 to 5 parts by mass of alumina powder and 50 to 80 parts by mass of titanium dioxide powder. The silica gel consists of glue A and glue B in a mass ratio of 1: 5, wherein the glue A is composed of 16.63 wt% of vinyl-terminated methylphenyl polysiloxane and 0.04 wt% of platinum divinyl tetramethyl disiloxane solution, and the glue B is composed of 63.5 wt% of phenyl silicone resin, 19.77 wt% of phenyl hydrogenpolysiloxane and 0.06 wt% of ethynyl cyclohexanol relative to 100 wt% of the silica gel. When the shading glue comprising the components is adopted, the gap can be effectively filled, the adhesion degree of the glue is not influenced while the shading effect is achieved, the heat dissipation effect is enhanced, and the excessive precipitation of powdery materials is prevented.

And 4, step 4: as shown in fig. 3(c), the first pressing member is pressed against the light shielding adhesive 30 so that the light shielding adhesive 30 fills the gap 21 and the light shielding adhesive 30 does not extend beyond the adhesive application area. The first pressing member includes a first pressing plate 40 and a protective film 41, the protective film 41 is in contact with the light-shielding glue 30, the first pressing plate 40 is disposed on the protective film 41, and the first pressing plate 40 is parallel to the carrier plate 10. The protective film 41 can keep the cured surface of the light shielding adhesive 30 smooth and clean, and the first pressing plate 40 can be a glass plate for providing a certain pressure. The first pressing plate 40 is pressed down to make the protective film 41 close to the upper surface of the flip LED chip 20, thereby reducing the residual light shielding adhesive 30 on the upper surface of the flip LED chip 20.

And 5: the light-shielding glue 30 is cured. The curing conditions may be 45 to 80min at 75 to 90 ℃ and 15 to 45min at 115 to 125 ℃. Specifically, in this embodiment, the curing process may be performed in an oven, wherein the curing process is performed at 80 ℃ for 1 hour and at 120 ℃ for 0.5 hour.

Step 6: as shown in fig. 3(d), the first pressing member is peeled off, and the light-shielding paste 30 on the upper surface of the flip LED chip 20 is removed. Specifically, the light-shielding adhesive 30 on the upper surface of the flip LED chip 20 may be removed by using a remover, the remover may be stuck on the nonwoven fabric, and the nonwoven fabric may be manually clamped by using tweezers to wipe the upper surface of the flip LED chip 20. The film remover comprises the following components in parts by mass: diluent agent: 50 to 70 parts by mass; industrial alcohol: 30 to 40 parts by mass; acetone: 10 to 30 parts by mass; wherein the diluent comprises 60 wt% to 90 wt% of methyl acetate and 10 wt% to 40 wt% of industrial alcohol. By adopting the film remover, redundant residual films on the surfaces of the chips can be effectively removed, and after the residual films are removed, subsequent baking is carried out without foaming, so that the bonding degree of the chips and the fluorescent films is enhanced.

And 7: fluorescent glue 50 is applied to the matrix array. In the coating process of the fluorescent glue 50, the carrier with the flip LED chip 20 can be fixed by a clamp, and a coating machine is used for coating. The fluorescent glue 50 comprises the following components in parts by mass: silica gel: 90 to 110 parts by mass; fluorescent powder: 40 to 60 parts by mass; silicon dioxide powder: 1 to 5 parts by mass; DP glue: 1 to 3 parts by mass. The silica gel consists of glue A and glue B in a mass ratio of 1: 5, wherein the glue A is composed of 16.63 wt% of vinyl-terminated methylphenyl polysiloxane and 0.04 wt% of platinum divinyl tetramethyl disiloxane solution, and the glue B is composed of 63.5 wt% of phenyl silicone resin, 19.77 wt% of phenyl hydrogenpolysiloxane and 0.06 wt% of ethynyl cyclohexanol relative to 100 wt% of the silica gel. The fluorescent glue can improve the lighting effect, enhance the bonding force, better control the thickness of the fluorescent film and improve the subsequent cutting efficiency.

And 8: as shown in fig. 3(e), a supporting block 60 is disposed in the first vacant region, and the height of the supporting block 60 is greater than that of the flip LED chip 20. In this embodiment, the number of the supporting blocks 60 is 4, the height of each supporting block 60 is the same, and the 4 supporting blocks are respectively disposed on the first vacant regions around the glue spreading region. Step 8 is performed before or after step 7.

And step 9: as shown in fig. 3(e), a second presser member is placed on the support block 60, and the second presser member flattens the fluorescent glue 50 over the matrix array. The second casting die comprises a second pressing plate 70, a second pyrolytic film 71, a second double-side film 72 and a high-temperature film 73, the second pyrolytic film 71 is pasted on the second pressing plate 70, the second double-side film 72 is pasted on the second pyrolytic film 71, the second double-side film 72 comprises a pasting area and a second vacant area outside the pasting area, the pasting area corresponds to the gluing area, the second vacant area corresponds to the first vacant area, and the high-temperature film 73 is pasted on the pasting area. The second pressing member is placed on the supporting block 60 in such a manner that the second pressing plate 70 faces upward and the high temperature film 73 faces downward, the high temperature film 73 is in contact with the fluorescent paste 50, and the second double side film 72 is in contact with the supporting block 60. The second pyrolytic film 71 has adhesiveness, and the adhesiveness disappears after heating, so that the second pyrolytic film is easy to peel; the second double-sided film 72 may be a silica gel double-sided film, both sides of which have tackiness; the high temperature film 73 has no stickiness and a smooth surface, and prevents the fluorescent layer from sticking or causing the surface of the fluorescent layer to be rough. The second press plate 70, the second pyrolytic film 71, the second double side film 72, and the high temperature film 73 may be applied by a cold laminator with lamination rollers. The supporting block 60 is supported between the first double-faced film 12 and the second double-faced film 72, and the first double-faced film 12 and the second double-faced film 72 have a certain bonding effect on the supporting block 60, so that the packaging thickness change caused by the displacement of the second pressing piece relative to the carrier in the curing process and the like is avoided. The utility model discloses can select suitable supporting shoe 60's height and high temperature membrane 73's thickness according to the thickness requirement of CSP packaging part, the thickness of CSP packaging part equals supporting shoe 60's height and subtracts high temperature membrane 73's thickness. Specifically, in the present embodiment, the height of the supporting block 60 is 0.55mm, and the thickness of the high temperature film is 0.15mm, so that a packaged chip with a thickness of 0.4mm can be obtained.

Step 10: curing the fluorescent glue 50; the curing conditions were: curing at 75-90 deg.C for 45-80 min, and at 115-125 deg.C for 15-45 min; specifically, in this embodiment, the curing can be performed in an oven under the conditions of 80 ℃ for 1 hour and 120 ℃ for 0.5 hour.

Step 11: and stripping the second pressing piece, stripping the carrier plate 10 and cutting the matrix array to obtain the CSP packaging piece with the LED chip 20. The first pyrolytic film 11 or the first double-sided film 12 may be provided with cutting marks according to which the matrix array is cut.

Finally, it should be emphasized that the above-described embodiments are merely preferred embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A carrier for chip packaging, comprising:

comprises a support plate, a pyrolytic film and a double-sided film;

the pyrolysis film is attached to the support plate, the double-sided film is attached to the pyrolysis film, and the pyrolysis film is used for adhering a matrix array of chips;

the film surface of the pyrolysis film, which is pasted with the carrier plate, has viscosity, the viscosity disappears after heating, and the double surfaces of the double-sided film have viscosity.

2. The carrier for chip packaging according to claim 1, wherein:

the support plate is a steel plate, and the double-sided film is a silica gel double-sided film.