CN211303648U

CN211303648U - Electronic component adhesive dispensing device based on low-temperature technology

Info

Publication number: CN211303648U
Application number: CN201922107948.8U
Authority: CN
Inventors: 肖杰; 杨小英; 李海剑; 杨顺
Original assignee: Yuanling Xianghua Electronic Technology Co ltd
Current assignee: Yuanling Xianghua Electronic Technology Co ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-08-21
Anticipated expiration: 2029-11-29

Abstract

The utility model discloses an electronic component dispensing device based on low temperature technology, which comprises a side support frame and an intermediate frame, wherein the upper ends of the side support frame and the intermediate frame are provided with a transmission device, and the transmission device is connected with a driving device; the upper end of the middle frame is provided with a dispensing device which is inserted above the transmission device; the glue dispensing device comprises a fixed frame which is arranged into a U-shaped structure; the both sides activity of mount is provided with the slider, and the slider setting is on the fly leaf, and the upper end of fly leaf is passed through the bellows and is connected with flourishing gluey bucket, and the outer end of flourishing gluey bucket is provided with the heat preservation, and flourishing gluey bucket activity sets up in the top of mount, and flourishing gluey bucket passes through the bellows and is connected with the glue dripping box, and the bottom of glue dripping box is provided with the glue dripping pipe, and the both ends of glue dripping box are provided with blast. The invention provides an electronic component dispensing device based on a low-temperature technology, which can dispense electronic components quickly, efficiently and in large batch.

Description

Electronic component adhesive dispensing device based on low-temperature technology

Technical Field

The utility model relates to a dispensing device specifically is electronic components dispensing device based on low temperature technique.

Background

The electronic components are components of electronic elements and small-sized electric machines and instruments, are usually composed of a plurality of parts and can be commonly used in similar products; it is a general name of some parts in the industries of electric appliances, radio, instruments and the like, such as capacitors, transistors, hairsprings, springs and other sub-devices. Diodes and the like are common.

The electronic components comprise resistors, capacitors, potentiometers, electron tubes, radiators, electromechanical elements, connectors, semiconductor discrete devices, electroacoustic devices, laser devices, electronic display devices, photoelectric devices, sensors, power supplies, switches, micro-special motors, electronic transformers, relays, printed circuit boards, integrated circuits, various circuits, piezoelectricity, crystals, quartz, ceramic magnetic materials, base material substrates for printed circuits, special materials for electronic functional processes, electronic adhesive (tape) products, electronic chemical materials, parts and the like.

The electronic component glue is used for encapsulating electronic and electrical components, can play the roles of moisture protection, dust prevention, corrosion prevention and shock prevention, and improves the service performance and stable parameters. The preparation of glue under the very low condition of temperature not only can influence the activity, can also appear the not good phenomenon of embedment to influence the quality that electronic components glued, and electronic components glue dispensing device among the prior art is most simple structure, and the function is single, often has the inhomogeneous caking phenomenon of some glue to take place when gluing, consequently needs to improve.

Disclosure of Invention

The invention aims to solve the problems, and provides an electronic component dispensing device based on a low-temperature technology, which can be used for dispensing electronic components quickly, efficiently and in large batch.

In order to realize the purpose, the invention adopts the technical scheme that: the transmission device is connected with the driving device; the upper end of the middle frame is provided with a dispensing device which is inserted above the transmission device; the glue dispensing device comprises a fixed frame which is arranged into a U-shaped structure; the both sides activity of mount is provided with the slider, and the slider setting is on the fly leaf, and the upper end of fly leaf is passed through the bellows and is connected with flourishing gluey bucket, and the outer end of flourishing gluey bucket is provided with the heat preservation, and flourishing gluey bucket activity sets up in the top of mount, and flourishing gluey bucket passes through the bellows and is connected with the glue dripping box, and the bottom of glue dripping box is provided with the glue dripping pipe, and the both ends of glue dripping box are provided with blast.

Further, the glue containing barrel is movably arranged above the fixed frame through a connecting assembly, the connecting assembly comprises a movable block arranged in the sleeve, and the movable block is T-shaped; a second spring is arranged between the movable block and the sleeve; the upper end of movable block is provided with the baffle, and the baffle sets up to U style of calligraphy structure, and flourishing glue bucket sets up in the baffle.

Furthermore, the two sides of the glue containing barrel are provided with connecting blocks, one side of each connecting block is provided with a handle, and the handles are arranged in a circular ring shape.

Furthermore, the upper end of the glue containing barrel is provided with a movable plug which is convenient for pouring glue.

Furthermore, the lower extreme of mount is provided with first spring, and the one end setting of first spring is at the lower extreme of slider.

Furthermore, the blowing device comprises micro fans arranged at two ends of the glue dripping box, and air guide pipes are arranged at the lower ends of the micro fans.

Furthermore, a universal joint head is arranged between the micro fan and the air guide pipe.

Further, a material level sensor is arranged in the glue dripping box, and a material level switch is arranged on a corrugated pipe at the upper end of the glue dripping box; the material level switch is arranged on the movable plate through a connecting plate.

Further, the glue dripping box is arranged to be in an inverted trapezoid shape.

Further, the upper end of fly leaf is provided with the cylinder, and the cylinder setting is on the mount.

The invention has the beneficial effects that:

1. the invention provides an electronic component dispensing device based on a low-temperature technology, through the up-and-down lifting of a movable plate and the arrangement of a blowing device, when an electronic component on a transmission device moves below a dispensing tube, dispensing is carried out while upward drawing and drying, the electronic component can be dispensed quickly and efficiently in large batch, and the produced electronic component is uniform in dispensing and high in quality.

2. The outer end of the glue containing barrel is provided with the heat insulation layer, the glue containing barrel is movably arranged above the fixed frame through the connecting assembly, the connecting assembly comprises a movable block arranged in the sleeve, and the movable block is T-shaped; a second spring is arranged between the movable block and the sleeve; the upper end of movable block is provided with the baffle, the baffle sets up to U style of calligraphy structure, it is provided with the connecting block with the both sides of flourishing gluey bucket to glue the bucket setting greatly in the baffle, one side of connecting block is provided with the handle, the handle sets up to the ring form, such structural design is applicable to and uses on the very low condition of temperature, under the very low condition of temperature, the setting of heat preservation can guarantee that glue can not appear the caking, can hold the handle simultaneously under the effect of second spring, can shake glue in the flourishing gluey bucket evenly and reach the gluey incomperature unification in the flourishing gluey bucket, thereby electronic components's after the point is glued quality has.

3. According to the glue bucket, the partition plate is of a U-shaped structure, and the glue bucket is arranged in the partition plate, so that the structural design improves the placing stability of the glue bucket.

4. The blowing device comprises the micro fans arranged at two ends of the glue dripping box, the lower ends of the micro fans are provided with the air guide pipes, and the universal joint heads are arranged between the micro fans and the air guide pipes.

5. A material level sensor is arranged in the glue dripping box, and a material level switch is arranged on a corrugated pipe at the upper end of the glue dripping box; the material level switch is arranged on the movable plate through the connecting plate, and the automatic feeding of the dispensing device can be realized according to the requirement by the structural design, so that the use convenience of the dispensing device is improved.

6. The glue dripping box is in the inverted trapezoid shape, and the structural design can further control the glue outlet speed, so that the glue dripping uniformity of the electronic component is improved.

Drawings

Fig. 1 is a front view of the structure of the present invention.

Fig. 2 is a schematic view of a dispensing device in the structure of the present invention.

Fig. 3 is an enlarged schematic view of B in fig. 1.

Fig. 4 is an enlarged schematic view of C in fig. 1.

Fig. 5 is a front view of the glue bucket in the present invention.

Fig. 6 is a top view of the glue barrel of the present invention.

The text labels in the figures are represented as: 1. a side support frame; 2. a drive device; 3. a transmission device; 4. a dispensing device; 5. a middle frame; 401. a fixed mount; 402. a cylinder; 403. a partition plate; 404. a handle; 405. connecting blocks; 406. a heat-insulating layer; 407. a movable plug; 408. a glue containing barrel; 409. a movable block; 410. a second spring; 411. a sleeve; 412. a bellows; 413. a slider; 414 a first spring; 415. a connecting plate; 416. a material level switch; 417. a micro fan; 418. an air guide pipe; 419. a level sensor; 420. a glue dripping box; 421. a movable plate; 422. a universal joint head; 423. and (4) a rubber dropping tube.

Detailed Description

The following detailed description of the present invention is given for the purpose of better understanding technical solutions of the present invention by those skilled in the art, and the present description is only exemplary and explanatory and should not be construed as limiting the scope of the present invention in any way.

As shown in fig. 1 to 6, the specific structure of the present invention is: the device comprises a side support frame 1 and an intermediate frame 5, wherein the upper ends of the side support frame 1 and the intermediate frame 5 are provided with a transmission device 3, and the transmission device 3 is connected with a driving device 2; the upper end of the middle frame 5 is provided with a glue dispensing device 4, and the glue dispensing device 4 is inserted above the transmission device 3; the dispensing device 4 comprises a fixing frame 401, and the fixing frame 401 is arranged into a U-shaped structure; the both sides activity of mount 401 is provided with slider 413, and slider 413 sets up on fly leaf 421, and the upper end of fly leaf 421 is connected with flourishing gluey bucket 408 through bellows 412, and the outer end of flourishing gluey bucket 408 is provided with heat preservation 406, flourishing gluey bucket 408 activity sets up in the top of mount 401, and flourishing gluey bucket 408 is connected with glue dripping box 420 through bellows 412, and the bottom of glue dripping box 420 is provided with glue dripping pipe 423, and the both ends of glue dripping box 420 are provided with blast apparatus. When electronic components on the transmission device 3 move below the glue dripping tube 423 during specific use, the movable plate 421 is lifted up and down and the blowing device is arranged, so that glue is dispensed while the glue is blown up during glue dispensing, the glue dispensing can be performed on the electronic components rapidly, efficiently and in large batch, and the produced electronic components are dispensed uniformly and have high quality.

As shown in fig. 1-6, the glue barrel 408 is movably disposed above the fixed frame 401 through a connecting assembly, the connecting assembly includes a movable block 409 disposed in a sleeve 411, and the movable block 409 is T-shaped; a second spring 410 is arranged between the movable block 409 and the sleeve 411; the upper end of the movable block 409 is provided with a partition 403, the partition 403 is in a U-shaped structure, and the glue containing barrel 408 is arranged in the partition 403. Glue containing barrel 408's both sides are provided with connecting block 405, one side of connecting block 405 is provided with handle 404, handle 404 sets up to the ring form, such structural design is applicable to and uses on the very low condition of temperature, under the very low condition of temperature, setting up of heat preservation 406 can guarantee that glue can not appear agglomerating, can hold handle 404 simultaneously under the effect of second spring 410, can shake glue in glue containing barrel 408 and evenly reach glue nonthermal uniform in glue containing barrel 408, thereby electronic components's after the point is glued quality has been improved.

As shown in fig. 1, 2 and 5, a movable plug 407 for conveniently pouring glue is disposed at the upper end of the glue barrel 408.

As shown in fig. 1 and fig. 2, the lower end of the fixing frame 401 is provided with a first spring 414, and one end of the first spring 414 is disposed at the lower end of the sliding block 413, so that the structural design further improves the stability of the dispensing device.

As shown in fig. 1, 2 and 4, the blowing device includes a micro fan 417 disposed at two ends of the glue dropping box 420, and an air guide pipe 418 is disposed at a lower end of the micro fan 417, so that the structure is simple, and the manufacturing and the use are convenient.

As shown in fig. 1, 2 and 4, a universal joint 422 is disposed between the micro-fan 417 and the air guide duct 418, and the angle of the air guide duct 418 can be adjusted according to the structural design, so as to expand the application range.

As shown in fig. 1, 2 and 4, a material level sensor 419 is disposed in the glue dripping box 420, and a material level switch 416 is disposed on the corrugated pipe 412 at the upper end of the glue dripping box 420; the material level switch 416 is arranged on the movable plate 421 through the connecting plate 415, and the automatic feeding of the dispensing device can be realized according to the requirement through the structural design, so that the use convenience of the dispensing device is improved.

As shown in fig. 1, 2 and 4, the glue dropping box 420 is arranged in an inverted trapezoid shape, and such a structural design can further control the glue discharging speed, thereby improving the glue dispensing uniformity of the electronic component.

As shown in fig. 1-2, the upper end of the movable plate 421 is provided with an air cylinder 402, and the air cylinder 402 is disposed on the fixed frame 401, so that the structural design is convenient to control, and the lifting of the movable plate 421 is controlled by the extension and contraction of the air cylinder 402.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts of the present invention. The foregoing is only a preferred embodiment of the present invention, and it should be noted that there are objectively infinite specific structures due to the limited character expressions, and it will be apparent to those skilled in the art that a plurality of modifications, decorations or changes may be made without departing from the principle of the present invention, and the technical features described above may be combined in a suitable manner; such modifications, variations, combinations, or adaptations of the invention using its spirit and scope, as defined by the claims, may be directed to other uses and embodiments.

Claims

1. Electronic components adhesive deposite device based on low temperature technique, it includes collateral branch strut (1) and intermediate frame (5), characterized by, collateral branch strut (1) and intermediate frame (5) upper end are provided with transmission device (3), transmission device (3) are connected with drive arrangement (2); the upper end of the middle frame (5) is provided with a dispensing device (4), and the dispensing device (4) is inserted above the transmission device (3); the dispensing device (4) comprises a fixing frame (401), and the fixing frame (401) is of a U-shaped structure; the both sides activity of mount (401) is provided with slider (413), slider (413) set up on fly leaf (421), the upper end of fly leaf (421) is passed through bellows (412) and is connected with flourishing gluey bucket (408), the outer end of flourishing gluey bucket (408) is provided with heat preservation (406), flourishing gluey bucket (408) activity sets up the top at mount (401), flourishing gluey bucket (408) are connected with glue dripping box (420) through bellows (412), the bottom of glue dripping box (420) is provided with glue dripping pipe (423), the both ends of glue dripping box (420) are provided with blast apparatus.

2. The electronic component dispensing device based on the low-temperature technology as claimed in claim 1, wherein the glue containing barrel (408) is movably arranged above the fixed frame (401) through a connecting assembly, the connecting assembly comprises a movable block (409) arranged in a sleeve (411), and the movable block (409) is T-shaped; a second spring (410) is arranged between the movable block (409) and the sleeve (411); the upper end of the movable block (409) is provided with a partition plate (403), the partition plate (403) is of a U-shaped structure, and the glue containing barrel (408) is arranged in the partition plate (403).

3. The electronic component dispensing device based on the low-temperature technology as claimed in claim 2, wherein the glue barrel (408) is provided with connecting blocks (405) on both sides thereof, the handle (404) is provided on one side of the connecting blocks (405), and the handle (404) is arranged in a circular ring shape.

4. The electronic component dispensing device based on the low-temperature technology as claimed in claim 3, wherein the upper end of the glue barrel (408) is provided with a movable plug (407) for conveniently pouring glue.

5. The electronic component dispensing device based on the low-temperature technology as claimed in claim 1, wherein a first spring (414) is disposed at a lower end of the fixed frame (401), and one end of the first spring (414) is disposed at a lower end of the sliding block (413).

6. The electronic component dispensing device based on the low-temperature technology as claimed in claim 1, wherein the blowing device comprises a micro fan (417) arranged at two ends of the dispensing box (420), and an air guide pipe (418) is arranged at the lower end of the micro fan (417).

7. The electronic component dispensing device based on the low-temperature technology as claimed in claim 5, wherein a universal joint (422) is arranged between the micro-fan (417) and the air guide pipe (418).

8. The electronic component glue dispensing device based on the low-temperature technology as claimed in claim 1, wherein a material level sensor (419) is arranged in the glue dispensing box (420), and a material level switch (416) is arranged on a corrugated pipe (412) at the upper end of the glue dispensing box (420); the level switch (416) is arranged on the movable plate (421) through a connecting plate (415).

9. The electronic component dispensing device based on low-temperature technology as claimed in claim 8, characterized in that the dispensing box (420) is arranged in an inverted trapezoid shape.

10. The electronic component dispensing device based on low temperature technology as claimed in claim 1, wherein the upper end of the movable plate (421) is provided with a cylinder (402), and the cylinder (402) is disposed on the fixed frame (401).