CN211264265U

CN211264265U - Radiating structure of integrated circuit chip of tablet personal computer

Info

Publication number: CN211264265U
Application number: CN202020212932.3U
Authority: CN
Inventors: 冯诗琳
Original assignee: Shenzhen Heng Sheng Tong Technology Co ltd
Current assignee: Shenzhen Heng Sheng Tong Technology Co ltd
Priority date: 2020-02-26
Filing date: 2020-02-26
Publication date: 2020-08-14
Anticipated expiration: 2030-02-26

Abstract

The utility model relates to the field of integrated chip heat dissipation, in particular to a heat dissipation structure of a panel computer integrated circuit chip, which comprises a panel bottom plate, wherein the top end of the panel bottom plate is fixedly connected with an integrated circuit chip base, the top end of the integrated circuit chip base is fixedly welded with a chip group, one end of the integrated circuit chip base is fixedly connected with a heat conduction copper pipe, one end of the heat conduction copper pipe away from the integrated circuit chip base is fixedly connected with a fixed plate, the bottom end of the heat conduction copper pipe is fixedly connected with the panel bottom plate, and heat dissipation silicone grease arranged at the top end of a radiating fin bracket, because the heat is brought into the radiating fin bracket through the heat conduction copper pipe when the chip group works, heat is conducted to the inside of the radiating fin bracket, the heat is transmitted to a metal sheet on the radiating fin bracket through a, therefore, a radiating electric sheet is not needed, so that the material is saved, and the material cost is reduced.

Description

Radiating structure of integrated circuit chip of tablet personal computer

Technical Field

The utility model relates to an integrated chip heat dissipation field, specific panel computer integrated circuit chip heat radiation structure that says so.

Background

The TNT2 was issued as if it were a heavy pound bullet shot violently into the 3dfx heart. The core frequency is 150MHz, it supports almost all 3D acceleration characteristics at that time, including 32 bit rendering, 24 bit Z buffering, anisotropic filtering, panoramic anti-aliasing, hardware convex-concave mapping, etc., the performance enhancement means the increase of core heating, but the process still adopts 0.25 micron without great progress, so the passive mode of the radiating fin can not meet the current demand, the active radiating mode formally enters the stage of the display card, the Li's patent radiating system Twinturbo-II (second generation full-coverage double-turbine radiating fan) is used, the radiating fin completely covers the whole card, the air can go out one by one through two fans along one direction when starting, the heat of the chip and the display can be taken away rapidly. And two ball bearing fans can effectively reduce the noise, and metal radiator screen makes the life-span longer in addition, though the fan of high-speed is the best way of solving the heat dissipation problem, but some friends can't endure the noise like "smoke ventilator" when enjoying 3D recreation infinite enjoyment. The application of the heat pipe technology can solve the problem, and the heat pipe is generally composed of a core heat absorption block, a back heat absorption block, two large-area heat dissipation fins and a heat pipe. The heat pipe is used as a passive heat conduction device, heat is rapidly transferred from the heat absorption section to the heat release section through the phase state change of internal working fluid, then the heat pipe flows back to the heat absorption section by depending on an internal capillary structure, the circulation is repeated, no power consumption and no noise are generated, and the heat conduction capability is strong, so that the rapid heat transfer is realized in a limited space, the heat dissipation area is further increased, and the effective means of the passive heat dissipation effect is greatly improved. However, such a heat dissipation method is still disadvantageous because the heat dissipation capability is not strong enough and can only be applied to a middle-end card, and a fan must be added to the high-end card if the technology is adopted.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a heat dissipation structure of a tablet personal computer integrated circuit chip. In order to achieve the above purpose, the utility model adopts the following technical scheme: the heat dissipation structure comprises a flat bottom plate, wherein the top end of the flat bottom plate is fixedly connected with an integrated circuit chip base, the top end of the integrated circuit chip base is fixedly welded with a chip group, one end of the integrated circuit chip base is fixedly connected with a heat conduction copper pipe, the heat conduction copper pipe is far away from an end fixedly connected with fixing plate of the integrated circuit chip base, and the bottom end of the heat conduction copper pipe is fixedly connected with the flat bottom plate.

Preferably, one end of the top end of the flat bottom plate, which is far away from the integrated circuit chip base, is fixedly connected with a support.

Preferably, the four corners at the top end of the support are fixedly connected with support blocks, the support blocks are arranged in a rectangular shape, and the height of each support block is smaller than that of the support.

Preferably, the top end of the supporting block is fixedly connected with a top plate, the top plate is arranged in a rectangular shape, and the circumference and the shape of the top plate are equal to those of the support.

Preferably, the top end of the top plate is fixedly connected with a radiating fin support, the circumference and the shape of the radiating fin support are larger than those of the support, and the top end of the integrated circuit chip base is fixedly connected with a wire casing.

Preferably, the top end of the radiating fin support is fixedly connected with radiating silicone grease, the radiating silicone grease uniformly wraps the surface of the radiating fin support, the top end of the radiating silicone grease is fixedly connected with a plurality of radiating fins, and the top end of the radiating fin support is provided with a plurality of metal sheets.

Preferably, one end of the bottom plate, which is close to the support, is fixedly connected with a connecting block, the bottom end of the connecting block is fixedly connected with a wheel shaft, one end of the wheel shaft is rotatably connected with a wheel, a cleaning groove is formed in the surface of the wheel, the cleaning groove is in a trapezoidal arrangement, and the inner angle of the cleaning groove is 30 degrees.

Advantageous effects

1. The utility model discloses in, through the heat dissipation silicone grease that sets up on fin support top, because of at the chipset during operation, can bring the heat into fin support inside through heat conduction copper pipe, give fin support inside with the heat conduction, send the sheetmetal on the fin support with the heat through heat radiation fins, make the sheetmetal with heat direct transfer to the metal casing of panel computer on, make its heat dissipation, can not need the radiating electric piece like this, make the material more sparingly, reduce material cost.

Drawings

Fig. 1 is an axial view structural schematic diagram of the heat dissipation structure of the integrated circuit chip of the tablet computer provided by the present invention;

fig. 2 is a schematic top view of the heat dissipation structure of the integrated circuit chip of the tablet pc according to the present invention;

fig. 3 is the utility model provides a side view structure schematic of panel computer integrated circuit chip heat radiation structure.

Illustration of the drawings:

1. a flat plate base plate; 2. an integrated circuit chip base; 3. a heat conducting copper pipe; 4. a metal sheet; 5. a chipset; 6. a wire slot; 7. a support block; 8. a fixing plate; 9. a top plate; 10. a heat sink bracket; 11. a support; 12. heat dissipation silicone grease; 13. and heat dissipation fins.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.

Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

Referring to fig. 1-3, the heat dissipation structure for the integrated circuit chip of the tablet computer comprises a tablet bottom plate 1, wherein the top end of the tablet bottom plate 1 is fixedly connected with an integrated circuit chip base 2, the top end of the integrated circuit chip base 2 is fixedly welded with a chip group 5, one end of the integrated circuit chip base 2 is fixedly connected with a heat conduction copper pipe 3, the heat conduction copper pipe 3 is far away from one end of the integrated circuit chip base 2 and is fixedly connected with a fixing plate 8, and the bottom end of the heat conduction copper pipe 3 is fixedly connected with the tablet bottom plate.

One end of the top end of the flat bottom plate 1 far away from the integrated circuit chip base 2 is fixedly connected with a bracket 11, four corners of the top end of the bracket 11 are fixedly connected with supporting blocks 7, the supporting blocks 7 are arranged in a rectangular shape, the height of each supporting block 7 is smaller than that of the corresponding support 11, the top ends of the supporting blocks 7 are fixedly connected with the top plates 9, the top plates 9 are arranged in a rectangular shape, the circumference and the shape of the top plate 9 are equal to those of the support 11, the top end of the top plate 9 is fixedly connected with a radiating fin support 10, the circumference and the shape of the radiating fin support 10 are larger than those of the support 11, the top end of the integrated circuit chip base 2 is fixedly connected with a wire casing 6, the top end of the radiating fin support 10 is fixedly connected with radiating silicone grease 12, the radiating silicone grease 12 uniformly wraps the surface of the radiating fin support 10, the top end of the radiating silicone grease 12 is fixedly connected with a plurality of radiating fins 13, and the top end of the radiating fin support 10 is provided with a plurality of metal sheets 4.

The utility model discloses a theory of operation: firstly, the heat dissipation silicone grease 12 arranged at the top end of the heat dissipation fin support 10 carries heat into the heat dissipation fin support 10 through the heat conduction copper pipe 3 when the chipset 5 works, the heat is conducted into the heat dissipation fin support 10, the heat is transmitted to the metal sheet 4 on the heat dissipation fin support 10 through the heat dissipation fins 13, and the metal sheet 4 directly transmits the heat to the metal shell of the tablet computer to dissipate the heat, so that the heat dissipation electric sheet is not needed, the material is saved, and the material cost is reduced.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. Panel computer integrated circuit chip heat radiation structure, including dull and stereotyped bottom plate (1), its characterized in that: the top fixedly connected with integrated circuit chip base (2) of dull and stereotyped bottom plate (1), the top fixed welding of integrated circuit chip base (2) has chipset (5), the one end fixedly connected with heat conduction copper pipe (3) of integrated circuit chip base (2), the one end fixedly connected with fixed plate (8) of integrated circuit chip base (2) are kept away from in heat conduction copper pipe (3), and the bottom and dull and stereotyped bottom plate (1) fixed connection of heat conduction copper pipe (3).

2. The heat dissipation structure of an integrated circuit chip of a tablet computer according to claim 1, wherein: one end of the top end of the flat bottom plate (1), which is far away from the integrated circuit chip base (2), is fixedly connected with a support (11).

3. The heat dissipation structure of a tablet computer integrated circuit chip according to claim 2, wherein: four corners fixedly connected with supporting shoe (7) in the top of support (11), and supporting shoe (7) are the rectangle and arrange, and the height of supporting shoe (7) is less than the height of support (11).

4. The heat dissipation structure of an integrated circuit chip of a tablet computer according to claim 3, wherein: the top end of the supporting block (7) is fixedly connected with a top plate (9), the top plate (9) is arranged in a rectangular shape, and the perimeter and the shape of the top plate (9) are equal to those of the support (11).

5. The heat dissipation structure of an integrated circuit chip of a tablet computer according to claim 4, wherein: the top end of the top plate (9) is fixedly connected with a radiating fin support (10), the circumference and the shape of the radiating fin support (10) are larger than those of the support (11), and the top end of the integrated circuit chip base (2) is fixedly connected with a wire groove (6).

6. The heat dissipation structure of an integrated circuit chip of a tablet computer according to claim 5, wherein: the heat radiating structure is characterized in that the top end of the heat radiating fin support (10) is fixedly connected with heat radiating silicone grease (12), the heat radiating silicone grease (12) uniformly wraps the surface of the heat radiating fin support (10), the top end of the heat radiating silicone grease (12) is fixedly connected with a plurality of heat radiating fins (13), and the top end of the heat radiating fin support (10) is provided with a plurality of metal sheets (4).