CN211276877U - TR subassembly reflow soldering four-column type welding assembly fixture - Google Patents
TR subassembly reflow soldering four-column type welding assembly fixture Download PDFInfo
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- CN211276877U CN211276877U CN201922034079.0U CN201922034079U CN211276877U CN 211276877 U CN211276877 U CN 211276877U CN 201922034079 U CN201922034079 U CN 201922034079U CN 211276877 U CN211276877 U CN 211276877U
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Abstract
The utility model discloses a TR subassembly reflow soldering four-column type welding assembly fixture, all be provided with a guide pillar on four angles of bottom plate perpendicularly, all be provided with a guide sleeve hole that the adaptation slided on respective guide pillar perpendicularly on four angles of apron, all adopt D9/h10 clearance fit between the guide sleeve hole of each guide pillar rather than the looks adaptation, each pressure head all connects a jib bolt lower extreme, all adopt D9/h10 clearance fit between the cylinder face section on each jib bolt upper portion and the jib hole on the apron of its place; because the four guide columns and guide sleeves which are matched with the D9/h10 level are adopted, each pressure head is connected in a combined mode, and the lifting rod bolt matched with the cover plate in the D9/h10 level is arranged on each pressure head, the phenomenon that the pressure head touches peripheral capacitance resistance devices due to displacement or deflection caused by asynchronous contact or uneven force of a pressure head spring is overcome, and the assembly contact reject ratio of the capacitance resistance devices on the TR component circuit substrate after reflow soldering is reduced.
Description
Technical Field
The utility model relates to a reflow soldering frock field of TR subassembly especially relates to a four column type welding assembly fixtures of TR subassembly reflow soldering.
Background
The TR component is a core component of the phased array radar antenna, and the circuit substrate, the low-frequency connector and the radio-frequency connector are firstly assembled in the shell and then reflow soldering is carried out during production.
The circuit substrate of the TR component is adhered with more capacitance and resistance devices by adopting a small amount of soldering paste to be dense, hemp and positioned according to a micro-assembly process, and a solder ring is added in the assembly of the low-frequency connector and the radio-frequency connector to ensure the sealing property, and is only adhered to the side surface of the shell of the TR component by adopting a small amount of soldering paste; the whole assembly process can not generate overlarge pressure, little vibration or dislocation or component touch so as to meet the requirements of the TR component process and performance indexes, for example, the circuit substrate must reach more than 80% of penetration rate after welding so as to ensure the grounding and the component heat dissipation effects, and the sealing performance of a low-frequency connector and a radio-frequency connector after welding is not more than 5 multiplied by 10 < -9 >/Pa.m < 3 >/s, and the like.
However, according to the past batch production practice, the conventional TR component reflow soldering assembly tool is easy to generate dislocation and touch the components, so that the capacitance and resistance device is displaced and poorly contacted on the circuit substrate, and the gold plating layer of the low-frequency connector and the radio-frequency connector is damaged by friction, and even the connector falls off.
Therefore, there is still a need for improvement and development of the prior art.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a TR subassembly reflow soldering four column type welding assembly fixture how reduces the assembly contact defective rate that the electric capacity resistance device on the TR subassembly circuit substrate appears after reflow soldering.
The technical scheme of the utility model as follows: a TR component reflow soldering four-column type welding assembly tool comprises a cover plate and a bottom plate, wherein the bottom plate is used for supporting and positioning a shell of the TR component, and a circuit substrate of the TR component is assembled in the shell; the cover plate is positioned right above the circuit substrate; the circuit substrate is adhered with a plurality of capacitance and resistance devices through soldering paste, and the cover plate is provided with a plurality of pressure heads which are used for propping against the area without the devices of the circuit substrate when the cover plate and the bottom plate are combined together; wherein:
guide posts are vertically arranged at four corners of the bottom plate, guide sleeve holes which are matched with the guide posts to slide on the guide posts are vertically arranged at four corners of the cover plate, and each guide post is in clearance fit with the guide sleeve hole matched with the guide post by adopting D9/h 10;
each pressure head is connected to the lower end of a suspender bolt, the cylindrical surface section of the upper part of the suspender bolt is matched in a suspender hole of the cover plate and can slide up and down, a pressure head spring is supported between the cover plate and each pressure head, and the cylindrical surface section of the upper part of each suspender bolt is in clearance fit with the suspender hole in which the cylindrical surface section is positioned by D9/h 10.
TR subassembly reflow soldering four column type welding assembly fixture, wherein: the pre-pressure of all pressure head springs after assembly is set to be 1-2N, and the lower end faces of all pressure heads are flush after assembly.
TR subassembly reflow soldering four column type welding assembly fixture, wherein: the pressure heads are all made into a step cylinder shape or a cone frustum shape by adopting epoxy resin rods, and the diameter of the head part of each pressure head for pressing the circuit substrate is smaller than that of the tail part of each pressure head; and a threaded hole matched with the suspender bolt in threaded connection is formed in the center of the end face of the tail part of the pressure head.
TR subassembly reflow soldering four column type welding assembly fixture, wherein: the bottom plate is provided with a positioning sliding groove for supporting and positioning the shell of the TR component, and the front end opening of the positioning sliding groove is used for pushing in and taking out the TR component.
TR subassembly reflow soldering four column type welding assembly fixture, wherein: the bottom plate left side is provided with a low frequency location boss, the left end face of bottom plate has a low frequency location fixed bolster through the fix with screw, low frequency location fixed bolster is via a low frequency location pull rod swing joint low frequency locating piece, the low frequency locating piece is located between low frequency location fixed bolster and the low frequency location boss, be provided with on the low frequency location fixed bolster and be used for pushing up the low frequency locating screw in the one side of low frequency locating piece TR subassembly casing dorsad, the one side of orientation TR subassembly casing on the low frequency locating piece transversely is provided with the low frequency interface reference column, transversely correspond the low frequency interface locating hole that is provided with the adaptation low frequency interface reference column on the low frequency location boss, and adopt H9/H9 clearance fit between low.
TR subassembly reflow soldering four column type welding assembly fixture, wherein: the low-frequency interface positioning column is made into a cylindrical shape or a square shape by adopting an epoxy resin rod/block and is fixed on the low-frequency positioning block.
TR subassembly reflow soldering four column type welding assembly fixture, wherein: the radio frequency positioning device is characterized in that a radio frequency positioning boss is arranged on the right side of the bottom plate, a radio frequency positioning fixing support is fixed on the right end face of the bottom plate through a screw, the radio frequency positioning fixing support is movably connected with a radio frequency positioning block through a radio frequency positioning pull rod, the radio frequency positioning block is located between the radio frequency positioning fixing support and the radio frequency positioning boss, a radio frequency positioning screw used for pushing the radio frequency positioning block to the side, opposite to the TR component shell, is arranged on the radio frequency positioning fixing support, a radio frequency interface positioning column is transversely arranged on the radio frequency positioning block towards the side, facing the TR component shell, of the radio frequency positioning block, a radio frequency interface positioning hole matched with the radio frequency interface positioning column is transversely arranged.
TR subassembly reflow soldering four column type welding assembly fixture, wherein: the radio frequency interface positioning column is made into a cylinder shape by adopting an epoxy resin rod and is fixed on the radio frequency positioning block.
TR subassembly reflow soldering four column type welding assembly fixture, wherein: each guide post is sleeved with a guide post spring which is used for assisting in supporting the cover plate and parts on the cover plate before reflow soldering and used for bouncing and supporting the cover plate and parts on the cover plate after reflow soldering.
TR subassembly reflow soldering four column type welding assembly fixture, wherein: the cover plate and the bottom plate are respectively provided with a plurality of lightening holes for reducing the absorption of excessive space heat of the cover plate and the bottom plate in the reflow soldering process.
The utility model provides a four column type welding assembly fixtures of TR subassembly reflow soldering, because adopted four D9/h10 level complex guide pillar guide pin bushings between apron and bottom plate, combine to connect every pressure head and have D9/h10 level complex jib bolt with the apron, utilize the balancing act of guide pillar guide pin bushing to combine jib bolt, overcome the pressure head because of contact asynchronous or pressure head spring dynamics uneven displacement that appears or crooked and lead to the pressure head to touch its peripheral electric capacity resistance device's phenomenon, the assembly contact defective rate that electric capacity resistance device appears after the reflow soldering on the TR subassembly circuit board has been reduced, thereby the work bottleneck of TR subassembly in reflow soldering assembly and reflow soldering link has been solved, and easy operation is swift also improved production efficiency and product percent of pass greatly when also.
Drawings
FIG. 1 is a perspective view of an embodiment of a TR assembly reflow four-post welding assembly fixture (with a TR assembly) of the present invention;
fig. 2 is an exploded view of the upper half of fig. 1 in accordance with the present invention;
fig. 3 is a reduced exploded view of the lower half of fig. 1 (without the TR element) of the present invention.
Detailed Description
The following detailed description and examples of the present invention are provided in connection with the accompanying drawings, which are set forth for the purpose of illustration only and are not intended to limit the invention.
As shown in fig. 1, fig. 1 is a perspective view of an embodiment (with TR module) of the TR module reflow soldering four-column type welding assembly fixture of the present invention, the TR module reflow soldering four-column type welding assembly fixture includes a cover plate 200 and a bottom plate 300, which are used for positioning and fixing the housing 110 of the TR module 100 in the reflow step, the circuit board 120 of the TR module 100 is assembled in the housing 110, and the circuit board 120 is provided with more capacitance resistance devices 121 by adopting soldering positioning and adhesion according to the TR module micro-assembly process; the cover plate 200 is provided with a plurality of pressing heads 210, so that when the cover plate 200 is combined with the base plate 300, and under the action of the self weight of the cover plate 200, the pressing heads 210 are pressed against the component-free area on the circuit substrate 120, so as to fix the circuit substrate 120 in the housing 110 of the TR assembly 100.
Referring to fig. 2 and 3, fig. 2 is an exploded view of the upper half of fig. 1 of the present invention, and fig. 3 is a reduced exploded view of the lower half (without the TR element) of fig. 1 of the present invention; in order to avoid the phenomenon that the plurality of pressing heads 210 on the cover plate 200 are displaced or tilted due to asynchronous contact or uneven pressing force during the process of contacting and pressing the circuit substrate 120 in fig. 1, and the plurality of pressing heads contact the capacitive resistor device 121 on the circuit substrate 120, on one hand, a guide post 340 is vertically arranged at each of the four corners of the base plate 300, a guide sleeve hole 240 is vertically arranged at each of the four corners of the cover plate 200, the guide sleeve holes 240 can be sleeved on the respective guide posts 340 to slide up and down, and a clearance fit manner of D9/h10 is adopted between each guide post hole 240 and the guide post 340 matched with the guide post hole; therefore, the balancing effect of the guide pillars and the guide sleeves matched with the four D9/h10 levels is utilized, the phenomenon that the plurality of pressing heads 210 on the cover plate 200 touch the peripheral capacitive resistor devices 121 due to displacement or deflection caused by asynchronous contact or uneven pressing force during the process of contacting and pressing down the circuit substrate 120 is avoided, and the assembling contact reject ratio of the capacitive resistor devices 121 on the circuit substrate 120 is greatly reduced after the reflow soldering link.
On the other hand, each pressure head 210 is connected to the lower end of a boom bolt 220, all boom bolts 220 are hung on the cover plate 200, the cylindrical surface section of the upper part of each boom bolt 220 is matched in the hoisting hole 201 of the cover plate 200 and can slide up and down, a pressure head spring 230 is supported and arranged between the lower bottom surface of the cover plate 200 and the upper end surface of each pressure head 210, and the cylindrical surface section of the upper part of each boom bolt 220 and the boom hole 201 where the cylindrical surface section is located are in clearance fit with each other in a D9/h10 mode; therefore, the hanger rod bolt 220 matched with each D9/h10 level is utilized to further overcome the phenomenon that the pressure head 210 touches the peripheral capacitance resistance devices 121 due to displacement or deflection caused by asynchronous contact or uneven force of the pressure head spring 230 in the process that the pressure head 210 connected to the lower end of the pressure head contacts and presses down the circuit substrate 120, and further, after the reflow soldering link, the assembly contact failure rate of the capacitance resistance devices 121 on the circuit substrate 120 is further reduced.
Preferably, the pre-pressure of all the pressure head springs 230 after assembly is ensured to be between 1 and 2N, which can be determined by a measuring instrument, and adjusted by adjusting the length of the pressure head springs 230 before assembly; meanwhile, the lower end surfaces of all the indenters 210 are ensured to be flush after assembly, which can be determined by a measuring instrument, and adjusted by adjusting the length of the indenter 210 itself or the length of the connection with the boom bolt 220.
In the reflow step, the high temperature of soldering may have an effect on the expansion coefficient of the tooling and the parts contacting with the circuit substrate 120, for example, the indenter 210 directly contacting with the circuit substrate 120 may not adopt hard materials such as steel and glass, and may also withstand the gold-tin solder temperature of 285 ℃, and after many practices, it is found that the epoxy resin material has a certain micro-compression ratio and can also withstand the high temperature of more than 300 ℃; therefore, preferably, the indenters 210 are all made into a stepped cylinder shape or a truncated cone shape by using epoxy resin rods, and the diameter of the head part of the indenter 210 for pressing the circuit substrate 120 is smaller than the diameter of the tail part of the indenter; and the pressure head 210 and the nearest capacitance resistance device 121 are preferably kept at a safe distance of more than 0.5mm, so as to further prevent the pressure head 210 from touching the capacitance resistance device 121; meanwhile, in terms of the connection mode with the boom bolt 220, it is preferable that a threaded hole adapted to be threadedly connected with the boom bolt 220 is provided at the center of the end surface of the tail portion of the ram 210.
In selecting the positioning mode for determining the housing 110 of the TR module 100, it is preferable that a positioning slide 301 for supporting and positioning the housing 110 of the TR module 100 of fig. 1 is provided on the base plate 300 of fig. 3, and a front end opening of the positioning slide 301 is provided for pushing in and taking out the TR module 100 of fig. 1.
The utility model discloses among the preferred embodiment of TR subassembly reflow soldering four-column type welding assembly fixture, except that will assemble in TR subassembly 100 casing 110 in FIG. 1 and have circuit substrate 120 of a plurality of electric capacity resistance device 121 through the soldering paste adhesion to fix a position and fix, the both sides of this TR subassembly 100 casing 110 still bond respectively through soldering paste and solder ring has low frequency connector and radio frequency connector, it is fixed and fixed all to need to fix a position in the reflow soldering process equally, assume that low frequency connector 130 is located the left side of TR subassembly 100 casing 110 in FIG. 1, radio frequency connector 140 is located the right side of TR subassembly 100 casing 110 in FIG. 1.
Specifically, the left side of the base plate 300 is provided with a low frequency positioning boss 310, for example, the low frequency positioning boss 310 is located at the left side of the base plate 300 and extends upward and is integrally connected with the base plate 300, the left end surface of the base plate 300 is fixed with a low frequency positioning fixing bracket 320 through a screw, the low frequency positioning fixing bracket 320 is movably connected with a low frequency positioning block 350 through a low frequency positioning pull rod 330, the low frequency positioning block 350 is located between the low frequency positioning fixing bracket 320 and the low frequency positioning boss 310, the low frequency positioning fixing bracket 320 is provided with a low frequency positioning screw 321 for abutting against one side of the low frequency positioning block 350 back to the housing 110 of the TR component 100 in fig. 1, one side of the low frequency positioning block 350 facing the housing 110 of the TR component 100 is transversely provided with a low frequency interface positioning post 351, the low frequency positioning boss 310 is transversely provided with a low frequency interface positioning hole 311 corresponding to the low frequency interface positioning post 351, therefore, the low-frequency interface positioning column 351 on the low-frequency positioning block 350 is pushed into and penetrates through the low-frequency interface positioning hole 311 on the low-frequency positioning boss 310 through the low-frequency positioning pull rod 330, the low-frequency connector 130 on the left side of the housing 110 of the TR component 100 in fig. 1 is inserted, and the low-frequency positioning block 350 is tightly jacked by the low-frequency positioning screw 321 on the low-frequency positioning fixing support 320, so that the position of the low-frequency connector 130 on the left side of the housing 110 of the TR component 100 is accurately positioned and fixed in the reflow soldering process.
Preferably, the low frequency interface positioning post 351 is made into a cylindrical or square shape by adopting an epoxy resin rod/block and is fixed on the low frequency positioning block 350, and by utilizing the characteristics of certain micro compression ratio and high temperature resistance of an epoxy resin material, and combining the low frequency interface positioning hole 311 matched with the H9/H9 level on the low frequency positioning boss 310, in the reflow soldering process, the low frequency connector 130 can be accurately positioned and fixed on the left side of the casing 110 of the TR component 100, the friction damage caused by gold plating at the interface of the low frequency connector 130 is reduced, and the assembling time of the low frequency connector 130 is shortened.
Specifically, the right side of the bottom plate 300 is provided with a radio frequency positioning boss 360, for example, the radio frequency positioning boss 360 is located at the right side of the bottom plate 300 and extends upward and is integrally connected with the bottom plate 300, a radio frequency positioning fixing support 370 is fixed on the right end surface of the bottom plate 300 through a screw, the radio frequency positioning fixing support 370 is movably connected with a radio frequency positioning block 390 through a radio frequency positioning pull rod 380, the radio frequency positioning block 390 is located between the radio frequency positioning fixing support 370 and the radio frequency positioning boss 360, the radio frequency positioning fixing support 370 is provided with a radio frequency positioning screw 371 for abutting against the radio frequency positioning block 360 on the side opposite to the housing 110 of the TR component 100 in fig. 1, one side of the radio frequency positioning block 390 facing the housing 110 of the TR component 100 is transversely provided with a radio frequency interface positioning column 391, the radio frequency positioning boss 360 is transversely and correspondingly provided with a radio frequency interface positioning hole 361 of the radio frequency interface positioning column, therefore, the radio frequency interface positioning post 391 on the radio frequency positioning block 390 is pushed into and penetrates through the radio frequency interface positioning hole 361 on the radio frequency positioning boss 360 by the radio frequency positioning pull rod 380, and is inserted into the radio frequency connector 140 on the right side of the TR component 100 casing 110 in fig. 1, and then the radio frequency positioning block 390 is tightly jacked by the radio frequency positioning screw 371 on the radio frequency positioning fixing support 370, so as to accurately position and fix the position of the radio frequency connector 140 on the right side of the TR component 100 casing 110 in the reflow soldering process.
Preferably, the rf interface positioning post 391 is made into a cylinder shape by using an epoxy rod and fixed on the rf positioning block 390, and by using the characteristics of a certain micro compression ratio and high temperature resistance of the epoxy material, and combining with the rf interface positioning hole 361 of H9/H9 level matching on the rf positioning boss 360, in the reflow soldering process, not only can the rf connector 140 be accurately positioned and fixed on the right side of the TR component 100 casing 110, but also the friction damage to the gold plating layer at the interface of the rf connector 140 is reduced, and the assembling time of the rf connector 140 is also shortened.
Preferably, each guide post 340 is sleeved with a guide post spring 341 for assisting in supporting the cover plate 200 and the components thereon before reflow soldering, and for bouncing and supporting the cover plate 200 and the components thereon after reflow soldering; meanwhile, a positioning surface when the cover plate 200 and the base plate 300 are combined is provided, for example, the upper surfaces of the low-frequency positioning boss 310 and the radio-frequency positioning boss 360 on the base plate 300 in fig. 3 may be used as a lower positioning surface, an upper positioning surface is provided at a corresponding position on the cover plate 200, screw holes (312 and 362) are respectively provided on the upper surfaces of the low-frequency positioning boss 310 and the radio-frequency positioning boss 360, and the cover plate 200 and the base plate 300 when combined are connected and fixed by two screws 250 in fig. 2; therefore, the constant operation caused by the complete separation of the cover plate 200 and the bottom plate 300 is avoided, the disassembly-free integral tool is formed, and the production efficiency is greatly improved.
In addition, a plurality of lightening holes (202 and 302) are respectively arranged on the cover plate 200 and the base plate 300, and the lightening holes are mainly used for reducing the weight of the whole welding assembly tool, but are mainly used for reducing excessive space heat absorbed by the cover plate 200 and the base plate 300 in the reflow soldering process, so that adverse effects on the soldering effect of the TR component 100 are reduced.
In the assembly operation of the TR assembly reflow soldering four-column type welding assembly tool before reflow soldering, the TR assembly 100 shell 110 assembled with the circuit substrate 120, the low-frequency connector 130 and the radio-frequency connector 140 through soldering paste adhesion is gently pushed to slide to a positioning position from the positioning chute 301 on the bottom plate 300; then, the low-frequency positioning bosses 310 and the radio-frequency interface positioning columns 391 on two sides of the bottom plate 200 are lightly inserted into the external interfaces of the low-frequency connector 130 and the radio-frequency connector 140 through the low-frequency positioning pull rod 330 and the radio-frequency positioning pull rod 380, and are uniformly pressed against the low-frequency positioning blocks 350 and the radio-frequency positioning blocks 360 through the low-frequency positioning screws 321 and the radio-frequency positioning screws 371, and meanwhile, whether the low-frequency connector 130 and the radio-frequency connector 140 are dislocated or not is visually observed; and then, the cover plate 200 is slowly moved downwards until the cover plate and the base plate 300 are combined together, so that all the pressure heads 210 evenly press the circuit substrate 120, whether the pressure heads 210 are inclined or not and touch the capacitance resistance device 121 is visually checked, and the cover plate 200 and the base plate 300 are fixedly connected when the two screws 250 are screwed.
During the disassembly operation after reflow soldering, the two screws 250 are loosened, and the cover plate 200 and the base plate 300 are separated under the elastic force of the guide pillar spring 341; then loosening the low-frequency positioning screw 321 and the radio-frequency positioning screw 371, and lightly withdrawing the low-frequency positioning boss 310 and the radio-frequency interface positioning column 391 through the low-frequency positioning screw 321 and the radio-frequency positioning screw 371 respectively; then slowly sliding and taking out the welded TR component 100; of course, the assembling and disassembling sequence can also be established according to the operation habit of an assembler.
It should be understood that the above-mentioned embodiments are only preferred embodiments of the present invention, and are not intended to limit the technical solutions of the present invention, and those skilled in the art can add, subtract, replace, change or modify the above-mentioned embodiments within the spirit and principle of the present invention, and all such additions, substitutions, changes or modifications should fall within the scope of the appended claims.
Claims (10)
1. A TR component reflow soldering four-column type welding assembly tool comprises a cover plate and a bottom plate, wherein the bottom plate is used for supporting and positioning a shell of the TR component, and a circuit substrate of the TR component is assembled in the shell; the cover plate is positioned right above the circuit substrate; the circuit substrate is adhered with a plurality of capacitance and resistance devices through soldering paste, and the cover plate is provided with a plurality of pressure heads which are used for propping against the area without the devices of the circuit substrate when the cover plate and the bottom plate are combined together; the method is characterized in that:
guide posts are vertically arranged at four corners of the bottom plate, guide sleeve holes which are matched with the guide posts to slide on the guide posts are vertically arranged at four corners of the cover plate, and each guide post is in clearance fit with the guide sleeve hole matched with the guide post by adopting D9/h 10;
each pressure head is connected to the lower end of a suspender bolt, the cylindrical surface section of the upper part of the suspender bolt is matched in a suspender hole of the cover plate and can slide up and down, a pressure head spring is supported between the cover plate and each pressure head, and the cylindrical surface section of the upper part of each suspender bolt is in clearance fit with the suspender hole in which the cylindrical surface section is positioned by D9/h 10.
2. The TR component reflow soldering four-column type welding assembly tool of claim 1, which is characterized in that: the pre-pressure of all pressure head springs after assembly is set to be 1-2N, and the lower end faces of all pressure heads are flush after assembly.
3. The TR component reflow soldering four-column type welding assembly tool of claim 1, which is characterized in that: the pressure heads are all made into a step cylinder shape or a cone frustum shape by adopting epoxy resin rods, and the diameter of the head part of each pressure head for pressing the circuit substrate is smaller than that of the tail part of each pressure head; and a threaded hole matched with the suspender bolt in threaded connection is formed in the center of the end face of the tail part of the pressure head.
4. The TR component reflow soldering four-column type welding assembly tool of claim 1, which is characterized in that: the bottom plate is provided with a positioning sliding groove for supporting and positioning the shell of the TR component, and the front end opening of the positioning sliding groove is used for pushing in and taking out the TR component.
5. The TR component reflow soldering four-column type welding assembly tool of claim 1, which is characterized in that: the bottom plate left side is provided with a low frequency location boss, the left end face of bottom plate has a low frequency location fixed bolster through the fix with screw, low frequency location fixed bolster is via a low frequency location pull rod swing joint low frequency locating piece, the low frequency locating piece is located between low frequency location fixed bolster and the low frequency location boss, be provided with on the low frequency location fixed bolster and be used for pushing up the low frequency locating screw in the one side of low frequency locating piece TR subassembly casing dorsad, the one side of orientation TR subassembly casing on the low frequency locating piece transversely is provided with the low frequency interface reference column, transversely correspond the low frequency interface locating hole that is provided with the adaptation low frequency interface reference column on the low frequency location boss, and adopt H9/H9 clearance fit between low.
6. The TR component reflow soldering four-column type welding assembly tool of claim 5, which is characterized in that: the low-frequency interface positioning column is made into a cylindrical shape or a square shape by adopting an epoxy resin rod/block and is fixed on the low-frequency positioning block.
7. The TR component reflow soldering four-column type welding assembly tool of claim 1, which is characterized in that: the radio frequency positioning device is characterized in that a radio frequency positioning boss is arranged on the right side of the bottom plate, a radio frequency positioning fixing support is fixed on the right end face of the bottom plate through a screw, the radio frequency positioning fixing support is movably connected with a radio frequency positioning block through a radio frequency positioning pull rod, the radio frequency positioning block is located between the radio frequency positioning fixing support and the radio frequency positioning boss, a radio frequency positioning screw used for pushing the radio frequency positioning block to the side, opposite to the TR component shell, is arranged on the radio frequency positioning fixing support, a radio frequency interface positioning column is transversely arranged on the radio frequency positioning block towards the side, facing the TR component shell, of the radio frequency positioning block, a radio frequency interface positioning hole matched with the radio frequency interface positioning column is transversely arranged.
8. The TR component reflow soldering four-column type welding assembly tool of claim 7, which is characterized in that: the radio frequency interface positioning column is made into a cylinder shape by adopting an epoxy resin rod and is fixed on the radio frequency positioning block.
9. The TR component reflow soldering four-column type welding assembly tool of claim 1, which is characterized in that: each guide post is sleeved with a guide post spring which is used for assisting in supporting the cover plate and parts on the cover plate before reflow soldering and used for bouncing and supporting the cover plate and parts on the cover plate after reflow soldering.
10. The TR component reflow soldering four-column type welding assembly tool of claim 1, which is characterized in that: the cover plate and the bottom plate are respectively provided with a plurality of lightening holes for reducing the absorption of excessive space heat of the cover plate and the bottom plate in the reflow soldering process.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922034079.0U CN211276877U (en) | 2019-11-22 | 2019-11-22 | TR subassembly reflow soldering four-column type welding assembly fixture |
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| CN201922034079.0U CN211276877U (en) | 2019-11-22 | 2019-11-22 | TR subassembly reflow soldering four-column type welding assembly fixture |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112894050A (en) * | 2020-12-29 | 2021-06-04 | 昆山信方达电子有限公司 | 5G filter welding set |
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2019
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112894050A (en) * | 2020-12-29 | 2021-06-04 | 昆山信方达电子有限公司 | 5G filter welding set |
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