CN211282773U - A device that is used for ic frame lamination to receive material - Google Patents
A device that is used for ic frame lamination to receive material Download PDFInfo
- Publication number
- CN211282773U CN211282773U CN201922178173.3U CN201922178173U CN211282773U CN 211282773 U CN211282773 U CN 211282773U CN 201922178173 U CN201922178173 U CN 201922178173U CN 211282773 U CN211282773 U CN 211282773U
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- frame
- placing
- lamination
- feeding portion
- receiving
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Abstract
The utility model discloses a device for receiving IC frame lamination, which comprises a base (1), wherein a feeding part (2) is arranged on the base (1), the feeding part (2) is connected with a discharging part (3), and is characterized in that a telescopic step (4) for receiving an IC frame is arranged on the feeding part (2) close to the discharging part (3), a first placing step (5) for placing the IC frame is arranged below the telescopic step (4), a second placing step (6) for pre-connecting the IC frame is arranged between the telescopic step (4) and the first placing step (5), a feeding port (7) is arranged on the feeding part (2), a blocking block (8) for blocking the IC frame is arranged at one end of the feeding part (2) far away from the feeding port, a detection device for detecting the transmission of the IC frame is arranged on the feeding part (2), and a downward pressing cylinder (9) is arranged on the feeding part (2).
Description
Technical Field
The utility model relates to a receiving arrangement especially relates to a device that is used for ic frame lamination to receive material.
Background
in the ic frame manufacture process, receive the material part and be final a step, among the prior art, ic frame material collecting device does not connect the function in advance, when the ic frame collected a certain amount, then can stop collecting, will collect the good ic frame and transport pay-off department, returns again and continues to collect, has leaded to vacant time, has reduced work efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model provides a device for IC frame lamination is received material, then can transport the discharge portion with the IC frame when first step of placing reaches 50 IC frames, the step is placed to the second simultaneously and is stretched out, acts as the first position of placing the step and continues to meet the IC frame, and first step of placing can be along with the increase of IC frame and descend gradually, in the course of the work, has compensatied the blank time, can reach and meet the IC frame at every moment, has improved work efficiency.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a device for IC frame lamination is received material, includes the base, be provided with pan feeding portion on the base, pan feeding portion is connected with ejection of compact portion, be close to in pan feeding portion and be provided with the flexible step that is used for connecing the IC frame in ejection of compact portion department, flexible step below is provided with the first step of placing that is used for placing the IC frame, flexible step with first place the step in the middle of be provided with the second that is used for connecing the IC frame in advance and place the step.
The scheme is further that a feeding opening is formed in the feeding portion, and a blocking block used for blocking the ic frame is arranged at one end, far away from the feeding opening, of the feeding portion. Because the ic frame enters the feeding port and is transported in through the cylinder, the ic frame has certain impact force and is prevented from being ejected.
The feeding part is provided with a detection device for detecting the transmission of the ic frame, and the detection device is connected with the controller. Utilize detection device to discern the ic frame transportation condition, every will record once through an ic frame, give the controller with signal transmission, the controller sends out the instruction control flexible step and meets the ic frame.
The above scheme is further that the monitoring device adopts a light sensor.
Above-mentioned scheme is further, be provided with on the pan feeding portion and be used for pressing the ic frame to the first step of placing and the second place the push down cylinder on the step. Because ic frame self is lighter, can't stand immediately and drop on first step or the second is placed the step to placing when transporting the destination, can press the ic frame to first step or the second is placed on the step through pushing down the cylinder immediately.
Above-mentioned scheme is further, be provided with the fixing base that is used for fixed push down the cylinder on the pan feeding portion.
The above scheme is further that the telescopic step and the second placing step are connected with the cylinder.
The scheme is further that the first placing step is connected with a stepping motor.
The utility model discloses a technical advantage and effect:
the IC frame passes through after the inspection is qualified, enters into the pan feeding mouth, detects the IC frame transportation situation through light sensor, every entering a slice of IC frame and record, transmits for the controller, and the controller sends out the flexible step of instruction control and connects the IC frame. Because the IC frame gets into the pan feeding mouth and transports through the cylinder, in order to prevent that the IC frame from being launched out, prevent that the IC frame from being launched out through the stopper. Reach first placing platform department when the ic frame, can't fall into first placing the step through self gravity, can fall the ic frame to first placing the bench through the air cylinder that pushes down in the twinkling of an eye, and first placing the platform can reduce gradually along with the increase of ic quantity, when reaching 50 ic frames, then can transport the ic frame ejection of compact portions, at this moment, the second is placed the step and is stretched out and continue to connect the ic frame as the position of first step, has improved work efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a device for receiving ic frame lamination.
FIG. 2 is a schematic view of a feeding portion of an apparatus for collecting IC frame lamination.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a device for collecting ic frame lamination includes a base 1, a fixed support 11 is disposed on the lower end face of the base 1, a feeding portion 2 is disposed on the base 1, a feeding port 7 is disposed on the feeding portion 2, the feeding portion 2 is connected to a discharging portion 3, the discharging portion 3 is provided with a discharging port, a telescopic step 4 for receiving the ic frame is disposed on the feeding portion 2 near the discharging portion, the telescopic step 4 is connected to a cylinder, the telescopic step 4 is connected to the ic frame and is immediately retracted to enable the ic frame to fall onto a first placing step, a first placing step 5 for placing the ic frame is disposed below the telescopic step 4, the first placing step 5 is connected to a stepping motor, the first placing step 5 is gradually lowered along with the increase of the ic frame, when 50 ic frames are reached, certainly, the number of IC frames can be adjusted according to the work demand, and the controller can drive first step of placing and transport the IC frame to ejection of compact portion.
In order to make up the blank time between the first placing table and the discharging part for transporting the ic frame, a second placing step 6 for pre-receiving the ic frame is arranged between the telescopic step 4 and the first placing step 5, and the second placing step 6 is connected with the air cylinder. Specifically, the second placing step is generally in a retracted state, when the ic frames on the first placing step reach 50 sheets for transportation, the second placing step extends out to replace the position of the first placing step to continue collecting the ic frames, and when the first placing step returns to the initial position, the second placing step retracts to drop the collected ic frames onto the first placing step.
Can drop into first place the step or the second place the step for the ic frame rapidly, it is preferred, be provided with down air cylinder 9 on the pan feeding portion 3, be connected with depression bar down on the air cylinder 9, and the one end of depression bar and ic frame contact surface is the semiarc, can not damaged ic frame, be provided with the fixing base on the air cylinder down. One end of the feeding portion, which is far away from the feeding port, is provided with a blocking block for blocking the ic frame, so that the ic frame is prevented from being ejected.
Be provided with the detection device who is used for detecting the transmission of IC frame on pan feeding portion 2, detection device adopts the light sense sensor, and it can be understood that other sensors also can use the utility model discloses in, for example infrared ray sensor etc.. The light sensation sensor records the ic frame entering the feeding portion, signals are transmitted to the controller, the controller sends instructions to control the telescopic steps and the pressing cylinder to connect the ic frame, and automation is achieved.
The utility model discloses a technical advantage and effect:
the IC frame passes through after the inspection is qualified, enters into the pan feeding mouth, detects the IC frame transportation situation through light sensor, every entering a slice of IC frame and record, transmits for the controller, and the controller sends out the flexible step of instruction control and connects the IC frame. Because the IC frame gets into the pan feeding mouth and transports through the cylinder, in order to prevent that the IC frame from being launched out, prevent that the IC frame from being launched out through the stopper. Reach first placing platform department when the ic frame, can't fall into first placing the step through self gravity, can fall the ic frame to first placing the bench through the air cylinder that pushes down in the twinkling of an eye, and first placing the platform can reduce gradually along with the increase of ic quantity, when reaching 50 ic frames, then can transport the ic frame ejection of compact portions, at this moment, the second is placed the step and is stretched out and continue to connect the ic frame as the position of first step, has improved work efficiency.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (8)
1. The utility model provides a device for IC frame lamination is received material, includes base (1), be provided with pan feeding portion (2) on base (1), pan feeding portion (2) are connected with ejection of compact portion (3), a serial communication port, be close to on pan feeding portion (2) and locate to be provided with flexible step (4) that are used for connecing the IC frame in ejection of compact portion (3), flexible step (4) below is provided with first step (5) of placing that are used for placing the IC frame, flexible step (4) with first step (5) of placing the centre is provided with the second that is used for connecing the IC frame in advance and places step (6).
2. The device for collecting ic frame lamination as claimed in claim 1, wherein the material inlet (7) is provided on the material inlet portion (2), and a blocking block (8) for blocking the ic frame is provided on an end of the material inlet portion (2) far away from the material inlet.
3. The apparatus for collecting ic frame lamination as claimed in claim 1, wherein the feeding portion (2) is provided with a detecting device for detecting ic frame transmission, and the detecting device is connected to the controller.
4. The apparatus for collecting ic frame lamination as claimed in claim 3, wherein the detecting device is a light sensor.
5. The apparatus for receiving ic frame lamination as claimed in claim 1, wherein the feeding portion (2) is provided with a down-pressing cylinder (9) for pressing the ic frame onto the first placing step and the second placing step.
6. A device for receiving ic frame lamination according to claim 5, wherein the down-pressing cylinder (9) is provided with a fixing seat (10).
7. An apparatus for receiving ic frame lamination in accordance with claim 1 wherein the telescopic step (4) and the second placing step (6) are connected to a pneumatic cylinder.
8. An apparatus for receiving ic frame lamination in accordance with claim 1 wherein the first placing step (5) is connected to a stepping motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922178173.3U CN211282773U (en) | 2019-12-06 | 2019-12-06 | A device that is used for ic frame lamination to receive material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922178173.3U CN211282773U (en) | 2019-12-06 | 2019-12-06 | A device that is used for ic frame lamination to receive material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211282773U true CN211282773U (en) | 2020-08-18 |
Family
ID=72026652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922178173.3U Active CN211282773U (en) | 2019-12-06 | 2019-12-06 | A device that is used for ic frame lamination to receive material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211282773U (en) |
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2019
- 2019-12-06 CN CN201922178173.3U patent/CN211282773U/en active Active
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