CN211297192U - From microminiature CMOS chip signal lead wire welding set who takes camera lens - Google Patents
From microminiature CMOS chip signal lead wire welding set who takes camera lens Download PDFInfo
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- CN211297192U CN211297192U CN201922280399.4U CN201922280399U CN211297192U CN 211297192 U CN211297192 U CN 211297192U CN 201922280399 U CN201922280399 U CN 201922280399U CN 211297192 U CN211297192 U CN 211297192U
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- dimensional frame
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Abstract
The utility model discloses a from microminiature CMOS chip signal lead-out wire welding set of taking camera lens, include the three-dimensional frame type wiring board with this body coupling of chip, four side surface all fixed strip-shaped pads that are provided with of three-dimensional frame type wiring board, strip-shaped pad upper end is provided with the kink of a body structure, and three-dimensional frame type wiring board upper surface is provided with the apron at open position, the through-hole has all been seted up to apron surface four sides, all fixed circle type pad that is equipped with in the through-hole. The utility model discloses a surface cloth has the circle type pad with chip signal foot welded on the three-dimensional wiring circuit board, and the circle type pad passes through the through-hole and signal foot welding is convenient, through the bar type pad can be very convenient with external line connection, four bar type pad intervals are great to reduced the welding operation degree of difficulty, improved production efficiency and reduction rosin joint, the machine rate of welding, improve the yield, make the stability of whole product structure obtain improving through three-dimensional frame type wiring board simultaneously.
Description
Technical Field
The utility model relates to a chip bonding technology field, more specifically say, in particular to from microminiature CMOS chip signal outgoing line welding set who takes camera lens.
Background
At present, signal pins of a micro COMS chip with a lens are led out by data lines under the condition that the size of the chip is not changed, the data lines are required to be vertical to a BGA bonding pad surface, two additional PCB boards are generally adopted at present, namely, the COMS chip is firstly welded with one PCB in an SMT mode. And the other PCB is vertically welded with the PCB to form a T shape. And finally, welding the signal lead-out wire with the PCB. The current scheme has the following problems: 1, due to the limitation of size and space, when two PCBs form a T shape, the design of a welding pad at a welding position is small, cold solder and continuous solder are easily caused in the actual operation process, the welding is difficult, and the production efficiency and the yield are low. 2, when the PCB is welded with the signal leading-out wire, because the PCB can only be placed with the pads on two sides, due to the limitation of size and space, the size of the pad and the distance between the pads are designed to be smaller, and the problems of insufficient soldering and continuous soldering, difficult soldering, and lower production efficiency and yield in the actual operation process exist. 3, because the sizes of the two PCBs are limited to be small, the structure formed into the T shape is unstable, and the two PCBs are easy to separate and break.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a from microminiature CMOS chip signal lead wire welding set who takes camera lens.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a welding device for signal leading-out wire of microminiature CMOS chip with lens comprises a three-dimensional frame type wiring board connected with a chip body, strip-shaped bonding pads are fixedly arranged on four side surfaces of the three-dimensional frame type wiring board, the strip-shaped bonding pads are arranged on the side surface of the three-dimensional frame type wiring board along the length direction of the three-dimensional frame type wiring board, bending parts with integrated structures are arranged at the upper ends of the strip-shaped bonding pads, the bending parts are fixedly arranged on the upper surface of the three-dimensional frame type wiring board, the upper surface of the three-dimensional frame type wiring board is in an open state, a cover plate is arranged on the upper surface of the three-dimensional frame type wiring board at the open position, through holes are arranged on four side ends of the surface of the cover plate, ring-shaped bonding pads are fixedly arranged in the through holes, the upper ends of the ring-, and the ring-shaped bonding pad is fixedly welded with the signal pin of the chip body at the corresponding position.
Preferably, the chip body is a CMOS chip.
Preferably, the opening inner wall of the three-dimensional frame type wiring board is fixedly welded with a limit ring plate, the cover plate is placed on the upper surface of the limit ring plate, and the upper surface of the cover plate is flush with the upper surface of the three-dimensional frame type wiring board.
Preferably, the width of the bending part is equal to the wall thickness of the three-dimensional frame type wiring board.
Compared with the prior art, the utility model has the advantages of:
the utility model discloses an on three-dimensional wiring circuit board surface cloth have with chip signal foot welded circle type pad, it is convenient that circle type pad passes through-hole and signal foot welding, and draw forth strip type pad with the signal foot through protruding pad, can be very convenient and external line connection through strip type pad this moment, four strip type pad intervals are great, thereby the welding operation degree of difficulty has been reduced, improve production efficiency and reduce the rosin joint, the machine rate of welding, the improvement yield, make the stability of whole product structure obtain improving through three-dimensional frame type wiring board simultaneously.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a structural diagram of a signal lead-out wire welding device of a microminiature CMOS chip with a lens of the present invention;
FIG. 2 is a structural view of a three-dimensional frame-type wiring board of the present invention;
fig. 3 is a cross-sectional view of the three-dimensional frame-shaped wiring board of the present invention.
In the figure: 1 chip body, 2 three-dimensional frame type wiring board, 3 strip type bonding pads, 4 kink, 5 apron, 6 through-holes, 7 circle type bonding pads, 8 protrusion bonding pads, 9 spacing collar plate.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the scope of the present invention can be more clearly and clearly defined.
Referring to fig. 1, 2 and 3, the utility model provides a micro-CMOS chip signal outgoing line welding device with lens, comprising a three-dimensional frame type wiring board 2 connected with a chip body 1, the material of the three-dimensional frame type wiring board can be a ceramic substrate or an aluminum substrate, strip-shaped bonding pads 3 are fixedly arranged on four side surfaces of the three-dimensional frame type wiring board 2, the bonding pads 3 are arranged on the side surface of the three-dimensional frame type wiring board 2 along the length direction of the three-dimensional frame type wiring board 2, the upper end of the strip-shaped bonding pads 3 is provided with bending parts 4 with an integrated structure, the bending parts 4 are fixedly arranged on the upper surface of the three-dimensional frame type wiring board 2, the upper surface of the three-dimensional frame type wiring board 2 is in an opening state, a cover plate 5 is arranged on the opening position of the upper surface of the three-dimensional frame type wiring board 2, through holes 6 are arranged on four side ends of, the protruding bonding pad 8 of an organic whole structure is all fixed to 8 side surfaces of circle type bonding pad, 8 one end of protruding bonding pad and the kink 4 fixed weld of corresponding position, circle type bonding pad 8 and the signal pin fixed weld of the chip body 1 of corresponding position.
In this embodiment, the chip body 1 is a CMOS chip.
In this embodiment, the opening inner wall of the three-dimensional frame-shaped wiring board 2 is fixedly welded with the limit ring plate 9, the cover plate 5 is placed on the upper surface of the limit ring plate 9, and the upper surface of the cover plate 5 is flush with the upper surface of the three-dimensional frame-shaped wiring board 2.
In this embodiment, the width of the bent portion 4 is equal to the wall thickness of the three-dimensional frame-shaped wiring board 2.
The working principle is as follows: the cover plate 5 is placed at the position of a signal pin at the lower end of the chip body 1, the ring-shaped bonding pad 7 is fixedly welded with the signal pin of the chip body 1, the opening of the three-dimensional frame-shaped wiring board 2 is clamped with the cover plate 5 at the moment, then the bent part 4 of the strip-shaped bonding pad 3 is fixedly welded with the protruding bonding pad 8, and the cover plate 5 can be stably positioned in the opening of the three-dimensional frame-shaped wiring board 2 at the moment.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, various changes and modifications can be made by the owner within the scope of the appended claims, and the protection scope of the present invention should not be exceeded by the claims.
Claims (4)
1. A signal leading-out wire welding device of a microminiature CMOS chip with a lens comprises a three-dimensional frame type wiring board connected with a chip body, and is characterized in that: the three-dimensional frame type wiring board is characterized in that strip-shaped bonding pads are fixedly arranged on the four side surfaces of the three-dimensional frame type wiring board, the strip-shaped bonding pads are arranged on the side surfaces of the three-dimensional frame type wiring board along the length direction of the three-dimensional frame type wiring board, bent parts of an integrated structure are arranged at the upper ends of the strip-shaped bonding pads, the bent parts are fixedly arranged on the upper surface of the three-dimensional frame type wiring board, the upper surface of the three-dimensional frame type wiring board is in an open state, a cover plate is arranged at the open position on the upper surface of the three-dimensional frame type wiring board, through holes are formed in the four side ends of the surface of the cover plate, ring-shaped bonding pads are fixedly arranged in the through holes, the upper ends of the ring-shaped bonding pads extend out of the.
2. The apparatus for bonding signal lead-out wires of a microminiature CMOS chip with lens according to claim 1, wherein: the chip body is a CMOS chip.
3. The apparatus for bonding signal lead-out wires of a microminiature CMOS chip with lens according to claim 1, wherein: the opening inner wall of the three-dimensional frame type wiring board is fixedly welded with a limiting ring plate, the cover plate is placed on the upper surface of the limiting ring plate, and the upper surface of the cover plate is flush with the upper surface of the three-dimensional frame type wiring board.
4. The apparatus for bonding signal lead-out wires of a microminiature CMOS chip with lens according to claim 1, wherein: the width of the bending part is equal to the wall thickness of the three-dimensional frame type wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922280399.4U CN211297192U (en) | 2019-12-18 | 2019-12-18 | From microminiature CMOS chip signal lead wire welding set who takes camera lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922280399.4U CN211297192U (en) | 2019-12-18 | 2019-12-18 | From microminiature CMOS chip signal lead wire welding set who takes camera lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211297192U true CN211297192U (en) | 2020-08-18 |
Family
ID=72015607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922280399.4U Active CN211297192U (en) | 2019-12-18 | 2019-12-18 | From microminiature CMOS chip signal lead wire welding set who takes camera lens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211297192U (en) |
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2019
- 2019-12-18 CN CN201922280399.4U patent/CN211297192U/en active Active
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