CN211350666U

CN211350666U - Infrared receiving diode

Info

Publication number: CN211350666U
Application number: CN202020085067.0U
Authority: CN
Inventors: 阮国成
Original assignee: Shenzhen Yongerjia Industrial Co ltd
Current assignee: Shenzhen Yongerjia Industrial Co ltd
Priority date: 2020-01-15
Filing date: 2020-01-15
Publication date: 2020-08-25
Anticipated expiration: 2030-01-15

Abstract

The utility model discloses an infrared receiving diode, it is installed on the PCB board, including insulating substrate, electrically conductive pin and chip, the peripheral upwards extends a basin-shaped body of parcel chip of chip, it still includes the shielding layer of attachedly in insulating substrate positive and negative, wherein, the shielding layer that the front adheres to switches on with the shielding layer that the reverse side adheres to, and have on one of them shielding layer with PCB board electricity be connected a plurality of connect the pin position and at least a set of ground connection pin position; the utility model provides an infrared receiving diode solves among the prior art problem that the product size is thick and big.

Description

Infrared receiving diode

Technical Field

The utility model relates to a emitting diode technical field especially relates to an infrared receiving diode.

Background

Most of the existing infrared receiving tubes on the market are in appearance structures of products shown in fig. 1, and are poor in stability and difficult to operate; the PCB cannot be thinned due to the limitation of the height of the product; the osram receiver tube shown in fig. 1 has to be added with an iron box for EMC (anti-electromagnetic interference) resistance after the product leg, the process is complicated, the stability is poor, and the volume is large.

SUMMERY OF THE UTILITY MODEL

The utility model aims at above problem, provide an infrared receiving diode, solve among the prior art product size thick and big problem.

For the purpose of realizing above, the utility model discloses a technical scheme be, it is installed on the PCB board, including insulating substrate, electrically conductive pin and chip, the peripheral basin-shaped body that upwards extends a parcel chip of chip, it still includes attached in the shielding layer of insulating substrate positive and negative, and wherein, positive adnexed shielding layer switches on with the adnexed shielding layer of reverse side, and has a plurality of electric foot positions of connecing and at least a set of ground connection foot position of being connected with PCB board electricity on one of them shielding layer.

In the infrared receiving diode, a through hole penetrates through the insulating substrate, and a filling body for conducting the front shielding layer and the back shielding layer is filled in the through hole.

In the infrared receiving diode, the through hole and the ground pin are respectively arranged at two ends of the insulating substrate.

In the infrared receiving diode, the end face of the insulating substrate is provided with a notch groove corresponding to the plurality of power connection pins, grounding pins and conductive pins, and the notch groove is internally provided with a conductive sheet for conducting the front shielding layer and the back shielding layer.

In the infrared receiving diode, the conductive pins are adjacent positive and negative pins, and a mark for distinguishing polarity is sprayed between the positive and negative pins.

In the infrared receiving diode, the shielding layer is a gold plating layer.

In the infrared receiving diode, the basin-shaped body is made of epoxy resin material.

Compared with the prior art, the utility model, beneficial effect does:

1. the shielding layers are attached to the front side and the back side of the insulating substrate, and the anti-electromagnetic interference effect of an iron box in the prior art is replaced, so that the product is thin and small in size to meet the user requirements;

2. a through hole is penetrated in the insulating substrate, and a filling body is arranged in the through hole to ensure that the shielding layers on the two sides are conducted again, so that the communication performance of the connection of the upper shielding layer and the lower shielding layer is rapidly improved, the electromagnetic interference resistance is further improved, and the sensitivity of the product is enhanced;

other advantages of the present invention will be further explained in the detailed description of the invention.

Drawings

Fig. 1 is a schematic perspective view of an infrared receiving diode in the prior art.

Fig. 2 is a schematic diagram of the front structure of the infrared receiving diode of the present invention.

Fig. 3 is a schematic diagram of a back structure of the infrared receiving diode of the present invention.

The reference numbers in the drawings correspond to the names: 1. an insulating substrate; 2. a basin-shaped body; 3. a shielding layer; 4. a conductive pin; 5. marking; 6. a notch groove; 30. connecting a pin position; 31. a grounding pin; 32. an extension section; 101. and a through hole.

Detailed Description

In order to make the technical solution of the present invention better understood, the present invention is described in detail below with reference to the accompanying drawings, and the description of the present invention is only exemplary and explanatory, and should not be construed as limiting the scope of the present invention.

The present embodiment provides an infrared receiving diode, which is mounted on a PCB board, and includes an insulating substrate 1, conductive pins 4 and a chip (not shown) as shown in fig. 2 and 3, the periphery of the chip extends upwards to wrap a basin-shaped body 2 of the chip (the basin-shaped body 2 can be in various shapes such as round, square, oval, etc., and has a certain high temperature resistance, and is preferably made of epoxy resin material), wherein the shielding layer 3 is adhered to the front/back surface of the insulating substrate 1 by glue or other adhering means, a conductive segment (a conductive sheet in the present embodiment) is provided between the shielding layers 3 of the front/back surface, and the conductive segment is embedded on the notch 6 to conduct the shielding layer 3 of the front/back surface; meanwhile, the shielding layer 3 is provided with three groups of power connection pin positions 30 and at least one group of grounding pin positions 31 which are electrically connected with the PCB, the three groups of power connection pin positions 30 are arranged on one side of the insulating substrate 1, and the grounding pin positions 31 and the conductive pins 4 are arranged on the other side of the insulating substrate 1.

In the above embodiment, the shielding layer 3 is attached to resist electromagnetic interference, so that the product has a reduced volume and is beneficial to meeting different requirements of customers.

In a preferred embodiment of the above embodiment, a through hole 101 penetrates through the insulating substrate 1, and the through hole 101 is filled with a filling body for conducting the front surface shielding layer 3 and the back surface shielding layer 3; meanwhile, the through hole 101 and the grounding pin 31 are respectively arranged at the two end angle positions of one side of the insulating substrate 1, so that the communication performance of the upper and lower shielding layers 3 is rapidly improved, and the anti-interference capability of the product is further improved.

Preferably, the conductive pins 4 are adjacent positive electrode pins and negative electrode pins, wherein the marks 5 for distinguishing polarities are sprayed between the positive electrode pins and the negative electrode pins.

Preferably, the shielding layer 3 is a gold plating layer.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The principles and embodiments of the present invention have been explained herein using specific examples, which are presented only to assist in understanding the methods and their core concepts. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes can be made without departing from the principle of the present invention, and the above technical features can be combined in a proper manner; the application of these modifications, variations or combinations, or the application of the concepts and solutions of the present invention in other contexts without modification, is not intended to be considered as a limitation of the present invention.

Claims

1. The utility model provides an infrared receiving diode, its installs on the PCB board, including insulating substrate (1), electrically conductive pin (4) and chip, the peripheral basin body (2) of upwards extending a parcel chip of chip, its characterized in that, it still includes attached in insulating substrate (1) positive and negative shielding layer (3), and wherein, positive adnexed shielding layer (3) and the adnexed shielding layer (3) of reverse side switch on, and have on one of them shielding layer (3) and a plurality of electric foot positions (30) and at least a set of ground connection foot position (31) of connecing of being connected with the PCB board electricity.

2. An infrared receiving diode according to claim 1, wherein a through hole (101) penetrates through the insulating substrate (1), and the through hole (101) is filled with a filler for conducting the front side shielding layer (3) and the back side shielding layer (3).

3. An infrared receiving diode according to claim 2, characterized in that said through hole (101) and said ground pin (31) are respectively disposed at both ends of the insulating substrate (1).

4. The infrared receiving diode according to claim 1, wherein the end face of the insulating substrate (1) has a notch groove (6) corresponding to the plurality of electrical connection pins (30), the grounding pins (31) and the conductive pins (4), and a conductive sheet for conducting the front shielding layer (3) and the back shielding layer (3) is disposed in the notch groove (6).

5. The infrared receiving diode as claimed in claim 1, wherein the conductive pins (4) are adjacent positive and negative pins, and a polarity-distinguishing mark (5) is sprayed between the positive and negative pins.

6. An infrared receiving diode according to any one of claims 1 to 5, characterized in that said shielding layer (3) is a gold plating layer.

7. An infrared receiving diode according to claim 6, characterized in that said tub (2) is made of epoxy resin material.