CN211266979U - Camera module and electronic equipment - Google Patents
Camera module and electronic equipment Download PDFInfo
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- CN211266979U CN211266979U CN202020349355.2U CN202020349355U CN211266979U CN 211266979 U CN211266979 U CN 211266979U CN 202020349355 U CN202020349355 U CN 202020349355U CN 211266979 U CN211266979 U CN 211266979U
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- 206010070834 Sensitisation Diseases 0.000 abstract description 34
- 230000008313 sensitization Effects 0.000 abstract description 34
- 230000006870 function Effects 0.000 abstract description 26
- 230000004308 accommodation Effects 0.000 abstract description 6
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 241000218202 Coptis Species 0.000 description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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Abstract
The application provides a camera module and electronic equipment. Camera module includes the circuit board, the sensitization chip, support the deformation piece, hold carrier and base, be equipped with the accommodation space in the base, hold carrier setting on the base and the lid closes the accommodation space, the circuit board, the sensitization chip all locates in the accommodation space with supporting the deformation piece, it includes relative stiff end and the flexible end that sets up to support the deformation piece, the stiff end is connected on holding carrier and/or base, flexible end is located on the circuit board, the sensitization chip is located on the circuit board, and with support deformation piece interval setting, it takes place deformation under the on-state to support the deformation piece, so that the circuit board takes place the slope, the circuit board drives the sensitization chip and takes place the shake in order to resist the camera module. When using the camera module that this application embodiment provided to shoot, can effectively realize the anti-shake function, and carry out the slope anti-shake to sensitization chip, the scope of anti-shake is bigger, and the function is stronger.
Description
Technical Field
The utility model relates to a camera technical field, in particular to camera module and electronic equipment.
Background
With the development of mobile terminals, the functions of the mobile terminals are more and more powerful, and as a practical and powerful tool, the mobile terminals have become an indispensable tool in the life of users, and the performance requirements of the users on the mobile terminals are more and more high. The mobile terminal is generally configured with a camera module, and further has a camera function.
However, in the process that the user uses the camera to shoot, hardly guarantee that the camera module is in complete steady state, can produce the shake usually, the shake of camera module can influence the working property of camera module to a certain extent, and then the work quality that leads to shooing is relatively poor, can't satisfy the user requirement.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a camera module and electronic equipment for realize the anti-shake function at the shooting in-process, thereby solve above-mentioned technical problem.
This application camera module includes circuit board, sensitization chip, supports the deformation piece, holds carrier and base, be equipped with the accommodation space in the base, it sets up to hold carrier just to close on the base the accommodation space, the circuit board the sensitization chip with it all locates to support the deformation piece in the accommodation space, it includes relative stiff end and the flexible end that sets up to support the deformation piece, the stiff end connect in hold carrier and/or on the base, flexible end is located on the circuit board, the sensitization chip is located on the circuit board, and with support the setting of deformation piece interval, it takes place deformation under the on-state to support the deformation piece, so that the slope takes place for the circuit board, the circuit board drives the sensitization chip takes place to incline in order to resist the shake of camera module.
Use this application when the camera module is shot, it is right support the deformation piece and switch on, it can take place deformation to support the deformation piece, thereby drive the circuit board with sensitization chip is integrative to inclining to the direction opposite with the shake direction, and then guarantees to shoot the quality, has realized the anti-shake function. Simultaneously, for camera lens slope anti-shake, this application the camera module is to sensitization chip slope anti-shake, and the scope of anti-shake is bigger, and the function is stronger. And, this application the camera module is through control the circuit board slopes, and then drives sensitization chip slope, but direct control sensitization chip slopes, makes sensitization chip with gold thread connection between the circuit board can not receive the influence, and overall structure is simpler.
Wherein, support deformation spare including electrically conductive deformation spare and elastic component, electrically conductive deformation spare with the elastic component interval sets up or connects, the elastic component is including relative first end and the second end that sets up, electrically conductive deformation spare is including relative third end and the fourth end that sets up, first end with the third end is located hold carrier and/or on the base, just first end with the third end forms jointly the stiff end, the second end with the fourth end is located on the circuit board, just the second end with the fourth end forms jointly flexible end. The supporting deformation piece comprises a conductive deformation piece and an elastic piece, and the elastic piece is used for being connected with the circuit board, so that the circuit board is suspended in the containing space and is convenient to perform inclined motion. The conductive deformation piece is electrified and deformed, so that the circuit board is pushed and pulled, the circuit board and the photosensitive chip are inclined, and the anti-shaking function is realized.
The elastic pieces are arranged in a plurality of, a plurality of surrounding the photosensitive chip, the elastic pieces are arranged in a central symmetry mode relative to the center of the photosensitive chip, and/or the elastic pieces are arranged in an axial symmetry mode relative to the symmetry axis of the photosensitive chip. When the elastic component is a plurality of, and centers on when sensitization chip symmetry sets up, a plurality of elastic components make sensitization chip's removal is more steady.
The elastic piece is two elastic strip bodies, the two elastic strip bodies are arranged at the edge of the circuit board, and the two elastic strip bodies are symmetrical to the symmetry axis of the photosensitive chip. Under this structure, the camera module can satisfy corresponding functional requirement and the structure is comparatively simple.
The photosensitive chip comprises a photosensitive chip, a plurality of conductive deformation pieces, a plurality of photosensitive chips and a plurality of conductive deformation pieces, wherein the conductive deformation pieces are a plurality of and are surrounded by the photosensitive chip, the plurality of conductive deformation pieces are arranged in a centrosymmetric mode relative to the center of the photosensitive chip, and/or the plurality of conductive deformation pieces are arranged in an axisymmetric mode relative to the symmetry axis of the photosensitive chip. When electrically conductive deformation spare is a plurality of and centers on when sensitization chip symmetry sets up, it is right electrically conductive deformation spare is circular telegram, and electrically conductive deformation spare is right the circuit board with sensitization chip's control is nimble more and accurate.
The circuit board comprises four corners arranged at intervals, the number of the conductive deformation pieces is four, and one conductive deformation piece is arranged at one corner. Under this structure, the camera module can satisfy corresponding functional requirement and the structure is comparatively simple.
Wherein, hold carrier including be close to the circuit board and with the circuit board is relative is connected the face, support deformation piece the stiff end connect in hold carrier on the connection face. When support deformation one end with the circuit board is connected, the other end with hold the carrier when connecting the face and connecting, can effectively realize right sensitization chip's slope control.
Wherein, the base is including being close to the circuit board and with the relative stationary plane of circuit board, support the deformation piece the stiff end connect in the base on the stationary plane. When supporting deformation one end with the circuit board is connected, the other end with the base when the stationary plane is connected, can effectively realize right sensitization chip's slope control.
The camera module further comprises a lens group, an optical filter, a support and a position sensor, wherein the support is arranged on the circuit board, the optical filter is arranged on the support, the optical filter is located at the position where the photosensitive chip deviates from the circuit board, and is arranged opposite to the photosensitive chip at an interval, the lens group is assembled in the bearing piece, and the position sensor is used for measuring the position of the photosensitive chip. The camera module that above-mentioned structure is constituteed can satisfy corresponding functional requirement.
The application the electronic equipment includes any one of the above-mentioned camera module. Use this application when electronic equipment shoots, it is right in the camera module support the deformation piece and switch on, it can take place deformation to support the deformation piece, thereby drive the circuit board with sensitization chip an organic whole inclines to the direction opposite with the shake direction, and then guarantees to shoot the quality, has realized the anti-shake function. Simultaneously, for camera lens slope anti-shake, this application among the electronic equipment the camera module is to sensitization chip slope anti-shake, and the scope of anti-shake is bigger, and the function is stronger. And, this application among the electronic equipment the camera module is through control the circuit board inclines, and then drives sensitization chip slope, rather than direct control sensitization chip inclines, makes sensitization chip with gold thread connection between the circuit board can not receive the influence, and overall structure is simpler.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a cross-sectional view of a camera module according to an embodiment of the present application.
Fig. 2 is a cross-sectional view of a camera module in another embodiment.
Fig. 3 is a cross-sectional view of a camera module in a third embodiment.
Fig. 4 is a cross-sectional view of a camera module in a fourth embodiment.
Fig. 5 is a schematic distribution structure diagram of the conductive deformation element and the elastic element in the camera module according to an embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a cross-sectional view of a camera module 100 according to an embodiment of the present disclosure.
Based on the above problem, the embodiment of the present application provides a camera module 100. The camera module 100 provided in the embodiment of the present application includes a circuit board 10, a photo sensor chip 20, a supporting deformation member 30, a supporting member 40 and a base 50, wherein an accommodating space is provided in the base 50, the supporting member 40 is disposed on the base 50 and covers the accommodating space, the circuit board 10, the photo sensor chip 20 and the supporting deformation member 30 are disposed in the accommodating space, the supporting deformation member 30 includes a fixed end 301 and a telescopic end 302 disposed opposite to each other, the fixed end 301 is connected to the supporting member 40 and/or the base 50, the telescopic end 302 is disposed on the circuit board 10, the photo sensor chip 20 is disposed on the circuit board 10, and the photo sensor chip 20 and the supporting deformation member 30 are disposed at an interval along a direction parallel to a photo sensing surface of the photo sensor chip 20, that is, the supporting deformation member 30 does not directly contact with the photo sensor chip 20, thereby avoiding damage to the photo sensor chip 20, the supporting deformation member 30 deforms in a power, the circuit board 10 drives the photosensitive chip 20 to tilt to resist the shake of the camera module 100.
When using camera module 100 that this application embodiment provided to shoot, if camera module 100 takes place the shake, this application support deformation 30 can be circular telegram, support deformation 30 can take place deformation, and deformation support deformation 30 drives circuit board 10 and sensitization chip 20 an organic whole and inclines to the direction opposite with the shake direction to the shake of resisting camera module 100, and then guarantee the quality of shooing, realized anti-shake function.
Moreover, in the camera module 100 that this application embodiment provided, what adopt is that photosensitive chip 20 inclines anti-shake, carries out inclination control to photosensitive chip 20 promptly and realizes the anti-shake function, for traditional camera lens 60 inclination anti-shake (carrying out inclination control to camera lens 60 and realizing the anti-shake function), the anti-shake scope of photosensitive chip 20 inclination anti-shake is bigger, and the function is stronger.
It can be understood that the camera module 100 that this application embodiment provided is inclined through control circuit board 10, and then drives sensitization chip 20 slope, and not direct control sensitization chip 20 inclines, and this kind of indirect control sensitization chip 20's mode makes the gold thread connection between sensitization chip 20 and circuit board 10 can not receive the influence, and overall control structure is simpler moreover.
In one embodiment, the supporting deformation member 30 includes a conductive deformation member 31 and an elastic member 32, that is, the supporting deformation member 30 is divided into two members according to functions, the conductive deformation member 31 and the elastic member 32 are disposed at an interval or connected, and the two members of the conductive deformation member 31 and the elastic member 32 work together to achieve the inclination anti-shake of the photosensitive chip 20.
The elastic element 32 includes a first end 321 and a second end 322 which are oppositely disposed, the first end 321 of the elastic element 32 is connected to the bearing element 40 and/or the base 50, the second end 322 of the elastic element 32 is connected to the circuit board 10, the circuit board 10 is suspended in the accommodating space due to the supporting and/or lifting action of the elastic element 32, and the elastic element 32 enables the circuit board 10 to be in a suspended state, so that the circuit board 10 can be better stressed and perform tilting motion. In a specific embodiment, the elastic member 32 is a spring, and it is understood that the elastic member 32 is not limited to a spring, and can be any other elastic structure having the same function, and the shape structure of the elastic member 32 is not limited, and can be any shape structure capable of meeting the requirement of the corresponding function.
The conductive deformation member 31 includes a third end 313 and a fourth end 314 which are oppositely arranged, the third end 313 of the conductive deformation member 31 is connected with the bearing member 40 and/or the base 50, the fourth end 314 of the conductive deformation member 31 is connected with the circuit board 10, and when the conductive deformation member 31 is electrified, the conductive deformation member 31 is deformed, so that an acting force is generated on the circuit board 10, and the circuit board 10 performs corresponding tilting motion. In a specific implementation mode, electrically conductive deformation piece 31 is the wire made by shape memory alloy, shape memory alloy possesses the function that the pyrocondensation cold rises, circular telegram or increase current can make shape memory alloy become hot, thereby change shape memory alloy's crystal structure, thereby make the electrically conductive deformation piece 31 length of being made by shape memory alloy change, and then cause the push-and-pull effort to circuit board 10, according to the difference of hookup location between electrically conductive deformation piece 31 and the circuit board 10, and the difference of the size of electric current on the electrically conductive deformation piece 31, circuit board 10 atress can carry out corresponding tilting motion, thereby drive photosensitive chip 20 and carry out self position adjustment and realize optics anti-shake. It is understood that the conductive deformation member 31 is not limited to the wire made of the shape memory alloy, and may be any shape structure and any material that can be made into the conductive deformation member 31 having the same function.
As can be seen from the connection position relationship between the conductive deformation element 31 and the elastic element 32, the first end 321 of the elastic element 32 and the third end 313 of the conductive deformation element 31 are both connected to the load bearing member 40 and/or the base, and therefore, the first end 321 and the third end 313 together form the fixed end 301 for supporting the deformation element 30; the second end 322 of the elastic element 32 and the fourth end 314 of the conductive deformation element 31 are connected to the circuit board 10, so that the second end 322 and the fourth end 314 together form the telescopic end 302 of the supporting deformation element 30.
It can be understood that the position relationship between the conductive deformation element 31 and the elastic element 32 may be set at intervals or connected, that is, the conductive deformation element 31 and the elastic element 32 may be respectively set at different positions without contacting each other, so as to respectively fulfill the respective functional requirements; or, the conductive deformation element 31 and the elastic element 32 may also be directly connected or connected through a connector, so as to fulfill the two functional requirements of suspending the circuit board 10 and tilting the circuit board 10. The connected conductive deformation element 31 and the elastic element 32 may be an integral structure, or the connection relationship between the connected conductive deformation element 31 and the elastic element 32 may be: the elastic member 32 is wound around the conductive deformation member 31.
In this application, when the circular telegram to electrically conductive deformation piece 31, electrically conductive deformation piece 31 produces the effort to circuit board 10 for circuit board 10 carries out corresponding tilt motion, and elastic component 32 can be stretched or extrude this moment, and elastic component 32 still can carry out stable support or carry the pulling effect to circuit board 10, makes circuit board 10 be in steady state, effectively realizes the anti-shake function.
The connection positions of the conductive deformation element 31 and the elastic element 32 on the carrier 40 and/or the base 50 and the distribution positions of the conductive deformation element 31 and the elastic element 32 on the circuit board 10 will be described as follows. The following positions of the conductive deformation element 31 and the elastic element 32 can better resist the shake of the camera module 100.
Referring to fig. 2, fig. 3 and fig. 4, fig. 2 is a cross-sectional view of another embodiment of the camera module 100.
Fig. 3 is a sectional view of the camera module 100 according to the third embodiment.
Fig. 4 is a sectional view of the camera module 100 according to the fourth embodiment.
For the connection position of the conductive deformation element 31 and the elastic element 32 on the carrier 40 and/or the base 50. In one embodiment, the carrier 40 includes a connection surface 401 adjacent to the circuit board 10 and opposite to the circuit board 10, and the fixed end 301 of the supporting deformation element 30 is connected to the connection surface 401 of the carrier 40. At this time, the fixed end 301 of the supporting deformation member 30, i.e. the first end 321 of the elastic member 32 and the third end 313 of the conductive deformation member 31, are both connected to the connection surface 401 of the supporting member 40, and the telescopic end 302 of the supporting deformation member 30, i.e. the second end 322 of the elastic member 32 and the fourth end 314 of the conductive deformation member 31, are both connected to the circuit board 10.
In one embodiment, the base 50 includes a fixing surface 501 adjacent to the circuit board 10 and opposite to the circuit board 10, and the fixing end 301 of the support deformation element 30 is connected to the fixing surface 501 of the base 50. At this time, the fixed end 301 of the supporting deformation element 30, i.e. the first end 321 of the elastic element 32 and the third end 313 of the conductive deformation element 31, are both connected to the fixed surface 501 of the base 50, and the telescopic end 302 of the supporting deformation element 30, i.e. the second end 322 of the elastic element 32 and the fourth end 314 of the conductive deformation element 31, are both connected to the circuit board 10.
It can be understood that there are also cases where the first end 321 of the elastic element 32 is connected to the connecting surface 401 of the supporting element 40, and the third end 313 of the conductive deformation element 31 is connected to the fixing surface 501 of the base 50; and the first end 321 of the elastic element 32 is connected to the fixing surface 501 of the base 50, and the third end 313 of the conductive deformation element 31 is connected to the connecting surface 401 of the supporting element 40. The two cases can also realize the tilt control of the photosensitive chip 20, and a detailed description thereof is omitted here.
Referring to fig. 5, fig. 5 is a schematic distribution structure diagram of the conductive deformation element 31 and the elastic element 32 in the camera module 100 according to an embodiment.
The number of the conductive deformation elements 31 and the elastic elements 32 may be one or more, and it is understood that when the number of the elastic elements 32 is more than one, the elastic elements 32 can more smoothly support or pull the circuit board 10 and suspend the circuit board 10, as will be described below. The following distribution positions can achieve a better anti-shake function of the camera module 100.
In one embodiment, the plurality of elastic members 32 are disposed around the photosensitive chip 20, and the plurality of elastic members 32 are arranged in a central symmetry with respect to the center of the photosensitive chip 20. When the plurality of elastic members 32 are arranged in a central symmetry manner with respect to the center of the photosensitive chip 20, the number of the plurality of elastic members 32 may be odd or even, so as to satisfy the corresponding structural requirements.
In one embodiment, a plurality of elastic members 32 are disposed around the photosensitive chip 20, and the plurality of elastic members 32 are arranged in axial symmetry with respect to the axis of symmetry of the photosensitive chip 20. When the plurality of elastic members 32 are arranged in axial symmetry with respect to the axis of symmetry of the photosensitive chip 20, the structure formed by the plurality of elastic members 32 is more stable.
In a specific embodiment, there are two elastic members 32, the two elastic members 32 are symmetrically disposed at the edge position of the circuit board 10 with respect to the photosensitive chip 20, and the two elastic members 32 are in the shape of long bars. When the structure is the above structure, the elastic member 32 can meet the corresponding functional requirements, and the structure is simpler, and the cost is reduced.
In the above-mentioned distribution structures, the plurality of elastic members 32 are symmetrically disposed around the photosensitive chip 20, so that the movement of the circuit board 10 connected to the plurality of elastic members 32 is more stable, and the inclination process of the photosensitive chip 20 on the circuit board 10 is more stable.
When the number of the conductive deformation members 31 is plural, the position change of the photosensitive chip 20 on the circuit board 10 can be adjusted more flexibly by the power-on control of the plurality of conductive deformation members 31, so as to achieve a better anti-shake effect. The distribution positions of the conductive deformation members 31 on the circuit board 10 will be described below. The following distribution positions can achieve a better anti-shake function of the camera module 100.
In one embodiment, the conductive deformation members 31 are disposed around the photosensitive chip 20, and the conductive deformation members 31 are arranged in a central symmetry manner with respect to the center of the photosensitive chip 20. When the conductive deformation members 31 are arranged in a central symmetry manner with respect to the center of the photosensitive chip 20, the number of the conductive deformation members 31 may be odd or even, so as to satisfy the corresponding structural requirements.
In one embodiment, the conductive deformation members 31 are disposed around the photosensitive chip 20, and the conductive deformation members 31 are arranged in an axisymmetric manner with respect to a symmetry axis of the photosensitive chip 20. When the conductive deformation members 31 are arranged in axial symmetry with respect to the symmetry axis of the photosensitive chip 20, the conductive deformation members 31 can regulate and control the inclination process of the photosensitive chip 20 more accurately.
In a specific embodiment, the circuit board 10 has four corners, and the photosensitive chip 20 is disposed at the symmetrical center of the four corners, and each corner is connected with the conductive deformation member 31. The connecting line of the centers of the two opposite corners is intersected at the central point, the center of the photosensitive chip 20 is positioned at the central point, and when the structure is adopted, the conductive deformation piece 31 can meet the corresponding functional requirements, and the structure is simple, and the cost is reduced.
In above-mentioned several distribution structure, a plurality of electrically conductive deformation piece 31 all set up around sensitization chip 20 symmetry for receive the stress point symmetric distribution of electrically conductive deformation piece 31 effort on the circuit board 10, thereby electrically conductive deformation piece 31 is more nimble accurate to the slope control of circuit board 10, and then makes the slope process of sensitization chip 20 on the circuit board 10 more nimble and accurate.
In one embodiment, the supporting deformation element 30 is electrically connected to the circuit board 10, and the circuit board 10 is provided with a control circuit, and the control circuit controls the power-on state of the supporting deformation element 30. Due to the existence of the control circuit, the power-on state of the supporting deformation piece 30 can be controlled and adjusted more accurately, and the inclination of the supporting deformation piece 30 to the photosensitive chip 20 is controlled more accurately. When the supporting deformation member 30 is divided into the conductive deformation member 31 and the elastic member 32, the control circuit controls and adjusts the power-on state of the conductive deformation member 31, so that the inclination control of the conductive deformation member 31 to the photosensitive chip 20 is more accurate.
The camera module 100 of the embodiment of the present application further includes a lens group 60, a filter 70, a bracket 80 and a position sensor (not shown), the bracket 80 is disposed on the circuit board 10, the filter 70 is disposed on the bracket 80, the filter 70 is located at a position where the photosensitive chip 20 deviates from the circuit board 10, and is spaced and disposed relatively to the photosensitive chip 20, the lens group 60 is assembled in the supporting member 40, and the position sensor is used for measuring a position of the photosensitive chip 20. The camera module 100 having the above structure can satisfy corresponding functional requirements.
When using camera module 100 that this application embodiment provided to shoot, if camera module 100 takes place the shake, the support of this application deformation 30 can be circular telegram, and support deformation 30 can take place deformation, and the support deformation 30 of deformation drives circuit board 10 and sensitization chip 20 an organic whole and inclines to the direction opposite with the shake direction to resist camera module 100's shake, and then guarantee to shoot the quality, realized anti-shake function. Meanwhile, for the inclination anti-shake of the lens 60, the camera module 100 of the present application is used for inclination anti-shake of the photosensitive chip 20, and the anti-shake range is larger and the function is stronger.
The electronic equipment that this application embodiment provided includes above-mentioned arbitrary camera module 100, when using electronic equipment to shoot, if electronic equipment takes place the shake, support deformation 30 in the camera module 100 of this application can be circular telegram, it can take place deformation to support deformation 30, the support deformation 30 of deformation drives circuit board 10 and sensitization chip 20 an organic whole and inclines to the direction opposite with the shake direction, with the shake of resisting electronic equipment, and then guarantee to shoot the quality, the anti-shake function has been realized. Meanwhile, for the inclination anti-shake of the lens 60, the camera module 100 in the electronic device of the present application is inclined and anti-shake for the photosensitive chip 20, so that the anti-shake range is larger and the function is stronger.
The technical features of the above embodiments may be arbitrarily combined, and for the sake of brief description, all possible combinations of the technical features in the above embodiments are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A camera module is characterized by comprising a circuit board, a photosensitive chip, a supporting deformation piece, a bearing piece and a base, the base is internally provided with an accommodating space, the bearing piece is arranged on the base and covers the accommodating space, the circuit board, the photosensitive chip and the supporting deformation piece are all arranged in the accommodating space, the supporting deformation piece comprises a fixed end and a telescopic end which are oppositely arranged, the fixed end is connected with the bearing piece and/or the base, the telescopic end is arranged on the circuit board, the photosensitive chip is arranged on the circuit board, and is arranged at intervals with the supporting deformation piece, the supporting deformation piece deforms under the electrified state, so that the circuit board inclines, and the circuit board drives the photosensitive chip to incline to resist the shaking of the camera module.
2. The camera module according to claim 1, wherein the supporting deformation member includes a conductive deformation member and an elastic member, the conductive deformation member is disposed at an interval with or connected to the elastic member, the elastic member includes a first end and a second end disposed opposite to each other, the conductive deformation member includes a third end and a fourth end disposed opposite to each other, the first end and the third end are disposed on the supporting member and/or the base, the first end and the third end form the fixing end together, the second end and the fourth end are disposed on the circuit board, and the second end and the fourth end form the telescopic end together.
3. The camera module according to claim 2, wherein the number of the elastic members is plural, the plural elastic members are disposed around the photosensitive chip, the plural elastic members are arranged in a central symmetry with respect to a center of the photosensitive chip, and/or the plural elastic members are arranged in an axisymmetric arrangement with respect to a symmetry axis of the photosensitive chip.
4. The camera module according to claim 3, wherein the elastic member is two elastic bars, the two elastic bars are disposed on the edge of the circuit board, and the two elastic bars are symmetrical with respect to the symmetry axis of the photosensitive chip.
5. The camera module according to claim 2, wherein the number of the conductive deformation members is plural, the plural conductive deformation members are disposed around the photosensitive chip, the plural conductive deformation members are arranged in a central symmetry manner with respect to a center of the photosensitive chip, and/or the plural conductive deformation members are arranged in an axial symmetry manner with respect to a symmetry axis of the photosensitive chip.
6. The camera module according to claim 5, wherein the circuit board includes four corners spaced apart from each other, and the number of the conductive deformation members is four, and one of the conductive deformation members is disposed at one of the corners.
7. The camera module according to claim 1, wherein the carrier includes a connecting surface adjacent to and opposite to the circuit board, and the fixed end of the supporting deformation member is connected to the connecting surface of the carrier.
8. The camera module according to claim 1, wherein the base includes a fixing surface adjacent to the circuit board and opposite to the circuit board, and the fixing end of the support deformation member is connected to the fixing surface of the base.
9. The camera module of claim 1, further comprising a lens set, a filter, a bracket and a position sensor, wherein the bracket is disposed on the circuit board, the filter is disposed on the bracket, the filter is located at a position of the photosensitive chip away from the circuit board and is spaced from the photosensitive chip, the lens set is assembled in the carrier, and the position sensor is used for measuring a position of the photosensitive chip.
10. An electronic device, comprising the camera module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020349355.2U CN211266979U (en) | 2020-03-19 | 2020-03-19 | Camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020349355.2U CN211266979U (en) | 2020-03-19 | 2020-03-19 | Camera module and electronic equipment |
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| CN211266979U true CN211266979U (en) | 2020-08-14 |
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| CN202020349355.2U Expired - Fee Related CN211266979U (en) | 2020-03-19 | 2020-03-19 | Camera module and electronic equipment |
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| CN112822376A (en) * | 2021-01-27 | 2021-05-18 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN112887576A (en) * | 2021-01-28 | 2021-06-01 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN112911107A (en) * | 2021-01-19 | 2021-06-04 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN112965318A (en) * | 2021-03-02 | 2021-06-15 | 维沃移动通信有限公司 | Anti-shake module based on image sensor, lens module and electronic equipment |
| CN113079308A (en) * | 2021-05-07 | 2021-07-06 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113114901A (en) * | 2021-04-15 | 2021-07-13 | 维沃移动通信有限公司 | Imaging device and electronic apparatus |
| CN113114921A (en) * | 2021-05-26 | 2021-07-13 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN113114899A (en) * | 2021-04-15 | 2021-07-13 | 维沃移动通信有限公司 | Imaging device and electronic apparatus |
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Effective date of registration: 20210617 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
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