CN211350623U

CN211350623U - Power semiconductor module

Info

Publication number: CN211350623U
Application number: CN202020122278.7U
Authority: CN
Inventors: 张杰夫; 宋贵波; 邓海明; 夏文锦
Original assignee: SHENZHEN LIDE ELECTRIC CONTROL TECHNOLOGY CO LTD
Current assignee: SHENZHEN LIDE ELECTRIC CONTROL TECHNOLOGY CO LTD
Priority date: 2020-01-19
Filing date: 2020-01-19
Publication date: 2020-08-25
Anticipated expiration: 2030-01-19

Abstract

An embodiment of the utility model provides a power semiconductor module, including the shell, assemble in the inside power device of shell and make by metal material and settle in the radiating bottom plate of shell bottom, one side of shell is provided with a plurality of mounting groove, power device with radiating bottom plate laminates mutually, still assemble in the mounting groove inner with the power device electricity is connected and the outer end is used for the binding post with the butt joint of outside conducting strip, radiating bottom plate with the board side face of corresponding side connect in the shell is provided with the inner wall middle part of one side lateral wall of mounting groove, the lateral wall portion between the bottom surface of lateral wall and the radiating bottom plate bottom surface constitutes insulating isolation portion, insulating isolation portion has the predetermined height that makes outside conducting strip and radiating bottom plate fully electrically insulated. The embodiment of the utility model provides a through setting up insulating isolation, can effectively avoid insulating trouble's emergence.

Description

Power semiconductor module

Technical Field

The embodiment of the utility model provides a relate to power semiconductor device technical field, especially relate to a power semiconductor module.

Background

A conventional semiconductor module of a power semiconductor device generally includes a housing, a heat dissipation bottom plate made of a metal material and fixed to a bottom of the housing, and a connection terminal and a signal pin, which are disposed on the housing and electrically connected to an external conductive pad, wherein a mounting groove is formed in one side of the housing, and the connection terminal is accommodated in the mounting groove and is in butt joint with the external conductive pad. In the conventional power semiconductor device, a bottom edge of a side wall of the housing on which the mounting groove is provided is flush with a bottom surface of the heat dissipation base plate. When the combination surface of the connecting terminal and the external conducting sheet is designed to be vertical to the heat dissipation bottom plate, the external conducting sheet usually extends from the bottom of the shell to the top to a position opposite to the connecting terminal, the metal material part of the external conducting sheet corresponding to the bottom edge part of the side wall of the shell is exposed outside, and the distance between the external conducting sheet and the heat dissipation bottom plate is approximately equal to the thickness of the side wall of the shell and too close to the thickness of the side wall of the shell, so that the device is easily damaged due to insulation failure.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a technical problem who solves provides a power semiconductor module, can effectively avoid insulating trouble to take place.

In order to solve the technical problem, the embodiment of the utility model provides an adopt following technical scheme: a power semiconductor module comprises a shell, a power device assembled in the shell and a heat dissipation bottom plate made of metal materials and arranged at the bottom of the shell, wherein a plurality of mounting grooves are formed in one side of the shell, the power device is attached to the heat dissipation bottom plate, wiring terminals with inner ends electrically connected with the power device and outer ends used for being in butt joint with external conducting strips are further assembled in the mounting grooves, the heat dissipation bottom plate is in butt joint with the middle of the inner wall of the side wall of the shell, the side wall of the heat dissipation bottom plate is provided with a side wall of the mounting groove, the side wall of the bottom of the side wall is in insulation isolation with the bottom of the heat dissipation bottom plate, and the insulation isolation part is provided with a preset height enabling the external conducting strips to.

Further, the housing is integrally injection molded.

Furthermore, a plurality of notches with preset intervals are formed on the side wall of the shell, a plurality of inserting pieces protruding outwards are correspondingly formed on the corresponding side of the heat dissipation bottom plate, and the heat dissipation bottom plate is inserted into the notches on the side wall of the shell in a one-to-one correspondence mode through the inserting pieces.

Furthermore, a locking hole is formed in the heat dissipation bottom plate on the inner side of the insertion sheet.

Furthermore, the power device comprises a circuit board and a circuit component attached to the surface of the circuit board, and the inside of the wiring terminal is welded on the circuit board and is electrically connected with a line on the circuit board.

Adopt above-mentioned technical scheme, the embodiment of the utility model provides a following beneficial effect has at least: the embodiment of the utility model provides a through set up in one side lateral wall bottom surface of mounting groove for forming the insulating isolation portion of predetermined height between outside conducting strip and the radiating bottom plate, can increase the creepage distance between outside conducting strip and the radiating bottom plate, make both abundant electrical insulation, the effectual emergence of avoiding insulation fault.

Drawings

Fig. 1 is an exploded schematic view of an alternative embodiment of the power semiconductor module of the present invention.

Fig. 2 is a schematic perspective view of an alternative embodiment of the power semiconductor module of the present invention.

Fig. 3 is a schematic cross-sectional view of an alternative embodiment of the power semiconductor module of the present invention along the central axis of the outer conductive sheet.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the following illustrative embodiments and description are only intended to illustrate the present invention, and are not intended as a limitation of the present invention, and that features of the embodiments and examples may be combined with each other without conflict.

As shown in fig. 1 to 3, an alternative embodiment of the present invention provides a power semiconductor module, which includes a housing 1, a power device 9 assembled inside the housing 1, and a heat dissipation base plate 3 made of a metal material and disposed at the bottom of the housing 1, one side of the shell 1 is provided with a plurality of mounting grooves 10, the power device 9 is attached to the heat dissipation bottom plate 3, a connecting terminal 7 with an inner end electrically connected with the power device 9 and an outer end used for butting with the external conducting strip 5 is also assembled in the mounting groove 10, the radiating bottom plate 3 is in face-to-face contact with the middle of the inner wall of the side wall 12 of the housing 1 on the side where the mounting groove 10 is provided, the side wall portion between the bottom surface of the side wall 12 and the bottom surface of the heat-radiating bottom plate 3 constitutes an insulating partition 121, the insulating spacer 121 has a predetermined height to sufficiently electrically insulate the outer conductive sheet 5 from the heat-dissipating base plate 3.

The embodiment of the utility model provides a through set up in one side lateral wall 12 bottom surface of mounting groove 10 for forming predetermined height's insulating isolation portion 121 between outside conducting strip 5 and the radiating bottom plate 3, can increase the creepage distance between outside conducting strip 5 and the radiating bottom plate 3, make both abundant electrical insulation, the effectual emergence of avoiding insulation fault.

In another alternative embodiment of the present invention, the housing 1 is integrally formed by injection molding. This embodiment is through setting up shell 1 to be moulded plastics by plastics and form, can play fine electric insulation effect, saves material cost simultaneously.

As shown in fig. 2, in another alternative embodiment of the present invention, the side wall 12 of the housing 1 is further formed with a plurality of notches 123 with predetermined intervals, the corresponding side of the heat dissipation bottom plate 3 is correspondingly formed with a plurality of insertion pieces 30 protruding outwards, and the heat dissipation bottom plate 3 is inserted into each notch 123 on the side wall 12 of the housing 1 in a one-to-one correspondence with the insertion pieces 30. In the embodiment, the insertion pieces 30 are arranged on the corresponding sides of the heat dissipation base plate 3 and the side wall 12, so that the structure is simple, and the connection between the heat dissipation base plate 3 and the shell 1 is convenient.

As shown in fig. 2-3, in another optional embodiment of the present invention, the heat dissipation bottom plate 3 inside the insertion piece 30 is further provided with a locking hole 301. In the embodiment, the locking hole 301 is formed in the heat dissipation base plate 3 on the inner side of the insertion sheet 30, so that the heat dissipation base plate 3 and an external base can be conveniently fixed, and the power semiconductor module can be more stably mounted.

In another optional embodiment of the present invention, the power device 9 includes a circuit board 90 and a circuit component 92 attached to the surface of the circuit board 90, and the inner portion of the connection terminal 7 is soldered on the circuit board 90 and electrically connected to the circuit on the circuit board 90. The present embodiment is electrically connected to the external conductive sheet 5 by connecting the connection terminals 7 to the circuit board 90, thereby enabling the power device 9 to operate in the power semiconductor module.

The embodiments of the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the above-mentioned embodiments, which are only illustrative and not restrictive, and those skilled in the art can make many changes without departing from the spirit and the scope of the invention as claimed.

Claims

1. A power semiconductor module comprises a shell, a power device assembled in the shell and a heat dissipation bottom plate made of metal materials and arranged at the bottom of the shell, wherein a plurality of mounting grooves are formed in one side of the shell, the power device is attached to the heat dissipation bottom plate, and wiring terminals with inner ends electrically connected with the power device and outer ends used for being in butt joint with external conducting strips are further assembled in the mounting grooves.

2. The power semiconductor module of claim 1, wherein the housing is integrally injection molded.

3. The power semiconductor module of claim 1, wherein the side wall of the housing further has a plurality of notches with predetermined spacing, the corresponding side of the heat-dissipating base plate correspondingly has a plurality of pins protruding outward, and the heat-dissipating base plate is inserted into the notches of the side wall of the housing in a one-to-one correspondence with the pins.

4. The power semiconductor module of claim 3, wherein the heat dissipation base plate inside the insertion piece is further provided with a locking hole.

5. The power semiconductor module of claim 1, wherein the power device comprises a circuit board and a circuit component attached to a surface of the circuit board, and the inner portion of the connection terminal is soldered to the circuit board and electrically connected to a trace on the circuit board.