CN211374586U - High-temperature-resistant micro sample test board - Google Patents
High-temperature-resistant micro sample test board Download PDFInfo
- Publication number
- CN211374586U CN211374586U CN201921705357.4U CN201921705357U CN211374586U CN 211374586 U CN211374586 U CN 211374586U CN 201921705357 U CN201921705357 U CN 201921705357U CN 211374586 U CN211374586 U CN 211374586U
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- insulating substrate
- sample
- signal contact
- test board
- temperature sensor
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- Expired - Fee Related
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Abstract
The utility model discloses a high temperature resistant small sample test panel, including insulating substrate, be provided with temperature sensor on the insulating substrate, its middle part is the sample region, and the array sets up a plurality of sample measuring points, insulating substrate sets up a plurality of signal contact points all around, signal contact point with sample measuring point one-to-one to connect through the wire. The utility model discloses a signal contact point is drawn forth with the sample measuring point to the wire, has made things convenient for acquireing of signal, has broken away from the measurement space restriction, makes the measurement more reliable and more stable.
Description
Technical Field
The utility model relates to a film sample thermal conductivity capability test field especially relates to a high temperature resistant small sample test panel.
Background
In the thermal conductivity performance test of the film sample, the film sample is usually covered on a layer of substrate, because the film layer is very thin (below 1 micron) and can not be directly pricked on the film sample 5 by a probe, a plurality of measuring points 7 are made on the surface of the sample, and then the sample is tested by allowing the probe to prick on the testing points. Since the sample itself is small (10x10mm), the measurement point on the sample is much smaller (typically below 0.2x 0.2mm), and if measured with a probe, the size of the probe determines the measurable range. When in measurement, the detection point is very thin, and the measurement result is greatly influenced by excessive force or poor contact. For the test that needs many probes, the probe still needs fixture, and the measuring point interval can be influenced and can not set up too much, need move to next point after once having surveyed, calculates the average value through measuring different positions. In addition, the film sample needs to be tested in a vacuum environment, the testing temperature reaches 500K, and the probe clamping mechanism is inconvenient to carry out mobile testing. Therefore, the method for testing the thermal conductivity of the film sample by using the clamping probe mechanism has great limitation, and cannot meet the temperature rise test under vacuum.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in providing a high temperature resistant small sample test panel to the defect among the prior art, derives the measuring point of more convenient measurement with test signal, improves measurement of efficiency and enlarges suitable scene.
The utility model provides a technical scheme that its technical problem adopted is:
the utility model provides a small sample test panel of high temperature resistant, includes the insulating substrate, be provided with temperature sensor on the insulating substrate, its middle part is the sample region, and the array sets up a plurality of sample measuring points, the insulating substrate sets up a plurality of signal contact points all around, the signal contact point with sample measuring point one-to-one to connect through the wire.
According to the technical scheme, the insulating substrate is aluminum nitride.
According to the technical scheme, the array arrangement mode of the plurality of sample measuring points is an equidistant rectangular array.
According to the technical scheme, the signal contact points are rectangular and are arranged on the periphery of the insulating substrate at equal intervals.
According to the technical scheme, the signal contact point is made of copper or gold plated on the surface of the copper.
According to the technical scheme, the metal wire is a gold wire.
According to the technical scheme, the temperature sensor is a thin film platinum resistor, a thermocouple or an infrared temperature sensor.
The utility model discloses the beneficial effect who produces is: the utility model discloses a high temperature resistant small sample test panel through set up temperature sensor at insulating substrate, a plurality of rectangle array sample measuring point to set up a plurality of signal contact points all around, signal contact point with sample measuring point one-to-one to connect through the wire. The utility model discloses a signal contact point is drawn forth with the sample measuring point to the wire, has made things convenient for acquireing of signal, has broken away from the measurement space restriction, makes the measurement more reliable and more stable.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
As shown in FIG. 1, the utility model provides a small sample test board of high temperature resistance, including insulating substrate 1, be provided with temperature sensor 2 on insulating substrate 1, its middle part is regional 3 of sample, and the array sets up a plurality of sample measuring points 4, and insulating substrate 1 sets up a plurality of signal contact points 5 all around, and signal contact point 5 and sample measuring point 4 one-to-one to connect through wire 6. The sample measuring point 4 is led out to the signal contact point 5 through the metal wire 6, so that the acquisition of signals is facilitated, the limitation of measuring space is eliminated, and the measurement is more stable and reliable.
Further, the insulating substrate 1 is aluminum nitride, which has good thermal conductivity and good insulating property.
Furthermore, the array arrangement mode of the plurality of sample measuring points 4 is an equidistant rectangular array, and a plurality of contact points are arranged in the rectangular array mode, so that the limitation of the size of the probe is eliminated, and the uniformity index can be quickly given.
Further, the signal contacts 5 are rectangular and are arranged around the insulating substrate 1 at equal intervals, and the rectangular contacts are convenient to process and arrange.
Further, the material of the signal contact point 5 is copper or the surface of the copper is plated with gold, and the gold plating process can prevent oxidation and better transmit signals.
Furthermore, the metal wire 6 is a gold wire, and all the four properties of gold are excellent.
Furthermore, the temperature sensor 2 is a thin film platinum resistor, the size is small, the measurement signal processing is simple, and a standard comparison table is provided. Other types of thermocouples or infrared thermometry devices may also be used.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are considered to be within the scope of the invention as defined by the following claims.
Claims (7)
1. The high-temperature-resistant micro sample test board is characterized by comprising an insulating substrate, wherein a temperature sensor is arranged on the insulating substrate, the middle of the insulating substrate is a sample area, a plurality of sample measurement points are arranged in an array mode, a plurality of signal contact points are arranged on the periphery of the insulating substrate, and the signal contact points correspond to the sample measurement points one to one and are connected through metal wires.
2. The test plate of claim 1, wherein the insulating substrate is aluminum nitride.
3. The test plate of claim 1, wherein the array of the plurality of sample measurement sites is arranged in an equally spaced rectangular array.
4. The test board according to claim 1, wherein the signal contacts are rectangular and are equally spaced around the periphery of the insulating substrate.
5. The test board according to claim 1, wherein the signal contact point material is copper or copper surface gold plated.
6. The test plate of claim 1, wherein the metal wires are gold wires.
7. The test board according to claim 1, wherein the temperature sensor is a thin film platinum resistor, thermocouple or infrared temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921705357.4U CN211374586U (en) | 2019-10-12 | 2019-10-12 | High-temperature-resistant micro sample test board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921705357.4U CN211374586U (en) | 2019-10-12 | 2019-10-12 | High-temperature-resistant micro sample test board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211374586U true CN211374586U (en) | 2020-08-28 |
Family
ID=72154855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921705357.4U Expired - Fee Related CN211374586U (en) | 2019-10-12 | 2019-10-12 | High-temperature-resistant micro sample test board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211374586U (en) |
-
2019
- 2019-10-12 CN CN201921705357.4U patent/CN211374586U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200828 Termination date: 20211012 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |