CN211293507U - Bonding platform device - Google Patents
Bonding platform device Download PDFInfo
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- CN211293507U CN211293507U CN201922487899.5U CN201922487899U CN211293507U CN 211293507 U CN211293507 U CN 211293507U CN 201922487899 U CN201922487899 U CN 201922487899U CN 211293507 U CN211293507 U CN 211293507U
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Abstract
The utility model relates to a bonding platform device, including a unable adjustment base, one end at unable adjustment base is equipped with a quartz strip, upper surface at unable adjustment base's the other end is equipped with adjustable micrometer, upper surface at unable adjustment base is equipped with a platelike bonding platform spare, be equipped with a plurality of spring posts between bonding platform spare and the unable adjustment base, the spring post is used for mutually supporting with the locking tight screw, with the distance between regulation bonding platform spare and the unable adjustment base, be equipped with FPC bonding district on bonding platform spare, FPC bonding district is used for bonding flexible circuit board on liquid crystal glass's electrode. The utility model provides a nation decides platform device, the regulation of the vertical direction position of being convenient for, and improved the regulation precision.
Description
Technical Field
The utility model relates to a brilliant glass assembles auxiliary assembly technical field, in particular to nation decides platform device.
Background
With the rapid development of economy and the continuous progress of technology, electronic devices become more and more common in people's daily life, and become indispensable products in people's daily life and work. Among electronic devices, a liquid crystal display is one of important components. The normal display function can be realized only by bonding an FPC (flexible printed circuit) on the liquid crystal display screen.
In the field of crystal glass bonding technology, common methods include two types: one is bonding by the COG (chip On glass) technology, i.e. bonding the chip to the glass; the other is bonding by the fog (flilm On glass) technique, i.e. bonding the film to glass. In the bonding process, the workpiece needing to be bonded on the bonding platform and the bonded object glass are aligned, and the bonding platform is adjusted to a proper position in the vertical direction and then bonded.
However, the existing bonding platform device cannot adjust the position of the bonding worktable well, and the precision is not high.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model discloses a for solve current nation and decide platform device, can't adjust the position of nation's workstation betterly, and the not high problem of precision.
The utility model provides a bonding platform device, including a unable adjustment base, wherein unable adjustment base's one end is equipped with a quartz strip unable adjustment base's the upper surface of the other end is equipped with adjustable micrometer unable adjustment base's upper surface is equipped with a platelike bonding platform spare, bonding platform spare with be equipped with a plurality of spring posts between the unable adjustment base, the spring post is used for mutually supporting with the locking tight screw, in order to adjust bonding platform spare with distance between the unable adjustment base be equipped with FPC bonding district on the bonding platform spare, FPC bonding district is used for bonding the flexible circuit board on liquid crystal glazing's electrode.
The utility model provides a binding platform device, which comprises a fixed base, wherein one end of the fixed base is provided with a quartz strip for size calibration, the upper surface of the fixed base is also provided with a binding platform piece, and a spring column is arranged between the binding platform piece and the fixed base and is matched with a locking tightening screw to adjust the position of the binding platform piece in the vertical direction; meanwhile, the adjustable micrometer is further arranged on the fixed base, so that the position of the bonding platform part can be conveniently adjusted by taking the quartz strip as a standard, and the adjusting precision is improved. The utility model provides a nation decides platform device, the regulation of the vertical direction position of being convenient for, and improved the regulation precision.
Nation decides platform device, wherein, unable adjustment base's thickness is less than the thickness of quartz strip, the width of quartz strip with unable adjustment base's width is the same, the upper surface of quartz strip be used for with liquid crystal glazing laminates mutually.
Nation decides platform device, wherein a plurality of base through-holes have been seted up to unable adjustment base's upper surface still is equipped with a plurality ofly the spring post, the spring post has at least partly to be located the inside of nation decides platform spare.
Nation decides platform device, wherein, the quantity of base through-hole is 4, the quantity of spring post is 4, four the base through-hole is the square arrangement of rule.
The bonding platform device is characterized in that the height of the top of the adjustable micrometer is larger than the height of the liquid crystal glass in the vertical direction.
Nation decides platform device, wherein it has seted up locking screw through-hole and spring post mounting hole to decide on the platform spare, wherein the locking screw through-hole with base through-hole one-to-one, spring post mounting hole is located the inboard of locking screw through-hole.
Nation decides platform device, wherein, the locking screw through-hole with the quantity of spring post mounting through-hole is 4, every it is equipped with one respectively to divide equally in the spring post mounting through-hole the spring post.
Nation decides the platform device, wherein a horizontal light trap has been seted up on the nation decides the platform spare, the diameter of horizontal light trap is 1mm, nation decides the platform spare and is made by stainless steel material.
The bonding platform device is a COG bonding platform device or an FOG bonding platform device.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic view of an overall structure of a bonding platform device according to an embodiment of the present invention;
FIG. 2 is an exploded view of the bonding platform assembly shown in FIG. 1;
FIG. 3 is a schematic diagram of a portion of the bonding platform apparatus shown in FIG. 2;
FIG. 4 is an enlarged view of the construction of the bonding platform member of the bonding platform assembly shown in FIG. 2;
FIG. 5 is an enlarged view of the "V" portion of the bonding platform member shown in FIG. 4.
Description of the main symbols:
| |
11 | Base through |
111 |
| |
12 | |
211 |
| |
13 | Spring post mounting through |
212 |
| |
14 | Through hole of |
213 |
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15 | |
214 |
| |
21 |
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The existing bonding platform device cannot adjust the position of a bonding workbench well, and is low in precision.
In order to solve the technical problem, the utility model provides a nation decides platform device, please refer to fig. 1 to fig. 5, to the utility model provides a nation decides platform device, including a unable adjustment base 11, be equipped with a quartz strip 12 in this unable adjustment base 11's one end, be equipped with adjustable micrometer 14 at the upper surface of unable adjustment base 11's the other end, be equipped with a platelike nation decides platform spare 21 at unable adjustment base 11's upper surface, be equipped with a plurality of spring posts 15 between nation decides platform spare 21 and the unable adjustment base 11, spring posts 15 are used for and lock tight screw and mutually support to adjust the distance between nation platform spare 21 and the unable adjustment base 11.
Referring to fig. 3, for the fixed base 11, a plurality of base through holes 111 are formed on the upper surface of the fixed base 11. In the present embodiment, the number of the base through holes 111 is 4. The four base through holes 111 are arranged in a regular square shape, specifically in a square shape. In this embodiment, the thickness of the fixing base 11 is smaller than that of the quartz bar 12, and the width of the quartz bar 12 is the same as that of the fixing base 11. The upper surface of the quartz bar 12 is used for being attached with the liquid crystal glass 13.
As described above, a plurality of spring posts 15 are also provided between stationary base 11 and bonding platform 21 during assembly. It will be appreciated that spring posts 15 are provided to provide a resilient return force between mounting base 11 and bonding platform 21, and to adjust the relative distance between mounting base 11 and bonding platform 21 in conjunction with locking screw holes 213.
Referring to fig. 4, for the bonding platform 21, an FPC bonding area 211 is disposed on the bonding platform 21, and the FPC bonding area 211 is used for bonding the flexible circuit board on the electrode of the liquid crystal glass 13. In addition, a locking screw through hole 213 and a spring post mounting through hole 212 are formed on the bonding platform member 21, wherein the locking screw through holes 213 correspond to the base through holes 111 one by one, and the spring post mounting through hole 212 is located at the inner side of the locking screw through hole 213.
In this embodiment, the number of the locking screw through holes 213 and the number of the spring post mounting through holes 212 are both 4. In the specific installation process, one spring post 15 is respectively arranged in each spring post installation through hole 212. Meanwhile, a transverse light hole 214 is formed in the bonding platform part 21, and the diameter of the transverse light hole 214 is 1 mm. The transverse light-transmitting aperture 214 may facilitate fiber penetration for position bonding. In the present embodiment, the bonding stage member 21 is made of a stainless steel material.
In order to improve the accuracy of the height adjustment, an adjustable micrometer 14 is provided on the upper surface of the left end of the fixed base 11. In the present embodiment, the height of the top of the adjustable micrometer 14 is greater than the height of the liquid crystal glass 13 in the vertical direction. The bonding platform device may be a COG bonding platform device or an FOG bonding platform device. In this embodiment, the bonding platform device is a FOG bonding platform.
The utility model provides a binding platform device, which comprises a fixed base, wherein one end of the fixed base is provided with a quartz strip for size calibration, the upper surface of the fixed base is also provided with a binding platform piece, and a spring column is arranged between the binding platform piece and the fixed base and is matched with a locking tightening screw to adjust the position of the binding platform piece in the vertical direction; meanwhile, the adjustable micrometer is further arranged on the fixed base, so that the position of the bonding platform part can be conveniently adjusted by taking the quartz strip as a standard, and the adjusting precision is improved. The utility model provides a nation decides platform device, the regulation of the vertical direction position of being convenient for, and improved the regulation precision.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the technical solution of the present invention, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: those skilled in the art can still modify or easily conceive of changes in the technical solutions described in the foregoing embodiments or make equivalent substitutions for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. The utility model provides a bonding platform device, includes a unable adjustment base, its characterized in that unable adjustment base's one end is equipped with a quartz strip unable adjustment base's the upper surface of the other end is equipped with adjustable micrometer unable adjustment base's upper surface is equipped with a platelike bonding platform spare, bonding platform spare with be equipped with a plurality of spring posts between the unable adjustment base, the spring post is used for mutually supporting with the locking tight screw, in order to adjust bonding platform spare with distance between the unable adjustment base be equipped with FPC bonding district on the bonding platform spare, FPC bonding district is used for bonding the flexible circuit board on liquid crystal glazing's electrode.
2. A bonding platform arrangement according to claim 1, wherein the thickness of the fixing base is smaller than the thickness of the quartz strip, the width of the quartz strip is the same as the width of the fixing base, and the upper surface of the quartz strip is used for being attached to the liquid crystal glass.
3. A bonding platform assembly according to claim 1, wherein a plurality of base through holes are formed in the top surface of the stationary base, and a plurality of spring posts are also formed on the top surface of the stationary base, at least a portion of the spring posts being disposed within the interior of the bonding platform member.
4. A bonding platform arrangement according to claim 3, wherein the number of base through holes is 4, the number of spring posts is 4, and four base through holes are arranged in a regular square.
5. A bonding platform device according to claim 1, wherein the height of the top of the adjustable micrometer is greater than the height of the liquid crystal glass in the vertical direction.
6. A bonding platform assembly according to claim 3, wherein locking screw through holes are formed in the bonding platform member, and spring post mounting through holes are formed in the bonding platform member, wherein the locking screw through holes correspond to the base through holes one to one, and the spring post mounting through holes are located inside the locking screw through holes.
7. A bonding platform arrangement according to claim 6, wherein the number of locking screw through holes and spring post mounting through holes is 4, one spring post being provided in each spring post mounting through hole.
8. A bonding platform assembly according to claim 1, wherein a transverse light hole is formed in the bonding platform member, the transverse light hole having a diameter of 1mm, and the bonding platform member is made of stainless steel.
9. The bonding platform device of claim 1, wherein the bonding platform device is a COG bonding platform device or a FOG bonding platform device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922487899.5U CN211293507U (en) | 2019-12-31 | 2019-12-31 | Bonding platform device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922487899.5U CN211293507U (en) | 2019-12-31 | 2019-12-31 | Bonding platform device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211293507U true CN211293507U (en) | 2020-08-18 |
Family
ID=72014166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922487899.5U Active CN211293507U (en) | 2019-12-31 | 2019-12-31 | Bonding platform device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211293507U (en) |
-
2019
- 2019-12-31 CN CN201922487899.5U patent/CN211293507U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220208 Address after: 321000 building 10, No. 528, Jiuding Road, Yongkang Economic Development Zone, Jinhua City, Zhejiang Province (self declaration) Patentee after: Zhejiang lianxinkang Technology Co.,Ltd. Address before: 330096 No.59, Chuangxin 1st Road, high tech Development Zone, Nanchang City, Jiangxi Province Patentee before: JIANGXI UNITED THOUGHT TOUCH TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right |