CN211297533U

CN211297533U - Electronic component radiating fin

Info

Publication number: CN211297533U
Application number: CN202020222240.7U
Authority: CN
Inventors: 林惜莲
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-02-28
Filing date: 2020-02-28
Publication date: 2020-08-18
Anticipated expiration: 2030-02-28

Abstract

The utility model discloses an electronic components fin, include the cooling tube that draws in and form by the fin bending, be equipped with the bar mouth that more than one confession cooling tube inwards dwindled on the terminal surface of cooling tube, the outer wall of cooling tube upper end encircles the outside protrusion of outer wall round and forms an extrusion portion, all be equipped with the external screw thread on the outer wall of extrusion portion and the outer wall of cooling tube, the pot head has extrusion ring under the cooling tube, be equipped with the internal thread on the internal face of extrusion ring, the extrusion ring passes through the internal thread and is connected with the external screw thread meshing on the cooling tube, the inside mounting hole that is used for the cover on different kind electronic. The utility model discloses simple structure, through the outside wall that upwards screws up extrusion ring can effectual messenger's cooling tube upper end inwards extrude on being fixed in electronic components, avoided dropping, and can some distribute away the heat on electronic components fast through radiating groove, radiating rod and cooling tube, increased the security.

Description

Electronic component radiating fin

Technical Field

The utility model relates to an electronic components technical field, concretely relates to electronic components fin.

Background

With the rapid development of the society, electronic products are also designed to have high power and high capacity, when electronic components are operated fully, a large amount of heat is generated, if the heat cannot be timely separated from the electronic components, the high-temperature environment will affect the performance of the electronic components, the electronic components are seriously and directly damaged, and therefore, heat dissipation products need to be specially designed for the electronic components.

At present, patent 201820930241. X discloses an electronic component heat sink, which includes a heat sink itself, wherein a concave cavity is arranged at the lower end of the heat sink, so that the heat sink can be sleeved on the electronic component, the upper surface of the heat sink is a hemispherical surface, a heat conducting column is arranged on the hemispherical surface, the heat conducting column is perpendicular to the hemispherical surface tangent plane, and a heat radiating radar is arranged at the tail end of the heat conducting column.

Above device is only with the fin cover on electronic components, and the fastness of its installation is very poor, when the effect is in other electronic equipment that move such as vehicle, the fin drops when the vibration of production can be direct for the fin is in electronic equipment's casing continuous removal, strikes electronic components easily, consequently causes electronic components's damage easily.

Disclosure of Invention

The utility model aims to solve the technical problem that an electronic components fin is provided to solve the problem of proposing among the above-mentioned background art.

The utility model discloses a realize through following technical scheme: the utility model provides an electronic components fin, includes the cooling tube that forms by the fin bending draw in, be equipped with the bar mouth that more than one confession cooling tube inwards dwindled on the terminal surface of cooling tube, the outer wall of cooling tube upper end encircles the outside protrusion of outer wall round and forms an extrusion portion, all be equipped with the external screw thread on the outer wall of extrusion portion and the outer wall of cooling tube, cooling tube lower pot head has the extrusion ring, be equipped with the internal thread on the internal face of extrusion ring, the extrusion ring is connected through the external screw thread meshing on internal thread and the cooling tube, the inside mounting hole that is used for the cover on different kind electronic.

Preferably, the thickness of the uppermost end of the pressing portion is the largest, and gradually decreases as it goes downward until the uppermost end of the pressing portion is flush with the outer wall surface of the lower end of the radiating pipe, and the pressing portion is disposed in an inclined shape.

As a preferred technical scheme, the end surface of the lower end of the radiating pipe is outwards bent to form a flanging with an annular structure.

As a preferred technical scheme, more than one heat dissipation rod is installed on the outer ring surface of the extrusion ring, and the heat dissipation rods are arranged in an L-shaped structure.

Preferably, the mounting hole is circular or square.

As the preferred technical scheme, the upper end of the radiating pipe is provided with a cover plate covering the mounting hole, more than one connecting sheet is arranged between the outer ring surface of the cover plate and the radiating pipe, and the connecting sheets are elastic sheets.

As the preferred technical scheme, more than one radiating groove is also vertically arranged on the outer wall surface of the radiating pipe.

The utility model has the advantages that: the utility model discloses simple structure, can overlap the direct cover of cooling tube on electronic components, and the outer wall that can effectually make the cooling tube upper end through the extrusion ring of upwards screwing up extrudees to be fixed in on the electronic components, thereby it is fixed with electronic components locking to make the cooling tube, has avoided dropping, big increase the fastness, and through the radiating groove, some can be with the quick distribution away of the heat on the electronic components of radiating rod and cooling tube, can effectually protect electronic components through cooling tube and apron simultaneously, avoided the direct striking of outside article to electronic components, great increase the security.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure of the present invention; FIG. 2 is a partial cross-sectional view taken at A-A of FIG. 1; fig. 3 is a schematic structural view of different mounting holes in the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "disposed" are to be construed broadly, and may for example be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1, fig. 2 and fig. 3, the utility model discloses an electronic components fin, include the cooling tube 7 that draws in and form by the fin bending, be equipped with the bar mouth 2 that more than one confession cooling tube inwards reduces on the terminal surface of cooling tube 7, the outer wall of 7 upper ends of cooling tube encircles the outside protrusion of outer wall round and forms an extrusion portion 5, all be equipped with the external screw thread on the outer wall of extrusion portion 5 and the outer wall of cooling tube 7, the pot head has extrusion ring 9 under cooling tube 7, be equipped with the internal thread on the internal face of extrusion ring 9, extrusion ring 9 is connected through the external screw thread meshing on internal thread and the cooling tube 7, the inside mounting hole 11 that is used for the cover on different kind electronic components that.

In this embodiment, the thickness of the uppermost end of the extruding portion 5 is the largest, and gradually decreases as it goes downward until it is flush with the outer wall surface of the lower end of the heat dissipating pipe 7, and the extruding portion 5 is disposed in an inclined shape.

In this embodiment, the lower end of the heat pipe 7 is bent outward to form a flange 8 having an annular structure, so that the contact area with the circuit board is increased by the flange, thereby increasing the stability.

In this embodiment, more than one heat dissipation rods 6 are installed on the outer ring surface of the extrusion ring 9, and the heat dissipation rods 6 are all arranged in an "L" shape.

In this embodiment, the shape of the mounting hole 11 is circular or square, so that the mounting hole can be sleeved on electronic components of different shapes, and the practicability is improved.

In this embodiment, the upper end of the heat dissipation pipe 7 is provided with the cover plate 1 covering the mounting hole, more than one connecting sheet 4 is arranged between the outer ring surface of the cover plate 1 and the heat dissipation pipe 7, the connecting sheets 4 are elastic sheets, and inward extrusion of the extrusion part is not affected by the bendable connecting sheets.

In this embodiment, the outer wall surface of the heat dissipation pipe 7 is further vertically provided with more than one heat dissipation groove 3, so that the heat dissipation area of the heat dissipation pipe is increased, the heat dissipation pipe can be better contacted with the outside air, and the heat dissipation effect is increased.

During the use, overlap the cooling tube on electronic components through the mounting hole to through the rotatory extrusion ring of radiating rod, make the extrusion ring along screw thread rebound, because the upper end of extrusion portion is thick, consequently at the in-process of extrusion ring rebound, the extrusion portion can inwards be drawn close, offsets until the internal face that makes the extrusion portion and electronic components's outer wall, and effectual locking with the cooling tube is fixed in electronic components, has avoided dropping of this device.

Wherein, the heat on the electronic component can be transmitted to the cover plate, the extrusion ring and the heat dissipation rod along the heat dissipation pipe, and the heat is rapidly dissipated through the three heat dissipation grooves, so that the heat dissipation effect is greatly improved.

Wherein, can effectually cover electronic components through cooling tube and apron, avoid the direct striking electronic components of outside article, great increase the security.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that are not thought of through the creative work should be covered within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope defined by the claims.

Claims

1. An electronic component heat sink is characterized in that: include cooling tube (7) that draw in and form by the fin bending, be equipped with bar mouth (2) that more than one confession cooling tube inwards dwindled on the terminal surface of cooling tube (7), the outer wall of cooling tube (7) upper end encircles outside protrusion of outer wall round and forms an extrusion portion (5), all be equipped with the external screw thread on the outer wall of extrusion portion (5) and cooling tube (7), cooling tube (7) lower pot head has extrusion ring (9), be equipped with the internal thread on the internal face of extrusion ring (9), extrusion ring (9) are connected through the external screw thread meshing on internal thread and cooling tube (7), cooling tube (7) inside formation one is used for mounting hole (11) of cover on different kind electronic components.

2. The electronic component heat sink according to claim 1, wherein: the thickness of the uppermost end of the extrusion part (5) is the largest, the thickness gradually decreases downwards until the uppermost end is flush with the outer wall surface of the lower end of the radiating pipe (7), and the extrusion part (5) is arranged in an inclined shape.

3. The electronic component heat sink according to claim 1, wherein: the end surface of the lower end of the radiating pipe (7) is bent outwards to form a flanging (8) with an annular structure.

4. The electronic component heat sink according to claim 1, wherein: more than one heat dissipation rods (6) are arranged on the outer ring surface of the extrusion ring (9), and the heat dissipation rods (6) are arranged in an L-shaped structure.

5. The electronic component heat sink according to claim 1, wherein: the mounting hole (11) is circular or square.

6. The electronic component heat sink according to claim 1, wherein: the upper end of the radiating pipe (7) is provided with a cover plate (1) covering the mounting hole, more than one connecting sheet (4) is arranged between the outer ring surface of the cover plate (1) and the radiating pipe (7), and the connecting sheets (4) are elastic sheets.

7. The electronic component heat sink according to claim 1, wherein: more than one radiating groove (3) is also vertically arranged on the outer wall surface of the radiating pipe (7).